ES07B / ES07D
Vishay Semiconductors
Small Surface Mount Ultrafast Diodes
Features
For surface mounted applications
Low profile package
e3
Ideal for automated placement
Glass passivated
High temperature soldering:
260 °C/ 10 seconds at terminals
• Lead (Pb)-free component
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
•
•
•
•
•
17249
Mechanical Data
Case:
JEDEC DO-219AB (SMF
®
) Plastic case
Polarity:
Band denotes cathode end
Weight:
approx. 15 mg
Packaging codes-options:
GS18 / 10 K per 13" reel (8 mm tape), 50 k/box
GS08 / 3 K per 7" reel (8 mm tape), 30 k/box
Parts Table
Part
ES07B
ES07D
Ordering code
ES07B-GS18 or ES07B-GS08
ES07D-GS18 or ES07D-GS08
EB
ED
Marking
Remarks
Tape and Reel
Tape and Reel
Absolute Maximum Ratings
T
amb
= 25 °C, unless otherwise specified
Parameter
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current T
tp
= 105 °C
T
A
= 65 °C
1)
Peak forward surge current 8.3 ms single
half sine-wave
T
L
= 25 °C
Test condition
Part
ES07B
ES07D
ES07B
ES07D
ES07B
ES07D
Symbol
V
RRM
V
RRM
V
RMS
V
RMS
V
DC
V
DC
I
F(AV)
I
F(AV)
I
FSM
Value
100
200
70
140
100
200
1.2
0.5
30
Unit
V
V
V
V
V
V
A
A
A
1) Mounted on epoxy glass PCB with 3 x 3 mm, Cu pads (≥ 40
µm
thick)
Thermal Characteristics
T
amb
= 25 °C, unless otherwise specified
Parameter
Thermal resistance junction to ambient air
1)
Operating junction and storage
temperature range
1) Mounted on epoxy glass PCB with 3 x 3 mm, Cu pads (≥ 40
µm
thick)
Document Number 85737
Rev. 1.7, 13-Apr-05
www.vishay.com
1
Test condition
Symbol
R
thJA
T
J
, T
STG
Value
180
- 55 to + 150
Unit
K/W
°C
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