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产品型号ADXL335BCPZ-RL7的概述

ADXL335BCPZ-RL7芯片概述 ADXL335BCPZ-RL7是一款由Analog Devices, Inc.制造的微型三轴加速度传感器。该芯片以其高精度、高性能和低功耗的特点被广泛应用于运动检测、姿态控制、振动监测等众多领域。ADXL335的设计理念不仅体现在其小型化结构上，同时也实现了对加速度的精确测量，使得它在实际应用中具备了卓越的表现。芯片ADXL335BCPZ-RL7的详细参数 ADXL335BCPZ-RL7的主要技术规格如下： - 量程：±3g - 灵敏度：约30 mV/g - 工作电压：2.0V至3.6V - 功耗：约40μA（在低功耗模式下） - 输出类型：模拟电压输出 - 工作温度范围：-40°C至 +85°C - 封装类型：LFCSP（5 mm x 5 mm） - 引脚数：16个 - 带宽：可调至1 kHz - 零偏误差：小于±10 mg 厂家、包装及...

产品型号ADXL335BCPZ-RL7的Datasheet PDF文件预览

Small, Low Power, 3-Axis 3 g

Accelerometer

ADXL335

FEATURES

GENERAL DESCRIPTION

3-axis sensing

Small, low profile package

4 mm × 4 mm × 1.45 mm LFCSP

Low power : 350 μA (typical)

Single-supply operation: 1.8 V to 3.6 V

10,000 g shock survival

The ADXL335 is a small, thin, low power, complete 3-axis accel-

erometer with signal conditioned voltage outputs. The product

measures acceleration with a minimum full-scale range of 3 g.

It can measure the static acceleration of gravity in tilt-sensing

applications, as well as dynamic acceleration resulting from

motion, shock, or vibration.

Excellent temperature stability

BW adjustment with a single capacitor per axis

RoHS/WEEE lead-free compliant

The user selects the bandwidth of the accelerometer using the

C_X, C_Y, and C_Zcapacitors at the X_OUT, Y_OUT, and Z_OUTpins.

Bandwidths can be selected to suit the application, with a

range of 0.5 Hz to 1600 Hz for the X and Y axes, and a range

of 0.5 Hz to 550 Hz for the Z axis.

APPLICATIONS

Cost sensitive, low power, motion- and tilt-sensing

applications

Mobile devices

The ADXL335 is available in a small, low profile, 4 mm ×

4 mm × 1.45 mm, 16-lead, plastic lead frame chip scale package

(LFCSP_LQ).

Gaming systems

Disk drive protection

Image stabilization

Sports and health devices

FUNCTIONAL BLOCK DIAGRAM

+3V

ADXL335

~32kΩ

OUT

OUTPUT AMP

3-AXIS

SENSOR

OUT

AC AMP

DEMOD

OUT

COM

Figure 1.

Rev. B

Information furnished by Analog Devices is believed to be accurate and reliable. However, no

responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other

rights of third parties that may result from its use. Specifications subject to change without notice. No

license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

Trademarks and registeredtrademarks arethe property of their respective owners.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.

Tel: 781.329.4700 www.analog.com

ADXL335

TABLE OF CONTENTS

Features .............................................................................................. 1

Performance................................................................................ 10

Applications Information.............................................................. 11

Power Supply Decoupling ......................................................... 11

Setting the Bandwidth Using C_X, C_Y, and C_Z.......................... 11

Self-Test ....................................................................................... 11

Applications....................................................................................... 1

General Description......................................................................... 1

Functional Block Diagram .............................................................. 1

Revision History ............................................................................... 2

Specifications..................................................................................... 3

Absolute Maximum Ratings............................................................ 4

ESD Caution.................................................................................. 4

Pin Configuration and Function Descriptions............................. 5

Typical Performance Characteristics ............................................. 6

Theory of Operation ...................................................................... 10

Mechanical Sensor...................................................................... 10

Design Trade-Offs for Selecting Filter Characteristics: The

Noise/BW Trade-Off.................................................................. 11

Use with Operating Voltages Other Than 3 V ........................... 12

Axes of Acceleration Sensitivity ............................................... 12

Layout and Design Recommendations ................................... 13

Outline Dimensions....................................................................... 14

Ordering Guide .......................................................................... 14

REVISION HISTORY

1/10—Rev. A to Rev. B

Changes to Figure 21........................................................................ 9

7/09—Rev. 0 to Rev. A

Changes to Figure 22........................................................................ 9

Changes to Outline Dimensions................................................... 14

1/09—Revision 0: Initial Version

Rev. B | Page 2 of 16

ADXL335

SPECIFICATIONS

T_A= 25°C, V_S= 3 V, C_X= C_Y= C_Z= 0.1 μF, acceleration = 0 g, unless otherwise noted. All minimum and maximum specifications are

guaranteed. Typical specifications are not guaranteed.

Table 1.

Parameter

Conditions

Min

Typ

Max

Unit

SENSOR INPUT

Each axis

Measurement Range

±3

±3.6

±±.3

±1

±±.1

±1

Nonlinearity

% of full scale

Package Alignment Error

Interaxis Alignment Error

Cross-Axis Sensitivity¹

SENSITIVITY (RATIOMETRIC)²

Sensitivity at X_OUT, Y_OUT, Z_OUT

Sensitivity Change Due to Temperature³

ZERO g BIAS LEVEL (RATIOMETRIC)

± g Voltage at X_OUT, Y_OUT

± g Voltage at Z_OUT

± g Offset vs. Temperature

NOISE PERFORMANCE

Noise Density X_OUT, Y_OUT

Noise Density Z_OUT

Degrees

Each axis

V_S= 3 V

27±

3±±

±±.±1

33±

mV/g

%/°C

V_S= 3 V

1.35

1.2

1.5

±1

1.65

1.8

mg/°C

15±

3±±

μg/√Hz rms

FREQUENCY RESPONSE⁴

Bandwidth X_OUT, Y_OUT

No external filter

16±±

55±

Bandwidth Z_OUT

R_FILTTolerance

Sensor Resonant Frequency

SELF-TEST⁶

32 ± 15%

5.5

kΩ

kHz

Logic Input Low

Logic Input High

+±.6

+2.4

+6±

−325

+325

+55±

ST Actuation Current

Output Change at X_OUT

Output Change at Y_OUT

Output Change at Z_OUT

OUTPUT AMPLIFIER

Output Swing Low

Output Swing High

POWER SUPPLY

ꢀA

Self-Test ± to Self-Test 1

−15±

+15±

−6±±

+6±±

+1±±± mV

No load

±.1

2.8

Operating Voltage Range

1.8

3.6

Supply Current

Turn-On Time⁷

V_S= 3 V

35±

ꢀA

No external filter

TEMPERATURE

Operating Temperature Range

−4±

+85

°C

¹Defined as coupling between any two axes.

²Sensitivity is essentially ratiometric to V_S.

³Defined as the output change from ambient-to-maximum temperature or ambient-to-minimum temperature.

⁴Actual frequency response controlled by user-supplied external filter capacitors (C_X, C_Y, C_Z).

⁵Bandwidth with external capacitors = 1/(2 × π × 32 kΩ × C). For C_X, C_Y= ±.±±3 μF, bandwidth = 1.6 kHz. For C_Z= ±.±1 μF, bandwidth = 5±± Hz. For C_X, C_Y, C_Z= 1± μF,

bandwidth = ±.5 Hz.

⁶Self-test response changes cubically with V_S.

⁷Turn-on time is dependent on C_X, C_Y, C_Zand is approximately 16± × C_Xor C_Yor C_Z+ 1 ms, where C_X, C_Y, C_Zare in microfarads (μF).

Rev. B | Page 3 of 16

ADXL335

ABSOLUTE MAXIMUM RATINGS

Table 2.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Parameter

Rating

Acceleration (Any Axis, Unpowered)

1±,±±± g

Acceleration (Any Axis, Powered)

1±,±±± g

V_S

−±.3 V to +3.6 V

(COM − ±.3 V) to (V_S+ ±.3 V)

Indefinite

All Other Pins

Output Short-Circuit Duration

(Any Pin to Common)

Temperature Range (Powered)

Temperature Range (Storage)

−55°C to +125°C

−65°C to +15±°C

ESD CAUTION

Rev. B | Page 4 of 16

ADXL335

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

ADXL335

OUT

TOP VIEW

(Not to Scale)

COM

OUT

NC = NO CONNECT

NOTES

1. EXPOSED PAD IS NOT INTERNALLY

CONNECTED BUT SHOULD BE SOLDERED

FOR MECHANICAL INTEGRITY.

Figure 2. Pin Configuration

Table 3. Pin Function Descriptions

Pin No.

Mnemonic

Description

No Connect.¹

Self-Test.

COM

Common.

No Connect.¹

COM

Z_OUT

Common.

Z Channel Output.

No Connect.¹

1±

Y_OUT

X_OUT

V_S

Y Channel Output.

No Connect. ¹

X Channel Output.

No Connect. ¹

Supply Voltage (1.8 V to 3.6 V).

No Connect. ¹

V_S

Exposed Pad

Not internally connected. Solder for mechanical integrity.

¹NC pins are not internally connected and can be tied to COM pins, unless otherwise noted.

Rev. B | Page 5 of 16

ADXL335

TYPICAL PERFORMANCE CHARACTERISTICS

N > 1000 for all typical performance plots, unless otherwise noted.

–0.40

–0.38

–0.36

–0.34

–0.32

–0.30

–0.28

–0.26

1.42

1.44

1.46

1.48

1.50

1.52

1.54

1.56

1.58

VOLTS (V)

OUTPUT (V)

Figure 6. X-Axis Self-Test Response at 25°C, V_S= 3 V

Figure 3. X-Axis Zero g Bias at 25°C, V_S= 3 V

1.42

1.44

1.46

1.48

1.50

1.52

1.54

1.56

1.58

0.26

0.28

0.30

0.32

0.34

0.36

0.38

0.40

OUTPUT (V)

VOLTS (V)

Figure 4. Y-Axis Zero g Bias at 25°C, V_S= 3 V

Figure 7. Y-Axis Self-Test Response at 25°C, V_S= 3 V

1.42

1.44

1.46

1.48

1.50

1.52

1.54

1.56

1.58

0.48

0.50

0.52

0.54

0.56

0.58

0.60

0.62

OUTPUT (V)

VOLTS (V)

Figure 5. Z-Axis Zero g Bias at 25°C, V_S= 3 V

Figure 8. Z-Axis Self-Test Response at 25°C, V_S= 3 V

Rev. B | Page 6 of 16

ADXL335

1.55

1.54

1.53

1.52

1.51

1.50

1.49

1.48

1.47

1.46

1.45

N = 8

–3.0 –2.5 –2.0 –1.5 –1.0 –0.5

0.5 1.0 1.5 2.0 2.5 3.0

–40 –30 –20 –10

10 20 30 40 50 60 70 80 90 100

TEMPERATURE (°C)

TEMPERATURE COEFFICIENT (mg/°C)

Figure 9. X-Axis Zero g Bias Temperature Coefficient, V_S= 3 V

Figure 12. X-Axis Zero g Bias vs. Temperature—

Eight Parts Soldered to PCB

1.55

1.54

1.53

1.52

1.51

1.50

1.49

1.48

1.47

1.46

1.45

N = 8

–40 –30 –20 –10

10 20 30 40 50 60 70 80 90 100

TEMPERATURE (°C)

–3.0 –2.5 –2.0 –1.5 –1.0 –0.5

0.5 1.0 1.5 2.0 2.5 3.0

TEMPERATURE COEFFICIENT (mg/°C)

Figure 10. Y-Axis Zero g Bias Temperature Coefficient, V_S= 3 V

Figure 13. Y-Axis Zero g Bias vs. Temperature—

Eight Parts Soldered to PCB

1.50

1.48

1.46

1.44

1.42

1.40

1.38

1.36

1.34

1.32

1.30

N = 8

–7 –6 –5 –4 –3 –2 –1

–40 –30 –20 –10

10 20 30 40 50 60 70 80 90 100

TEMPERATURE (°C)

TEMPERATURE COEFFICIENT (mg/°C)

Figure 14. Z-Axis Zero g Bias vs. Temperature—

Figure 11. Z-Axis Zero g Bias Temperature Coefficient, V_S= 3 V

Eight Parts Soldered to PCB

Rev. B | Page 7 of 16

ADXL335

0.320

0.315

0.310

0.305

0.300

0.295

0.290

0.285

0.280

N = 8

0.285 0.288 0.291 0.294 0.297 0.300 0.303 0.306 0.309 0.312 0.315

–40 –30 –20 –10

10 20 30 40 50 60 70 80 90 100

TEMPERATURE (°C)

SENSITIVITY (V/g)

Figure 15. X-Axis Sensitivity at 25°C, V_S= 3 V

Figure 18. X-Axis Sensitivity vs. Temperature—

Eight Parts Soldered to PCB, V_S= 3 V

0.320

0.315

0.310

0.305

0.300

0.295

0.290

0.285

0.280

N = 8

0.285 0.288 0.291 0.294 0.297 0.300 0.303 0.306 0.309 0.312 0.315

–40 –30 –20 –10

10 20 30 40 50 60 70 80 90 100

TEMPERATURE (°C)

SENSITIVITY (V/g)

Figure 19. Y-Axis Sensitivity vs. Temperature—

Eight Parts Soldered to PCB, V_S= 3 V

Figure 16. Y-Axis Sensitivity at 25°C, V_S= 3 V

0.320

0.315

0.310

0.305

0.300

0.295

0.290

0.285

0.280

N = 8

0.285 0.288 0.291 0.294 0.297 0.300 0.303 0.306 0.309 0.312 0.315

–40 –30 –20 –10

10 20 30 40 50 60 70 80 90 100

TEMPERATURE (°C)

SENSITIVITY (V/g)

Figure 20. Z-Axis Sensitivity vs. Temperature—

Eight Parts Soldered to PCB, V_S= 3 V

Figure 17. Z-Axis Sensitivity at 25°C, V_S= 3 V

Rev. B | Page 8 of 16

ADXL335

350

300

250

200

= C = C = 0.0047µF

CH4: Z

500mV/DIV

OUT

CH3: Y

OUT

500mV/DIV

150

100

CH2: X

OUT

500mV/DIV

CH1: POWER,

1V/DIV

OUTPUTS ARE OFFSET FOR CLARITY

TIME (1ms/DIV)

1.5

2.0

2.5

3.0

3.5

4.0

SUPPLY (V)

Figure 21. Typical Current Consumption vs. Supply Voltage

Figure 22. Typical Turn-On Time, V_S= 3 V

Rev. B | Page 9 of 16

ADXL335

THEORY OF OPERATION

The ADXL335 is a complete 3-axis acceleration measurement

system. The ADXL335 has a measurement range of 3 g mini-

mum. It contains a polysilicon surface-micromachined sensor

and signal conditioning circuitry to implement an open-loop

acceleration measurement architecture. The output signals are

analog voltages that are proportional to acceleration. The

accelerometer can measure the static acceleration of gravity

in tilt-sensing applications as well as dynamic acceleration

resulting from motion, shock, or vibration.

The demodulator output is amplified and brought off-chip

through a 32 kΩ resistor. The user then sets the signal

bandwidth of the device by adding a capacitor. This filtering

improves measurement resolution and helps prevent aliasing.

MECHANICAL SENSOR

The ADXL335 uses a single structure for sensing the X, Y, and

Z axes. As a result, the three axes’ sense directions are highly

orthogonal and have little cross-axis sensitivity. Mechanical

misalignment of the sensor die to the package is the chief

source of cross-axis sensitivity. Mechanical misalignment

can, of course, be calibrated out at the system level.

The sensor is a polysilicon surface-micromachined structure

built on top of a silicon wafer. Polysilicon springs suspend the

structure over the surface of the wafer and provide a resistance

against acceleration forces. Deflection of the structure is meas-

ured using a differential capacitor that consists of independent

fixed plates and plates attached to the moving mass. The fixed

plates are driven by 180° out-of-phase square waves. Acceleration

deflects the moving mass and unbalances the differential capacitor

resulting in a sensor output whose amplitude is proportional to

acceleration. Phase-sensitive demodulation techniques are then

used to determine the magnitude and direction of the

acceleration.

PERFORMANCE

Rather than using additional temperature compensation circui-

try, innovative design techniques ensure that high performance

is built in to the ADXL335. As a result, there is no quantization

error or nonmonotonic behavior, and temperature hysteresis

is very low (typically less than 3 mg over the −25°C to +70°C

temperature range).

Rev. B | Page 1± of 16

ADXL335

APPLICATIONS INFORMATION

Never expose the ST pin to voltages greater than V_S+ 0.3 V.

POWER SUPPLY DECOUPLING

If this cannot be guaranteed due to the system design (for

instance, if there are multiple supply voltages), then a low

V_Fclamping diode between ST and V_Sis recommended.

For most applications, a single 0.1 μF capacitor, C_DC, placed

close to the ADXL335 supply pins adequately decouples the

accelerometer from noise on the power supply. However, in

applications where noise is present at the 50 kHz internal clock

frequency (or any harmonic thereof), additional care in power

supply bypassing is required because this noise can cause errors

in acceleration measurement.

DESIGN TRADE-OFFS FOR SELECTING FILTER

CHARACTERISTICS: THE NOISE/BW TRADE-OFF

The selected accelerometer bandwidth ultimately determines

the measurement resolution (smallest detectable acceleration).

Filtering can be used to lower the noise floor to improve the

resolution of the accelerometer. Resolution is dependent on

If additional decoupling is needed, a 100 Ω (or smaller) resistor

or ferrite bead can be inserted in the supply line. Additionally, a

larger bulk bypass capacitor (1 μF or greater) can be added in

parallel to C_DC. Ensure that the connection from the ADXL335

ground to the power supply ground is low impedance because

noise transmitted through ground has a similar effect to noise

transmitted through V_S.

the analog filter bandwidth at X_OUT, Y_OUT, and Z_OUT

The output of the ADXL335 has a typical bandwidth of greater

than 500 Hz. The user must filter the signal at this point to

limit aliasing errors. The analog bandwidth must be no more

than half the analog-to-digital sampling frequency to minimize

aliasing. The analog bandwidth can be further decreased to

reduce noise and improve resolution.

SETTING THE BANDWIDTH USING C_X, C_Y, AND C_Z

The ADXL335 has provisions for band limiting the X_OUT, Y_OUT

The ADXL335 noise has the characteristics of white Gaussian

noise, which contributes equally at all frequencies and is

described in terms of ꢀg/√Hz (the noise is proportional to the

square root of the accelerometer bandwidth). The user should

limit bandwidth to the lowest frequency needed by the applica-

tion to maximize the resolution and dynamic range of the

accelerometer.

and Z_OUTpins. Capacitors must be added at these pins to imple-

ment low-pass filtering for antialiasing and noise reduction. The

equation for the 3 dB bandwidth is

_{−3 dB}= 1/(2π(32 kΩ) × C_{(X, Y, Z)}

or more simply

_{–3 dB}= 5 ꢀF/C_{(X, Y, Z)}

)

With the single-pole, roll-off characteristic, the typical noise of

the ADXL335 is determined by

The tolerance of the internal resistor (R_FILT) typically varies as

much as 15% of its nominal value (32 kΩ), and the bandwidth

varies accordingly. A minimum capacitance of 0.0047 ꢀF for C_X,

C_Y, and C_Zis recommended in all cases.

rms Noise = Noise Density ×( BW ×1.6)

It is often useful to know the peak value of the noise. Peak-to-

peak noise can only be estimated by statistical methods. Table 5

is useful for estimating the probabilities of exceeding various

peak values, given the rms value.

Table 4. Filter Capacitor Selection, C_X, C_Y, and C_Z

Bandwidth (Hz)

Capacitor (μF)

4.7

1±

5±

1±±

2±±

5±±

±.47

±.1±

±.±5

±.±27

±.±1

Table 5. Estimation of Peak-to-Peak Noise

% of Time That Noise Exceeds

Peak-to-Peak Value

2 × rms

Nominal Peak-to-Peak Value

4 × rms

4.6

6 × rms

8 × rms

±.27

±.±±6

SELF-TEST

The ST pin controls the self-test feature. When this pin is set to

V_S, an electrostatic force is exerted on the accelerometer beam.

The resulting movement of the beam allows the user to test if

the accelerometer is functional. The typical change in output

is −1.08 g (corresponding to −325 mV) in the X-axis, +1.08 g

(or +325 mV) on the Y-axis, and +1.83 g (or +550 mV) on the

Z-axis. This ST pin can be left open-circuit or connected to

common (COM) in normal use.

Rev. B | Page 11 of 16

ADXL335

Self-test response in g is roughly proportional to the square of

the supply voltage. However, when ratiometricity of sensitivity

is factored in with supply voltage, the self-test response in volts

is roughly proportional to the cube of the supply voltage. For

example, at V_S= 3.6 V, the self-test response for the ADXL335

is approximately −560 mV for the X-axis, +560 mV for the

Y-axis, and +950 mV for the Z-axis.

USE WITH OPERATING VOLTAGES OTHER THAN 3 V

The ADXL335 is tested and specified at V_S= 3 V; however, it

can be powered with V_Sas low as 1.8 V or as high as 3.6 V. Note

that some performance parameters change as the supply voltage

is varied.

The ADXL335 output is ratiometric, therefore, the output

sensitivity (or scale factor) varies proportionally to the

supply voltage. At V_S= 3.6 V, the output sensitivity is typi-

cally 360 mV/g. At V_S= 2 V, the output sensitivity is typically

195 mV/g.

At V_S= 2 V, the self-test response is approximately −96 mV for

the X-axis, +96 mV for the Y-axis, and −163 mV for the Z-axis.

The supply current decreases as the supply voltage decreases.

Typical current consumption at V_S= 3.6 V is 375 μA, and typi-

cal current consumption at V_S= 2 V is 200 μA.

The zero g bias output is also ratiometric, thus the zero g

output is nominally equal to V_S/2 at all supply voltages.

AXES OF ACCELERATION SENSITIVITY

The output noise is not ratiometric but is absolute in volts;

therefore, the noise density decreases as the supply voltage

increases. This is because the scale factor (mV/g) increases

while the noise voltage remains constant. At V_S= 3.6 V,

the X-axis and Y-axis noise density is typically 120 μg/√Hz,

whereas at V_S= 2 V, the X-axis and Y-axis noise density is

typically 270 ꢀg/√Hz.

Figure 23. Axes of Acceleration Sensitivity; Corresponding Output Voltage

Increases When Accelerated Along the Sensitive Axis.

= –1g

= 0g

OUT

TOP

GRAVITY

= 0g

= –1g

= 0g

= 1g

= 0g

OUT

TOP

OUT

TOP

= 1g

= 0g

OUT

= 0g

= 1g

= 0g

= –1g

OUT

Figure 24. Output Response vs. Orientation to Gravity

Rev. B | Page 12 of 16

ADXL335

LAYOUT AND DESIGN RECOMMENDATIONS

The recommended soldering profile is shown in Figure 25 followed by a description of the profile features in Table 6. The recommended

PCB layout or solder land drawing is shown in Figure 26.

CRITICAL ZONE

t_P

TO T

RAMP-UP

t_L

SMAX

SMIN

t_S

RAMP-DOWN

PREHEAT

25°C TO PEAK

TIME

Figure 25. Recommended Soldering Profile

Table 6. Recommended Soldering Profile

Profile Feature

Sn63/Pb37

Pb-Free

Average Ramp Rate (T_Lto T_P)

Preheat

3°C/sec max

Minimum Temperature (T_SMIN

Maximum Temperature (T_SMAX

Time (T_SMINto T_SMAX)(t_S)

)

1±±°C

15±°C

6± sec to 12± sec

15±°C

2±±°C

6± sec to 18± sec

)

T_SMAXto T_L

Ramp-Up Rate

3°C/sec max

Time Maintained Above Liquidous (T_L)

Liquidous Temperature (T_L)

Time (t_L)

Peak Temperature (T_P)

Time Within 5°C of Actual Peak Temperature (t_P)

Ramp-Down Rate

183°C

217°C

6± sec to 15± sec

24±°C + ±°C/−5°C

1± sec to 3± sec

6°C/sec max

6± sec to 15± sec

26±°C + ±°C/−5°C

2± sec to 4± sec

6°C/sec max

Time 25°C to Peak Temperature

6 minutes max

8 minutes max

0.50

MAX

0.65

0.325

0.35

MAX

0.65

1.95

0.325

EXPOSED PAD IS NOT

INTERNALLY CONNECTED

BUT SHOULD BE SOLDERED

FOR MECHANICAL INTEGRITY.

1.95

DIMENSIONS SHOWN IN MILLIMETERS

Figure 26. Recommended PCB Layout

Rev. B | Page 13 of 16

ADXL335

OUTLINE DIMENSIONS

4.15

4.00 SQ

3.85

0.35

0.30

0.25

PIN 1

INDICATOR

PIN 1

INDICATOR

0.65

BSC

EXPOSED

PAD

2.55

2.40 SQ

2.25

0.55

TOP VIEW

BOTTOM VIEW

0.50

0.45

0.15 MAX

1.50

1.45

1.40

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

0.05 MAX

0.02 NOM

COPLANARITY

0.08

SECTION OF THIS DATA SHEET.

SEATING

PLANE

0.15 REF

COMPLIANT TO JEDEC STANDARDS MO-220-WGGD.

Figure 27. 16-Lead Lead Frame Chip Scale Package [LFCSP_LQ]

4 mm × 4 mm Body, 1.45 mm Thick Quad

(CP-16-14)

Dimensions shown in millimeters

ORDERING GUIDE

Model¹

Measurement Range Specified Voltage

Temperature Range Package Description Package Option

ADXL335BCPZ

±3 g

3 V

−4±°C to +85°C

16-Lead LFCSP_LQ

Evaluation Board

CP-16-14

ADXL335BCPZ–RL

ADXL335BCPZ–RL7

EVAL-ADXL335Z

¹Z = RoHS Compliant Part.

Rev. B | Page 14 of 16

ADXL335

NOTES

Rev. B | Page 15 of 16

ADXL335

NOTES

Analog Devices offers specific products designated for automotive applications; please consult your local Analog Devices sales representative for details. Standard products sold by

Analog Devices are not designed, intended, or approved for use in life support, implantable medical devices, transportation, nuclear, safety, or other equipment where malfunction of

the product can reasonably be expected to result in personal injury, death, severe property damage, or severe environmental harm. Buyer uses or sells standard products for use in the

above critical applications at Buyer's own risk and Buyer agrees to defend, indemnify, and hold harmless Analog Devices from any and all damages, claims, suits, or expenses resulting

from such unintended use.

registered trademarks are the property of their respective owners.

D07808-0-1/10(B)

Rev. B | Page 16 of 16

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ADXL335BCPZ-RL7产品参数

型号:	ADXL335BCPZ-RL7
Brand Name：	Analog Devices Inc
是否无铅：	含铅
是否Rohs认证：	不符合
生命周期：	Active
IHS 制造商：	ANALOG DEVICES INC
零件包装代码：	QFN
包装说明：	HQCCN, LCC16,.16SQ,25
针数：	16
制造商包装代码：	CP-16-14
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	9031.80.80.85
风险等级：	0.82
Samacsys Confidence：	3
Samacsys Status：	Released
Samacsys PartID：	421567
Samacsys Pin Count：	17
Samacsys Part Category：	Integrated Circuit
Samacsys Package Category：	Quad Flat No-Lead
Samacsys Footprint Name：	16-Lead LFCSP_L-1
Samacsys Released Date：	2017-01-11 11:21:59
Is Samacsys：	N
模拟集成电路 - 其他类型：	ANALOG CIRCUIT
JESD-30 代码：	S-PQCC-N16
JESD-609代码：	e3
长度：	4 mm
湿度敏感等级：	3
功能数量：	1
端子数量：	16
最高工作温度：	85 °C
最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY
封装代码：	HQCCN
封装等效代码：	LCC16,.16SQ,25
封装形状：	SQUARE
封装形式：	CHIP CARRIER, HEAT SINK/SLUG
峰值回流温度（摄氏度）：	260
电源：	3 V
认证状态：	Not Qualified
座面最大高度：	1.5 mm
子类别：	Other Analog ICs
最大供电电压 (Vsup)：	3.6 V
最小供电电压 (Vsup)：	1.8 V
标称供电电压 (Vsup)：	3 V
表面贴装：	YES
温度等级：	INDUSTRIAL
端子面层：	Matte Tin (Sn)
端子形式：	NO LEAD
端子节距：	0.65 mm
端子位置：	QUAD
处于峰值回流温度下的最长时间：	40
宽度：	4 mm
Base Number Matches：	1

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