BAT54CFILM原理图各脚功能电路原理芯片引脚定义引脚图及功能-中国IC网-芯三七

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产品型号BAT54CFILM的概述

芯片BAT54CFILM的概述 BAT54CFILM是一种小型双极型晶体管（BJT），它在电子产品中用途广泛，尤其是在低功耗、高效率的应用场景中。该晶体管通常被用于开关和放大电路，具有较低的输入和输出电压，适用于低电压的操作环境。由于其低阈值和优良的温度稳定性，BAT54CFILM已成为现代电子电路设计中不可或缺的元件之一。芯片BAT54CFILM的详细参数 BAT54CFILM的主要电气特性包括： 1. 工作电压范围： - 最大正向电流：200mA - 反向电压：最大40V 2. 直流电流增益（hFE）： - 在10mA的集电极电流下，hFE一般在50至200之间。 3. 耗散功率： - 最大耗散功率为250mW。 4. 结温范围： - 工作温度范围：-55°C 至 +150°C。 5. 开关速度： - 适合高频应用，开关时间非常短。这些参数使...

产品型号BAT54CFILM的Datasheet PDF文件预览

BAT54, A, C, S

SMALL SIGNAL SCHOTTKY DIODE

FEATURES AND BENEFITS

VERY SMALL CONDUCTION LOSSES

NEGLIGIBLE SWITCHING LOSSES

LOW FORWARD VOLTAGE DROP

SURFACE MOUNT DEVICE

BAT54

BAT54A

DESCRIPTION

Schottky barrier diodes encapsulated in a SOT-23

small SMD packages.

Double diodes with different pining are available.

BAT54S

BAT54C

SOT-23

ABSOLUTE RATINGS

Symbol

(limiting values)

Parameter

Value

Unit

V_RRM

I_F

Repetitive peak reverse voltage

Continuous forward current

0.3

I_FSM

P_tot

T_stg

Surge non repetitive forward current

Power dissipation (note 1)

tp=10ms sinusoidal

T_amb= 25°C

250

Maximum storage temperature range

Maximum operating junction temperature *

- 65 to +150

150

T_L

Maximum temperature for soldering during 10s

260

Note 1:

for double diodes, Ptot is the total dissipation of both diodes.

dPtot

dTj

* :

thermal runaway condition for a diode on its own heatsink

Rth(j−a)

June 1999 - Ed: 3A

1/5

BAT54, A, C, S

THERMAL RESISTANCE

Symbol

Parameter

Value

Unit

R_{th (j-a)}Junction to ambient (*)

500

C/W

(*) Mounted on epoxy board with recommended pad layout.

STATIC ELECTRICAL CHARACTERISTICS

(per diode)

Symbol

Parameters

Tests conditions

Min. Typ. Max.

Unit

V_F*

Forward voltage drop

Tj = 25 C

I_F= 0.1 mA

I_F= 1 mA

240

320

400

500

900

I_F= 10 mA

I_F= 30 mA

I_F= 100 mA

V_R= 30 V

I_R**

Reverse leakage current

Tj = 25 C

Tj = 100 C

100

Pulse test : * tp = 380 µs, δ < 2%

** tp = 5 ms, δ < 2%

DYNAMIC CHARACTERISTICS

(Tj = 25 °C)

Symbol

Parameters

Junction

Tests conditions

= 1 V F = 1 MHz

Min.

Typ. Max. Unit

Tj = 25 C

V_R

capacitance

t_rr

Reverse recovery

time

I_F= 10 mA I_R= 10 mA Tj = 25°C

I_rr= 1 mA R_L= 100 Ω

Fig.1 :

average forward current.

Average forward power dissipation versus

Fig.2 :

Average forward current versus ambient

temperature ( = 1).

PF(av)(W)

IF(av)(A)

0.35

δ = 0.1

δ = 0.2

δ = 0.5

δ = 0.05

0.30

0.25

0.20

0.15

0.30

0.25

0.20

0.15

0.10

0.05

0.00

δ = 1

0.10

0.05

Tamb(°C)

=tp/T

IF(av) (A)

0.15 0.20

=tp/T

0.00

100

125

150

0.00

0.05

0.10

0.25

0.30

2/5

BAT54, A, C, S

Fig.3 :

Fig.4 :

Relative variation of thermal impedance

junction to ambient versus pulse duration (alumine

substrate 10mm x 8mm x 0.5mm).

Non repetitive surge peak forward current

versus overload duration (maximum values).

IM(A)

Zth(j-a)/Rth(j-a)

1.0

1.00

0.9

0.8

0.7

δ = 0.5

δ = 0.2

Ta=25°C

0.6

0.5

0.4

0.3

0.2

0.1

0.0

δ = 0.1

0.10

Ta=50°C

Ta=100°C

Single pulse

tp(s)

t(s)

=tp/T

=0.5

0.01

1E-3

1E-2

1E-1

1E+0

1E-2

1E-1

1E+0

1E+1

1E+2

Fig.5 :

Fig.6 :

Reverse leakage current versus junction

temperature.

Reverse leakage current versus reverse

voltage applied (typical values).

IR(µA)

1E+4

IR(µA)

1E+2

VR=30V

1E+3

1E+2

1E+1

1E+0

1E-1

1E-2

Tj=100°C

1E+1

Tj=50°C

1E+0

Tj=25°C

1E-1

Tj(°C)

VR(V)

1E-2

100

125

150

Fig.7 :

Fig.8 :

current (typical values).

Junction capacitance versus reverse

Forward voltage drop versus forward

voltage applied (typical values).

C(pF)

IFM(A)

5E-1

F=1MHz

Tj=25°C

1E-1

Tj=100°C

1E-2

Tj=50°C

Tj=25°C

1E-3

VFM(V)

VR(V)

1E-4

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

3/5

BAT54, A, C, S

PACKAGE MECHANICAL DATA

SOT-23

DIMENSIONS

Millimeters Inches

Min. Max.

REF.

Min.

Max.

0.89

1.4

0.1

0.035

0.055

0.004

0.02

0.3

0.51

0.18

3.04

1.05

2.1

0.012

0.003

0.108

0.033

0.067

0.047

0.083

0.085

2.75

0.85

1.7

0.007

0.12

0.041

0.083

0.063

0.108

1.2

1.6

2.1

2.75

0.6 typ.

0.024 typ.

0.35

0.65

0.014

0.026

Ordering type

BAT54FILM

Marking

D86

Package

SOT-23

Weight

0.01g

Base qty

3000

Delivery mode

Tape & reel

BAT54AFILM

BAT54CFILM

BAT54SFILM

D84

3000

D87

3000

D88

3000

Epoxy meets UL94,V0

4/5

BAT54, A, C, S

OPTIMIZED SOT-23 FOOTPRINT DIMENSIONS

FOOTPRINT DIMENSIONS

COMPATIBLE SOT-23 / SC-59

(in millimeters and inches)

0.9

0.035

1.9

0.075

0.079

inch

1.45

0.037

0.040

0.9

0.035

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of

use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by

implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to

change without notice. This publication supersedes and replaces all information previously supplied.

STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-

proval of STMicroelectronics.

The ST logo is a registered trademark of STMicroelectronics

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