This device is designed specifically for
APPLICATION NOTES:
Recommended Pad Layout
The pad dimensions should be 0.010" longer than the
contact size in the lead axis. This allows a solder fillet
to form, see figure below. Contact factory for soldering
methods.
transiient voltage suppression from threats
generated by ESD for board levelload
switching components.
The wide leads assure a large surface contact
for good heat disipation, and a low resistance
path for surge current flow to ground.
This series is designed to optimize board
space and for use with surface mount technology
automated assembly equipment.
They can be easily mounted on printed circuit
boards and ceramic substrates to protect
sensitive components from transient voltage
damage.
Dimensions in inches and (millimeters)
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TSC [ TAIWAN SEMICONDUCTOR COMPANY, LTD ]
