AT24C02现货热卖使用介绍供应商报价哪里找芯片批发报价-中国IC网-芯三七

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产品型号AT24C02的概述

AT24C02芯片概述 AT24C02是一款由Atmel（现为Microchip Technology的一部分）生产的EEPROM（电可擦可编程只读存储器）芯片。该芯片具有256个字节的存储容量，主要用于存储少量的数据，如配置信息、状态标志信息等。其主要特点是支持I²C通信协议，使得多种设备可以简便地互联，广泛应用于嵌入式系统、消费电子、工业设备等领域。 AT24C02的工作电压范围为1.8V至3.6V，使得它适合于低功耗的应用。此外，AT24C02的读写速度较快，写入一个字节的时间通常为5毫秒，而读取一个字节的时间则更短。由于其在数据存储器中的重要性，AT24C02成为许多应用的理想选择。 AT24C02的详细参数 AT24C02的技术参数包括： - 存储容量：256比特（32字节） - 通信协议：I²C（双线接口） - 工作电压：1.8V 至 3.6V - 最大工作电流： - ...

产品型号AT24C02的Datasheet PDF文件预览

Features

• Low-voltage and Standard-voltage Operation

– 2.7 (V_CC= 2.7V to 5.5V)

– 1.8 (V_CC= 1.8V to 5.5V)

• Internally Organized 128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K),

1024 x 8 (8K) or 2048 x 8 (16K)

• Two-wire Serial Interface

• Schmitt Trigger, Filtered Inputs for Noise Suppression

• Bidirectional Data Transfer Protocol

• 100 kHz (1.8V) and 400 kHz (2.7V, 5V) Compatibility

• Write Protect Pin for Hardware Data Protection

• 8-byte Page (1K, 2K), 16-byte Page (4K, 8K, 16K) Write Modes

• Partial Page Writes Allowed

• Self-timed Write Cycle (5 ms max)

• High-reliability

Two-wire

Serial EEPROM

1K (128 x 8)

– Endurance: 1 Million Write Cycles

– Data Retention: 100 Years

2K (256 x 8)

• Automotive Grade and Lead-free/Halogen-free Devices Available

• 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead MAP, 5-lead SOT23,

8-lead TSSOP and 8-ball dBGA2 Packages

• Die Sales: Wafer Form, Waffle Pack and Bumped Wafers

4K (512 x 8)

8K (1024 x 8)

16K (2048 x 8)

Description

The AT24C01A/02/04/08A/16A provides 1024/2048/4096/8192/16384 bits of serial

electrically erasable and programmable read-only memory (EEPROM) organized as

128/256/512/1024/2048 words of 8 bits each. The device is optimized for use in many

industrial and commercial applications where low-power and low-voltage operation

are essential. The AT24C01A/02/04/08A/16A is available in space-saving 8-lead PDIP,

8-lead JEDEC SOIC, 8-lead MAP, 5-lead SOT23 (AT24C01A/AT24C02/AT24C04), 8-

lead TSSOP, and 8-ball dBGA2 packages and is accessed via a Two-wire serial inter-

face. In addition, the entire family is available in 2.7V (2.7V to 5.5V) and 1.8V (1.8V to

5.5V) versions.

AT24C01A

AT24C02

AT24C04

AT24C08A

AT24C16A

8-lead TSSOP

8-lead SOIC

Table 1. Pin Configuration

VCC

Pin Name

A0 - A2

SDA

Function

Address Inputs

Serial Data

SCL

SDA

SCL

SDA

GND

SCL

Serial Clock Input

Write Protect

No Connect

Ground

8-ball dBGA2

8-lead MAP

VCC

VCC 8

1 A0

2 A1

3 A2

4 GND

SCL

SDA

WP 7

SCL 6

SDA 5

GND

VCC

GND

Power Supply

Bottom View

8-lead PDIP

Bottom View

5-lead SOT23

VCC

SCL

GND

SDA

SCL

SDA

VCC

GND

0180V–SEEPR–8/05

Absolute Maximum Ratings

*NOTICE:

Stresses beyond those listed under “Absolute

Maximum Ratings” may cause permanent dam-

age to the device. This is a stress rating only and

functional operation of the device at these or any

other conditions beyond those indicated in the

operational sections of this specification is not

implied. Exposure to absolute maximum rating

conditions for extended periods may affect device

reliability.

Operating Temperature..................................–55°C to +125°C

Storage Temperature.....................................–65°C to +150°C

Voltage on Any Pin

with Respect to Ground....................................–1.0V to +7.0V

Maximum Operating Voltage .......................................... 6.25V

DC Output Current........................................................ 5.0 mA

Figure 1. Block Diagram

AT24C01A/02/04/08A/16A

0180V–SEEPR–8/05

AT24C01A/02/04/08A/16A

Pin Description

SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each

EEPROM device and negative edge clock data out of each device.

SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is

open-drain driven and may be wire-ORed with any number of other open-drain or open-

collector devices.

DEVICE/PAGE ADDRESSES (A2, A1, A0): The A2, A1 and A0 pins are device

address inputs that are hard wired for the AT24C01A and the AT24C02. As many as

eight 1K/2K devices may be addressed on a single bus system (device addressing is

discussed in detail under the Device Addressing section).

The AT24C04 uses the A2 and A1 inputs for hard wire addressing and a total of four 4K

devices may be addressed on a single bus system. The A0 pin is a no connect.

The AT24C08A only uses the A2 input for hardwire addressing and a total of two 8K

devices may be addressed on a single bus system. The A0 and A1 pins are no

connects.

The AT24C16A does not use the device address pins, which limits the number of

devices on a single bus to one. The A0, A1 and A2 pins are no connects.

WRITE PROTECT (WP): The AT24C01A/02/04/08A/16A has a Write Protect pin that

provides hardware data protection. The Write Protect pin allows normal Read/Write

operations when connected to ground (GND). When the Write Protect pin is connected

to V_CC, the write protection feature is enabled and operates as shown in Table 2.

Table 2. Write Protect

Part of the Array Protected

WP Pin

Status

At V_CC

At GND

24C01A

24C02

24C04

24C08A

Full (8K)

Array

24C16A

Full (1K)

Array

Full (2K)

Array

Full (4K)

Array

Full (16K)

Array

Normal Read/Write Operations

Memory Organization AT24C01A, 1K SERIAL EEPROM: Internally organized with 16 pages of 8 bytes each,

the 1K requires a 7-bit data word address for random word addressing.

AT24C02, 2K SERIAL EEPROM: Internally organized with 32 pages of 8 bytes each,

the 2K requires an 8-bit data word address for random word addressing.

AT24C04, 4K SERIAL EEPROM: Internally organized with 32 pages of 16 bytes each,

the 4K requires a 9-bit data word address for random word addressing.

AT24C08A, 8K SERIAL EEPROM: Internally organized with 64 pages of 16 bytes each,

the 8K requires a 10-bit data word address for random word addressing.

AT24C16A, 16K SERIAL EEPROM: Internally organized with 128 pages of 16 bytes

each, the 16K requires an 11-bit data word address for random word addressing.

0180V–SEEPR–8/05

Table 3. Pin Capacitance⁽¹⁾

Applicable over recommended operating range from T_A= 25°C, f = 1.0 MHz, V_CC= +1.8V

Symbol

C_I/O

Test Condition

Max

Units

Conditions

V_I/O= 0V

V_IN= 0V

Input/Output Capacitance (SDA)

Input Capacitance (A₀, A₁, A₂, SCL)

C_IN

Note:

1. This parameter is characterized and is not 100% tested.

Table 4. DC Characteristics

Applicable over recommended operating range from: T_AI= –40°C to +85°C, V_CC= +1.8V to +5.5V, V_CC= +1.8V to +5.5V

(unless otherwise noted)

Symbol

V_CC1

V_CC2

V_CC3

I_CC

Parameter

Test Condition

Min

1.8

2.7

4.5

Typ

Max

5.5

Units

Supply Voltage

5.5

Supply Voltage

5.5

Supply Current V_CC= 5.0V

Standby Current V_CC= 1.8V

Standby Current V_CC= 2.5V

Standby Current V_CC= 2.7V

Standby Current V_CC= 5.0V

Input Leakage Current

Output Leakage Current

Input Low Level⁽¹⁾

READ at 100 kHz

WRITE at 100 kHz

V_IN= V_CCor V_SS

V_OUT= V_CCor V_SS

0.4

2.0

1.0

µA

I_CC

3.0

I_SB1

I_SB2

I_SB3

I_SB4

I_LI

0.6

3.0

1.4

4.0

1.6

4.0

8.0

18.0

3.0

0.10

0.05

I_LO

3.0

V_IL

–0.6

V_CCx 0.3

V_CC+ 0.5

0.4

V_IH

Input High Level⁽¹⁾

V_CCx 0.7

V_OL2

V_OL1

Output Low Level V_CC= 3.0V

Output Low Level V_CC= 1.8V

I_OL= 2.1 mA

I_OL= 0.15 mA

0.2

Note:

1. V_ILmin and V_IHmax are reference only and are not tested.

AT24C01A/02/04/08A/16A

0180V–SEEPR–8/05

AT24C01A/02/04/08A/16A

Table 5. AC Characteristics

Applicable over recommended operating range from T_AI= –40°C to +85°C, V_CC= +1.8V to +5.5V, V_CC= +2.7V to +5.5V,

CL = 1 TTL Gate and 100 pF (unless otherwise noted)

1.8-volt

2.7, 5.0-volt

Min Max

Symbol

f_SCL

t_LOW

t_HIGH

t_I

Parameter

Min

Max

Units

kHz

µs

Clock Frequency, SCL

Clock Pulse Width Low

Clock Pulse Width High

Noise Suppression Time⁽¹⁾

Clock Low to Data Out Valid

100

400

4.7

4.0

1.2

0.6

µs

100

4.5

t_AA

0.1

4.7

0.1

1.2

0.9

µs

Time the bus must be free before

a new transmission can start⁽¹⁾

t_BUF

µs

t_HD.STA

t_SU.STA

t_HD.DAT

t_SU.DAT

t_R

Start Hold Time

4.0

4.7

0.6

µs

Start Setup Time

Data In Hold Time

Data In Setup Time

Inputs Rise Time⁽¹⁾

Inputs Fall Time⁽¹⁾

Stop Setup Time

Data Out Hold Time

Write Cycle Time

200

100

1.0

0.3

t_F

300

t_SU.STO

t_DH

4.7

0.6

100

t_WR

Write

Cycles

Endurance⁽¹⁾

5.0V, 25°C, Byte Mode

Note:

1. This parameter is characterized.

0180V–SEEPR–8/05

Device Operation

CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an exter-

nal device. Data on the SDA pin may change only during SCL low time periods (see

Figure 4 on page 7). Data changes during SCL high periods will indicate a start or stop

condition as defined below.

START CONDITION: A high-to-low transition of SDA with SCL high is a start condition

which must precede any other command (see Figure 5 on page 8).

STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition.

After a read sequence, the stop command will place the EEPROM in a standby power

mode (see Figure 5 on page 8).

ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the

EEPROM in 8-bit words. The EEPROM sends a zero to acknowledge that it has

received each word. This happens during the ninth clock cycle.

STANDBY MODE: The AT24C01A/02/04/08A/16A features a low-power standby mode

which is enabled: (a) upon power-up and (b) after the receipt of the STOP bit and the

completion of any internal operations.

MEMORY RESET: After an interruption in protocol, power loss or system reset, any 2-

wire part can be reset by following these steps:

1. Clock up to 9 cycles.

2. Look for SDA high in each cycle while SCL is high.

3. Create a start condition.

AT24C01A/02/04/08A/16A

0180V–SEEPR–8/05

AT24C01A/02/04/08A/16A

Bus Timing

Figure 2. SCL: Serial Clock, SDA: Serial Data I/O

Write Cycle Timing

Figure 3. SCL: Serial Clock, SDA: Serial Data I/O

SCL

SDA

ACK

8th BIT

WORDn

(1)

START

CONDITION

STOP

CONDITION

Note:

1. The write cycle time t_WRis the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle.

Figure 4. Data Validity

0180V–SEEPR–8/05

Figure 5. Start and Stop Definition

Figure 6. Output Acknowledge

AT24C01A/02/04/08A/16A

0180V–SEEPR–8/05

AT24C01A/02/04/08A/16A

Device Addressing

The 1K, 2K, 4K, 8K and 16K EEPROM devices all require an 8-bit device address word

following a start condition to enable the chip for a read or write operation (refer to Figure

7).

The device address word consists of a mandatory one, zero sequence for the first four

most significant bits as shown. This is common to all the EEPROM devices.

The next 3 bits are the A2, A1 and A0 device address bits for the 1K/2K EEPROM.

These 3 bits must compare to their corresponding hard-wired input pins.

The 4K EEPROM only uses the A2 and A1 device address bits with the third bit being a

memory page address bit. The two device address bits must compare to their corre-

sponding hard-wired input pins. The A0 pin is no connect.

The 8K EEPROM only uses the A2 device address bit with the next 2 bits being for

memory page addressing. The A2 bit must compare to its corresponding hard-wired

input pin. The A1 and A0 pins are no connect.

The 16K does not use any device address bits but instead the 3 bits are used for mem-

ory page addressing. These page addressing bits on the 4K, 8K and 16K devices

should be considered the most significant bits of the data word address which follows.

The A0, A1 and A2 pins are no connect.

The eighth bit of the device address is the read/write operation select bit. A read opera-

tion is initiated if this bit is high and a write operation is initiated if this bit is low.

Upon a compare of the device address, the EEPROM will output a zero. If a compare is

not made, the chip will return to a standby state.

Write Operations

BYTE WRITE: A write operation requires an 8-bit data word address following the

device address word and acknowledgment. Upon receipt of this address, the EEPROM

will again respond with a zero and then clock in the first 8-bit data word. Following

receipt of the 8-bit data word, the EEPROM will output a zero and the addressing

device, such as a microcontroller, must terminate the write sequence with a stop condi-

tion. At this time the EEPROM enters an internally timed write cycle, t_WR, to the

nonvolatile memory. All inputs are disabled during this write cycle and the EEPROM will

not respond until the write is complete (see Figure 8 on page 11).

PAGE WRITE: The 1K/2K EEPROM is capable of an 8-byte page write, and the 4K, 8K

and 16K devices are capable of 16-byte page writes.

A page write is initiated the same as a byte write, but the microcontroller does not send

a stop condition after the first data word is clocked in. Instead, after the EEPROM

acknowledges receipt of the first data word, the microcontroller can transmit up to seven

(1K/2K) or fifteen (4K, 8K, 16K) more data words. The EEPROM will respond with a zero

after each data word received. The microcontroller must terminate the page write

sequence with a stop condition (see Figure 9 on page 11).

The data word address lower three (1K/2K) or four (4K, 8K, 16K) bits are internally

incremented following the receipt of each data word. The higher data word address bits

are not incremented, retaining the memory page row location. When the word address,

internally generated, reaches the page boundary, the following byte is placed at the

beginning of the same page. If more than eight (1K/2K) or sixteen (4K, 8K, 16K) data

words are transmitted to the EEPROM, the data word address will “roll over” and previ-

ous data will be overwritten.

0180V–SEEPR–8/05

ACKNOWLEDGE POLLING: Once the internally timed write cycle has started and the

EEPROM inputs are disabled, acknowledge polling can be initiated. This involves sending a

start condition followed by the device address word. The read/write bit is representative of the

operation desired. Only if the internal write cycle has completed will the EEPROM respond

with a zero allowing the read or write sequence to continue.

Read

Operations

Read operations are initiated the same way as write operations with the exception that the

read/write select bit in the device address word is set to one. There are three read operations:

current address read, random address read and sequential read.

CURRENT ADDRESS READ: The internal data word address counter maintains the last

address accessed during the last read or write operation, incremented by one. This address

stays valid between operations as long as the chip power is maintained. The address “roll

over” during read is from the last byte of the last memory page to the first byte of the first page.

The address “roll over” during write is from the last byte of the current page to the first byte of

the same page.

Once the device address with the read/write select bit set to one is clocked in and acknowl-

edged by the EEPROM, the current address data word is serially clocked out. The

microcontroller does not respond with an input zero but does generate a following stop condi-

tion (see Figure 10 on page 12).

RANDOM READ: A random read requires a “dummy” byte write sequence to load in the data

word address. Once the device address word and data word address are clocked in and

acknowledged by the EEPROM, the microcontroller must generate another start condition.

The microcontroller now initiates a current address read by sending a device address with the

read/write select bit high. The EEPROM acknowledges the device address and serially clocks

out the data word. The microcontroller does not respond with a zero but does generate a fol-

lowing stop condition (see Figure 11 on page 12).

SEQUENTIAL READ: Sequential reads are initiated by either a current address read or a ran-

dom address read. After the microcontroller receives a data word, it responds with an

acknowledge. As long as the EEPROM receives an acknowledge, it will continue to increment

the data word address and serially clock out sequential data words. When the memory

address limit is reached, the data word address will “roll over” and the sequential read will con-

tinue. The sequential read operation is terminated when the microcontroller does not respond

with a zero but does generate a following stop condition (see Figure 12 on page 12).

AT24C01A/02/04/08A/16A

0180V–SEEPR–8/05

AT24C01A/02/04/08A/16A

Figure 7. Device Address

MSB

16K

Figure 8. Byte Write

Figure 9. Page Write

(* = DON’T CARE bit for 1K)

0180V–SEEPR–8/05

Figure 10. Current Address Read

Figure 11. Random Read

(* = DON’T CARE bit for 1K)

Figure 12. Sequential Read

AT24C01A/02/04/08A/16A

0180V–SEEPR–8/05

AT24C01A/02/04/08A/16A

AT24C01A Ordering Information⁽¹⁾

Ordering Code

Package

Operation Range

AT24C01A-10PI-2.7

AT24C01A-10SI-2.7

AT24C01A-10TI-2.7

8P3

8S1

8A2

Industrial Temperature

(–40°C to 85°C)

AT24C01A-10PI-1.8

AT24C01A-10SI-1.8

AT24C01A-10TI-1.8

8P3

8S1

8A2

Industrial Temperature

(–40°C to 85°C)

AT24C01A-10PU-2.7⁽²⁾

AT24C01A-10PU-1.8⁽²⁾

AT24C01A-10SU-2.7⁽²⁾

AT24C01A-10SU-1.8⁽²⁾

AT24C01A-10TU-2.7⁽²⁾

AT24C01A-10TU-1.8⁽²⁾

AT24C01A-10TSU-1.8⁽²⁾

AT24C01AU3-10UU-1.8⁽²⁾

AT24C01AY1-10YU-1.8⁽²⁾

8P3

8S1

8A2

5TS1

8U31

8Y1

Lead-free/Halogen-free/

Industrial Temperature

(–40°C to 85°C)

AT24C01A-W2.7-11⁽³⁾

AT24C01A-W1.8-11⁽³⁾

Die Sale

Industrial Temperature

(–40°C to 85°C)

Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.

2. “U” designates Green Package + RoHS compliant.

3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact

Serial EEPROM Marketing.

Package Type

8P3

8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)

8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)

5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)

8-ball, die Ball Grid Away Package (dBGA2)

8S1

8A2

8Y1

5TS1

8U3-1

Options

–2.7

–1.8

Low-voltage (2.7V to 5.5V)

Low-voltage (1.8V to 5.5V)

0180V–SEEPR–8/05

AT24C02 Ordering Information⁽¹⁾

Ordering Code

Package

Operation Range

AT24C02-10PI-2.7

AT24C02N-10SI-2.7

AT24C02-10TI-2.7

8P3

8S1

8A2

Industrial Temperature

(–40°C to 85°C)

AT24C02-10PI-1.8

AT24C02N-10SI-1.8

AT24C02-10TI-1.8

8P3

8S1

8A2

Industrial Temperature

(–40°C to 85°C)

AT24C02-10PU-2.7⁽²⁾

AT24C02-10PU-1.8⁽²⁾

AT24C02N-10SU-2.7⁽²⁾

8P3

8S1

AT24C02N-10SU-1.8⁽²⁾

AT24C02-10TU-2.7⁽²⁾

8S1

8A2

Lead-free/Halogen-free/

Industrial Temperature

AT24C02-10TU-1.8⁽²⁾

AT24C02Y1-10YU-1.8⁽²⁾

AT24C02-10TSU-1.8⁽²⁾

AT24C02U3-10UU-1.8⁽²⁾

8A2

8Y1

5TS1

8U3-1

(–40°C to 85°C)

AT24C02-W2.7-11⁽³⁾

AT24C02-W1.8-11⁽³⁾

Die Sale

Industrial Temperature

(–40°C to 85°C)

Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.

2. “U” designates Green Package + RoHS compliant.

3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact

Serial EEPROM Marketing.

Package Type

8P3

8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)

8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)

5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)

8-ball, die Ball Grid Away Package (dBGA2)

8S1

8A2

8Y1

5TS1

8U3-1

Options

–2.7

–1.8

Low-voltage (2.7V to 5.5V)

Low-voltage (1.8V to 5.5V)

AT24C01A/02/04/08A/16A

0180V–SEEPR–8/05

AT24C01A/02/04/08A/16A

AT24C04 Ordering Information⁽¹⁾

Ordering Code

Package

Operation Range

AT24C04-10PI-2.7

AT24C04N-10SI-2.7

AT24C04-10TI-2.7

8P3

8S1

8A2

Industrial Temperature

(–40°C to 85°C)

AT24C04-10PI-1.8

AT24C04N-10SI-1.8

AT24C04-10TI-1.8

8P3

8S1

8A2

Industrial Temperature

(–40°C to 85°C)

AT24C04-10PU-2.7⁽²⁾

AT24C04-10PU-1.8⁽²⁾

AT24C04N-10SU-2.7⁽²⁾

AT24C04N-10SU-1.8⁽²⁾

AT24C04-10TU-2.7⁽²⁾

AT24C04-10TU-1.8⁽²⁾

AT24C04Y1-10YU-1.8⁽²⁾

AT24C04-10TSU-1.8⁽²⁾

AT24C04U3-10UU-1.8⁽²⁾

8P3

8S1

8A2

8Y1

5TS1

8U3-1

Lead-free/Halogen-free/

Industrial Temperature

(–40°C to 85°C)

AT24C04-W2.7-11⁽³⁾

AT24C04-W1.8-11⁽³⁾

Die Sale

Industrial Temperature

(–40°C to 85°C)

Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.

2. “U” designates Green Package + RoHS compliant.

3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact

Serial EEPROM Marketing.

Package Type

8P3

8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)

8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)

5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)

8-ball, die Ball Grid Away Package (dBGA2)

8S1

8A2

8Y1

5TS1

8U3-1

Options

–2.7

–1.8

Low-voltage (2.7V to 5.5V)

Low-voltage (1.8V to 5.5V)

0180V–SEEPR–8/05

AT24C08A Ordering Information⁽¹⁾

Ordering Code

Package

Operation Range

AT24C08A-10PI-2.7

AT24C08AN-10SI-2.7

AT24C08A-10TI-2.7

8P3

8S1

8A2

Industrial Temperature

(–40°C to 85°C)

AT24C08A-10PI-1.8

AT24C08AN-10SI-1.8

AT24C08A-10TI-1.8

8P3

8S1

8A2

Industrial Temperature

(–40°C to 85°C)

AT24C08A-10PU-2.7⁽²⁾

AT24C08A-10PU-1.8⁽²⁾

AT24C08AN-10SU-2.7⁽²⁾

AT24C08AN-10SU-1.8⁽²⁾

AT24C08A-10TU-2.7⁽²⁾

AT24C08A-10TU-1.8⁽²⁾

AT24C08AY1-10YU-1.8⁽²⁾

AT24C08AY5-10YU-1.8⁽²⁾

AT24C08AU2-10UU-1.8⁽²

8P3

8S1

8A2

8Y1

8Y5

8U2-1

Lead-free/Halogen-free/

Industrial Temperature

(−40°C to 85°C)

AT24C08A-W2.7-11⁽³⁾

AT24C08A-W1.8-11⁽³⁾

Die Sale

Industrial Temperature

(−40°C to 85°C)

Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.

2. “U” designates Green Package + RoHS compliant.

3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact

Serial EEPROM Marketing.

Package Type

8P3

8S1

8A2

8Y1

8Y5

8U2-1

8-pin, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)

8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)

8-lead, 2.00 mm x 3.00 mm Body, Dual Footprint, Non-Leaded, Miniature Array Package (MAP)

8-ball, die Ball Grid Array Package (dBGA2)

Options

−2.7

−1.8

Low Voltage (2.7V to 5.5V)

Low Voltage (1.8V to 5.5V)

AT24C01A/02/04/08A/16A

0180V–SEEPR–8/05

AT24C01A/02/04/08A/16A

AT24C16A Ordering Information⁽¹⁾

Ordering Code

Package

Operation Range

AT24C16A-10PI-2.7

AT24C16AN-10SI-2.7

AT24C16A-10TI-2.7

8P3

8S1

8A2

Industrial Temperature

(–40°C to 85°C)

AT24C16A-10PI-1.8

AT24C16AN-10SI-1.8

AT24C16A-10TI-1.8

8P3

8S1

8A2

Industrial Temperature

(–40°C to 85°C)

AT24C16A-10PU-2.7⁽²⁾

AT24C16A-10PU-1.8⁽²⁾

AT24C16AN-10SU-2.7⁽²⁾

AT24C16AN-10SU-1.8⁽²⁾

AT24C16A-10TU-2.7⁽²⁾

AT24C16A-10TU-1.8⁽²⁾

AT24C16AY1-10YU-1.8⁽²⁾

AT24C16AY5-10YU-1.8⁽²⁾

AT24C16AU2-10UU-1.8⁽²⁾

8P3

8S1

8A2

8Y1

8Y5

8U2-1

Lead-free/Halogen-free/

Industrial Temperature

(−40°C to 85°C)

AT24C16A-W2.7-11⁽³⁾

AT24C16A-W1.8-11⁽³⁾

Die Sale

Industrial Temperature

(−40°C to 85°C)

Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.

2. “U” designates Green Package + RoHS compliant.

3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact

Serial EEPROM Marketing.

Package Type

8P3

8S1

8A2

8Y1

8Y5

8U2-1

8-pin, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)

8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)

8-lead, 2.00 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)

8-ball, die Ball Grid Array Package (dBGA2)

Options

−2.7

−1.8

Low Voltage (2.7V to 5.5V)

Low Voltage (1.8V to 5.5V)

0180V–SEEPR–8/05

Packaging Information

8P3 – PDIP

Top View

End View

COMMON DIMENSIONS

(Unit of Measure = inches)

MIN

–

MAX

0.210

0.195

0.022

0.070

0.045

0.014

0.400

–

NOM

–

NOTE

SYMBOL

A2 A

0.115

0.014

0.045

0.030

0.008

0.355

0.005

0.300

0.240

0.130

0.018

0.060

0.039

0.010

0.365

–

4 PLCS

0.310

0.250

0.100 BSC

0.300 BSC

0.130

0.325

0.280

Side View

0.115

0.150

Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA, for additional information.

2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.

3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.

4. E and eA measured with the leads constrained to be perpendicular to datum.

5. Pointed or rounded lead tips are preferred to ease insertion.

6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).

01/09/02

TITLE

DRAWING NO.

REV.

2325 Orchard Parkway

San Jose, CA 95131

8P3, 8-lead, 0.300" Wide Body, Plastic Dual

In-line Package (PDIP)

8P3

AT24C01A/02/04/08A/16A

0180V–SEEPR–8/05

AT24C01A/02/04/08A/16A

8S1 – JEDEC SOIC

Top View

End View

COMMON DIMENSIONS

(Unit of Measure = mm)

MIN

1.35

0.10

MAX

1.75

0.25

NOM

NOTE

SYMBOL

–

0.31

0.17

4.80

3.81

5.79

–

0.51

0.25

5.00

3.99

6.20

–

Side View

1.27 BSC

0.40

0˚

–

1.27

8˚

Note:

These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.

10/7/03

REV.

TITLE

DRAWING NO.

1150 E. Cheyenne Mtn. Blvd.

Colorado Springs, CO 80906

8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing

8S1

Small Outline (JEDEC SOIC)

0180V–SEEPR–8/05

8A2 – TSSOP

2 1

Pin 1 indicator

this corner

Top View

End View

COMMON DIMENSIONS

(Unit of Measure = mm)

MIN

MAX

NOM

3.00

NOTE

SYMBOL

2.90

3.10

2, 5

6.40 BSC

4.40

4.30

–

4.50

1.20

1.05

0.30

3, 5

–

0.80

0.19

1.00

–

0.65 BSC

0.60

0.45

0.75

Side View

1.00 REF

Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,

datums, etc.

2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed

0.15 mm (0.006 in) per side.

3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm

(0.010 in) per side.

4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the

b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between

protrusion and adjacent lead is 0.07 mm.

5. Dimension D and E1 to be determined at Datum Plane H.

5/30/02

DRAWING NO.

TITLE

REV.

8A2, 8-lead, 4.4 mm Body, Plastic

Thin Shrink Small Outline Package (TSSOP)

2325 Orchard Parkway

San Jose, CA 95131

8A2

AT24C01A/02/04/08A/16A

0180V–SEEPR–8/05

AT24C01A/02/04/08A/16A

8Y1 – MAP

PIN 1 INDEX AREA

Bottom View

End View

Top View

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

MIN

–

MAX

0.90

0.05

5.10

3.20

1.15

0.35

NOM

–

NOTE

0.00

4.70

2.80

0.85

0.25

–

4.90

3.00

1.00

0.30

0.65 TYP

0.60

Side View

0.50

0.70

2/28/03

TITLE

DRAWING NO.

REV.

2325 Orchard Parkway

San Jose, CA 95131

8Y1, 8-lead (4.90 x 3.00 mm Body) MSOP Array Package

(MAP) Y1

8Y1

0180V–SEEPR–8/05

5TS1 – SOT23

End View

Top View

Seating

Plane

COMMON DIMENSIONS

(Unit of Measure = mm)

Side View

MIN

–

MAX

1.10

0.10

1.00

0.20

NOM

–

NOTE

SYMBOL

NOTES: 1. This drawing is for general information only. Refer to JEDEC Drawing

MO-193, Variation AB, for additional information.

2. Dimension D does not include mold flash, protrusions, or gate burrs.

0.00

0.70

0.08

–

Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per end.

Dimension E1 does not include interlead flash or protrusion. Interlead

flash or protrusion shall not exceed 0.15 mm per side.

3. The package top may be smaller than the package bottom. Dimensions

D and E1 are determined at the outermost extremes of the plastic body

exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but

including any mismatch between the top and bottom of the plastic body.

4. These dimensions apply to the flat section of the lead between 0.08 mm

and 0.15 mm from the lead tip.

5. Dimension "b" does not include Dambar protrusion. Allowable Dambar

protrusion shall be 0.08 mm total in excess of the "b" dimension at

maximum material condition. The Dambar cannot be located on the lower

radius of the foot. Minimum space between protrusion and an adjacent lead

shall not be less than 0.07 mm.

0.90

–

2.90 BSC

2.80 BSC

1.60 BSC

0.60 REF

0.95 BSC

1.90 BSC

–

2, 3

0.30

0.50

4, 5

6/25/03

TITLE

REV.

DRAWING NO.

1150 E. Cheyenne Mtn. Blvd.

Colorado Springs, CO 80906

5TS1, 5-lead, 1.60 mm Body, Plastic Thin Shrink

Small Outline Package (SHRINK SOT)

PO5TS1

AT24C01A/02/04/08A/16A

0180V–SEEPR–8/05

AT24C01A/02/04/08A/16A

8U3-1 – dBGA2

A₁

PIN 1 BALL PAD CORNER

A₂

Top View

PIN 1 BALL PAD CORNER

Side View

(d1)

COMMON DIMENSIONS

(Unit of Measure = mm)

(e1)

MIN

0.71

0.10

0.40

0.20

MAX

0.91

0.20

0.50

0.30

NOM

0.81

NOTE

SYMBOL

Bottom View

8 SOLDER BALLS

0.15

0.45

0.25

1.50 BSC

2.00 BSC

0.50 BSC

0.25 REF

1.00 BSC

0.25 REF

1. Dimension “b” is measured at the maximum solder ball diameter.

This drawing is for general information only.

6/24/03

TITLE

REV.

DRAWING NO.

1150 E. Cheyenne Mtn. Blvd.

Colorado Springs, CO 80906

8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch,

Small Die Ball Grid Array Package (dBGA2)

PO8U3-1

0180V–SEEPR–8/05

Atmel Corporation

Atmel Operations

2325 Orchard Parkway

San Jose, CA 95131, USA

Tel: 1(408) 441-0311

Fax: 1(408) 487-2600

Memory

RF/Automotive

Theresienstrasse 2

Postfach 3535

74025 Heilbronn, Germany

Tel: (49) 71-31-67-0

Fax: (49) 71-31-67-2340

2325 Orchard Parkway

San Jose, CA 95131, USA

Tel: 1(408) 441-0311

Fax: 1(408) 436-4314

Regional Headquarters

Microcontrollers

2325 Orchard Parkway

San Jose, CA 95131, USA

Tel: 1(408) 441-0311

Fax: 1(408) 436-4314

1150 East Cheyenne Mtn. Blvd.

Colorado Springs, CO 80906, USA

Tel: 1(719) 576-3300

Europe

Atmel Sarl

Route des Arsenaux 41

Case Postale 80

CH-1705 Fribourg

Switzerland

Tel: (41) 26-426-5555

Fax: (41) 26-426-5500

Fax: 1(719) 540-1759

Biometrics/Imaging/Hi-Rel MPU/

High Speed Converters/RF Datacom

Avenue de Rochepleine

La Chantrerie

BP 70602

44306 Nantes Cedex 3, France

Tel: (33) 2-40-18-18-18

Fax: (33) 2-40-18-19-60

BP 123

38521 Saint-Egreve Cedex, France

Tel: (33) 4-76-58-30-00

Fax: (33) 4-76-58-34-80

Asia

Room 1219

Chinachem Golden Plaza

77 Mody Road Tsimshatsui

East Kowloon

Hong Kong

Tel: (852) 2721-9778

Fax: (852) 2722-1369

ASIC/ASSP/Smart Cards

Zone Industrielle

13106 Rousset Cedex, France

Tel: (33) 4-42-53-60-00

Fax: (33) 4-42-53-60-01

1150 East Cheyenne Mtn. Blvd.

Colorado Springs, CO 80906, USA

Tel: 1(719) 576-3300

Japan

9F, Tonetsu Shinkawa Bldg.

1-24-8 Shinkawa

Chuo-ku, Tokyo 104-0033

Japan

Tel: (81) 3-3523-3551

Fax: (81) 3-3523-7581

Fax: 1(719) 540-1759

Scottish Enterprise Technology Park

Maxwell Building

East Kilbride G75 0QR, Scotland

Tel: (44) 1355-803-000

Fax: (44) 1355-242-743

Literature Requests

www.atmel.com/literature

Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any

intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDI-

TIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY

WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR

PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDEN-

TAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT

OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no

representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications

and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided

otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use

as components in applications intended to support or sustain life.

marks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.

Printed on recycled paper.

0180V–SEEPR–8/05

AT24C02相关文章

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AT24C02-10MC产品参数

型号:	AT24C02-10MC
是否Rohs认证：	不符合
生命周期：	Obsolete
IHS 制造商：	ATMEL CORP
零件包装代码：	SOIC
包装说明：	TSSOP, TSSOP8,.19
针数：	8
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8542.32.00.51
风险等级：	5.17
最大时钟频率 (fCLK)：	0.4 MHz
数据保留时间-最小值：	100
耐久性：	1000000 Write/Erase Cycles
I2C控制字节：	1010DDDR
JESD-30 代码：	R-PDSO-G8
JESD-609代码：	e0
长度：	3 mm
内存密度：	2048 bit
内存集成电路类型：	EEPROM
内存宽度：	8
功能数量：	1
端子数量：	8
字数：	256 words
字数代码：	256
工作模式：	SYNCHRONOUS
最高工作温度：	70 °C
最低工作温度：
组织：	256X8
封装主体材料：	PLASTIC/EPOXY
封装代码：	TSSOP
封装等效代码：	TSSOP8,.19
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行：	SERIAL
峰值回流温度（摄氏度）：	NOT SPECIFIED
电源：	5 V
认证状态：	Not Qualified
座面最大高度：	1.1 mm
串行总线类型：	I2C
最大待机电流：	0.000018 A
子类别：	EEPROMs
最大压摆率：	0.003 mA
最大供电电压 (Vsup)：	5.5 V
最小供电电压 (Vsup)：	4.5 V
标称供电电压 (Vsup)：	5 V
表面贴装：	YES
技术：	CMOS
温度等级：	COMMERCIAL
端子面层：	Tin/Lead (Sn/Pb)
端子形式：	GULL WING
端子节距：	0.65 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	3 mm
最长写入周期时间 (tWC)：	10 ms
写保护：	HARDWARE
Base Number Matches：	1

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