Package information - SOD523
Surface mounted, 2 pin package
Package outline
D
L1
c
Cathode
Mark
E1
E
L
b1
A2
A1
A
DIM
Millimeters
Min.
Max.
0.800
0.100
0.800
0.300
0.220
0.900
Inches
Min.
–
0.000
0.0236
0.0062
0.0031
0.0275
Max.
0.0314
0.0039
0.0314
0.0118
0.0086
0.0354
DIM
Millimeters
Min.
Max.
1.700
1.300
0.400
0.230
10°
-
Inches
Min.
0.0590
0.0433
0.0078
0.0066
4°
-
Max.
0.0669
0.0511
0.0157
0.0090
10°
-
A
A1
A2
b1
c
D
–
0.000
0.600
0.160
0.080
0.700
E
E1
L
L1
1.500
1.100
0.200
0.170
4°
-
-
Note:
Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Soldering footprint
1.4
0.055
0.4
0.016
0.4
0.016
mm
inches
© Zetex Semiconductors plc 2007