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产品型号BM77SPPS3MC2-0007AA的概述

芯片BM77SPPS3MC2-0007AA概述 随着无线通信技术的发展,Bluetooth模块在物联网设备、智能家居和各种智能终端中越来越普及。BM77SPPS3MC2-0007AA是一款设计用于蓝牙低功耗(BLE)应用的系统级芯片。该芯片专注于提供高效的无线通信能力,并集成了多个功能模块,以便于开发者进行产品设计。BM77SPPS3MC2-0007AA尤其适用于需要小型化和低能耗的终端设备。 BM77SPPS3MC2-0007AA基于低功耗无线通信技术,能够在保持长时间稳定连接的同时,降低设备的能量消耗。其设计考虑到了多种应用场景,包括运动监测、健康监测、智能家居设备及各类传感器。这种灵活性使得该芯片成为了许多研发项目中的理想选择。 BM77SPPS3MC2-0007AA详细参数 BM77SPPS3MC2-0007AA的详细规格参数如下: - 工作电压:1.8V - 3.6V - 芯...

产品型号BM77SPPS3MC2-0007AA的Datasheet PDF文件预览

30077 新竹科學工業園區工業東七路55樓  
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park, Hsinchu 30077, Taiwan, R.O.C.  
TEL : 886-3-577-8385 FAX : 886-3-577-8945  
www.issc-tech.com  
BM77SPPx3MC2  
Bluetooth® 4.0 Dual Mode Module  
Features:  
FIGURE 1:  
Complete, Fully Certified, Embedded 2.4 GHz  
Bluetooth® Version 4.0 Module  
Bluetooth Classic (BR/EDR) and Low Energy (LE)  
Bluetooth SIG Certified  
Onboard embedded Bluetooth Stack  
Transparent UART mode for seamless serial data over  
UART interface  
Easy to configure with Windows GUI or direct by MCU  
Firmware can be field upgradable via UART  
Compact surface mount module: 22 x 12 x 2.4 mm  
Castellated surface mount pads for easy and reliable  
host PCB mounting  
Environmentally friendly, RoHS compliant  
Perfect for Portable Battery Operated Devices  
Internal Battery Regulator Circuitry  
Worldwide regulatory certifications  
Operational:  
Single operating voltage: 3.2V to 4.3V  
Temperature range: -20 to 70°C  
Simple, UART interface  
Integrated crystal, internal voltage regulator, and  
matching circuitry  
Multiple I/O pins for control and status  
General Description:  
The BM77 is a fully-certified Bluetooth® Version 4.0  
(BR/EDR/LE) module for designers who want to easily add  
dual mode Bluetooth® wireless capability to their products.  
Delivering local connectivity for the Internet of Things (IoT),  
the BM77 bridges your product to Smart Phones and Tablets  
for convenient data transfer, control and access to cloud  
applications.  
RF/Analog:  
Frequency: 2.402 to 2.480 GHz  
Receive Sensitivity: -90 dBm (Classic); -92 dBm (LE)  
Power Output: 2 dBm (typ.)  
This Bluetooth SIG certified module provides a complete  
wireless solution with Bluetooth stack onboard, integrated  
antenna, and worldwide radio certifications in a compact  
surface mount package, 22 x 12 x 2.4 mm. It supports GAP,  
SDP, SPP, and GATT profiles. Data is transferred over the  
Bluetooth link by sending/receiving data via transparent  
UART mode, making it easy to integrate with any processor  
or Microcontroller with a UART interface. Configuration is  
made easy using a Windows® based GUI or directly via UART  
by a MCU.  
Data Throughput:  
50 kilobyte (Classic on Android)  
8 kilobyte (LE on iOS7)  
MAC/Baseband/Higher Layer:  
Secure AES128 encryption  
GAP, SDP, SPP, GATT profiles  
Antenna:  
Ceramic Chip Antenna (BM77SPPS3MC2)  
External Antenna Connection via RF Pad  
(BM77SPP03MC2)  
Applications:  
Mobile Point of Sales (mPOS)  
LED lighting  
Wearables  
Digital Sports  
Fitness Devices  
Health Care/ Medical  
Automotive Accessories  
Home Automation  
Remote Control Toys  
Compliance:  
Bluetooth SIG QDID: B021961  
Modular Certified for the United States (FCC) and  
Canada (IC)  
European R&TTE Directive Assessed Radio Module  
Australia, New Zealand, Korea, Taiwan, Japan  
© 2014 ISSC Technologies Corp.  
Preliminary  
Revision 2.1.1 – June 16, 2015 Page 1  
BM77SPPx3MC2  
1.0 DEVICE OVERVIEW  
The BM77 is a complete, fully certified, embedded 2.4 GHz Bluetooth® version 4.0 (BR/EDR/LE) wireless  
module. It incorporates an on-board Bluetooth stack, cryptographic accelerator, power management  
subsystem, 2.4 GHz transceiver, and RF power amplifier (see Figure 1-1). With the BM77, designers can  
embed Bluetooth functionality rapidly into virtually any device.  
The BM77 provides cost and time-to-market savings as a self-contained module solution. The module  
has been designed to provide integrators with a simple Bluetooth solution that features:  
Ease of integration and programming  
Vastly reduced development time  
Minimum system cost  
Interoperability with Bluetooth hosts  
Maximum value in a range of applications  
The BM77 can independently maintain a low-power wireless connection. Low-power usage and flexible  
power management maximize the module’s lifetime in battery-operated devices.  
The BM77 module comes in two varieties. The BM77SPPS3MC2 is a complete, fully regulatory certified  
module with integral ceramic chip antenna and shield. The BM77SPP03MC2 is a lower cost alternative  
with external antenna and no shield. The integrator is responsible for the antenna, antenna matching,  
and regulatory certifications.  
The BM77 is a small, compact, surface mount module with castellated pads for easy and reliable host  
PCB mounting. The module is compatible with standard pick-and-place equipment.  
TABLE 1-1: BM77 MODULE FAMILY TYPES  
Device  
Antenna  
Shield  
Yes  
No  
Regulatory Certifications  
FCC, IC, CE, KCC, NCC, Japan  
CE  
BM77SPPS3MC2-0007AA  
BM77SPP03MC2-0007AA  
Integral ceramic chip  
External  
FIGURE 1-1: BM77 BLOCK DIAGRAM  
BM77SPPx3MC2  
Ceramic Chip Antenna  
(BM77SPPS3MC2)  
External Antenna  
(BM77SPP03MC2)  
IS1677SM  
16 MHz  
RF Matching  
Configurable  
Control and  
Indication I/O  
UART  
Power  
I2C  
8Kbit  
Serial  
EEPROM  
1.1  
Interface Description  
© 2014 ISSC Technologies Corp.  
Preliminary  
Revision 2.1.1 – June 16, 2015 Page 2  
BM77SPPx3MC2  
The BM77SPPS3MC2 pin diagram is shown in Figure 1-2 and the BM77SPP03MC2 is shown in Figure 1-3.  
The pin descriptions are shown in Table 1-1  
FIGURE 1-2: BM77SPPS3MC2 PIN DIAGRAM  
GND  
GND  
1
2
33 GND  
32 GND  
GND  
BAT_IN  
3
4
5
6
7
8
9
SW_BTN  
LDO33_O  
VDD_IO  
31 GND  
30 LED1  
29 P37  
28 P36  
27 P34  
26 P33  
25 P32  
24 P31  
23 TXD  
22 RXD  
LDO18_O  
WAKEUP  
PMULDO_O 10  
P04 11  
P15 12  
P12/SCL 13  
P13/SDA 14  
FIGURE 1-3: BM77SPP03MC2 PIN DIAGRAM  
GND  
BAT_IN  
1
2
3
4
5
6
7
8
9
30 BT_RF  
SW_BTN  
LDO33_O  
VDD_IO  
29 GND  
28 LED1  
27 P37  
26 P36  
25 P34  
24 P33  
23 P32  
22 P31  
21 TXD  
20 RXD  
LDO18_O  
WAKEUP  
PMULDO_O  
P04  
P15 10  
P12/SCL 11  
P13/SDA 12  
TABLE 1-1: PIN DESCRIPTION  
BM77SPPS3MC2 BM77SPP03MC2  
Symbol  
Type  
Description  
© 2014 ISSC Technologies Corp.  
Preliminary  
Revision 2.1.1 – June 16, 2015 Page 3  
BM77SPPx3MC2  
Pin  
1
2
3
4
Pin  
--  
--  
1
2
GND  
GND  
GND  
BAT_IN  
Power  
Power  
Power  
Power  
Ground reference  
Ground reference  
Ground reference  
Battery Input. Main positive supply input. Connect to 10  
uF low ESR ceramic capacitor.  
SW_BTN  
5
6
3
4
5
6
7
8
DI  
Software Button H: Power On / L: Power Off  
(See Section 1.6)  
Internal 3.3V LDO regulator output. Connect to 10 uF low  
ESR ceramic capacitor.  
I/O positive supply input. Ensure VDD_IOand MCU I/O  
voltages are compatible.  
Internal 1.8V LDO regulator output. Connect to 10 uF low  
ESR ceramic capacitor.  
Wakeup from shutdown mode (active low)  
(internal pull-up)  
Power management unit output. Connect to 1 uF low ESR  
ceramic capacitor.  
LDO33_O  
VDD_IO  
Power  
Power  
Power  
DI  
7
LDO18_O  
WAKEUP  
8
9
PMULDO_O  
10  
Power  
P04  
P15  
P12/SCL  
P13/SDA  
P17/CTS  
P05  
11  
12  
13  
14  
15  
16  
17  
9
DO  
DO  
DO  
DIO  
DIO  
DIO  
DIO  
Status Indicator 2 (STATUS_IND_2). See Section 1.5  
Status Indicator 1 (STATUS_IND_1). See Section 1.5  
I2C SCL (Do Not Connect)  
10  
11  
12  
13  
14  
15  
I2C SDA (Do Not Connect)  
Configurable Control or Indication pin or UART CTS (input)  
Configurable Control or Indication pin  
Configurable Control or Indication pin or UART RTS  
(output)  
System configuration (internal pull-up)  
(See Section 1.10)  
System configuration (internal pull-up)  
(See Section 1.10)  
System configuration (internal pull-down)  
(See Section 1.10)  
P00/RTS  
P20  
18  
19  
20  
21  
16  
17  
18  
19  
DI  
DI  
DI  
DI  
P24  
EAN  
RST_N  
Module reset (active low) (internal pull-up)  
Apply a pulse of at least 63 ns.  
RXD  
TXD  
P31  
22  
23  
24  
20  
21  
22  
DI  
DO  
DIO  
UART data input  
UART data output  
Configurable Control or Indication pin  
(when configured as input: internal pull-up)  
Configurable Control or Indication pin  
(when configured as input: internal pull-up)  
Configurable Control or Indication pin  
(when configured as input: internal pull-up)  
Configurable Control or Indication pin  
(when configured as input: internal pull-up)  
(Do Not Connect)  
Configurable Control or Indication pin  
(when configured as input: internal pull-up)  
Status LED (See Section 1.9)  
Ground reference  
External antenna connection (50 ohm)  
Ground reference  
P32  
P33  
P34  
25  
26  
27  
23  
24  
25  
DIO  
DIO  
DIO  
P36  
P37  
28  
29  
26  
27  
DIO  
DIO  
LED1  
GND  
BT_RF  
GND  
30  
31  
--  
32  
33  
28  
29  
30  
--  
DO  
Power  
AIO  
Power  
Power  
GND  
--  
Ground reference  
Note 1: Pin type abbreviation: A = Analog, D = Digital, I = Input, O = Output.  
1.2  
Configuring the BM77  
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Configuring the BM77 features can be performed using either MCU commands documented in the “ISSC  
Flash Protocol Programmer’s Guide,” or with the “Windows UI Configuration tool” and “Write EEPROM  
tool.” MCU UART commands are documented in BM77SPP Command Set.”  
1.3  
UART Interface  
Figures 1-4 and 1-5 show Power and MCU interface examples.  
The BM77 UART pins TXDand RXDconnect to the UART pins of the host MCU. It is highly  
recommended to use hardware flow control pins RTSand CTS. The BM77 hardware flow control is  
disabled by default and must be configured to enable. The UART Baud is configurable. The available  
signal rates are listed in Table 4-5.  
1.4  
Control and Indication I/O Pins  
I/O pins P00, P05, P17, P31, P32, P33, P34 and P37 are configurable control and indication I/O. Control  
signals are input to the BM77. Indication signals are output from the BM77. Table 1-2 shows  
configurable I/O pin assignment to control and indication signals. Note that RTS can only be assigned to  
P00 and CTS to P17.  
TABLE 1-2: CONFIGURATION AND INDICATION I/O ASSIGNMENTS  
P00  
P05  
P17  
P31  
P32  
P33  
P34  
P37  
Default  
Default  
Default  
Default  
Default  
Default  
Default  
Default  
1.5  
Status Indication I/O Pins  
I/O pins P15and P04are Status Indicator 1 and 2 signals respectively. Together they provide status  
indication to the MCU as shown in Table 1-3.  
TABLE 1-3: STATUS INDICATION  
P04/STATUS_IND_2  
P15/STATUS_IND_1  
Indication  
Power default / Shutdown state  
Access state  
Link state (no UART data being transmitted)  
Link state (UART data being transmitted)  
H
H
L
H
L
H
L
L
1.6  
Software Button (SW_BTN)  
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The Software Button (SW_BTN) input pin powers the BM77 on (high) or off (low)  
1.7  
WAKE UP (WAKEUP)  
The Wake Up (WAKEUP) input pin wakes the BM77 from shutdown mode (active low).  
1.8  
RESET (RST_N)  
The Reset (RST_N) input pin resets the BM77 (active low pulse for at least 63 ns).  
1.9  
Status LED (LED1)  
The status LED (LED1) indicates:  
Standby  
Inquiry  
Link  
Link Back  
Low Battery  
Page  
Each indication is a configurable flashing sequence. LED brightness can also be configured.  
1.10 System Configuration  
I/O pins P20, P24, and EAN place the BM77 into operation modes as shown in Table 1-4. P20 and P24  
each have internal pull-ups. EAN has internal pull-down.  
TABLE 1-4: SYSTEM CONFIGURATION SETTINGS  
P20  
High  
Low  
Low  
P24  
High  
High  
Low  
EAN  
Low  
Low  
High  
Operational Mode  
Normal operation  
Test (Write EEPROM)  
Write Flash (Firmware programming)  
1.11 Power  
Figure 1-4 shows an example power scheme using a 3.3 volt low-dropout (LDO) regulator supplying 3.3  
volts to both the BM77 (BAT_INand VDD_IO) and MCU VDD. This power scheme ensures that BM77  
and MCU I/O voltages are compatible.  
Figure 1-5 shows an example power scheme using a 3.7 volt lithium-ion battery. The BM77 has an  
internal 3.3 volt LDO regulator. Battery power is applied to BAT_INpin. The regulated 3.3 volts output  
is on the LDO33_Opin. From the LDO33_Opin, voltage can be routed the VDD_IOpin and external  
circuitry including the MCU. This power scheme ensures that BM77 and MCU I/O voltages are  
compatible.  
CAUTION: The internal 3.3 volt LDO current source: 50 mA maximum  
Recommended bypass capacitor location and values are shown in Figures 1-4 and 1-5. Capacitors can be  
low ESR ceramic. Place capacitors close to BM77 module.  
FIGURE 1-4: BM77 TO MCU INTERFACE EXAMPLE – LDO  
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FIGURE 1-5: BM77 TO MCU INTERFACE EXAMPLE – BATTERY  
Li-ion Battery  
(3.7V)  
(3.3V)  
LDO  
BM77 Module  
MCU  
BAT_IN  
(3.2 – 4.3V)  
P15/STATUS_IND_1  
P04/STATUS_IND_2  
I/O  
I/O  
VDD  
Note 1  
10uF  
10uF  
SW_BTN  
WAKEUP  
RST_N  
I/O  
I/O  
I/O  
LDO33_O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
P37  
P34  
P33  
P32  
P31  
P05  
VDD_IO (Note 1)  
(2.8 – 3.63V)  
Note 2  
NC  
NC  
LDO18_O  
CTS  
RTS  
P00/RTS  
P17/CTS  
PMULDO_O  
TXD  
RXD  
RX  
TX  
P12/SCL  
P13/SDA  
P36  
NC  
NC  
NC  
LED1  
Note: 1. Ensure VDD_IO and MCU VDD voltages are compatible.  
2. Control and indication ports are configurable.  
System Configuration  
1.12 Mounting Details  
The BM77SPPS3MC2 physical dimensions are shown in Figure 1-6, recommended host PCB footprint in  
Figure 1-7, and mounting suggestion in Figure 1-8. There should not be top copper layer near the test  
pin area shown in Figure 1-7. When laying out the host PCB, the areas under the antenna should not  
contain any top, inner layer, or bottom copper as shown in Figure 1-8. A low-impedance ground plane  
will ensure best radio performance (best range, lowest noise). Figure 1-8 shows a minimum ground  
plane area to the left and right of the module for best antenna performance. The ground plane can be  
extended beyond the minimum recommended as need for host PCB EMC noise reduction. For best  
range performance, keep all external metal away from the ceramic chip antenna at least 31 mm.  
The BM77SPP03MC2 physical dimensions are shown in Figure 1-9, recommended host PCB footprint in  
Figure 1-10, and mounting suggestion in Figure 1-11. It is highly recommended to layout the host PCB as  
suggested in Figure 1-11. A low-impedance ground plane will ensure best radio performance (best  
range, lowest noise). Pin 30 (BT_RF) is a 50 ohm connection to an external antenna connector, PCB  
trace antenna, or component (ceramic chip) antenna through a host PCB 50 ohm micro-strip trace. This  
trace can be extended to include passive parts for antenna attenuation padding, impedance matching,  
or to provide test posts. It is recommended that the micro-strip trace be as short as possible for  
minimum loss and best impedance matching. If the micro-strip trace is longer, it should be a 50 ohm  
impedance. Figure 1-11 shows an example connection to U.FL connector.  
1.13 Soldering Recommendations  
The BM77 wireless module was assembled using standard lead-free reflow profile IPC/JEDEC J-STD-020.  
The module can be soldered to the host PCB using standard leaded and lead-free solder reflow profiles.  
To avoid damaging the module, the following recommendations are given:  
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BM77SPPx3MC2  
Microchip Technology Application Note AN233 Solder Reflow Recommendation (DS00233)  
provides solder reflow recommendations  
Do not exceed peak temperature (TP) of 250 deg C  
Refer to the solder paste data sheet for specific reflow profile recommendations  
Use no-clean flux solder paste  
Do not wash as moisture can be trapped under the shield  
Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.  
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BM77SPPx3MC2  
FIGURE 1-6: BM77SPPS3MCS MODULE DIMENSIONS  
(Top View)  
(Side View)  
(Bottom View)  
22.0  
21.2  
20.1  
22.0  
21.2  
20.1  
21.5  
19.9  
1
33  
18.95  
16.95  
14.90  
18.0  
18.0  
17.3  
shield mounting hole  
13.9  
12.8  
11.7  
10.6  
9.5  
13.9  
12.8  
11.7  
10.6  
9.5  
1.0mm  
0.7mm  
1.1mm  
8.4  
8.4  
(Bottom View)  
7.3  
7.3  
6.2  
6.2  
5.1  
5.1  
4.0  
4.0  
2.9  
2.9  
1.8  
1.8  
0.7  
0.0  
0.0  
shield  
mounting  
hole  
Dimentions are in millimeters  
Tolerances:  
PCB Outline: +/- 0.4 mm  
PCB Thickness: +/- 0.06 mm  
1.0mm  
Pad Detail  
FIGURE 1-7: BM77SPPS3MC2 RECOMMEDED PCB FOOTPRINT  
(Top View)  
Top Copper  
Keep Out Area  
22.0  
21.2  
20.1  
18.0  
18.0  
16.0  
13.9  
12.8  
11.7  
10.6  
9.5  
0.5mm  
1.5mm  
8.4  
0.7mm  
1.1mm  
7.3  
6.2  
5.1  
4.0  
2.9  
1.8  
0.0  
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BM77SPPx3MC2  
FIGURE 1-8: BM77SPPS3MCS HOST PCB MOUNTING SUGGESTION  
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BM77SPPx3MC2  
FIGURE 1-9: BM77SPP03MCS MODULE DIMENSIONS  
(Top View) (Side View)  
(Bottom View)  
1.0mm  
15.0  
13.9  
12.8  
11.7  
10.6  
9.5  
15.0  
13.9  
12.8  
11.7  
10.6  
9.5  
1
30  
0.7mm  
1.1mm  
8.4  
8.4  
(Bottom View)  
7.3  
7.3  
6.2  
5.1  
4.0  
2.9  
1.8  
6.2  
5.1  
4.0  
2.9  
1.8  
0.0  
0.0  
Dimentions are in millimeters  
Tolerances:  
PCB Outline: +/- 0.4 mm  
PCB Thickness: +/- 0.06 mm  
1.0mm  
Pad Detail  
FIGURE 1-10: BM77SPP03MC2 RECOMMEDED PCB FOOTPRINT  
(Top View)  
0.5mm  
1.5mm  
15.0  
13.9  
12.8  
11.7  
10.6  
9.5  
8.4  
0.7mm  
7.3  
6.2  
5.1  
1.1mm  
4.0  
2.9  
1.8  
0.0  
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BM77SPPx3MC2  
FIGURE 1-11: BM77SPP03MCS HOST PCB MOUNTING SUGGESTION  
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BM77SPPx3MC2  
2.0 APPLICATION INFORMATION  
2.2 BM77SPPS3MC2 Ceramic Chip Antenna  
The BM77SPPS3MC2 module contains an integral ceramic chip antenna. The antenna performance on  
the module is shown in Figure 2-1.  
FIGURE 2-1: BM77SPPS3MC2 ANTENNA RADIATION PATTERN  
Frequency  
Max Gain  
Efficiency  
2450 MHz  
1.63 dBi  
71.55%  
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BM77SPPx3MC2  
2.3 External Configuration and Programming  
The BM77 module can be configured and firmware programmed using an external configuration and  
programming tool available from ISSC Technologies. Figure 2-2 shows the connections between the  
BM77 and header J1, a standard 8-pin 0.100” (2.54 mm) spaced header. It is recommended to include  
this header on the host PCB for development.  
Configuration and firmware programming modes are entered according to the system configuration I/O  
pins (see Section 1.8).  
FIGURE 2-2: EXTERNAL PROGRAMMING HEADER CONNECTIONS  
BM77 Module  
BAT_IN  
GND  
(BM77SPP03MC2) BT_RF  
LED1  
J1  
P24  
8
7
6
5
4
3
2
1
SW_BTN  
P37  
P36  
P34  
P33  
GND  
TXD  
LDO33_O  
VDD_IO  
LDO18_O  
RXD  
5V_USB  
EAN  
NC  
BAT_IN  
P20  
WAKEUP  
PMULDO_O  
P32  
P31  
P04  
P15  
P12/SCL  
P13/SDA  
TXD  
RXD  
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3.0 REGULATORY APPROVAL  
This section outlines the regulatory information for the BM77SSPS3MC2 module for the following  
countries:  
United States  
Canada  
Europe  
Australia  
New Zealand  
Japan  
Korea  
Taiwan  
Other Regulatory Jurisdictions  
3.2  
United States  
The BM77SSPS3MC2 module has received Federal Communications Commission (FCC) CFR47  
Telecommunications, Part 15 Subpart C “Intentional Radiators” modular approval in accordance with  
Part 15.212 Modular Transmitter approval. Modular approval allows the end user to integrate the BM77  
module into a finished product without obtaining subsequent and separate FCC approvals for intentional  
radiation, provided no changes or modifications are made to the module circuitry. Changes or  
modifications could void the user’s authority to operate the equipment. The end user must comply with  
all of the instructions provided by the Grantee, which indicate installation and/or operating conditions  
necessary for compliance.  
The finished product is required to comply with all applicable FCC equipment authorizations regulations,  
requirements and equipment functions not associated with the transmitter module portion. For  
example, compliance must be demonstrated to regulations for other transmitter components within the  
host product; to requirements for unintentional radiators (Part 15 Subpart B “Unintentional Radiators”),  
such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization  
requirements for the non-transmitter functions on the transmitter module (i.e., Verification, or  
Declaration of Conformity) (e.g., transmitter modules may also contain digital logic functions) as  
appropriate.  
3.2.1 LABELING AND USER INFORMATION REQUIREMENTS  
The BM77 module has been labeled with its own FCC ID number, and if the FCC ID is not visible when  
the module is installed inside another device, then the outside of the finished product into which the  
module is installed must also display a label referring to the enclosed module. This exterior label can use  
wording as follows:  
Contains Transmitter Module FCC ID: A8TBM77SPPSYC2A  
or  
Contains FCC ID: A8TBM77SPPSYC2A  
This device complies with Part 15 of the FCC Rules. Operation is subject to the  
following two conditions: (1) this device may not cause harmful interference,  
and (2) this device must accept any interference received, including  
interference that may cause undesired operation  
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A user’s manual for the finished product should include the following statement:  
This equipment has been tested and found to comply with the limits for a  
Class B digital device, pursuant to part 15 of the FCC Rules. These limits are  
designed to provide reasonable protection against harmful interference in a  
residential installation. This equipment generates, uses and can radiate radio  
frequency energy, and if not installed and used in accordance with the  
instructions, may cause harmful interference to radio communications.  
However, there is no guarantee that interference will not occur in a particular  
installation. If this equipment does cause harmful interference to radio or  
television reception, which can be determined by turning the equipment off  
and on, the user is encouraged to try to correct the interference by one or  
more of the following measures:  
Reorient or relocate the receiving antenna.  
Increase the separation between the equipment and receiver.  
Connect the equipment into an outlet on a circuit different from that  
to which the receiver is connected.  
Consult the dealer or an experienced radio/TV technician for help.  
Additional information on labeling and user information requirements for Part 15 devices can be found  
in KDB Publication 784748 available at the FCC Office of Engineering and Technology (OET) Laboratory  
Division Knowledge Database (KDB) http://apps.fcc.gov/oetcf/kdb/index.cfm.  
3.2.2 RF EXPOSURE  
All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF  
Exposure Guidance provides guidance in determining whether proposed or existing transmitting  
facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields  
adopted by the Federal Communications Commission (FCC).  
From the FCC Grant: Output power listed is conducted. This grant is valid only when the module is sold  
to OEM integrators and must be installed by the OEM or OEM integrators. This transmitter is restricted  
for use with the specific antenna(s) tested in this application for Certification and must not be co-located  
or operating in conjunction with any other antenna or transmitters within a host device, except in  
accordance with FCC multi-transmitter product procedures.  
3.2.3 HELPFUL WEB SITES  
Federal Communications Commission (FCC): http://www.fcc.gov  
FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB):  
http://apps.fcc.gov/oetcf/kdb/index.cfm  
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3.3  
Canada  
The BM77SSPS3MC2 module has been certified for use in Canada under Industry Canada (IC) Radio  
Standards Specification (RSS) RSS-210 and RSS-Gen. Modular approval permits the installation of a  
module in a host device without the need to recertify the device.  
3.3.1 LABELING AND USER INFORMATION REQUIREMENTS  
Labeling Requirements for the Host Device (from Section 3.2.1, RSS-Gen, Issue 3, December 2010): The  
host device shall be properly labeled to identify the module within the host device.  
The Industry Canada certification label of a module shall be clearly visible at all times when installed in  
the host device, otherwise the host device must be labeled to display the Industry Canada certification  
number of the module, preceded by the words “Contains transmitter module”, or the word “Contains”,  
or similar wording expressing the same meaning, as follows:  
Contains transmitter module IC: 12246A-BM77SPPSYC2  
User Manual Notice for License-Exempt Radio Apparatus (from Section 7.1.3 RSS-Gen, Issue 3,  
December 2010): User manuals for license-exempt radio apparatus shall contain the following or  
equivalent notice in a conspicuous location in the user manual or alternatively on the device or both:  
This device complies with Industry Canada license-exempt RSS standard(s).  
Operation is subject to the following two conditions: (1) this device may not  
cause interference, and (2) this device must accept any interference, including  
interference that may cause undesired operation of the device.  
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux  
appareils radio exempts de licence. L'exploitation est autorisée aux deux  
conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2)  
l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi,  
même si le brouillage est susceptible d'en compromettre le fonctionnement.  
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Transmitter Antenna (from Section 7.1.2 RSS-Gen, Issue 3, December 2010): User manuals for  
transmitters shall display the following notice in a conspicuous location:  
Under Industry Canada regulations, this radio transmitter may only operate  
using an antenna of a type and maximum (or lesser) gain approved for the  
transmitter by Industry Canada. To reduce potential radio interference to  
other users, the antenna type and its gain should be so chosen that the  
equivalent isotropically radiated power (e.i.r.p.) is not more than that  
necessary for successful communication.  
Conformément à la réglementation d'Industrie Canada, le présent émetteur  
radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou  
inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de  
réduire les risques de brouillage radioélectrique à l'intention des autres  
utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la  
puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité  
nécessaire à l'établissement d'une communication satisfaisante.  
The above notice may be affixed to the device instead of displayed in the user manual.  
User manuals for transmitters equipped with detachable antennas shall also contain the following  
notice in a conspicuous location:  
This radio transmitter (identify the device by certification number, or model  
number if Category II) has been approved by Industry Canada to operate with  
the antenna types listed below with the maximum permissible gain and  
required antenna impedance for each antenna type indicated. Antenna types  
not included in this list, having a gain greater than the maximum gain  
indicated for that type, are strictly prohibited for use with this device.  
Conformément à la réglementation d'Industrie Canada, le présent émetteur  
radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou  
inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de  
réduire les risques de brouillage radioélectrique à l'intention des autres  
utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la  
puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité  
nécessaire à l'établissement d'une communication satisfaisante.  
Immediately following the above notice, the manufacturer shall provide a list of all antenna types  
approved for use with the transmitter, indicating the maximum permissible antenna gain (in dBi) and  
required impedance for each.  
3.3.2 RF EXPOSURE  
All transmitters regulated by IC must comply with RF exposure requirements listed in RSS-102 - Radio  
Frequency (RF) Exposure Compliance of Radiocommunication Apparatus (All Frequency Bands).  
(Get direct quote from Certificate and place here)  
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3.3.3 HELPFUL WEB SITES  
Industry Canada: http://www.ic.gc.ca/  
3.4  
Europe  
The BM77SPPS3MC2 module is an R&TTE Directive assessed radio module that is CE marked and has  
been manufactured and tested with the intention of being integrated into a final product.  
The BM77 module has been tested to R&TTE Directive 1999/5/EC Essential Requirements for Health and  
Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC) (Article 3.1(b)), and Radio (Article 3.2) and  
are summarized in Table 3-1: European Compliance Testing. A Notified Body Opinion has also been  
issued. All test reports are available on the BM77 product web page at  
http://www.microchip.com/bm77.  
The R&TTE Compliance Association provides guidance on modular devices in document Technical  
Guidance Note 01 available at http://www.rtteca.com/html/download_area.htm.  
Note: To maintain conformance to the testing listed in Table 3-1: European Compliance Testing, the  
PENDING  
module shall be installed in accordance with the installation instructions in this data sheet and shall  
not be modified.  
When integrating a radio module into a completed product the integrator becomes the manufacturer  
of the final product and is therefore responsible for demonstrating compliance of the final product  
with the essential requirements of the R&TTE Directive.  
3.4.1 LABELING AND USER INFORMATION REQUIREMENTS  
The label on the final product which contains the BM77 module must follow CE marking requirements.  
The R&TTE Compliance Association Technical Guidance Note 01 provides guidance on final product CE  
marking.  
3.4.2 ANTENNA REQUIREMENTS  
From R&TTE Compliance Association document Technical Guidance Note 01:  
Provided the integrator installing an assessed radio module with an integral or specific antenna  
and installed in conformance with the radio module manufacturer’s installation instructions  
requires no further evaluation under Article 3.2 of the R&TTE Directive and does not require  
further involvement of an R&TTE Directive Notified Body for the final product. [Section 2.2.4]  
The European Compliance Testing listed in Table 3-1 was performed using the integral ceramic chip  
antenna.  
TABLE 3-1: EUROPEAN COMPLIANCE TESTING  
Certification  
Safety  
Standards  
Article  
Laboratory  
Report Number  
Date  
EN 60950-1:2006+A11:2009+A1:2010 (3.1(a))  
EN 50371:2002-03  
Health  
EMC  
EN 301 489-1 V1.8.1 (2008-04)  
EN 301 489-17 V2.1.1 (2009-05)  
EN 300 328 V1.7.1 (2006-10)  
(3.1(b))  
Radio  
(3.2)  
Notified Body  
Opinion  
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3.4.3 HELPFUL WEB SITES  
A document that can be used as a starting point in understanding the use of Short Range Devices (SRD)  
in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can  
be downloaded from the European Radio Communications Office (ERO) at: http://www.ero.dk/.  
Additional helpful web sites are:  
Radio and Telecommunications Terminal Equipment (R&TTE):  
http://ec.europa.eu/enterprise/rtte/index_en.htm  
European Conference of Postal and Telecommunications Administrations (CEPT):  
http://www.cept.org  
European Telecommunications Standards Institute (ETSI):  
http://www.etsi.org  
European Radio Communications Office (ERO):  
http://www.ero.dk  
The Radio and Telecommunications Terminal Equipment Compliance Association (R&TTE CA):  
http://www.rtteca.com/  
3.5  
Australia  
The Australia radio regulations do not provide a modular approval policy similar to the United States  
(FCC) and Canada (IC). However, BM77 module RF transmitter test reports can be used in part to  
demonstrate compliance in accordance with ACMA Radio communications “Short Range Devices”  
Standard 2004 (The Short Range Devices standard calls up the AS/NZS 4268:2008 industry standard).  
The BM77 module test reports can be used as part of the product certification and compliance folder.  
For more information on the RF transmitter test reports, contact Microchip Technology Australia sales  
office.  
PENDING  
To meet overall Australian final product compliance, the developer must construct a compliance folder  
containing all relevant compliance test reports e.g. RF, EMC, electrical safety and DoC (Declaration of  
Conformity) etc. It is the responsibility of the integrator to know what is required in the compliance  
folder for ACMA compliance. All test reports are available on the BM77 product web page at  
http://www.microchip.com. For more information on Australia compliance, refer to the Australian  
Communications and Media Authority web site http://www.acma.gov.au/.  
3.5.1 HELPFUL WEB SITES  
The Australian Communications and Media Authority: www.acma.gov.au/.  
3.6  
New Zealand  
The New Zealand radio regulations do not provide a modular approval policy similar to the United States  
(FCC) and Canada (IC). However, BM77 module RF transmitter test reports can be used in part to  
demonstrate compliance against the New Zealand “General User Radio License for Short Range  
PENDING  
Devices”. New Zealand Radio communications (Radio Standards) Notice 2010 calls up the AS / NZS  
4268:2008 industry standard. The BM77 module test reports can be used as part of the product  
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certification and compliance folder. All test reports are available on the BM77 product web page at  
http://www.microchip.com/bm77. For more information on the RF transmitter test reports, contact  
Microchip Technology sales office.  
Information on the New Zealand short range devices license can be found in the following web links:  
http://www.rsm.govt.nz/cms/licensees/types-oflicence/general-user-licences/short-range-devices  
and  
http://www.rsm.govt.nz/cms/policy-and-planning/spectrum-policy-overview/legislation/gazette-  
notices/product-compliance/ .  
To meet overall New Zealand final product compliance, the developer must construct a compliance  
folder containing all relevant compliance test reports e.g. RF, EMC, electrical safety and DoC  
(Declaration of Conformity) etc. It is the responsibility of the developer to know what is required in the  
compliance folder for New Zealand Radio communications. For more information on New Zealand  
compliance, refer to the web site http://www.rsm.govt.nz/.  
3.6.1 HELPFUL WEB SITES  
Radio Spectrum Ministry of Economic Development: http://www.rsm.govt.nz/.  
3.7  
Japan  
The BM77SSPS3MC2 module has received type certification and is labeled with its own technical  
conformity mark and certification number as required to conform to the technical standards regulated  
by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of  
Japan.  
Integration of this module into a final product does not require additional radio certification provided  
installation instructions are followed and no modifications of the module are allowed. Additional testing  
may be required:  
If the host product is subject to electrical appliance safety (for example, powered from an AC  
mains), the host product may require Product Safety Electrical Appliance and Material (PSE)  
testing. The integrator should contact their conformance laboratory to determine if this testing  
is required.  
There is an voluntary Electromagnetic Compatibility (EMC) test for the host product  
administered by VCCI: http://www.vcci.jp/vcci_e/index.html  
3.7.1 LABELING AND USER INFORMATION REQUIREMENTS  
The label on the final product which contains the BM77 module must follow Japan marking  
requirements. The integrator of the module should refer to the labeling requirements for Japan  
available at the Ministry of Internal Affairs and Communications (MIC) website.  
The BM77 module is labeled with its own technical conformity mark and certification number. The final  
product in which this module is being used must have a label referring to the type certified module  
inside:  
© 2014 ISSC Technologies Corp.  
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BM77SPPx3MC2  
Contains transmitter module with certificate number:  
202-SMC066  
3.7.2 HELPFUL WEB SITES  
Ministry of Internal Affairs and Communications (MIC): http://www.tele.soumu.go.jp/e/index.htm  
Association of Radio Industries and Businesses (ARIB): http://www.arib.or.jp/english/  
3.8  
Korea  
The BM77SSPS3MC2 module has received certification of conformity in accordance with the Radio  
Waves Act. Integration of this module into a final product does not require additional radio certification  
provided installation instructions are followed and no modifications of the module are allowed.  
3.8.1 LABELING AND USER INFORMATION REQUIREMENTS  
The label on the final product which contains the BM77 module must follow KC marking requirements.  
PENDING  
The integrator of the module should refer to the labeling requirements for Korea available on the Korea  
Communications Commission (KCC) website.  
The BM77 module is labeled with its own KC mark. The final product requires the KC mark and  
certificate number of the module:  
(Number)  
3.8.2 HELPFUL WEB SITES  
Korea Communications Commission (KCC): http://www.kcc.go.kr  
National Radio Research Agency (RRA): http://rra.go.kr  
3.9  
Taiwan  
The BM77SSPS3MC2 module has received compliance approval in accordance with the  
Telecommunications Act. Customers seeking to use the compliance approval in their product should  
contact Microchip Technology sales or distribution partners to obtain a Letter of Authority.  
Integration of this module into a final product does not require additional radio certification provided  
installation instructions are followed and no modifications of the module are allowed.  
3.9.1 LABELING AND USER INFORMATION REQUIREMENTS  
The BM77 module is labeled with its own NCC mark and certificate number as below:  
© 2014 ISSC Technologies Corp.  
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BM77SPPx3MC2  
The user’s manual should contain below warning (for RF device) in traditional Chinese:  
注意 !  
依據 低功率電波輻射性電機管理辦法  
第十二條 經型式認證合格之低功率射頻電機,非經許可,  
公司、商號或使用者均不得擅自變更頻率、加大功率或變更原設計  
之特性及功能。  
第十四條 低功率射頻電機之使用不得影響飛航安全及干擾合法通信;  
經發現有干擾現象時,應立即停用,並改善至無干擾時方得繼續使用。  
前項合法通信,指依電信規定作業之無線電信。  
低功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性  
電機設備之干擾。  
3.9.2 HELPFUL WEB SITES  
National Communications Commission (NCC): http://www.ncc.gov.tw  
3.10 Other Regulatory Jurisdictions  
Should other regulatory jurisdiction certification be required by the customer, or the customer need to  
recertify the module for other reasons, a certification utility is available. For further regulatory  
Certification Utility and documentation, contact ISSC Technologies Corp.  
© 2014 ISSC Technologies Corp.  
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BM77SPPx3MC2  
4.0 ELECTRICAL CHARACTERISTICS  
TABLE 4-1: ENVIRONMENTAL CONDITIONS  
Parameter  
Value  
-20 to 70°C  
-40 to 85°C  
10% to 90%  
10% to 90%  
2
Temperature Range (Operating)  
Temperature Range (Storage)  
Relative Humidity (Operating)  
Relative Humidity (Storage)  
Moisture Sensitivity Level  
TABLE 4-2: ELECTRICAL CHARACTERISTICS  
Parameter  
Supply Voltage (BAT_IN)  
I/O Supply Voltage (VDD_IO)  
I/O Voltage Levels  
Min.  
3.2  
2.8  
Typ.  
Max.  
4.3  
3.63  
Units  
V
V
3.3  
VIL input logic levels low  
VIH input logic levels high  
VOL output logic levels low  
VOH output logic levels high  
RESET  
VTH,res threshold voltage  
Input and Tri-State Current with  
Pull-up Resistor  
-0.3  
2.0  
0.8  
3.6  
0.4  
V
V
V
V
2.4  
-10  
1.6  
65  
V
Kohm  
uA  
Leakage current  
10  
Supply Current  
TX mode  
RX mode  
70  
70  
mA  
mA  
TABLE 4-3: SUPPLY CONSUMPTION – CLASSIC (1)  
Current  
Parameter  
(avg.)  
Units  
Notes  
Standby mode  
Deep power down mode  
Connected + Sniff, Master (no data)  
2.543  
0.343  
0.858  
mA  
mA  
mA  
No data was transmitted  
Sniff interval = 500ms  
No data was transmitted  
Sniff interval = 500ms  
(Data transmitted at 115200 bps; block  
size=500)  
Connected + Sniff, Slave (no data)  
Data, Master  
0.864  
23.03  
mA  
mA  
mA  
Data, Slave  
25.597  
(Data transmitted at 115200 bps; block  
size=500)  
Note 1: Classic BR/EDR, RX_IND Function Enabled  
© 2014 ISSC Technologies Corp.  
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BM77SPPx3MC2  
TABLE 4-4: SUPPLY CONSUMPTION –LOW ENERGY (1)  
Current  
Parameter  
Units  
Notes  
(avg.)  
Standby mode (Discoverable &  
Connectable mode)  
Standby mode (Discoverable &  
Connectable mode)  
Deep power down mode  
Connected (No data)connection  
interval = 500ms  
mA  
mA  
LE fast advertising interval = 160 ms,  
standby at 0 ~ 30 sec  
LE Reduced Power advertising  
interval = 961 ms, standby after 30 sec  
1.237  
0.765  
0.348  
0.679  
mA  
mA  
No data was transmitted  
connection interval = 500 ms, latency=2.  
Connected (transfer  
mA  
mA  
mA  
13.073  
1.648  
Connection interval = 500 ms, latency=2.  
data)connection interval = 500ms  
Connected (No data)connection  
interval = 20ms  
Connected (transfer  
data)connection interval = 20ms  
No data was transmitted  
connection interval = 20 ms, latency=2.  
18.581  
Connection interval = 20 ms, latency=2.  
Note 1: Low Energy, RX_IND Function Enabled  
TABLE 4-5: UART BAUD  
Crystal Frequency  
Baud  
Actual Baud  
Error Rate (%)  
(MHz)  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
921600  
460800  
307200  
230400  
115200  
57600  
38400  
28800  
19200  
14400  
9600  
941176  
457143  
307692  
231884  
117647  
57145  
38462  
28623  
19231  
14480  
9615  
2.12  
-0.79  
0.16  
0.64  
2.1  
-0.97  
0.16  
-0.62  
0.16  
0.55  
0.16  
0.16  
-0.03  
4800  
4808  
2400  
2399  
© 2014 ISSC Technologies Corp.  
Preliminary  
Revision 2.1.1 – June 16, 2015 Page 25  
BM77SPPx3MC2  
4.0 ORDERING INFORMATION  
TABLE 4-1: ORDERING INFORMATION  
Part Number  
Description  
BM77SPPS3MC2-0007AA  
Bluetooth® 4.0 Dual Mode, Class 2, Surface Mount module with integral  
antenna, with shield  
BM77SPP03MC2-0007AA  
EV77SPPS3MC2A  
Bluetooth® 4.0 Dual Mode, Class 2, Surface Mount module, external  
antenna, no shield  
Evaluation board for the BM77SPPS3MC2 Bluetooth Dual Mode module  
with USB cable  
© 2014 ISSC Technologies Corp.  
Preliminary  
Revision 2.1.1 – June 16, 2015 Page 26  
BM77SPPx3MC2  
APPENDIX A: REVISION HISTORY  
Revision 2.0 (October 2014)  
Added content and editing.  
Revision 2.1.1 (June 2015)  
Updated operating temperature range and Taiwan NCC certification information.  
© 2014 ISSC Technologies Corp.  
Preliminary  
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BM77SPPx3MC2  
NOTES:  
© 2014 ISSC Technologies Corp.  
Preliminary  
Revision 2.1.1 – June 16, 2015 Page 28  
配单直通车
BM77SPPS3MC2-0007AA产品参数
型号:BM77SPPS3MC2-0007AA
是否Rohs认证: 符合
生命周期:Not Recommended
包装说明:,
Reach Compliance Code:compliant
HTS代码:8542.39.00.01
Factory Lead Time:20 weeks
风险等级:7.83
JESD-30 代码:R-XQMA-N33
长度:22 mm
功能数量:1
端子数量:33
最高工作温度:70 °C
最低工作温度:-20 °C
封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY
峰值回流温度(摄氏度):NOT SPECIFIED
座面最大高度:2.46 mm
表面贴装:YES
电信集成电路类型:TELECOM CIRCUIT
温度等级:OTHER
端子形式:NO LEAD
端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:12 mm
Base Number Matches:1
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