W TE
PO WE R SEM IC O ND UC TO R S
KBP005M – KBP10M
1.5A GLASS PASSIVATED BRIDGE RECTIFIER
Features
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Glass Passivated Die Construction
Low Forward Voltage Drop
High Current Capability
High Reliability
High Surge Current Capability
Ideal for Printed Circuit Boards
L
A
KBP
Dim
Min
Max
A
14.22
15.24
B
10.67
11.68
C
15.2
—
D
4.57
5.08
E
3.60
4.10
G
2.16
2.67
H
0.76
0.86
I
1.52
—
J
11.68
12.7
K
12.7
—
L
3.2 x 45° Typical
All Dimensions in mm
B
+
~
~
-
J
C
K
H
E
G
I
Mechanical Data
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Case: Molded Plastic
Terminals: Plated Leads Solderable per
MIL-STD-202, Method 208
Polarity: As Marked on Body
Weight: 1.7 grams (approx.)
Mounting Position: Any
Marking: Type Number
D
Maximum Ratings and Electrical Characteristics
Single Phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
KBP
005M
50
35
@T
A
=25°C unless otherwise specified
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
(Note 1)
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
KBP
01M
100
70
KBP
02M
200
140
KBP
04M
400
280
1.5
KBP
06M
600
420
KBP
08M
800
560
KBP
10M
1000
700
Unit
V
V
A
@T
A
= 50°C
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave superimposed on
rated load (JEDEC Method)
Forward Voltage (per element)
Peak Reverse Current
At Rated DC Blocking Voltage
Rating for Fusing (t<8.3ms)
Typical Junction Capacitance per element (Note 2)
Typical Thermal Resistance (Note 3)
Operating and Storage Temperature Range
@I
F
= 1.5A
@T
A
= 25°C
@T
A
= 100°C
I
FSM
V
FM
I
RM
I
2
t
C
j
R
JA
T
j,
T
STG
50
1.1
10
500
10
15
28
-55 to +150
A
V
µA
A
2
s
pF
K/W
°C
Note: 1. Leads maintained at ambient temperature at a distance of 9.5mm from the case.
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.
3. Thermal resistance junction to ambient mounted on PC board with 12mm
2
copper pad.
KBP005M – KBP10M
1 of 3
© 2002 Won-Top Electronics
WTE [ WON-TOP ELECTRONICS ]
