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W25Q64FVSFIG 参数 Datasheet PDF下载

W25Q64FVSFIG图片预览
型号: W25Q64FVSFIG
PDF下载: 下载PDF文件 查看货源
内容描述: 与双核/四SPI和QPI 3V 64M位串行闪存 [3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI]
分类和应用: 闪存
文件页数/大小: 88 页 / 1207 K
品牌: WINBOND [ WINBOND ]
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W25Q64FV
7.2.30
Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down / Device
ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device ID
instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code “90h”
followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond (EFh)
and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown
in Figure 29. The Device ID values for the W25Q64FV is listed in Manufacturer and Device Identification
table. The instruction is completed by driving /CS high.
/CS
Mode 3
0
1
2
3
4
5
6
7
8
9
10
28
29
30
31
CLK
Mode 0
Instruction (90h)
DI
(IO
0
)
DO
(IO
1
)
High Impedance
23
22
Address (000000h)
21
3
2
1
0
*
*
= MSB
/CS
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
Mode 3
Mode 0
CLK
DI
(IO
0
)
DO
(IO
1
)
0
7
6
5
4
3
2
1
0
Manufacturer ID (EFh)
*
Device ID
Figure 29. Read Manufacturer / Device ID Instruction (SPI Mode)
- 57 -
Publication Release Date: December 19, 2011
Revision D