AO4702
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max Units
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
ID=250µA, VGS=0V
VR=30V
30
V
0.007 0.05
Zero Gate Voltage Drain Current
(Set by Schottky leakage)
IDSS
VR=30V, TJ=125°C
VR=30V, TJ=150°C
VDS=0V, VGS= ±20V
mA
3.2
12
10
20
IGSS
Gate-Body leakage current
Gate Threshold Voltage
On state drain current
100
nA
V
VGS(th)
ID(ON)
V
DS=VGS ID=250µA
VGS=4.5V, VDS=5V
GS=10V, ID=11A
1
1.8
3
40
A
V
13.4
16.8
20
16
21
25
mΩ
mΩ
RDS(ON)
TJ=125°C
Static Drain-Source On-Resistance
VGS=4.5V, ID=8A
DS=5V, ID=11A
IS=1A,VGS=0V
gFS
VSD
IS
Forward Transconductance
V
25
S
V
A
Diode + Schottky Forward Voltage
0.45
0.5
5
Maximum Body-Diode + Schottky Continuous Current
DYNAMIC PARAMETERS
Ciss
Coss
Crss
Rg
Input Capacitance
1040 1250
212
pF
pF
pF
Ω
VGS=0V, VDS=15V, f=1MHz
Output Capacitance (FET+Schottky)
Reverse Transfer Capacitance
Gate resistance
121
VGS=0V, VDS=0V, f=1MHz
0.7
0.85
SWITCHING PARAMETERS
Qg(10V)
Total Gate Charge
Total Gate Charge
Gate Source Charge
Gate Drain Charge
Turn-On DelayTime
Turn-On Rise Time
Turn-Off DelayTime
Turn-Off Fall Time
19.8
9.8
2.5
3.5
4.5
3.9
17.4
3.2
19
24
12
nC
nC
nC
nC
ns
Qg(4.5V)
VGS=10V, VDS=15V, ID=11A
Qgs
Qgd
tD(on)
tr
7
7
VGS=10V, VDS=15V, RL=1.35Ω,
ns
tD(off)
tf
RGEN=3Ω
30
5.7
23
11
ns
ns
trr
IF=11A, dI/dt=100A/µs
IF=11A, dI/dt=100A/µs
Body Diode + Schottky Reverse Recovery Time
Body Diode + Schottky Reverse Recovery Charge
ns
Qrr
9
nC
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The value in any
given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using 80 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA curve
provides a single pulse rating.
F. The Schottky appears in parallel with the MOSFET body diode, even though it is a separate chip. Therefore, we provide the net forward drop, capacitance
and recovery characteristics of the MOSFET and Schottky. However, the thermal resistance is specified for each chip separately.
Rev 5: Aug 2005
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Alpha & Omega Semiconductor, Ltd.