V•I Chip – BCM
Bus Converter Module
TM
B048K120T20
+ +
–
K
–
©
1
V•I
• 48 V to 12 V V•I Chip Converter
• 200 Watt (300 Watt for 1 ms)
• High density – up to 800 W/in
3
• Small footprint – 200 W/in
2
• Low weight – 0.5 oz (14 g)
• ZVS/ZCS isolated sine
amplitude converter
• >96% efficiency
• 125°C operation
• 1 µs transient response
• >3.5 million hours MTBF
• No output filtering required
• BGA or J-Lead packages
Vin = 42 - 53 V
Vout = 10.5 - 13.25 V
Iout = 17.0 A
K =
1
/
4
Rout = 25 mΩ max
Actual size
Product Description
The V•I Chip Bus Converter Module
(BCM) is a high efficiency (>96%),
narrow input range Voltage
Transformation Module (VTM) operating
from a 48 Vdc bus to deliver an isolated
12 V secondary for Intermediate Bus
Architecture applications. The BCM may
be used to power non-isolated POL
converters or as an independent 12 V
source. Due to the fast response time and
low noise of the BCM, the need for
limited life aluminum electrolytic or
tantalum capacitors at the input of POL
converters is reduced—or eliminated—
resulting in savings of board area,
materials and total system cost.
The BCM achieves a power density of
800 W/in
3
and may be surface mounted
with a profile as low as 0.16" (4mm) over
the PCB. Its V•I Chip power package is
compatible with on-board or in-board
surface mounting. The V•I Chip package
provides flexible thermal management
through its low Junction-to-Case and
Junction-to-BGA thermal resistance.
Owing to its high conversion efficiency
and safe operating temperature range, the
BCM does not require a discrete heat sink
in typical applications. It is also
compatible with heat sink options,
assuring low junction temperatures and
long life in the harshest environments.
Absolute Maximum Ratings
Parameter
+In to -In
+In to -In
PC to -In
TM to -In
+Out to -Out
Isolation voltage
Operating junction temperature
Output current
Peak output current
Case temperature during reflow
Storage temperature
Output power
Peak output power
Values
-1.0 to 60.0
100
-0.3 to 7.0
-0.3 to 7.0
-0.5 to 15.0
2250
-40 to 125
17.0
25
208
-40 to 150
200
300
Unit
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
°C
A
A
°C
°C
W
W
Notes
For 100 ms
Input to Output
T grade; See note 2
Continuous
For 1 ms
Continuous
For 1 ms
Thermal Resistance
Symbol
R
θJC
R
θJB
R
θJA
R
θJA
Parameter
Junction-to-case
Junction-to-BGA
Junction-to-ambient
3
Junction-to-ambient
4
Typ
1.1
2.1
Max
1.5
2.5
Units
°C/W
°C/W
°C/W
°C/W
6.5
5.0
7.2
5.5
Notes
1. For complete product matrix see chart on page 10.
2. The referenced junction is defined as the semiconductor having the highest temperature. This
temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.
3. B048K120T20 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
4. B048L120T20 (0.25"H optional Pin Fins) surface mounted on FR4 board, 300 LFM.
45
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Bus Converter
B048K120T20
Rev. 2.2
Page 1 of 16
VICOR [ VICOR CORPORATION ]
