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  • 北京元坤伟业科技有限公司

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产品型号BCM56850AOKFSBG的概述

芯片BCM56850AOKFSBG的概述 BCM56850AOKFSBG是一款高性能的网络处理器芯片,广泛应用于数据中心、云计算和高性能网络交换设备中。该芯片是博通(Broadcom)公司推出的一款集成度高、功能强大的多层以太网交换机芯片,旨在满足现代网络环境对高速和高效数据处理的需求。BCM56850系列芯片专门为支持大型企业网和服务提供商的网络应用而设计,其灵活的架构和强大的处理能力使其成为当前网络硬件工程师和系统设计师追求的理想选择。 芯片BCM56850AOKFSBG的详细参数 BCM56850AOKFSBG芯片具有以下主要参数: 1. 处理能力:支持多达48个10G以太网端口,能够实现极高的吞吐量,典型值可达到1.44Tbps。同时,该芯片也支持对更高速度端口(如25G和100G)的扩展,以便适应未来网络的高带宽需求。 2. 转发性能:其低延迟特性,使其可以在不妨碍数据传输速...

产品型号BCM5690的Datasheet PDF文件预览

BCM5671  
®
BCM5671 4-PORT, 80-Gbps SWITCH FABRIC  
S U M M A R Y O F B E N E F I T S  
F E A T U R E S  
Four 10-Gbps (HiGig™) switch fabric ports  
System vendors can build high-performance, high-density  
Gigabit Ethernet LAN switches in several form factors.  
Nonblocking, 80-Gbps wire speed backplane/switch fabric  
performance  
Support for multiple CoS and very low latency enable the  
support of VoIP and other voice, video, and data applications.  
Forwarding rate of 60 million packets/second  
4 integrated high performance XAUI interfaces  
Eight programmable priority queues per port  
Port trunking and mirroring across multiple devices  
Hot-swap capable with AC coupling  
Built-in high-speed serial interfaces with Broadcom-unique  
SerDes technology eases and accelerates system design, while  
reducing cost and conserving board space.  
A 640 KB internal data buffer memory eliminates the need for  
expensive external memory.  
Drives up to 10m of low cost copper cables for stacking switch  
applications.  
Supports redundancy on linecards for chassis based  
applications  
T A R G E T A P P L I C A T I O N S  
Advanced diagnostic features including IEEE 1149.1 boundary  
scan, JTAG and extensive BIST functionality  
Switch fabric in modular Gigabit Ethernet switches  
Resilient link configuration through active multipath  
forwarding  
Switch fabric in high-port-count stand-alone or stackable  
Gigabit Ethernet switches  
PCI interface  
Switch fabric for chassis and in-server switch blade  
applications  
Broadcom switch API compatibility  
Advanced 0.13 µm CMOS technology  
Small 600-pin EBGA package  
Low power: 6W  
Packet-based switch fabric in telco applications  
HiGig  
Interface  
10G  
HiGig  
QUEUE SYSTEM  
FORWARDING TABLES  
10 Gbps  
10 Gbps  
CMIC  
RAM  
HiGig  
Protocol  
Processor  
HiGig  
4 channels  
of 3.125 Gbps  
(XAUI I/F)  
Nonblocking 4-Port Gigabit Ethernet Switch  
O V E R V I E W  
I2C Bus  
HiGig (10 Gbps)  
HiGig (10 Gbps)  
HiGig (10 Gbps)  
HiGig (10 Gbps)  
PCI Bus  
Port 4  
Port 3  
Port 2  
Port 1  
Port 0  
XAUI  
XAUI  
MAC  
XAUI  
MAC  
XAUI  
MAC  
I2C I/F  
PCI  
MAC  
DMA Buffers  
FIFO  
FIFO  
FIFO  
FIFO  
CMIC Bus Interface  
MR Bus Controller  
MMU  
128 KB  
RAM  
MMU  
128 KB  
RAM  
MMU  
128 KB  
RAM  
MMU  
128 KB  
RAM  
Ingress  
Ingress  
Ingress  
Ingress  
BCM5671  
General Description  
20 Gbps (10 Gbps, full-duplex). The BCM5671 switch fabric  
interconnects other StrataXGS component chips across an 80-Gbps  
backplane. It introduces very low switching latency, enabling the high-  
quality transmission of voice, video, and data traffic. The primary  
application of the BCM5671 is stackable solutions and linecard  
applications.  
The Broadcom BCM5671 switch fabric is the central component of the  
modular and highly scalable StrataXGS Gigabit Ethernet switch  
architecture. StrataXGS components can be applied in a wide variety of  
configurations, enabling system designers to strategically balance cost,  
port density, and performance in the products they build.  
Flexible Management  
Highly Integrated  
The BCM5671 HiGig switch links to a host CPU through a PCI bus at  
speeds up to 66 MHz. Bus mastering and advanced DMA are supported  
in hardware for the efficient exchange of packet data between CPU  
memory and the BCM5671 switch.  
The integration of Broadcom’s robust XAUI-compatible serializer/  
deserializer (SerDes) interface on each BCM5671 port reduces board  
complexity. The XAUI interface can be used to route high-speed signals  
across 44 inches of FR4, connectors, and backplanes. SerDes technology  
also enables the use of inexpensive cables for stacking applications.  
The BCM5671 switch can also work without host CPU support, using an  
I2C interface to initialize chip registers and forwarding tables. The  
BCM5632 can also link to a BCM5671 via an XGMII-to-XAUI  
converter, such as the BCM8011.  
Superior Performance  
The BCM5671 delivers wire speed switching performance across all the  
ports simultaneously. The effective bandwidth of each HiGig interface is  
Broadcom®, the pulse logo, HiGig™ and Connecting everything® are trademarks of  
Broadcom Corporation and/or its subsidiaries in the United States and certain other countries. All other  
trademarks mentioned are the property of their respective owners.  
®
BROADCOM CORPORATION  
16215 Alton Parkway, P.O. Box 57013  
Irvine, California 92619-7013  
Phone: 949-450-8700  
Fax: 949-450-8710  
E-mail: info@broadcom.com  
Web: www.broadcom.com  
© 2004 by BROADCOM CORPORATION. All rights reserved.  
5671-PB05-R  
03/25/04  
配单直通车
BCM5690产品参数
型号:BCM5690
是否Rohs认证: 不符合
生命周期:Transferred
零件包装代码:BGA
包装说明:BGA,
针数:480
Reach Compliance Code:compliant
HTS代码:8542.39.00.01
风险等级:5.78
JESD-30 代码:X-PBGA-B480
湿度敏感等级:1
功能数量:1
端子数量:480
封装主体材料:PLASTIC/EPOXY
封装代码:BGA
封装形式:GRID ARRAY
峰值回流温度(摄氏度):225
认证状态:Not Qualified
表面贴装:YES
电信集成电路类型:TELECOM CIRCUIT
端子形式:BALL
端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED
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