PRELIMINARY
Configuration Options
Configuration
Effective power density
Junction-Board
thermal resistance
Junction-Case
thermal resistance
Junction-Ambient
thermal resistance 300LFM
Notes:
Inboard
(1)
(Figure 14)
1400 W/in
3
2.1 °C/W
1.1 °C/W
6.5 °C/W
Onboard
(1)
(Figure 15)
880 W/in
3
2.4 °C/W
1.1 °C/W
6.8 °C/W
Inboard with 0.25"
Pin Fins
(2)
550 W/in
3
2.1 °C/W
N/A
5.0 °C/W
Onboard with 0.25"
Pin Fins
(2)
440 W/in
3
2.4 °C/W
N/A
5.0 °C/W
(1) Surface mounted to a 2" x 2" FR4 board, 4 layers 2 oz Cu
(2) Pin Fin heat sink available as a separate item
21.5
0.85
22.0
0.87
32.0
1.26
32.0
1.26
4.0
0.16
6.3
0.25
INBOARD MOUNT
(V•I Chip recessed into PCB)
mm
in
ONBOARD MOUNT
mm
in
Figure 14—Inboard
mounting – package K
Figure 15—Onboard
mounting – package F
vicorpower.com
800-735-6200
V•I Chip Voltage Transformation Module
V048K060T040
Rev. 1.0
Page 9 of 15
VICOR [ VICOR CORPORATION ]
