VBPW34S, VBPW34SR
Silicon PIN Photodiode
Vishay Semiconductors
REEL DIMENSIONS FOR VBPW34S AND VBPW34SR
in millimeters
21732
SOLDER PROFILE
DRYPACK
300
250
255 °C
240 °C
217 °C
max. 260 °C
245 °C
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
Temperature (°C)
200
max. 30 s
150
max. 120 s
100
50
0
0
50
100
150
200
250
300
max. ramp
up
3 °C/s max. ramp down 6 °C/s
max. 100 s
FLOOR LIFE
Time between soldering and removing from MBB must not
exceed the time indicated in J-STD-020:
Moisture sensitivity: level 3
Floor life: 168 h
Conditions: T
amb
< 30 °C, RH < 60 %
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or
recommended conditions:
192 h at 40 °C (+ 5 °C), RH < 5 %
or
96 h at 60 °C (+ 5 °C), RH < 5 %.
19841
Time (s)
Fig. 8 - Lead (Pb)-free Reflow Solder Profile
acc. J-STD-020
Document Number: 81128
Rev. 1.1, 20-Apr-10
For technical questions, contact:
detectortechsupport@vishay.com
www.vishay.com
7
VISHAY [ VISHAY TELEFUNKEN ]
