Motor driver ICs
BA6209 / BA6209N
FOperation notes
(1) Resistor dividing IC power consumption
To reduce power dissipated in the IC, a resistance (about
3X10Ω)mustalwaysbeconnectedbetweenVCC andthe
power supply pin of the driver circuit. If VCC2 is connected
to VCC with no resistor, the IC can be damaged by over-
current when operated at the voltage range close to the
maximum operating voltage.
This should be avoided by detecting the motor operating
current in a way shown in Fig. 20.
(2) Control signal waveform
The rise and fall times of signals applied to the control
pins should be 5ms or less. Longer times can cause er-
ratic operation of the internal logic circuits and may result
in damage to the driver circuits.
(4) Input pins
Voltage should never be applied to the input pins when
the VCC voltage is not applied to the IC. Similarly, when
VCC is applied, the voltage on each input pin should be
less than VCC and within the guaranteed range for the
electrical characteristics.
(5) Back-rush voltage
Depending on the ambient conditions, environment, or
motor characteristics, the back-rush voltage may fluctu-
ate. Be sure to confirm that the back-rush voltage will not
adversely affect the operation of the IC.
For example, if the supply voltage for the external control
circuit comes up after the supply voltage of the IC, the ris-
ing edge of the control signal slowly follows the rise of the
externalsupplyvoltage. Thiscouldresultinerraticopera-
tion or damage to the IC due to excess currents.
(6) Large current line
Largecurrentsarecarriedbythemotorpowersupplyand
motor ground for these ICs.
Therefore, the layout of the pattern of the PC board and
the constants of certain parameters for external compo-
nents, such as the capacitor between the power supply
and ground, may cause this large output current to flow
back to the input pins, resulting in output oscillation or
other malfunctions. To prevent this, make sure that the
PC board layout and external circuit constants cause no
problems with the characteristics of these ICs.
(7) Power dissipation
(3) IC ground voltage
To provide separation between the circuit elements with-
in the IC, the GND pin of the IC must always be held at
a lower potential than the other pins.
The power dissipation will fluctuate depending on the
mounting conditions of the IC and the ambient environ-
ment. Make sure to carefully check the thermal design of
the application where these ICs sill be used.
(8) Power consumption
IfthepotentialoftheGNDpinisallowedtoriseabovethat
of other pins (such as the control input pins), separation
between the internal circuit elements could break down,
resulting in erratic operation or internal damage.
For example, a resistor may be connected between GND
(pin 1) and the ground as shown in Fig. 19, when detect-
ing and controlling the motor operating current. In this
case, thepotentialofpin1wouldbeabovethegroundpo-
tential by an amount equal to the voltage drop across the
resistor. Therefore, dropping the input pin potential to the
ground potential would have the effect of applying a neg-
ative voltage to the input pin.
The power consumption by the IC varies widely with the
power supply voltage and the output current. Give full
consideration to the power dissipation rating and the
thermal resistance data and transient thermal resistance
data, to provide a thermal design so that none of the rat-
ings for the IC are exceeded.
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