ISD1700系列
目录
1
2
3
4
5
6
概述..............................................................................................................3
FEATURES......................................................................................................................................4
BLOCK DIAGRAM...........................................................................................................................5
引脚CONFIGURATION............................................................................................................6
引脚说明.........................................................................................................................7
作战样式.............................................................................................................8
6.1独立（按钮）模式.......................................... .................................................. 0.8
6.2 SPI模式.................................................................................................................................8
7
时序图........................................................................................................................8
7.1独立操作..............................................................................................................8
7.2 SPI Operation.........................................................................................................................12
8
9
绝对最大额定值............................................... ................................................. 13
8.1工作条件.............................................................................................................13
电气特性................................................ ............................................. 14
9.1直流参数......................................................................................................................14
9.2交流Parameters.......................................................................................................................15
10
11
典型应用CIRCUITS.............................................................................................16
10.1良好的音频设计实践............................................. .................................................. 0.18
包装.................................................................................................................................19
11.1 28引脚8x13.4mm塑料薄型小尺寸封装（ TSOP ）类型1 - IQC .................... 19
11.2 28引脚300mil的塑料小外形集成电路（ SOIC ） ................................... ....... 20
11.3 28引脚600密耳厚的塑料双列直插式封装（ PDIP ） .................................... ........................ 21
11.4模具Information.......................................................................................................................21
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13
订购信息.........................................................................................................22
VERSION HISTORY......................................................................................................................23
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WINBOND [ WINBOND ]
