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FDN357N 参数 Datasheet PDF下载

FDN357N图片预览
型号: FDN357N
PDF下载: 下载PDF文件 查看货源
内容描述: [SuperSOT-3]
分类和应用: 晶体晶体管开关光电二极管PC
文件页数/大小: 2 页 / 319 K
品牌: TYSEMI [ TY Semiconductor Co., Ltd ]
 浏览型号FDN357N的Datasheet PDF文件第2页  
SMD Type
Product specification
FDN357N
General Description
SuperSOT
TM
-3 N-Channel logic level enhancement mode power
field effect transistors are produced using Fairchild's
proprietary, high cell density, DMOS technology. This very high
density process is especially tailored to minimize on-state
resistance. These devices are particularly suited for low voltage
applications in notebook computers, portable phones, PCMCIA
cards, and
other battery powered circuits where fast
switching, and low in-line power loss are needed in a very small
outline surface mount package.
Features
1.9 A, 30 V, R
DS(ON)
= 0.090
@ V
GS
= 4.5 V
R
DS(ON)
= 0.060
@ V
GS
= 10 V.
Industry standard outline SOT-23 surface mount
package using proprietary SuperSOT
TM
-3 design for
superior thermal and electrical capabilities.
High density cell design for extremely low R
DS(ON)
.
Exceptional on-resistance and maximum DC current
capability.
SOT-23
SuperSOT
TM
-6
SuperSOT
TM
-8
SO-8
SOT-223
SOIC-16
D
D
7
35
S
SuperSOT -3
TM
G
G
S
Absolute Maximum Ratings
Symbol
V
DSS
V
GSS
I
D
P
D
T
J
,T
STG
R
θ
JA
R
θ
JC
Parameter
Drain-Source Voltage
T
A
= 25
o
C unless other wise noted
FDN357N
30
±20
1.9
10
(Note 1a)
(Note 1b)
Units
V
V
A
Gate-Source Voltage - Continuous
Drain/Output Current - Continuous
- Pulsed
Maximum Power Dissipation
0.5
0.46
-55 to 150
W
Operating and Storage Temperature Range
°C
THERMAL CHARACTERISTICS
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 1a)
(Note 1)
250
75
°C/W
°C/W
http://www.twtysemi.com
4008-318-123
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