New Product
Si7145DP
Vishay Siliconix
P-Channel 30-V (D-S) MOSFET
FEATURES
I
D
(A)
- 60
d
- 60
d
Q
g
(Typ.)
129 nC
PRODUCT SUMMARY
V
DS
(V)
- 30
R
DS(on)
(Ω)
0.0026 at V
GS
= - 10 V
0.00375 at V
GS
= - 4.5 V
PowerPAK SO-8
•
Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET
®
Power MOSFET
• 100 % R
g
Tested
• 100 % UIS Tested
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
6.15 mm
S
1
2
3
4
D
8
7
6
5
D
D
D
S
S
G
S
5.15 mm
• Adaptor Switch
- Notebook Computers
G
Bottom View
D
P-Channel MOSFET
Ordering Information:
Si7145DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS
T
A
= 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
T
C
= 25 °C
T
A
= 25 °C
L = 0.1 mH
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
Symbol
V
DS
V
GS
Limit
- 30
± 20
- 60
d
- 60
d
- 36.5
a, b
- 29.2
a, b
- 100
- 60
d
- 5.6
a, b
- 50
125
104
66.6
6.25
a, b
4.0
a, b
- 55 to 150
260
Unit
V
Continuous Drain Current (T
J
= 150 °C)
I
D
Pulsed Drain Current
Continuous Source-Drain Diode Current
Avalanche Current
Single-Pulse Avalanche Energy
I
DM
I
S
I
AS
E
AS
A
mJ
Maximum Power Dissipation
P
D
W
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
e, f
T
J
, T
stg
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient
a, c
Maximum Junction-to-Case
t
≤
10 s
Steady State
Symbol
R
thJA
R
thJC
Typical
15
0.9
Maximum
20
1.2
Unit
°C/W
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. Maximum under Steady State conditions is 54 °C/W.
d. Package limited.
e. See Solder Profile
(www.vishay.com/doc?73257).
The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
f. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 64814
S09-0872-Rev. A, 18-May-09
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