ADM2587EBRWZ-REEL7全新原装原理图各脚功能电路原理芯片引脚定义-中国IC网-芯三七

Signal and Power Isolated RS-485

Transceiver with ± ±5 ꢀk ꢁSꢂ Protection

AꢂM2582ꢁ/AꢂM2587ꢁ

FEATURES

FUNCTIONAL BLOCK DIAGRAM

V

ISOOUT

CC

Isolated RS-485/RS-422 transceiver, configurable as half or

full duplex

isoPower DC-TO-DC CONVERTER

isoPower® integrated isolated dc-to-dc converter

15 kV ESD protection on RS-485 input/output pins

Complies with ANSI/TIA/EIA-485-A-98 and ISO 8482:1987(E)

ADM2582E data rate: 16 Mbps

OSCILLATOR

RECTIFIER

V

ISOIN

REGULATOR

ADM2587E data rate: 500 kbps

5 V or 3.3 V operation

Connect up to 256 nodes on one bus

DIGITAL ISOLATION iCoupler

TRANSCEIVER

D

Y

Z

Open- and short-circuit, fail-safe receiver inputs

High common-mode transient immunity: >25 kV/μs

Thermal shutdown protection

Safety and regulatory approvals (pending)

UL recognition: 2500 V rms for 1 minute per UL 1577

VDE Certificates of Conformity

ENCODE

DECODE

ENCODE

TxD

DE

ENCODE

DECODE

A

B

RxD

R

DIN V VDE V 0884-10 (VDE V 0884-10):2006-12

V

_IORM= 560 V peak

RE

ADM2582E/ADM2587E

Operating temperature range: −40°C to +85°C

Highly integrated, 20-lead, wide-body SOIC package

GND

2

1

ISOLATION

BARRIER

Figure 1.

APPLICATIONS

Isolated RS-485/RS-422 interfaces

Industrial field networks

Multipoint data transmission systems

GENERAL DESCRIPTION

The ADM2582E/ADM2587E are fully integrated signal and

power isolated data transceivers with ±±5 kV ESD protection

and are suitable for high speed communication on multipoint

transmission lines. The ADM2582E/ADM2587E include an

integrated isolated dc-to-dc power supply, which eliminates the

need for an external dc-to-dc isolation block.

The ADM2582E/ADM2587E driver has an active high enable.

An active low receiver enable is also provided that causes the

receiver output to enter a high impedance state when disabled.

The devices have current limiting and thermal shutdown

features to protect against output short circuits and situations

where bus contention may cause excessive power dissipation.

The parts are fully specified over the industrial temperature

range and are available in a highly integrated, 20-lead, wide-

body SOIC package.

They are designed for balanced transmission lines and comply

with ANSI/TIA/EIA-485-A-98 and ISO 8482:±987(E).

The devices integrate Analog Devices, Inc., iCoupler® technology to

combine a 3-channel isolator, a three-state differential line driver, a

differential input receiver, and Analog Devices isoPower dc-to-

dc converter into a single package. The devices are powered by a

single 5 V or 3.3 V supply, realizing a fully integrated signal and

power isolated RS-485 solution.

The ADM2582E/ADM2587E contain isoPower technology that

uses high frequency switching elements to transfer power through

the transformer. Special care must be taken during printed circuit

board (PCB) layout to meet emissions standards. Refer to

Application Note AN-097±, Control of Radiated Emissions with

isoPower Devices, for details on board layout considerations.

Rev. 0

Information furnished by Analog Devices is believed to be accurate and reliable. However, no

responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other

rights of third parties that may result from its use. Specifications subject to change without notice. No

license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

Trademarks and registeredtrademarks arethe property of their respective owners.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.

Tel: 781.329.4700

Fax: 781.461.3113

www.analog.com

AꢂM2582ꢁ/AꢂM2587ꢁ

TABLꢁ OF CONTꢁNTS

Features .............................................................................................. ±

Test Circuits..................................................................................... ±2

Switching Characteristics .............................................................. ±3

Circuit Description......................................................................... ±4

Signal Isolation ........................................................................... ±4

Power Isolation ........................................................................... ±4

Truth Tables................................................................................. ±4

Thermal Shutdown .................................................................... ±4

Open- and Short-Circuit, Fail-Safe Receiver Inputs.............. ±4

DC Correctness and Magnetic Field Immunity........................... ±5

Applications Information.............................................................. ±6

PCB Layout ................................................................................. ±6

EMI Considerations................................................................... ±6

Insulation Lifetime..................................................................... ±6

Isolated Power Supply Considerations .................................... ±7

Typical Applications................................................................... ±9

Outline Dimensions....................................................................... 20

Ordering Guide .......................................................................... 20

Applications....................................................................................... ±

Functional Block Diagram .............................................................. ±

General Description......................................................................... ±

Revision History ............................................................................... 2

Specifications..................................................................................... 3

ADM2582E Timing Specifications ............................................ 4

ADM2587E Timing Specifications ............................................ 4

ADM2582E/ADM2587E Package Characteristics................... 4

ADM2582E/ADM2587E Regulatory Information .................. 5

ADM2582E/ADM2587E Insulation and Safety-Related

Specifications ................................................................................ 5

ADM2582E/ADM2587E VDE 0884 Insulation

Characteristics (Pending)............................................................ 5

Absolute Maximum Ratings............................................................ 6

ESD Caution.................................................................................. 6

Pin Configuration and Function Descriptions............................. 7

Typical Performance Characteristics ............................................. 8

REVISION HISTORY

9/09—Revision 0: Initial Version

Rev. 0 | Page 2 of 20

AꢂM2582ꢁ/AꢂM2587ꢁ

SPꢁCIFICATIONS

All voltages are relative to their respective ground; 3.0 ≤ V_CC≤ 5.5 V. All minimum/maximum specifications apply over the entire

recommended operation range, unless otherwise noted. All typical specifications are at T_A= 25°C, V_CC= 5 V unless otherwise noted.

Table 1.

Parameter

Symbol Min

Typ

Max

Unit

Test Conditions

ADM2587E SUPPLY CURRENT

Data Rate ≤ 500 kbps

I_CC

90

72

125

98

mA

V_CC= 3.3 V, 100 Ω load between Y and Z

V_CC= 5 V, 100 Ω load between Y and Z

V_CC= 3.3 V, 54 Ω load between Y and Z

V_CC= 5 V, 54 Ω load between Y and Z

120 Ω load between Y and Z

120

ADM2582E SUPPLY CURRENT

Data Rate = 16 Mbps

I_CC

150

230

mA

120 Ω load between Y and Z

54 Ω load between Y and Z

ISOLATED SUPPLY VOLTAGE

DRIVER

V_ISOUT

3.3

Differential Outputs

Differential Output Voltage, Loaded

|V_OD2

|

2.0

1.5

5.0

0.2

3.0

0.2

200

30

V

mA

μA

R_L= 100 Ω (RS-422), see Figure 23

R_L= 54 Ω (RS-485), see Figure 23

−7 V ≤ V_TEST1≤ 12 V, see Figure 24

R_L= 54 Ω or 100 Ω, see Figure 23

|V_OD3

Δ|V_OD| for Complementary Output States Δ|V_OD

|

Common-Mode Output Voltage

Δ|V_OC| for Complementary Output States

Short-Circuit Output Current

V_OC

Δ|V_OC|

I_OS

Output Leakage Current (Y, Z)

I_O

DE = 0 V, RE = 0 V, V_CC= 0 V or 3.6 V,

V_IN= 12 V

−30

μA

DE = 0 V, RE = 0 V, V_CC= 0 V or 3.6 V,

V_IN= −7 V

Logic Inputs DE, RE, TxD

Input Threshold Low

Input Threshold High

Input Current

V_IL

V_IH

I_I

0.3 × V_CC

−10

V

DE, RE, TxD

0.7 × V_CC

10

V

0.01

μA

RECEIVER

Differential Inputs

Differential Input Threshold Voltage

Input Voltage Hysteresis

Input Current (A, B)

V_TH

V_HYS

I_I

−200

−125

15

−30

125

mV

μA

kΩ

−7 V < V_CM< +12 V

V_OC= 0 V

DE = 0 V, V_CC= 0 V or 3.6 V, V_IN= 12 V

DE = 0 V, V_CC= 0 V or 3.6 V, V_IN= -7 V

−7 V < V_CM< +12 V

−100

96

Line Input Resistance

Logic Outputs

R_IN

Output Voltage Low

Output Voltage High

V_OL

V_OH

0.2

0.4

V

I_O= 1.5 mA, V_A− V_B= −0.2 V

I_O= −1.5 mA, V_A− V_B= 0.2 V

V_CC− 0.3 V_CC− 0.2

Short-Circuit Current

100

mA

COMMON-MODE TRANSIENT IMMUNITY¹

25

kV/μs V_CM= 1 kV, transient magnitude = 800 V

¹CM is the maximum common-mode voltage slew rate that can be sustained while maintaining specification-compliant operation. V_CMis the common-mode potential

difference between the logic and bus sides. The transient magnitude is the range over which the common-mode is slewed. The common-mode voltage slew rates

apply to both rising and falling common-mode voltage edges.

Rev. 0 | Page 3 of 20

AꢂM2582ꢁ/AꢂM2587ꢁ

ADM2582E TIMING SPECIFICATIONS

T_A= −40°C to +85°C.

Table 2.

Parameter

Symbol Min Typ Max Unit

Test Conditions

DRIVER

Maximum Data Rate

Propagation Delay, Low to High

Propagation Delay, High to Low

Output Skew

Rise Time/Fall Time

Enable Time

16

Mbps

ns

t_DPLH

t_DPHL

t_SKEW

t_DR, t_DF

t_ZL, t_ZH

t_LZ, t_HZ

63

64

1

100

8

15

120

150

R_L= 54 Ω, C_L1= C _L2= 100 pF, see Figure 25 and Figure 29

R_L= 54 Ω, C_L1= C_L2= 100 pF, see Figure 25 and Figure 29

R_L= 110 Ω, C_L= 50 pF, see Figure 26 and Figure 31

ns

Disable Time

RECEIVER

Propagation Delay, Low to High

Propagation Delay, High to Low

Output Skew¹

Enable Time

Disable Time

t_RPLH

t_RPHL

t_SKEW

t_ZL, t_ZH

t_LZ, t_HZ

94

95

1

110

12

15

ns

C_L= 15 pF, see Figure 27 and Figure 30

R_L= 1 kΩ, C_L= 15 pF, see Figure 28 and Figure 32

¹Guaranteed by design.

ADM2587E TIMING SPECIFICATIONS

T_A= −40°C to +85°C.

Table 3.

Parameter

Symbol

Min Typ Max

Unit

Test Conditions

DRIVER

Maximum Data Rate

Propagation Delay, Low to High t_DPLH

Propagation Delay, High to Low t_DPHL

Output Skew

Rise Time/Fall Time

Enable Time

500

250

kbps

ns

503

510

7

700

100

R_L= 54 Ω, C_L1= C _L2= 100 pF, see Figure 25 and Figure 29

R_L= 54 Ω, C_L1= C_L2= 100 pF, see Figure 25 and Figure 29

R_L= 110 Ω, C_L= 50 pF, see Figure 26 and Figure 31

t_SKEW

ns

t_DR, t_DF

t_ZL, t_ZH

t_LZ, t_HZ

200

1100 ns

2.5

200

μs

ns

Disable Time

RECEIVER

Propagation Delay, Low to High t_RPLH

Propagation Delay, High to Low t_RPHL

91

95

4

200

30

15

ns

C_L= 15 pF, see Figure 27 and Figure 30

R_L= 1 kΩ, C_L= 15 pF, see Figure 28 and Figure 32

Output Skew

Enable Time

Disable Time

t_SKEW

t_ZL, t_ZH

t_LZ, t_HZ

ADM2582E/ADM2587E PACKAGE CHARACTERISTICS

Table 4.

Parameter

Symbol

R_I-O

C_I-O

Min

Typ

10¹²

3

Max

Unit

Ω

pF

Test Conditions

Resistance (Input-to-Output)¹

Capacitance (Input-to-Output)¹

Input Capacitance²

f = 1 MHz

C_I

4

pF

Input IC Junction-to-Case Thermal Resistance

θ_JCI

33

°C/W

Thermocouple located at center of

package underside

Output IC Junction-to-Case Thermal Resistance

θ_JCO

28

°C/W

Thermocouple located at center of

package underside

¹Device considered a 2-terminal device: short together Pin 1 to Pin 10 and short together Pin 11 to Pin 20.

²Input capacitance is from any input data pin to ground.

Rev. 0 | Page 4 of 20

AꢂM2582ꢁ/AꢂM2587ꢁ

ADM2582E/ADM2587E REGULATORY INFORMATION

Table 5. Pending ADM2582E/ADM2587E Approvals

Organization Approval Type

Notes

UL

To be recognized under the Component

Recognition Program of Underwriters

Laboratories, Inc.

In accordance with UL 1577, each ADM2582E/ADM2587E is proof tested

by applying an insulation test voltage ≥ 3000 V rms for 1 second.

VDE

To be certified according to

In accordance with VDE 0884-10, each ADM2582E/ADM2587E is proof

DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 tested by applying an insulation test voltage ≥ 1050 V_PEAKfor 1 second.

ADM2582E/ADM2587E INSULATION AND SAFETY-RELATED SPECIFICATIONS

Table 6.

Parameter

Symbol Value

Unit

Conditions

Rated Dielectric Insulation Voltage

Minimum External Air Gap (Clearance)

2500

>8.0

V rms 1-minute duration

L(I01)

L(I02)

mm

Measured from input terminals to output terminals,

shortest distance through air

Measured from input terminals to output terminals,

shortest distance along body

Minimum External Tracking (Creepage)

>8.0

Minimum Internal Gap (Internal Clearance)

Tracking Resistance (Comparative Tracking Index)

Isolation Group

0.017 min mm

Insulation distance through insulation

DIN IEC 112/VDE 0303-1

Material Group (DIN VDE 0110: 1989-01, Table 1)

CTI

>175

IIIa

V

ADM2582E/ADM2587E VDE 0884 INSULATION CHARACTERISTICS (PENDING)

This isolator is suitable for basic electrical isolation only within the safety limit data. Maintenance of the safety data must be ensured by

means of protective circuits.

Table 7.

Description

Conditions

Symbol Characteristic Unit

CLASSIFICATIONS

Installation Classification per DIN VDE 0110 for

Rated Mains Voltage

≤150 V rms

≤300 V rms

≤400 V rms

I to IV

I to III

I to II

40/85/21

2

Climatic Classification

Pollution Degree

VOLTAGE

DIN VDE 0110, see Table 1

Maximum Working Insulation Voltage

Input-to-Output Test Voltage

Method b1

V_IORM

V_PR

560

V peak

V_IORM× 1.875 = V_PR, 100% production tested,

t_m= 1 sec, partial discharge < 5 pC

1050

Method a

After Environmental Tests, Subgroup 1

After Input and/or Safety Test,

Subgroup 2/Subgroup 3

V_IORM× 1.6 = V_PR, t_m= 60 sec, partial discharge < 5 pC

V_IORM× 1.2 = V_PR, t_m= 60 sec, partial discharge < 5 pC

896

672

V peak

Highest Allowable Overvoltage

SAFETY-LIMITING VALUES

Case Temperature

Input Current

Output Current

Transient overvoltage, t_TR= 10 sec

V_TR

4000

V peak

Maximum value allowed in the event of a failure

T_S

I_S, _INPUT

I_S, _OUTPUT335

R_S

>10⁹

150

265

°C

mA

Ω

Insulation Resistance at T_S

V_IO= 500 V

Rev. 0 | Page 5 of 20

AꢂM2582ꢁ/AꢂM2587ꢁ

ABSOLUTꢁ MAXIMUM RATINGS

T_A= 25°C, unless otherwise noted. All voltages are relative to

their respective ground.

Table 9. Maximum Continuous Working Voltage¹

Parameter

Max Unit

Reference Standard

AC Voltage

Bipolar Waveform

Table 8.

Parameter

424

600

V peak 50-year minimum

lifetime

Rating

V_CC

−0.5 V to +7 V

−0.5 V to V_DD+ 0.5 V

−9 V to +14 V

−40°C to +85°C

−55°C to +150°C

15 kV

Unipolar Waveform

Basic Insulation

Digital Input Voltage (DE, RE, TxD)

Digital Output Voltage (RxD)

Driver Output/Receiver Input Voltage

Operating Temperature Range

Storage Temperature Range

V peak Maximum approved

working voltage per

IEC 60950-1 (pending)

Reinforced Insulation 560

V peak Maximum approved

working voltage per

IEC 60950-1 and

ESD (Human Body Model) on

A, B, Y, and Z pins

VDE V 0884-10

(pending)

2 kV

ESD (Human Body Model) on Other Pins

Lead Temperature

Soldering (10 sec)

Vapor Phase (60 sec)

Infrared (15 sec)

DC Voltage

Basic Insulation

600

V peak Maximum approved

working voltage per

260°C

215°C

220°C

IEC 60950-1(pending)

Reinforced Insulation 560

V peak Maximum approved

working voltage per

IEC 60950-1 and

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

VDE V 0884-10

(pending)

¹Refers to continuous voltage magnitude imposed across the isolation

barrier. See the Insulation Lifetime section for more details.

ESD CAUTION

Rev. 0 | Page 6 of 20

AꢂM2582ꢁ/AꢂM2587ꢁ

PIN CONFIGURATION ANꢂ FUNCTION ꢂꢁSCRIPTIONS

GND

1

2

3

4

5

6

7

8

9

20 GND

1

2

V

19

18

17

V

ISOIN

CC

GND

A

B

1

ADM2582E

ADM2587E

RxD

RE

16 GND

2

TOP VIEW

DE

15

Z

(Not to Scale)

TxD

14 GND

2

V

13

12

Y

V

CC

GND

1

ISOOUT

GND 10

1

11 GND

2

NOTES

1. PIN 12 AND PIN 19 MUST BE

CONNECTED EXTERNALLY.

Figure 2. Pin Configuration

Table 10. Pin Function Description

Pin No.

Mnemonic

Description

1

2

GND₁

V_CC

Ground, Logic Side.

Logic Side Power Supply. It is recommended that a 0.1 μF and a 10 μF decoupling capacitor be fitted between

Pin 2 and Pin 1.

3

4

GND₁

RxD

Ground, Logic Side.

Receiver Output Data. This output is high when (A − B) > 200 mV and low when (A − B) < –200 mV.

The output is tristated when the receiver is disabled, that is, when RE is driven high.

5

RE

Receiver Enable Input. This is an active-low input. Driving this input low enables the receiver; driving it

high disables the receiver.

6

7

8

DE

TxD

V_CC

Driver Enable Input. Driving this input high enables the driver; driving it low disables the driver.

Driver Input. Data to be transmitted by the driver is applied to this input.

Logic Side Power Supply. It is recommended that a 0.1 μF and a 0.01 μF decoupling capacitor be fitted between

Pin 8 and Pin 7.

9

GND₁

GND₂

V_ISOOUT

Ground, Logic Side.

Ground, Bus Side.

10

11

12

Isolated Power Supply Output. This pin must be connected externally to V_ISOIN. It is recommended that a reservoir

capacitor of 10 μF and a decoupling capacitor of 0.1 μF be fitted between Pin 12 and Pin 11.

13

14

15

16

17

18

19

Y

Driver Noninverting Output

Ground, Bus Side.

Driver Inverting Output

Ground, Bus Side.

Receiver Inverting Input.

Receiver Noninverting Input.

Isolated Power Supply Input. This pin must be connected externally to V_ISOOUT. It is recommended that a

0.1 μF and a 0.01 μF decoupling capacitor be fitted between Pin 19 and Pin 20.

GND₂

Z

GND₂

B

A

V_ISOIN

20

GND₂

Ground, Bus Side.

Rev. 0 | Page 7 of 20

AꢂM2582ꢁ/AꢂM2587ꢁ

TYPICAL PꢁRFORMANCꢁ CHARACTꢁRISTICS

180

120

100

80

60

40

20

0

160

R

= 54Ω

L

140

120

100

80

R

= 54Ω

L

R

= 120Ω

L

= 120Ω

L

NO LOAD

60

NO LOAD

40

20

0

–40

–15

10

35

60

85

–40

–15

10

35

60

85

TEMPERATURE (°C)

Figure 3. ADM2582E Supply Current (I_CC) vs. Temperature

(Data Rate = 16 Mbps, DE = 3.3 V, V_CC= 3.3 V)

Figure 6. ADM2587E Supply Current (I_CC) vs. Temperature

(Data Rate = 500 kbps, DE = 3.3 V, V_CC= 3.3 V)

72

70

68

66

64

62

60

58

56

54

52

50

140

120

100

80

R

= 54Ω

L

R

= 120Ω

t_DPHL

t_DPLH

60

NO LOAD

40

20

0

–40

–15

10

35

60

85

–15

10

35

60

TEMPERATURE (°C)

Figure 7. ADM2582E Differential Driver Propagation Delay vs. Temperature

Figure 4. ADM2582E Supply Current (I_CC) vs. Temperature

(Data Rate = 16 Mbps, DE = 5 V, V_CC= 5 V)

600

580

560

140

120

100

80

60

40

20

0

R

= 54Ω

L

540

t_DPLH

520

t_DPHL

= 120Ω

L

500

480

460

440

420

400

NO LOAD

–40

–15

10

35

60

85

–40

–15

10

35

60

TEMPERATURE (°C)

Figure 8. ADM2587E Differential Driver Propagation Delay vs. Temperature

Figure 5. ADM2587E Supply Current (I_CC) vs. Temperature

(Data Rate = 500 kbps, DE = 5 V, V_CC= 5 V)

Rev. 0 | Page 8 of 20

AꢂM2582ꢁ/AꢂM2587ꢁ

60

50

40

30

20

10

0

TxD

1

Z

Y

3

CH1 2.0V CH2 2.0V

CH3 2.0V

M10.00ns

A

CH1

1.28V

0

1

2

3

4

5

OUTPUT VOLTAGE (V)

Figure 9. ADM2582E Driver Propagation Delay

Figure 12. Receiver Output Current vs. Receiver Output Low Voltage

4.75

4.74

4.73

4.72

4.71

4.70

4.69

4.68

4.67

TxD

1

Z

Y

3

4.66

4.65

CH1 2.0V CH2 2.0V

CH3 2.0V

M200ns

A CH1

2.56V

–40

–15

10

35

60

85

TEMPERATURE (°C)

Figure 10. ADM2587E Driver Propagation Delay

Figure 13. Receiver Output High Voltage vs. Temperature

0

0.32

–10

–20

–30

–40

–50

–60

–70

0.30

0.28

0.26

0.24

0.22

0.20

0

1

2

3

4

5

–40

–15

10

35

60

85

OUTPUT VOLTAGE (V)

TEMPERATURE (°C)

Figure 11. Receiver Output Current vs. Receiver Output High Voltage

Figure 14. Receiver Output Low Voltage vs. Temperature

Rev. 0 | Page 9 of 20

AꢂM2582ꢁ/AꢂM2587ꢁ

100

99

98

97

96

95

94

93

92

91

90

B

A

t_RPHL

1

RxD

t_RPLH

3

CH1 2.0V CH2 2.0V

CH3 2.0V

M10.00ns

A

CH1

2.56V

–40

–15

10

35

60

85

TEMPERATURE (°C)

Figure 15. ADM2582E Receiver Propagation Delay

Figure 18. ADM2587E Receiver Propagation Delay vs. Temperature

3.33

3.32

3.31

3.30

A

B

1

3.29

NO LOAD

R

= 120Ω

= 54Ω

3.28

3.27

3.26

L

RxD

3

CH1 2.0V CH2 2.0V

CH3 2.0V

M10.00ns

A

CH1

2.56V

–40

–15

10

35

60

85

TEMPERATURE (°C)

Figure 19. ADM2582E Isolated Supply Voltage vs. Temperature

(V_CC= 3.3 V, Data Rate = 16 Mbps)

Figure 16. ADM2587E Receiver Propagation Delay

98

3.36

3.35

3.34

3.33

3.32

3.31

3.30

3.29

97

96

95

94

93

92

t_RPHL

t_RPLH

NO LOAD

3.28

3.27

3.26

R

= 120Ω

= 54Ω

L

–40

–15

10

35

60

85

–40

–15

10

35

60

85

TEMPERATURE (°C)

Figure 17. ADM2582E Receiver Propagation Delay vs. Temperature

Figure 20. ADM2582E Isolated Supply Voltage vs. Temperature

(V_CC= 5 V, Data Rate = 16 Mbps)

Rev. 0 | Page 10 of 20

AꢂM2582ꢁ/AꢂM2587ꢁ

60

50

40

30

20

10

0

40

35

30

25

20

15

10

5

R

= 54Ω

L

R

= 54Ω

L

= 120Ω

L

= 120Ω

L

NO LOAD

0

–40

–15

10

35

60

85

–15

10

35

60

85

TEMPERATURE (°C)

Figure 21. ADM2582E Isolated Supply Current vs. Temperature

(V_CC= 3.3 V, Data Rate = 16 Mbps)

Figure 22. ADM2587E Isolated Supply Current vs. Temperature

(V_CC= 3.3 V, Data Rate = 500 kbps)

Rev. 0 | Page 11 of 20

AꢂM2582ꢁ/AꢂM2587ꢁ

TꢁST CIRCUITS

Y

R

L

2

TxD

V

OD2

V

CC

OUT

R

L

Y

Z

R

110Ω

Z

2

L

V

OC

TxD

DE

S1

S2

C

L

50pF

Figure 23. Driver Voltage Measurement

Figure 26. Driver Enable/Disable

Y

375Ω

A

V

TxD

60Ω

OD3

375Ω

V

Z

OUT

V

TEST

RE

B

C

L

Figure 24. Driver Voltage Measurement

Figure 27. Receiver Propagation Delay

V

Y

+1.5V

–1.5V

CC

C

L

S1

TxD

R

L

R

L

S2

Z

RE

C

V

OUT

L

RE IN

Figure 25. Driver Propagation Delay

Figure 28. Receiver Enable/Disable

Rev. 0 | Page 12 of 20

AꢂM2582ꢁ/AꢂM2587ꢁ

SWITCHING CHARACTꢁRISTICS

V

CC

V

/2

V

/2

CC

0V

Z

t_DPLH

t_DPHL

V

CC

0.5V

t_ZL

0.5V

CC

1/2V

DE

O

V

O

0V

t_LZ

2.3V

Y

Y, Z

+V

V

OL

+ 0.5V

– 0.5V

O

90% POINT

V

= V – V

(Y) (Z)

V

DIFF

OL

V

DIFF

t_ZH

t_HZ

V

10% POINT

OH

–V

O

V

OH

t_DF

t_DR

t

= │t

– t

│

SKEW

DPHL

DPLH

Figure 29. Driver Propagation Delay, Rise/Fall Timing

Figure 31. Driver Enable/Disable Timing

0.7V

0.3V

CC

0.5V

t_ZL

0.5V

CC

RE

A – B

0V

t_LZ

1.5V

RO

V

+ 0.5V

t_RPLH

t_RPHL

OL

OUTPUT LOW

OUTPUT HIGH

V

OL

V

OH

t_ZH

t_HZ

V

OH

RxD

1.5V

t_SKEW= |t_RPLH

–

t_RPHL

|

– 0.5V

OH

RO

0V

OL

Figure 32. Receiver Enable/Disable Timing

Figure 30. Receiver Propagation Delay

Rev. 0 | Page 13 of 20

AꢂM2582ꢁ/AꢂM2587ꢁ

CIRCUIT ꢂꢁSCRIPTION

Table 13. Receiving (see Table 11 for Abbreviations)

Inputs Output

SIGNAL ISOLATION

The ADM2582E/ADM2587E signal isolation is implemented on

the logic side of the interface. The part achieves signal isolation

by having a digital isolation section and a transceiver section

(see Figure ±). Data applied to the TxD and DE pins and referenced

to logic ground (GND_±) are coupled across an isolation barrier

to appear at the transceiver section referenced to isolated ground

(GND₂). Similarly, the single-ended receiver output signal,

referenced to isolated ground in the transceiver section, is

coupled across the isolation barrier to appear at the RXD pin

referenced to logic ground.

A − B

RE

RxD

> −0.03 V

< −0.2 V

−0.2 V < A − B < −0.03 V

L or NC

H

L

X

H

Z

H

L

Inputs open

X

L or NC

THERMAL SHUTDOWN

POWER ISOLATION

The ADM2582E/ADM2587E contain thermal shutdown circuitry

that protects the parts from excessive power dissipation during

fault conditions. Shorting the driver outputs to a low impedance

source can result in high driver currents. The thermal sensing

circuitry detects the increase in die temperature under this

condition and disables the driver outputs. This circuitry is

designed to disable the driver outputs when a die temperature

of ±50°C is reached. As the device cools, the drivers are reenabled

at a temperature of ±40°C.

The ADM2582E/ADM2587E power isolation is implemented

using an isoPower integrated isolated dc-to-dc converter. The

dc-to-dc converter section of the ADM2582E/ADM2587E works

on principles that are common to most modern power supplies.

It is a secondary side controller architecture with isolated pulse-

width modulation (PWM) feedback. V^CCpower is supplied to

an oscillating circuit that switches current into a chip-scale air

core transformer. Power transferred to the secondary side is

rectified and regulated to 3.3 V. The secondary (V^ISO) side

controller regulates the output by creating a PWM control

signal that is sent to the primary (V^CC) side by a dedicated

iCoupler data channel. The PWM modulates the oscillator

circuit to control the power being sent to the secondary side.

Feedback allows for significantly higher power and efficiency.

OPEN- AND SHORT-CIRCUIT, FAIL-SAFE RECEIVER

INPUTS

The receiver inputs have open- and short-circuit, fail-safe

features that ensure that the receiver output is high when the

inputs are open or shorted. During line-idle conditions, when no

driver on the bus is enabled, the voltage across a terminating

resistance at the receiver input decays to 0 V. With traditional

transceivers, receiver input thresholds specified between −200 mV

and +200 mV mean that external bias resistors are required on the

A and B pins to ensure that the receiver outputs are in a known

state. The short-circuit, fail-safe receiver input feature eliminates

the need for bias resistors by specifying the receiver input

threshold between −30 mV and −200 mV. The guaranteed negative

threshold means that when the voltage between A and B decays

to 0 V, the receiver output is guaranteed to be high.

TRUTH TABLES

The truth tables in this section use the abbreviations found in

Table ±±.

Table 11. Truth Table Abbreviations

Letter

Description

H

L

High level

Low level

X

Don’t care

Z

NC

High impedance (off)

Disconnected

Table 12. Transmitting (see Table 11 for Abbreviations)

Inputs

Outputs

DE

H

L

X

L

TxD

Y

H

L

Z

L

H

L

X

H

Z

X

Rev. 0 | Page 14 of 20

AꢂM2582ꢁ/AꢂM2587ꢁ

100

10

DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY

The digital signals transmit across the isolation barrier using

iCoupler technology. This technique uses chip-scale transformer

windings to couple the digital signals magnetically from one

side of the barrier to the other. Digital inputs are encoded into

waveforms that are capable of exciting the primary transformer

winding. At the secondary winding, the induced waveforms are

decoded into the binary value that was originally transmitted.

1

0.1

Positive and negative logic transitions at the isolator input cause

narrow (~± ns) pulses to be sent to the decoder via the transformer.

The decoder is bistable and is, therefore, either set or reset by

the pulses, indicating input logic transitions. In the absence of

logic transitions at the input for more than ± μs, periodic sets of

refresh pulses indicative of the correct input state are sent to

ensure dc correctness at the output. If the decoder receives no

internal pulses of more than approximately 5 ꢀs, the input side

is assumed to be unpowered or nonfunctional, in which case,

the isolator output is forced to a default state by the watchdog

timer circuit.

0.01

0.001

1k

10k

100k

1M

10M

100M

MAGNETIC FIELD FREQUENCY (Hz)

Figure 33. Maximum Allowable External Magnetic Flux Density

For example, at a magnetic field frequency of ± MHz, the

maximum allowable magnetic field of 0.2 kgauss induces a

voltage of 0.25 V at the receiving coil. This is about 50% of the

sensing threshold and does not cause a faulty output transition.

Similarly, if such an event occurs during a transmitted pulse

(and is of the worst-case polarity), it reduces the received pulse

from >±.0 V to 0.75 V, which is still well above the 0.5 V sensing

threshold of the decoder.

This situation should occur in the ADM2582E/ADM2587E devices

only during power-up and power-down operations. The limitation

on the ADM2582E/ADM2587E magnetic field immunity is set

by the condition in which induced voltage in the transformer

receiving coil is sufficiently large to either falsely set or reset the

decoder. The following analysis defines the conditions under

which this can occur.

The preceding magnetic flux density values correspond

to specific current magnitudes at given distances from the

ADM2582E/ADM2587E transformers. Figure 34 expresses

these allowable current magnitudes as a function of frequency

for selected distances. As shown in Figure 34, the ADM2582E/

ADM2587E are extremely immune and can be affected only by

extremely large currents operated at high frequency very close

to the component. For the ± MHz example, a 0.5 kA current must

be placed 5 mm away from the ADM2582E/ADM2587E to affect

The 3.3 V operating condition of the ADM2582E/ADM2587E

is examined because it represents the most susceptible mode of

operation. The pulses at the transformer output have an amplitude

of >±.0 V. The decoder has a sensing threshold of about 0.5 V,

thus establishing a 0.5 V margin in which induced voltages can

be tolerated. The voltage induced across the receiving coil is

given by

component operation.

1k

V = (−dβ/dt)Σπr_n2; n = ±, 2, … , N

DISTANCE = 1m

100

where:

β is magnetic flux density (gauss).

N is the number of turns in the receiving coil.

r_nis the radius of the nth turn in the receiving coil (cm).

10

DISTANCE = 100mm

Given the geometry of the receiving coil in the ADM2582E/

ADM2587E and an imposed requirement that the induced

voltage be, at most, 50% of the 0.5 V margin at the decoder, a

maximum allowable magnetic field is calculated as shown in

Figure 33.

1

DISTANCE = 5mm

0.1

0.01

1k

10k

100k

1M

10M

100M

MAGNETIC FIELD FREQUENCY (Hz)

Figure 34. Maximum Allowable Current for Various Current-to-

ADM2582E/ADM2587E Spacings

Note that in combinations of strong magnetic field and high

frequency, any loops formed by printed circuit board (PCB)

traces can induce error voltages sufficiently large to trigger the

thresholds of succeeding circuitry. Take care in the layout of

such traces to avoid this possibility.

Rev. 0 | Page 15 of 20

AꢂM2582ꢁ/AꢂM2587ꢁ

APPLICATIONS INFORMATION

The ADM2582E/ADM2587E dissipate approximately 650 mW

of power when fully loaded. Because it is not possible to apply

a heat sink to an isolation device, the devices primarily depend

on heat dissipation into the PCB through the GND pins. If the

devices are used at high ambient temperatures, provide a thermal

path from the GND pins to the PCB ground plane. The board

layout in Figure 35 shows enlarged pads for Pin ±, Pin 3, Pin 9,

Pin ±0, Pin ±±, Pin ±4, Pin ±6, and Pin 20. Implement multiple

vias from the pad to the ground plane to reduce the temperature

inside the chip significantly. The dimensions of the expanded

pads are at the discretion of the designer and dependent on the

available board space.

PCB LAYOUT

The ADM2582E/ADM2587E isolated RS-422/RS-485 transceiver

contains an isoPower integrated dc-to-dc converter, requiring

no external interface circuitry for the logic interfaces. Power

supply bypassing is required at the input and output supply pins

(see Figure 35). The power supply section of the ADM2582E/

ADM2587E uses an ±80 MHz oscillator frequency to pass power

efficiently through its chip-scale transformers. In addition, the

normal operation of the data section of the iCoupler introduces

switching transients on the power supply pins.

Bypass capacitors are required for several operating frequencies.

Noise suppression requires a low inductance, high frequency

capacitor, whereas ripple suppression and proper regulation

require a large value capacitor. These capacitors are connected

between Pin ± (GND_±) and Pin 2 (V_CC) and Pin 8 (V_CC) and

Pin 9 (GND_±) for V_CC. The V_ISOINand V_ISOOUTcapacitors are

connected between Pin ±± (GND₂) and Pin ±2 (V_ISOOUT) and

Pin ±9 (V_ISOIN) and Pin 20 (GND₂). To suppress noise and reduce

ripple, a parallel combination of at least two capacitors is required.

The recommended capacitor values are 0.± μF and ±0 μF. The

recommended best practice is to use a very low inductance

ceramic capacitor, or its equivalent, for the smaller value. The

total lead length between both ends of the capacitor and the

input power supply pin should not exceed ±0 mm.

EMI CONSIDERATIONS

The dc-to-dc converter section of the ADM2582E/ADM2587E

components must, of necessity, operate at very high frequency

to allow efficient power transfer through the small transformers.

This creates high frequency currents that can propagate in circuit

board ground and power planes, causing edge and dipole radiation.

Grounded enclosures are recommended for applications that use

these devices. If grounded enclosures are not possible, good RF

design practices should be followed in the layout of the PCB.

See Application Note AN-097±, Control of Radiated Emissions

with isoPower Devices, for more information.

INSULATION LIFETIME

All insulation structures eventually break down when subjected to

voltage stress over a sufficiently long period. The rate of insulation

degradation is dependent on the characteristics of the voltage

waveform applied across the insulation. Analog Devices conducts

an extensive set of evaluations to determine the lifetime of the

insulation structure within the ADM2582E/ADM2587E.

GND

1

2

20

19

18

17

16

15

14

13

12

11

GND

2

1

V

ISOIN

CC

GND

3

A

B

1

RxD

RE

4

5

GND

Z

2

DE

6

TxD

7

GND

Y

2

V

8

CC

Accelerated life testing is performed using voltage levels higher

than the rated continuous working voltage. Acceleration factors for

several operating conditions are determined, allowing calculation

of the time to failure at the working voltage of interest. The values

shown in Table 9 summarize the peak voltages for 50 years of

service life in several operating conditions. In many cases, the

working voltage approved by agency testing is higher than the

50-year service life voltage. Operation at working voltages higher

than the service life voltage listed leads to premature insulation

failure.

GND

9

V

ISOOUT

1

GND

10

GND

2

Figure 35. Recommended PCB Layout

In applications involving high common-mode transients, ensure

that board coupling across the isolation barrier is minimized.

Furthermore, design the board layout such that any coupling

that does occur equally affects all pins on a given component

side. Failure to ensure this can cause voltage differentials between

pins exceeding the absolute maximum ratings for the device,

thereby leading to latch-up and/or permanent damage.

The insulation lifetime of the ADM2582E/ADM2587E depends

on the voltage waveform type imposed across the isolation barrier.

The iCoupler insulation structure degrades at different rates,

depending on whether the waveform is bipolar ac, unipolar ac,

or dc. Figure 36, Figure 37, and Figure 38 illustrate these different

isolation voltage waveforms.

Bipolar ac voltage is the most stringent environment. A 50-year

operating lifetime under the bipolar ac condition determines

the Analog Devices recommended maximum working voltage.

Rev. 0 | Page 16 of 20

AꢂM2582ꢁ/AꢂM2587ꢁ

In the case of unipolar ac or dc voltage, the stress on the insulation

is significantly lower. This allows operation at higher working

voltages while still achieving a 50-year service life. The working

voltages listed in Table 9 can be applied while maintaining the

50-year minimum lifetime, provided the voltage conforms to either

the unipolar ac or dc voltage cases. Any crossinsulation voltage

waveform that does not conform to Figure 37 or Figure 38 should

be treated as a bipolar ac waveform, and its peak voltage should

be limited to the 50-year lifetime voltage value listed in Table 9.

RATED PEAK VOLTAGE

ISOLATED POWER SUPPLY CONSIDERATIONS

The typical output voltage of the integrated isoPower dc-to-dc

isolated supply is 3.3 V. The isolated supply in the ADM2587E

is capable of supplying a current of 55 mA when the junction

temperature of the device is kept below ±20°C. It is important

to note that the current available on the V_ISOOUTpin is the total

current available and includes the current required to supply the

internal RS-485 circuitry.

The ADM2587E can typically supply ±5 mA externally on

V

_ISOOUTwhen the driver is switching at 500 kbps loaded with 54 Ω,

0V

while the junction temperature of the part is less than ±20°C.

Table 14. Typical Maximum External Current Available

Figure 36. Bipolar AC Waveform

on V_ISOOUT

RATED PEAK VOLTAGE

External Load

Current (mA)

R_T

System Configuration

0V

15

54 Ω

Double terminated bus with

R_T= 110 Ω

Single terminated bus

Unterminated bus

Figure 37. DC Waveform

RATED PEAK VOLTAGE

29

46

120 Ω

Unloaded

The ADM2582E typically has no current available externally

on V_ISOOUT

0V

.

NOTES

1. THE VOLTAGE IS SHOWN AS SINUSODIAL FOR ILLUSTRATION

PURPOSES ONLY. IT IS MEANT TO REPRESENT ANY VOLTAGE

WAVEFORM VARYING BETWEEN 0 AND SOME LIMITING VALUE.

THE LIMITING VALUE CAN BE POSITIVE OR NEGATIVE, BUT THE

VOLTAGE CANNOT CROSS 0V.

When external current is drawn from the V_ISOOUTpin, there is

an increased risk of generating radiated emissions due to the

high frequency switching elements used in the isoPower dc to-

dc converter. Special care must be taken during PCB layout to

meet emissions standards. See Application Note AN-097±,

Control of Radiated Emissions with isoPower Devices, for details

on board layout considerations.

Figure 38. Unipolar AC Waveform

V

CC

V

EXTERNAL

LOAD

V

ISOOUT

CC

isoPower DC-TO-DC CONVERTER

GND

1

OSCILLATOR

RECTIFIER

GND

2

V

ISOIN

REGULATOR

TRANSCEIVER

DIGITAL ISOLATION iCoupler

Y

TxD

DE

500kbps

ENCODE

DECODE

ENCODE

D

Z

V

CC

R

T

ENCODE

DECODE

A

B

RxD

RE

R

ADM2582E/ADM2587E

ISOLATION

BARRIER

GND

2

1

Figure 39. ADM2587E Typical Maximum External Current Measurements

Rev. 0 | Page 17 of 20

AꢂM2582ꢁ/AꢂM2587ꢁ

3.3V/5V POWER

SUPPLY

100nF

10µF

100nF

10nF

100nF

10µF

V

CC

ISOOUT

V

CC

isoPower DC-TO-DC CONVERTER

OSCILLATOR

RECTIFIER

V

ISOIN

100nF 10nF

REGULATOR

DIGITAL ISOLATION

ENCODE

i

Coupler

TRANSCEIVER

D

Y

TxD

DE

R

DECODE

ENCODE

Z

T

MICROCONTROLLER

AND UART

ENCODE

DECODE

A

B

RxD

R

T

RE

ADM2582E/ADM2587E

GND

2

1

ISOLATION

BARRIER

GND

1

Figure 40. Example Circuit Diagram Using the ADM2582E/ADM2587E

Figure 40 is an example of a circuit diagram using the ADM2582E/ADM2587E.

Rev. 0 | Page 18 of 20

AꢂM2582ꢁ/AꢂM2587ꢁ

TYPICAL APPLICATIONS

Figure 4± and Figure 42 show typical applications of the ADM2582E/

ADM2587E in half duplex and full duplex RS-485 network

configurations. Up to 256 transceivers can be connected to the

RS-485 bus. To minimize reflections, terminate the line at the

receiving end in its characteristic impedance, and keep stub

lengths off the main line as short as possible. For half-duplex

operation, this means that both ends of the line must be

terminated because either end can be the receiving end.

MAXIMUM NUMBER OF TRANSCEIVERS ON BUS = 256

ADM2582E/

ADM2587E

ADM2582E/

ADM2587E

A

B

A

RxD

R

B

RE

DE

R

T

R

T

DE

Z

Y

Z

TxD

D

Y

A

B

Z

Y

A

B

Z

Y

R

D

ADM2582E/

ADM2587E

ADM2582E/

ADM2587E

RxD RE DE TxD

NOTES

1. R IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE.

T

2. ISOLATION NOT SHOWN.

Figure 41. ADM2582E/ADM2587E Typical Half Duplex RS-485 Network

MAXIMUM NUMBER OF NODES = 256

MASTER

R

SLAVE

A

B

Z

Y

Z

RxD

RE

D

TxD

DE

R

T

B

A

DE

RE

R

T

D

TxD

R

RxD

Y

ADM2582E/

ADM2587E

ADM2582E/

ADM2587E

A

B

Z

Y

A

B

Z

Y

SLAVE

R

D

ADM2582E/

ADM2587E

ADM2582E/

ADM2587E

RxD RE DE TxD

NOTES

1. R IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE.

T

2. ISOLATION NOT SHOWN.

Figure 42. ADM2582E/ADM2587E Typical Full Duplex RS-485 Network

Rev. 0 | Page 19 of 20

AꢂM2582ꢁ/AꢂM2587ꢁ

OUTLINꢁ ꢂIMꢁNSIONS

13.00 (0.5118)

12.60 (0.4961)

20

1

11

10

7.60 (0.2992)

7.40 (0.2913)

10.65 (0.4193)

10.00 (0.3937)

0.75 (0.0295)

0.25 (0.0098)

45°

2.65 (0.1043)

2.35 (0.0925)

0.30 (0.0118)

0.10 (0.0039)

8°

0°

COPLANARITY

0.10

SEATING

PLANE

0.51 (0.0201)

0.31 (0.0122)

1.27 (0.0500)

0.40 (0.0157)

1.27

(0.0500)

BSC

0.33 (0.0130)

0.20 (0.0079)

COMPLIANT TO JEDEC STANDARDS MS-013-AC

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

Figure 43. 20-Lead Standard Small Outline Package [SOIC_W]

Wide Body

(RW-20)

Dimensions shown in millimeters and (inches)

ORDERING GUIDE

Model

Data Rate (Mbps)

Temperature Range

−40°C to +85°C

Package Description

20-Lead SOIC_W

Package Option

RW-20

ADM2582EBRWZ¹

ADM2582EBRWZ-REEL7¹

ADM2587EBRWZ¹

ADM2587EBRWZ-REEL7¹

EVAL-ADM2582EEBZ¹

EVAL-ADM2587EEBZ¹

16

0.5

RW-20

ADM2582E Evaluation Board

ADM2587E Evaluation Board

¹Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D08111-0-9/09(0)

Rev. 0 | Page 20 of 20

型号:	ADM2587EBRWZ-REEL7
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Active
IHS 制造商：	ROCHESTER ELECTRONICS LLC
零件包装代码：	SOIC
包装说明：	ROHS COMPLIANT, MS-013-AC, SOIC-20
针数：	20
Reach Compliance Code：	unknown
风险等级：	5.62
差分输出：	YES
驱动器位数：	1
输入特性：	DIFFERENTIAL SCHMITT TRIGGER
接口集成电路类型：	LINE TRANSCEIVER
接口标准：	EIA-485-A; TIA-485-A; ISO 8482E
JESD-30 代码：	R-PDSO-G20
JESD-609代码：	e3
长度：	12.8 mm
湿度敏感等级：	NOT APPLICABLE
功能数量：	1
端子数量：	20
最高工作温度：	85 °C
最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
峰值回流温度（摄氏度）：	260
最大接收延迟：	200 ns
接收器位数：	1
座面最大高度：	2.65 mm
最大供电电压：	5.5 V
最小供电电压：	3 V
标称供电电压：	3.3 V
表面贴装：	YES
温度等级：	INDUSTRIAL
端子面层：	MATTE TIN
端子形式：	GULL WING
端子节距：	1.27 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	40
最大传输延迟：	700 ns
宽度：	7.5 mm

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