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产品型号AMCD-7602-BLK的Datasheet PDF文件预览

ACMD-7602  
Miniature UMTS Band I Duplexer  
Data Sheet  
Description  
Features  
• Miniature size  
- 2.5 x 3.0 mm max footprint  
- 1.2 mm max height  
The Avago ACMD-7602 is a miniature duplexer designed  
for use in UMTS Band I handsets.  
Maximum Insertion Loss in the Tx channel is only 1.5 dB,  
which minimizes current drain from the power amplifier.  
Insertion Loss in the Rx channel is a maximum of 2.0 dB,  
improving receiver sensitivity.  
• High power rating  
- +33 dBm Abs Max Tx Power  
• Lead-free construction  
The ACMD-7602 enhances the sensitivity and dynamic  
range of WCDMA receivers by providing more than  
53 dB attenuation of the transmitted signal at the  
receiver input and more than 43 dB rejection of trans-  
mit-generated noise in the receive band.  
Specifications  
• Performance guaranteed –30 to +85°C  
• Rx band performance (2110 – 2170 mHz)  
- Insertion loss: 2.0 dB max  
- Noise blocking: 43 dB min  
The ACMD-7602 is designed with Avago Technologies’  
Film Bulk Acoustic Resonator (FBAR) technology, which  
makes possible ultra-small, high-Q filters at a fraction of  
their usual size. The excellent power handling capabil-  
ity of the FBAR bulk-mode resonators supports the high  
output power levels needed in handsets while adding  
virtually no distortion.  
• Tx band performance (1920 – 1980 mHz)  
- Insertion loss: 1.5 dB max  
- Interferer blocking: 53 dB min  
Applications  
• Handsets or data terminals operating in the UMTS  
Band I frequency range  
The ACMD-7602 also utilizes Avago Technologies’ in-  
novative Microcap bonded-wafer, chip scale packaging  
technology. This process allows the filters to be assem-  
bled in a molded chip-on-board module that is less than  
1.2 mm high with a maximum footprint of only 2.5 mm  
x 3.0 mm.  
Functional Block Diagram  
ANT  
PORT 3  
Rx  
PORT 2  
Tx  
PORT 1  
[1]  
ACMD-7602 Specifications, Z = 50 Ω, T as Indicated  
0
C
[2]  
–30 to +85°C  
[3]  
Symbol  
Parameter  
Antenna Port to Receive Port  
Units  
Min.  
Typ.  
Max.  
S23  
Insertion Loss in Receive Band (2110 – 2170 MHz)  
Ripple (p-p) in Receive Band  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
1.1  
0.6  
2.0  
1.0  
0.5  
∆S23  
∆S23  
S22  
Ripple (p-p) in Any 5 MHz Channel within Receive Band  
Return Loss of Receive Port in Receive Band  
Attenuation 0 – 1900 mHz  
10  
30  
53  
40  
16  
50  
61  
54  
S23  
S23  
Attenuation in Transmit Band (1920 – 1980 mHz)  
Attenuation in Bluetooth Band (2400 – 2500 mHz)  
Transmit Port to Antenna Port  
S23  
S31  
S31  
∆S31  
∆S31  
S11  
S31  
S31  
S31  
S31  
S31  
Insertion Loss in Transmit Band (1920 – 1980 mHz) -30° to +25°C  
Insertion Loss in Transmit Band (1920 – 1980 mHz) +25° to +85°C  
Ripple (p-p) in Transmit Band  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
1.1  
1.1  
0.4  
1.5  
1.6  
1.0  
0.5  
Ripple (p-p) in Any 5 mHz Channel within Transmit Band  
Return Loss of Transmit Port in Transmit Band  
Attenuation 0 – 1800 mHz  
10  
30  
41  
25  
25  
15  
20  
44  
52  
31  
36  
17  
Attenuation in Receive Band (2110 – 2170 mHz)  
Attenuation in Bluetooth Band (2400 – 2500 mHz)  
Attenuation in Transmit 2nd Harmonic Band (3840 – 3960 mHz)  
Attenuation in Transmit 3rd Harmonic Band (5760 – 5940 mHz)  
Antenna Port  
S33  
Return Loss of Antenna Port in Transmit and Receive Bands  
Isolation Transmit Port to Receive Port  
dB  
10  
17  
S21  
S21  
Tx-Rx Isolation in Transmit Band (1920 – 1980 mHz)  
Tx-Rx Isolation in Receive Band (2110 – 2170 mHz)  
dB  
dB  
53  
43  
62  
52  
Notes:  
1. TC is the case temperature and is defined as the temperature of the underside of the duplexer where it makes contact with the  
circuit board.  
2. Specifications guaranteed over the given temperature range (unless otherwise noted) with the input power to the Tx port equal  
to or less than  
+29 dBm over all Tx frequencies.  
3. Typical data is the arithmetic mean value of the parameter over its indicated frequency range at the specified temperature. Typi-  
cal values may  
vary from part to part and over time.  
2
[1]  
Absolute Maximum Ratings  
Parameter  
Unit  
°C  
Value  
Storage Temperature  
-65 to +125  
+33  
Maximum RF Input Power to Tx Port  
dBm  
[2]  
Maximum Recommended Operating Conditions  
Parameter  
Unit  
°C  
Value  
[3]  
Operating Temperature, T  
, Tx Power ≤ 29 dBm  
-40 to +100  
-40 to +85  
C
[3]  
Operating Temperature, T  
, Tx Power ≤ 30 dBm  
°C  
C
Notes:  
1. Operation in excess of any one of these conditions may result in permanent damage to the device.  
2. The device will function over the recommended range without degradation in reliability or permanent change in performance, but is not  
guaranteed to meet electrical specifications.  
3. T is defined as case temperature, the temperature of the underside of the duplexer where it makes contact with the circuit board.  
C
ACMD-7602 Typical Performance at T = 25°C  
C
0
0
-0.5  
-1.0  
-1.5  
-2.0  
-2.5  
-0.5  
-1.0  
-1.5  
-2.0  
-2.5  
1920  
1930  
1940  
1950  
1960  
1970  
1980  
2110  
2120  
2130  
2140  
2150  
2160  
2170  
FREQUENCY (MHz)  
FREQUENCY (MHz)  
Figure 1. Tx band insertion loss  
Figure 2. Rx band insertion loss  
0
0
-10  
-5  
Tx  
Rx  
-20  
-30  
-40  
-50  
-60  
-10  
Tx  
Rx  
-15  
-20  
-25  
1800  
1900  
2000  
2100  
2200  
2300  
1800  
1900  
2000  
2100  
2200  
2300  
FREQUENCY (MHz)  
FREQUENCY (MHz)  
Figure 4. Tx rejection in Rx band and Rx rejection in Tx band  
Figure 3. Tx and Rx port return loss  
3
-40  
-50  
-60  
-70  
-80  
0
-5  
-10  
-15  
-20  
-25  
1800  
1900  
2000  
2100  
2200  
2300  
1800  
1900  
2000  
2100  
2200  
2300  
FREQUENCY (MHz)  
FREQUENCY (MHz)  
Figure 6. Antenna port return loss  
Figure 5. Tx to Rx isolation  
-20  
-30  
-40  
-50  
-60  
0
-10  
-20  
-30  
-40  
3.80  
3.85  
3.90  
3.95  
4.00  
5.7  
5.8  
5.8  
5.9  
5.9  
6.0  
6.0  
FREQUENCY (GHz)  
FREQUENCY (GHz)  
Figure 7. Tx second harmonic rejection  
Figure 8. Tx third harmonic rejection  
-20  
-30  
-40  
-50  
-40  
-50  
-60  
-70  
2.40  
2.42  
2.44  
2.46  
2.48  
2.50  
2.40  
2.42  
2.44  
2.46  
2.48  
2.50  
FREQUENCY (GHz)  
FREQUENCY (GHz)  
Figure 10. Rx rejection in bluetooth band (2400 – 2500 mHz)  
Figure 9. Tx rejection in bluetooth band (2400 – 2500 mHz)  
4
-20  
-30  
-40  
-50  
-60  
-70  
-80  
-20  
-30  
-40  
-50  
-60  
-70  
-80  
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
FREQUENCY (GHz)  
FREQUENCY (GHz)  
Figure 11. Tx low frequency rejection  
Figure 12. Rx low frequency rejection  
0
-10  
Tx  
-20  
Rx  
-30  
Rx  
-40  
Tx  
-50  
-60  
0
1
2
3
4
5
6
FREQUENCY (MHz)  
Figure 13. Tx and Rx wideband response  
5
1.0  
1.0  
0.8  
0.8  
1.5  
1.5  
0.6  
0.6  
2
2
0.4  
0.4  
3
3
4
4
5
5
10  
20  
10  
20  
50  
-50  
50  
-50  
0.2  
0.4  
0.6 0.8  
1.0  
1.5  
2
3
4
5
10 20 50  
0.2  
0.4  
0.6 0.8  
1.0  
1.5  
2
3
4
5
10 20 50  
-20  
-20  
-10  
-10  
-5  
-4  
-5  
-4  
-3  
-3  
-0.4  
-0.4  
-2  
-2  
-0.6  
-0.6  
-1.5  
-1.5  
-0.8  
-0.8  
-1.0  
-1.0  
Figure 14. Tx impedance (S11) in Tx band  
Figure 15. Rx impedance (S22) in Rx band  
1.0  
0.8  
1.0  
0.8  
1.5  
1.5  
0.6  
0.6  
2
2
0.4  
0.4  
3
3
4
5
4
5
10  
20  
10  
20  
50  
-50  
50  
-50  
0.2  
0.4  
0.6 0.8  
1.0  
1.5  
2
3
4
5
10 20 50  
0.2  
0.4  
0.6 0.8  
1.0  
1.5  
2
3
4
5
10 20 50  
-20  
-20  
-10  
-10  
-5  
-5  
-4  
-4  
-3  
-3  
-0.4  
-0.4  
-2  
-2  
-0.6  
-0.6  
-1.5  
-1.5  
-0.8  
-0.8  
-1.0  
-1.0  
Figure 16. Ant impedance (S33) in Tx band  
Figure 17. Ant impedance (S33) in Rx band  
6
0.34  
0.53  
0.34  
ANT  
0.53  
0.34  
0.20  
PRODUCT  
MARKING  
2.5 MAX.  
2.30  
0.34  
0.53  
0.20  
Rx  
Tx  
0.25  
0.34  
3.0 MAX.  
1.2 MAX.  
0.53  
0.34  
0.53  
PACKAGE ORIENTATION  
2.27  
2.80  
Notes:  
1. Dimensions in millimeters.  
2. Dimensions nominal unless otherwise noted.  
3. All chamfers 45 .  
4. I/O pads (3 ea):  
Size: 0.53 x 0.53, corner chamfers: 0.03 x 0.03  
Spacing to ground plane: 0.34  
Inside ground plane chamfer: 0.20 x 0.20  
5. Tolerance:  
X.X = 0.1  
X.XX = 0.05  
6. Contact areas are gold plated.  
Figure 18. Package drawing  
PACKAGE  
ORIENTATION  
T = ACMD-7602  
FB = Avago ID  
TX  
RX  
Y = Year  
WW = Work Week  
DC = Date Code  
NNNN = Lot Number  
ANT  
Figure 19. Package marking  
7
Ø 0.20 VIA ARRAY  
HORIZ PITCH = 0.33  
VERT PITCH = 0.38  
0.10  
Ant  
Ø 0.20 VIA ARRAY  
HORIZ PITCH = 0.38  
0.10  
1.78  
W
Rx  
Tx  
G
Ø 0.20 VIA ARRAY  
HORIZ PITCH = 0.38  
VERT PITCH = 0.33  
Ø 0.20 VIA ARRAY  
HORIZ PITCH = 0.33  
VERT PITCH = 0.38  
2.27  
Notes:  
1. Dimensions in mm.  
2. Transmission line Gap (G) and Width (W) adjusted for Zo = 50 ohms.  
3. I/O Pads (3 ea) 0.53 x 0.53, corner chamfer 0.30.  
4. I/O Pad to Ground plane gap = 0.34, corner chamfer 0.30.  
5. Ground vias positioned to maximize port-to-port isolation.  
Figure 20. PCB layout  
A PCB layout implementing design principles similar  
to those illustrated in Figure 16 is recommended to  
optimize performance of the AMCD-7602.  
It is particularly important to maximize isolation between  
the Tx connection to the duplexer and the Rx port. High  
isolation is achieved by (1) maintaining a continuous  
ground plane around the duplexer mounting area,  
(2) surrounding the I/O ports with sufficient ground  
vias to enclose the connections in a “Faraday cage, and  
(3) preferably routing the Tx trace in a different metal  
layer than the Rx.  
The latter is especially useful, not only to maintain Tx-  
Rx isolation of the duplexer, but also to prevent leakage  
of the Tx signal into other components that could  
result in the creation of intermodulation products and  
degradation of overall system performance.  
Figure 21. ACMD-7602 superposed on PCB layout  
8
0.63  
> 0.30 TYP.  
0.63  
0.24  
2.40  
0.24  
2.90  
> 0.30 TYP.  
Figure 23. AMCD-7602 superposed on solder mask  
Note:  
Dimensions in mm.  
Figure 22. Recommended solder mask  
STENCIL  
BOUNDARY  
0.15  
0.15  
A
B
B
2.30  
C
A
A
2.80  
Figure 25. Solder stencil overlaid on AMCD-7602 bottom metal pattern  
STENCIL OPENING ID QTY  
WIDTH (mm)  
0.43  
LENGTH (mm)  
A (I/O pad areas)  
3
2
1
0.43  
1.24  
1.24  
B
C
0.50  
0.77  
Notes:  
1. Chamfer or radius all corners 0.05 mm min.  
2. Stencil openings aligned to Boundary rectangle or center lines.  
Figure 24. Recommended solder stencil  
9
4.00 ± 0.10  
(SEE NOTE #2)  
2.00 ± 0.05  
1.55 ± 0.05  
1.75 ± 0.10  
R0.60 TYP.  
5.50 ± 0.05  
12.00 ± 0.10  
Bo  
Ko  
SECTION B – B  
1.50 (MIN.)  
8.00 ± 0.10  
5° (MAX.)  
Ao  
0.30 ± 0.05  
SECTION A – A  
NOTES:  
Ao  
Bo  
Ko  
= 2.80  
= 3.30  
= 1.50  
1. Ao and Bo measured at 0.3 mm above base of pocket.  
2. 10 pitches cumulative tolerance ± 0.2 mm.  
3. ( ) Reference dimensions only.  
Pitch = 8.00  
Width = 12.00  
Figure 26. SMD tape packing  
SPROCKET HOLES  
PACKAGE PIN 1  
ORIENTATION  
TAPE  
WIDTH  
POCKET  
CAVITY  
Figure 27. Unit orientation in tape  
10  
Figure 28. Reel drawing, back view  
Reel Component  
Resistivity  
Reel (coated with proprietary antistatic agent)  
Carrier Tape (carbon polystyrene)  
10^9 to 10^11 Ohm/Sq  
10^9 Ohm/Sq  
Cover Tape  
10^9 to 10^11 Ohm/Sq  
Top Layer – transparent PET film  
Bonding Layer – adhesive Polyolefin  
Sealing Layer – peelable, special film  
Notes:  
1. Reel shall be labeled with the following  
information (as a minimum):  
a. Manufactures name or symbol  
b. Avago Technologies part number  
c. Purchase order number  
d. Date code  
e. Quantity of units  
2. A certificate of compliance © of C) shall  
be issued and accompany each shipment  
of product.  
3. Reel must not be made with or contain  
ozone depleting materials.  
4. All dimensions in millimeters (mm).  
Figure 29. Reel drawing, front view  
Package Moisture Sensitivity  
Feature  
Test Method  
J-STD-020C  
Performance  
Moisture Sensitivity  
Level (MSL) at 260°C  
Level 3  
300  
250  
200  
150  
100  
50  
Tested profile shown.  
0
0
50  
100  
150  
200  
250  
300  
TIME (SECONDS)  
Figure 30. Verified SMT solder profile  
AMCD-7602 Ordering Information  
Part Number  
No. of Devices  
25  
Container  
AMCD-7602-BLK  
AMCD-7602-TR1  
Anti-static Bag  
1000  
178 mm  
(7-inch) Reel  
For product information and a complete list of distributors, please go to our website: www.avagotech.com  
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.  
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved.  
AV02-0472EN - September 25, 2007  
配单直通车
AMCD-7602-BLK产品参数
型号:AMCD-7602-BLK
生命周期:Obsolete
IHS 制造商:AVAGO TECHNOLOGIES INC
Reach Compliance Code:compliant
风险等级:5.56
其他特性:ANTI-STATIC BAG
滤波器类型:DUPLEXER
高度:1.2 mm
插入损耗(接收):2 dB
插入损耗(发送):1.6 dB
JESD-609代码:e4
长度:3 mm
制造商序列号:ACMD-7602
安装类型:SURFACE MOUNT
最高工作温度:85 °C
最低工作温度:-30 °C
物理尺寸:L3.0XB2.5XH1.2 (mm)/L0.118XB0.098XH0.047 (inch)
端子面层:GOLD
宽度:2.5 mm
Base Number Matches:1
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