AM26LV31EIDR全新原装原理图各脚功能电路原理芯片引脚定义-中国IC网-芯三七

AM26LV31E

www.ti.com............................................................................................................................................................... SLLS848A–APRIL 2008–REVISED MAY 2008

LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVER

WITH ±15-kV IEC ESD PROTECTION

1

FEATURES

D, NS, OR PW PACKAGE

•

Meets or Exceeds Standards TIA/EIA-422-B

and ITU Recommendation V.11

(TOP VIEW)

1A

1Y

1Z

V_CC

1

2

3

4

5

6

7

8

16

•

Operates From a Single 3.3-V Power Supply

ESD Protection for RS422 Bus Pins

15 4A

14 4Y

13 4Z

–

±15-kV Human-Body Model (HBM)

G

2Z

±8-kV IEC61000-4-2, Contact Discharge

±15-kV IEC61000-4-2, Air-Gap Discharge

12

11

10

9

G

2Y

3Z

3Y

3A

•

Switching Rates up to 32 MHz

2A

GND

Propagation Delay Time . . . 8 ns Typ

Pulse Skew Time . . . 500 ps Typ

High Output-Drive Current . . . ±30 mA

Controlled Rise and Fall Times . . . 5 ns Typ

RGY PACKAGE

(TOP VIEW)

Differential Output Voltage With 100-Ω

Load . . . 2.6 V Typ

1

16

•

Accepts 5-V Logic Inputs With 3.3-V Supply

1Y

1Z

G

2Z

2Y

2A

15 4A

14 4Y

2

3

4

5

6

7

I_offSupports Partial-Power-Down Mode

Operation

4Z

G

3Z

3Y

13

12

11

10

•

Driver Output Short-Protection Circuit

Glitch-Free Power-Up/Power-Down Protection

Package Options: SOP, SOIC, TSSOP, QFN

8

9

DESCRIPTION/ORDERING INFORMATION

The AM26LV31E is a quadruple differential line driver with 3-state outputs. This driver has ±15-kV ESD

(HBM and IEC61000-4-2, Air-Gap Discharge) and ±8-kV ESD (IEC61000-4-2, Contact Discharge) protection.

This device is designed to meet TIA/EIA-422-B and ITU Recommendation V.11 drivers with reduced supply

voltage.

The device is optimized for balanced-bus transmission at switching rates up to 32 MHz. The outputs have high

current capability for driving balanced lines, such as twisted-pair transmission lines, and provide a high

impedance in the power-off condition.

The AM26LV31EI is characterized for operation from –40°C to 85°C.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

AM26LV31E

SLLS848A–APRIL 2008–REVISED MAY 2008............................................................................................................................................................... www.ti.com

ORDERING INFORMATION

T_A

PACKAGE⁽¹⁾⁽²⁾

ORDERABLE PART NUMBER

AM26LV31EIDR

TOP-SIDE MARKING

AM26LV3IEI

SOIC – D

Tape and reel

SOP – NS

Tape and reel

AM26LV31EINSR

AM26LV31EIPWR

AM26LV31EIRGYR

26LV31EI

SB31

–40°C to 85°C

TSSOP – PW

QFN – RGY

SB31

(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

FUNCTION TABLE⁽¹⁾

ENABLES

OUTPUTS

INPUT

A

G

H

X

L

G

X

L

Y

H

L

Z

L

H

L

H

L

H

L

H

L

H

Z

X

H

Z

(1) H = high level, L = low level, X = irrelevant,

Z = high impedance (off)

LOGIC DIAGRAM

4

G

12

G

2

1

1Y

1A

3

1Z

6

7

2Y

2A

5

2Z

10

9

3Y

3Z

3A

11

14

13

15

4Y

4Z

4A

2

Submit Documentation Feedback

Product Folder Link(s): AM26LV31E

AM26LV31E

www.ti.com............................................................................................................................................................... SLLS848A–APRIL 2008–REVISED MAY 2008

SCHEMATIC

EQUIVALENT OF EACH INPUT (A, G, OR G)

TYPICAL OF EACH DRIVER OUTPUT

V

CC

V

CC

Input

Output

GND

ABSOLUTE MAXIMUM RATINGS⁽¹⁾

over operating free-air temperature range (unless otherwise noted)

MIN

–0.5

MAX

UNIT

V_CC

V_I

Supply voltage range⁽²⁾

6

V

Input voltage range

V

V_O

I_IK

Output voltage range

6

V

Input clamp current

V_I< 0

–20

±150

±200

150

73

mA

°C

I_OK

l_O

Output clamp current

V_O< 0

Continuous output current

Continuous current through V_CCor GND

Operating virtual junction temperature

T_J

D package

NS package

PW package

RGY package

64

θ_JA

Package thermal impedance⁽³⁾⁽⁴⁾

°C/W

108

39

T_A

Operating free-air temperature range

Storage temperature range

–40

–65

85

°C

T_stg

150

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values except differential input voltage are with respect to the network GND.

(3) Maximum power dissipation is a function of T_J(max), θ_JA, and T_A. The maximum allowable power dissipation at any allowable ambient

temperature is P_D= (T_J(max)– T_A)/θ_JA. Selecting the maximum of 150°C can affect reliability.

(4) The package thermal impedance is calculated in accordance with JESD 51-7.

Submit Documentation Feedback

3

Product Folder Link(s): AM26LV31E

AM26LV31E

SLLS848A–APRIL 2008–REVISED MAY 2008............................................................................................................................................................... www.ti.com

RECOMMENDED OPERATING CONDITIONS

MIN

3

TYP

MAX

3.6

UNIT

V

V_CC

V_I

Supply voltage

3.3

Input voltage

0

5.5

V

V_IH

V_IL

I_OH

I_OL

T_A

High-level input voltage

Low-level input voltage

High-level output current

Low-level output current

Operating free-air temperature

2

V

0.8

–30

30

V

mA

°C

–40

85

ELECTRICAL CHARACTERISTICS

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_IH= 2 V, V_IL= 0.8 V, I_OH= –20 mA

V_IH= 2 V, V_IL= 0.8 V, I_OL= 20 mA

I_O= 0 mA

MIN

TYP⁽¹⁾

3

MAX UNIT

V_OH

High-level output voltage

Low-level output voltage

Differential output voltage

2.4

V

V_OL

0.2

0.4

4

V

|V_OD1

|

2

|V_OD2

R_L= 100 Ω (see Figure 1)⁽²⁾

2.6

1.5

Change in magnitude of

differential output voltage

Δ|V_OD

|

R_L= 100 Ω (see Figure 1)⁽²⁾

±0.4

2

V

V_OC

Common-mode output voltage

Change in magnitude of

common-mode output voltage

Δ|V_OC

|

±0.4

I_O(OFF)

I_OZ

Output current with power off

High-impedance state output current

Input current

V_CC= 0, V_O= –0.25 V or 5.5 V

V_O= –0.25 V or 5.5 V, G = 0.8 V or G = 2 V

V_CC= 0 or 3.6 V, V_I= 0 or 5.5 V

V_O= V_CCor GND⁽³⁾

±100

±10

µA

mA

µA

pF

I_I

I_OS

I_CC

C_pd

Short-circuit output current

Supply current (total package)

Power dissipation capacitance

–30

–150

100

V_I= V_CCor GND, No load, enable

No load⁽⁴⁾

160

(1) All typical values are at V_CC= 3.3 V, T_A= 25°C.

(2) Refer to TIA-EIA-422-B for exact conditions.

(3) Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second.

(4) C_pddetermines the no-load dynamic current consumption. I_S= C_pd× V_CC× f + I_CC

4

Submit Documentation Feedback

Product Folder Link(s): AM26LV31E

AM26LV31E

www.ti.com............................................................................................................................................................... SLLS848A–APRIL 2008–REVISED MAY 2008

SWITCHING CHARACTERISTICS

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

Propagation delay time, high- to low-level output

Propagation delay time, low- to high-level output

Transition time (t_ror t_f)

TEST CONDITIONS

MIN

4

TYP⁽¹⁾

8

MAX UNIT

t_PHL

t_PLH

t_t

12

10

20

1.5

3

ns

See Figure 2

4

8

See Figure 2

See Figure 3

See Figure 4

See Figure 3

See Figure 4

5

ns

t_PZH

t_PZL

t_PHZ

t_PLZ

t_sk(p)

t_sk(o)

t_sk(lim)

f_(max)

Output-enable time to high level

Output-enable time to low level

Output-disable time from high level

Output-disable time from low level

Pulse skew

10

0.5

ns

Skew limit (pin to pin)

See Figure 2⁽²⁾⁽³⁾

ns

Skew limit (device to device)

Maximum operating frequency

ns

See Figure 2

32

MHz

(1) All typical values are at V_CC= 3.3 V, T_A= 25°C.

(2) Pulse skew is defined as the |t_PLH– t_PHL| of each channel of the same device.

(3) Skew limit (device to device) is the maximum difference in propagation delay times between any two channels of any two devices.

ESD PROTECTION

PARAMETER

TEST CONDITIONS

TYP

±15

±8

UNIT

HBM

Driver output

IEC61000-4-2, Air-Gap Discharge

IEC61000-4-2, Contact Discharge

kV

Submit Documentation Feedback

5

Product Folder Link(s): AM26LV31E

AM26LV31E

SLLS848A–APRIL 2008–REVISED MAY 2008............................................................................................................................................................... www.ti.com

PARAMETER MEASUREMENT INFORMATION

R /2

L

V

OD

V

OC

R /2

L

Figure 1. Test Circuit, V_ODand V_OC

C2 = 40 pF

Y

R

L

= 100 Ω

Input

C1 = 40 pF

C3 = 40 pF

Z

See Note A

V

CC

Input

50%

A

0 V

t

PHL

PLH

Z

Y

Output, V

O

PROPAGATION DELAY TIMES

V

OH

90%

10%

OL

Y

Z

t

r

f

Output, V

O

t

f

r

V

OH

90%

10%

OL

RISE AND FALL TIMES

NOTES: A. C includes probe and jig capacitance.

L

B.

t and t ≤ 2 ns.

f

r

Figure 2. Test Circuit and Voltage Waveforms, t_PHLand t_PLH

6

Submit Documentation Feedback

Product Folder Link(s): AM26LV31E

AM26LV31E

www.ti.com............................................................................................................................................................... SLLS848A–APRIL 2008–REVISED MAY 2008

PARAMETER MEASUREMENT INFORMATION (continued)

S1

Y

A

V

CC

Z

Output

R = 110 Ω

L

C = 40 pF

L

(see Note A)

G

Generator

(see Note B)

50 Ω

V

CC

(see Note C)

TEST CIRCUIT

V

CC

50%

Input

0 V

t

PHZ

t

PZH

0.3 V

V

OH

Output

50%

V

off

≈ 0

VOLTAGE WAVEFORMS

NOTES: A. C includes probe and jig capacitance.

L

B.

C. To test the active-low enable G, ground G and apply an inverted waveform to G.

and t ≤ 2 ns.

f

r

Figure 3. Test Circuit and Voltage Waveforms, t_PZHand t_PHZ

Submit Documentation Feedback

7

Product Folder Link(s): AM26LV31E

AM26LV31E

SLLS848A–APRIL 2008–REVISED MAY 2008............................................................................................................................................................... www.ti.com

PARAMETER MEASUREMENT INFORMATION (continued)

V

CC

R

L

= 110 Ω

S1

Y

Z

A

V

CC

Output

C

L

= 40 pF

(see Note A)

G

Generator

50 Ω

(see Note B)

V

CC

(see Note C)

TEST CIRCUIT

V

CC

Input

50%

0 V

t

PLZ

t

PZL

V

off

≈ V

CC

50%

Output

V

OL

0.3 V

VOLTAGE WAVEFORMS

NOTES: A. C includes probe and jig capacitance.

L

B.

C. To test the active-low enable G, ground G and apply an inverted waveform to G.

and t ≤ 2 ns.

f

r

Figure 4. Test Circuit and Voltage Waveforms, t_PZLand t_PLZ

8

Submit Documentation Feedback

Product Folder Link(s): AM26LV31E

PACKAGE OPTION ADDENDUM

www.ti.com

18-Sep-2008

PACKAGING INFORMATION

Orderable Device

AM26LV31EIDR

Status ⁽¹⁾

ACTIVE

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

SOIC

D

16

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

AM26LV31EIDRG4

AM26LV31EINSR

AM26LV31EINSRG4

AM26LV31EIPWR

AM26LV31EIPWRG4

AM26LV31EIRGYR

AM26LV31EIRGYRG4

SOIC

SO

D

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

NS

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SO

NS

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TSSOP

QFN

PW

RGY

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

QFN

1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

28-Jun-2008

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

A0 (mm)

B0 (mm)

K0 (mm)

P1

W

Pin1

Diameter Width

(mm) W1 (mm)

(mm) (mm) Quadrant

AM26LV31EIDR

AM26LV31EINSR

AM26LV31EIPWR

AM26LV31EIRGYR

SOIC

SO

D

16

2500

2000

1000

330.0

180.0

16.4

12.4

6.5

8.2

7.0

3.8

10.3

10.5

5.6

2.1

2.5

1.6

1.5

8.0

12.0

8.0

16.0

12.0

Q1

NS

TSSOP

QFN

PW

RGY

4.3

8.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

28-Jun-2008

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

AM26LV31EIDR

AM26LV31EINSR

AM26LV31EIPWR

AM26LV31EIRGYR

SOIC

SO

D

16

2500

2000

1000

346.0

190.5

346.0

212.7

33.0

29.0

31.8

NS

TSSOP

QFN

PW

RGY

Pack Materials-Page 2

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,30

0,19

M

0,10

0,65

14

8

0,15 NOM

4,50

4,30

6,60

6,20

Gage Plane

0,25

1

7

0°–8°

A

0,75

0,50

Seating Plane

0,10

0,15

0,05

1,20 MAX

PINS **

8

14

16

20

24

28

DIM

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

9,80

9,60

A MAX

A MIN

7,70

4040064/F 01/97

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,

and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should

obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are

sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard

warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where

mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and

applications using TI components. To minimize the risks associated with customer products and applications, customers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,

or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information

published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a

warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual

property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied

by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive

business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional

restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all

express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not

responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably

be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing

such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products

and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be

provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in

such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are

specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military

specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at

the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are

designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated

products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products

Applications

Audio

Automotive

Broadband

Digital Control

Medical

Amplifiers

Data Converters

DSP

Clocks and Timers

Interface

amplifier.ti.com

dataconverter.ti.com

dsp.ti.com

www.ti.com/clocks

interface.ti.com

logic.ti.com

www.ti.com/audio

www.ti.com/automotive

www.ti.com/broadband

www.ti.com/digitalcontrol

www.ti.com/medical

www.ti.com/military

Logic

Military

Power Mgmt

Microcontrollers

RFID

power.ti.com

microcontroller.ti.com

www.ti-rfid.com

Optical Networking

Security

Telephony

Video & Imaging

Wireless

www.ti.com/opticalnetwork

www.ti.com/security

www.ti.com/telephony

www.ti.com/video

RF/IF and ZigBee® Solutions www.ti.com/lprf

www.ti.com/wireless

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

型号:	AM26LV31EIDR
Brand Name：	Texas Instruments
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Active
零件包装代码：	SOIC
包装说明：	SOP, SOP16,.25
针数：	16
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
风险等级：	1.29
其他特性：	BUILT-IN DRIVER OUTPUT SHORT CIRCUIT PROTECTION
差分输出：	YES
驱动器位数：	4
输入特性：	STANDARD
接口集成电路类型：	LINE DRIVER
接口标准：	EIA-422-B; TIA-422-B; V.11
JESD-30 代码：	R-PDSO-G16
JESD-609代码：	e4
长度：	9.9 mm
湿度敏感等级：	1
功能数量：	4
端子数量：	16
最高工作温度：	85 °C
最低工作温度：	-40 °C
最小输出摆幅：	2 V
输出特性：	3-STATE
最大输出低电流：	0.03 A
输出极性：	TRUE
封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP
封装等效代码：	SOP16,.25
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
峰值回流温度（摄氏度）：	260
电源：	3.3 V
认证状态：	Not Qualified
最大接收延迟：
座面最大高度：	1.75 mm
子类别：	Line Driver or Receivers
最大压摆率：	0.1 mA
最大供电电压：	3.6 V
最小供电电压：	3 V
标称供电电压：	3.3 V
电源电压1-最大：	3.6 V
电源电压1-分钟：	3 V
电源电压1-Nom：	3.3 V
表面贴装：	YES
温度等级：	INDUSTRIAL
端子面层：	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：	GULL WING
端子节距：	1.27 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
最大传输延迟：	12 ns
宽度：	3.9 mm
Base Number Matches：	1

电子百科

产品导航

产品型号AM26LV31EIDR的概述

产品型号AM26LV31EIDR的Datasheet PDF文件预览

AM26LV31EIDR相关产品

AM26LV31EIDR相关文章

IC37:专业IC行业平台