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产品型号BU24031GW-E2的概述

BU24031GW-E2 芯片概述 BU24031GW-E2 是一款由日本半导体制造商“ROHM”出品的高性能电源管理芯片,特别是在低功耗和高效率的应用场景中,表现出色。该芯片主要用于提供稳定的电源解决方案,适用于手机、平板电脑、可穿戴设备等便携式电子产品。 BU24031GW-E2 的设计兼顾了多种电源控制需求,这使得它在市场上获得了广泛应用。其内置一个高效的降压转换器,支持多种工作模式,以满足不同负载条件下的电源需求。此外,该芯片还具有过压、过流和短路等多种保护机制,增强了整个系统的稳健性。 BU24031GW-E2 的详细参数 BU24031GW-E2 芯片的详细参数可以从其数据手册中获取,这些参数包括但不限于以下内容: - 工作电压范围:2.5V 至 5.5V - 输出电压:可调输出,通常在1.5V到3.3V之间 - 输出电流:最大可达 1A - 效率:在不同负载下,效率高达 ...

产品型号BU24031GW-E2的Datasheet PDF文件预览

Datasheet  
System Lens Drivers  
μ-step System Lens Driver  
for Digital Still Cameras  
BU24031GW  
General Description  
Key Specifications  
„ I/O Power Supply Voltage:  
„ Digital Power Supply Voltage:  
„ Driver Power Supply Voltage:  
„ Output Current (1ch-5ch):  
„ Input Clock Frequency:  
„ FET ON Resistance (1ch-4ch):  
„ FET ON Resistance (5ch):  
„ Operating Temperature Range:  
1.62V to 3.6V  
2.7V to 3.6V  
2.7V to 5.5V  
±500mA(Max)  
1MHz to 28MHz  
2.0(Typ)  
BU24031GW is a system Lens Driver that uses μ-step  
driving to make the configuration of the sophisticated,  
high precision and low noise lens driver system possible.  
This IC has a built-in driver for both DC motor and voice  
coil motor and a μ-step controller that decreases CPU  
power. Therefore, multifunctional lens can be applied.  
1.0(Typ)  
-20to +85℃  
Features  
„ Built-in 5 channels Driver block.  
1ch-4ch: Voltage control type H-bridge  
(Adaptable to STM 1systems)  
5ch: Current control type H-bridge  
„ Built-in 2 channels PI driving circuit  
„ Built-in 3 channels Waveforming circuit  
„ Built-in FLL digital servo circuit  
„ Built-in PLL circuit  
Package  
UCSP75M2  
2.50mm x 2.50mm x 0.85mm  
Applications  
„ Digital still cameras  
Typical Application Circuit  
Example1  
Photo interrupter  
VDDAMP  
I
DVDDIO  
DVDD  
MVCC12  
MVCC3  
MVCC4  
MGND  
OUT1A  
DVSS  
OUT4A  
OUT4B  
4ch  
Driver  
1ch  
Driver  
M
OUT1B  
OUT2A  
Logic  
2ch  
Driver  
RNF5  
OUT2B  
OUT3A  
OUT5A  
5ch  
Driver  
3ch  
Driver  
OUT5B  
OUT3B  
Main Host  
Product structureSilicon monolithic integrated circuit This product is not designed for protection against radioactive rays  
.www.rohm.com  
TSZ02201-0M2M0BC12010-1-2  
2.May.2013 Rev.003  
© 2013 ROHM Co., Ltd. All rights reserved.  
1/20  
TSZ2211114001  
Daattaasshheeeett  
BU24031GW  
Pin Configuration  
(Bottom view)  
PIOUT1  
SDATA  
OUT3A  
CSB  
OUT3B  
STATE  
MVCC4  
IN5  
OUT4A  
SO2  
F
VDDAMP  
OUT5A  
E
D
C
B
A
MVCC3  
OUT4B  
DVDDIO  
DVSS  
SCLK  
MGND  
SI2  
SI1  
RNF5  
OUT5B  
PIOUT2  
SO3/  
SOUT  
DVDD  
SO1  
FCLK  
MVCC12  
SI3  
6
OUT1B  
2
OUT1A  
3
OUT2A  
4
OUT2B  
5
1
Pin Description  
Land  
Matrix  
No.  
Land  
Matrix  
No.  
Power  
Supply  
Power  
Supply  
Pin Name  
Function  
Pin Name  
MVCC12  
Function  
1ch, 2ch Driver  
power supply  
B1  
DVDDIO  
-
I/O power supply  
A1  
-
-
B2  
D2  
B3  
E2  
C2  
DVDD  
DVSS  
FCLK  
CSB  
-
-
Digital power supply  
Ground  
D3  
A3  
A2  
A4  
A5  
MGND  
OUT1A  
OUT1B  
OUT2A  
OUT2B  
Driver ground  
MVCC12 1ch Driver A output  
MVCC12 1ch Driver B output  
MVCC12 2ch Driver A output  
MVCC12 2ch Driver B output  
DVDDIO FCLK logic input  
DVDDIO CSB logic input  
DVDDIO SCLK logic input  
SCLK  
3ch Driver  
power supply  
E1  
SDATA  
DVDDIO SDATA logic input  
D1  
MVCC3  
-
STATE logic input/  
E3  
E4  
F1  
STATE  
IN5  
DVDDIO  
output  
F2  
F3  
F4  
OUT3A  
OUT3B  
MVCC4  
MVCC3  
MVCC3  
-
3ch Driver A output  
3ch Driver B output  
DVDDIO IN5 logic input  
4ch Driver  
power supply  
PIOUT1  
DVDD  
PI driving output 1  
B6  
C5  
PIOUT2  
SI1  
VDDAMP PI driving output 2  
DVDD Waveforming input1  
F5  
C1  
OUT4A  
OUT4B  
MVCC4  
MVCC4  
4ch Driver A output  
4ch Driver B output  
5ch Power supply of  
current driver control  
B5  
D5  
SO1  
SI2  
DVDDIO Waveforming output1  
DVDD Waveforming input2  
DVDDIO Waveforming output2  
F6  
D6  
VDDAMP  
RNF5  
-
-
5ch Driver power  
supply  
E5  
A6  
SO2  
SI3  
E6  
C6  
OUT5A  
OUT5B  
RNF5  
RNF5  
5ch Driver A output  
5ch Driver B output  
DVDD  
Waveforming input3  
Waveforming output3/  
SOUT logic output  
B4  
SO3/SOUT  
DVDDIO  
www.rohm.com  
TSZ02201-0M2M0BC12010-1-2  
2.May.2013 Rev.003  
© 2013 ROHM Co., Ltd. All rights reserved.  
2/20  
TSZ2211115001  
Daattaasshheeeett  
BU24031GW  
Block Diagram  
DVDD  
DVDD  
DVDD  
VDDAMP  
DVDD  
DVDDIO  
DVDD  
DVDD  
POR  
DVDD  
TSD  
DVDD  
MVCC12  
MVCC12  
DVSS  
PLL  
PRE-  
DRIVER  
OUT1A  
OUT1B  
MVCC4  
MVCC4  
MGND  
Speed control  
Logic  
Analog Feed-Back  
MVCC12  
OUT4A  
OUT4B  
PRE-  
DRIVER  
MVCC12  
MGND  
PRE-  
DRIVER  
OUT2A  
OUT2B  
Logic  
VDDAMP  
RNF5  
MGND  
Analog Feed-Back  
DVDD  
-
+
DAC5  
MVCC3  
OUT5A  
OUT5B  
MVCC3  
PRE-  
DRIVER  
OUT3A  
OUT3B  
MGND  
MGND  
www.rohm.com  
TSZ02201-0M2M0BC12010-1-2  
2.May.2013 Rev.003  
© 2013 ROHM Co., Ltd. All rights reserved.  
3/20  
TSZ2211115001  
Daattaasshheeeett  
BU24031GW  
Description of Blocks  
Stepping Motor Driver (1ch, 2ch Driver)  
Built-in stepping motor driver of PWM driving type.  
1 stepping motor can be driven.  
Built-in voltage feedback circuit of D-class type.  
(1) Control  
It corresponds to both the Clock IN and the Autonomous control.  
()Clock IN Control  
Set the registers for the stepping motor control.  
The stepping motor is rotated and synchronized with the input clock in the STATE pin.  
It is possible to select the mode of stepping motor control from μ-step, 1-2 phase excitation, 2 phase excitation and  
the number of edge for electrical angle cycle from 4, 8, 32, 64, 128, 256, 512 or 1024.  
ON/OFF  
Direction  
Torque  
CSB  
SCLK  
SDATA  
H.B.  
H.B.  
STM  
3
SIF  
SIN wave  
Control  
Logic  
STM  
Control  
Logic  
PWM  
Control  
Logic  
Host  
(SpeedAmount)  
STATE  
()Autonomous Control  
The stepping motor is rotated by setting the registers for the stepping motor control.  
The state of rotation command (executing: 1, finished: 0), Cache register and motor position are the output from the  
serial output (SOUT pin). Also, the signal (MO output) which is synchronized with the motor rotation is the output from  
STATE pin.  
It is possible to select the mode of stepping motor control from μ-step (1024 portion), 1-2 phase excitation and  
2 phase excitation.  
Cache Method  
Built-in Cache registers.  
Cache registers enable the setting of subsequent process while the motor is in operation. Through these registers,  
operations are done continuously.  
Up Down Method  
It is possible to set Up, Constant and Down operation before the motor operates.  
ON/OFF  
Direction  
Speed  
Torque  
Amount  
CSB  
SCLK  
SDATA  
H.B.  
H.B.  
STM  
3
SIF  
SIN wave  
Control  
Logic  
STM  
Control  
Logic  
PWM  
Control  
Logic  
Host  
State  
SOUT  
Position  
STATE  
www.rohm.com  
TSZ02201-0M2M0BC12010-1-2  
2.May.2013 Rev.003  
© 2013 ROHM Co., Ltd. All rights reserved.  
4/20  
TSZ2211115001  
Daattaasshheeeett  
BU24031GW  
Description of Blocks  
Voltage Driver (3ch, 4ch Driver)  
Built-in voltage driver of PWM driving type.  
Built-in digital FLL speed control logic for 4ch driver.  
(1) Control  
()Register Control  
3ch Driver, 4ch Driver (at speed control = OFF)  
The PWM drive is executed by the PWM duty ratio, the PWM direction and the PWM ON/OFF which are controlled by  
the register settings.  
CSB  
SCLK  
SDATA  
PWM duty  
Direction  
ON/OFF  
PWM  
Control  
Logic  
Host  
H.B.  
M
3
SIF  
4ch Driver (at speed control = ON)  
The speed control drive is executed by the target speed value, the direction, the coefficient value of PI filter and the  
turning ON/OFF which are controlled by the register settings.  
The motor speed is adjusted by comparing the target speed with the motor speed detected at the signal of  
photo-interrupter.  
Target speed  
PI filter  
Direction  
ON/OFF  
CSB  
SCLK  
SDATA  
PMW  
Control  
Logic  
H.B.  
DCM  
PI  
DCM  
Speed control  
Logic  
3
SIF  
Host  
PI Dr  
Comp  
www.rohm.com  
TSZ02201-0M2M0BC12010-1-2  
2.May.2013 Rev.003  
© 2013 ROHM Co., Ltd. All rights reserved.  
5/20  
TSZ2211115001  
Daattaasshheeeett  
BU24031GW  
Description of Blocks  
Current Driver (5ch Driver)  
Built-in constant current driver.  
The voltage of RNF pin and the external resistor (RRNF) determine the amount of output current. The internal  
high-precision amplifier (CMOS gate input) is used for constant current control. If any resistance component exists in  
the wirings of RNF pin and the external resistor (RRNF), the precision can be reduced. To avoid this, pay utmost  
attention to the wirings.  
(1) Control  
()Register Control  
The constant current drive is executed by the output current value, the current direction and the current ON/OFF which  
are controlled by the register settings.  
Current value  
Direction  
CSB  
SCLK  
SDATA  
ON/OFF  
3
Control  
Logic  
Current control  
DAC  
VCM  
C.C.  
Host  
SIF  
()External Pin Control  
The constant current drive is executed by the output current value and the current direction which are controlled by the  
register settings. Constant current driving ON/OFF is controlled by IN5 pin.  
CSB  
SCLK  
SDATA  
Current value  
Direction  
3
SIF  
Control  
Logic  
Current control  
DAC  
VCM  
C.C.  
Host  
ON/OFF  
IN5  
www.rohm.com  
TSZ02201-0M2M0BC12010-1-2  
2.May.2013 Rev.003  
© 2013 ROHM Co., Ltd. All rights reserved.  
6/20  
TSZ2211115001  
Daattaasshheeeett  
BU24031GW  
Absolute Maximum Ratings (Ta=25)  
Parameter  
Power Supply Voltage  
Input Voltage  
Symbol  
Limit  
Unit  
V
Remark  
DVDDIO  
DVDD  
-0.3 to +4.5  
MVCC12, MVCC3, MVCC4,  
VDDAMP  
MVCC  
VIN  
-0.3 to +7.0  
-0.3 to supply voltage+0.3  
±500  
V
V
MVCC12, MVCC3, MVCC4,  
RNF5  
mA  
Input / Output Current *1  
IIN  
+50  
+150  
mA  
mA  
PIOUT1  
PIOUT2  
Storage Temperature Range  
Operating Temperature Range  
Permissible Dissipation *2  
TSTG  
TOPE  
PD  
-55 to +125  
-20 to +85  
800  
mW  
*1  
*2  
Must not exceed PD.  
To use at a temperature higher than Ta=25 °C, derate 8mW per 1 °C  
(At mounting 50mm x 58mm x 1.75mm glass epoxy board.)  
Recommended Operating Rating (Ta=25)  
Parameter  
Symbol  
DVDDIO  
DVDD  
Limit  
Unit  
V
Remark  
I/O Power Supply Voltage  
Digital Power Supply Voltage  
Driver Power Supply Voltage  
Clock Operating Frequency  
1.62 to 3.6  
2.7 to 3.6  
2.7 to 5.5  
1 to 28  
V
DVDDMVCC  
MVCC12, MVCC3, MVCC4,  
VDDAMP  
MVCC  
FCLK  
V
MHz Reference clock  
www.rohm.com  
TSZ02201-0M2M0BC12010-1-2  
2.May.2013 Rev.003  
© 2013 ROHM Co., Ltd. All rights reserved.  
7/20  
TSZ2211115001  
Daattaasshheeeett  
BU24031GW  
Electrical Characteristics  
(Unless otherwise specified, Ta=25°C, DVDDIO=DVDD=3.0V, MVCC=5.0V, DVSS=MGND=0.0V)  
Limit  
Parameter  
Symbol  
Unit  
Conditions  
MIN  
TYP  
MAX  
<Current Consumption>  
CMD_RS=0  
Quiescence  
(DVDDIO)  
ISSDO  
ISSD  
-
-
-
-
-
0
50  
0
10  
95  
10  
1
μA  
μA  
μA  
mA  
mA  
(DVDD)  
(MVCC)  
ISSM  
CMD_RS=STB=CLK_EN=1  
FCLK=24MHz  
CLK_DIV setting : 0h  
No load  
Operation  
(DVDDIO) IDDDO  
0.1  
4
(DVDD)  
IDDD  
8
<Logic Block>  
Low-level Input Voltage  
High-level Input Voltage  
Low-level Input Current  
High-level Input Current  
Low-level Output Voltage  
High-level Output Voltage  
<PI Driving Circuit>  
VIL  
VIH  
IIL  
DVSS  
-
-
-
-
-
-
0.3DVDDIO  
DVDDIO  
10  
V
V
0.7DVDDIO  
0
0
μA VIL=DVSS  
IIH  
10  
μA VIH=DVDDIO  
VOL  
DVSS  
0.2DVDDIO  
DVDDIO  
V
V
IOL=1.0mA  
IOH=1.0mA  
VOH 0.8DVDDIO  
Output Voltage  
PIVO  
-
0.15  
0.5  
V
IIH=30mA  
<Waveforming Circuit>  
High-level Threshold Voltage  
Low-level Threshold Voltage  
Hysteresis Width  
VthH  
VthL  
Vhys  
-
-
-
-
1.9  
-
V
V
V
DVDD=3.25V  
DVDD=3.25V  
DVDD=3.25V  
0.9  
0.2  
0.6  
<Voltage Driver Block 1ch-4ch>  
IO=±100mA  
(the sum of high and low  
sides)  
ON-resistance  
Ron  
-
2.0  
2.5  
OFF-leak Current  
IOZ  
-10  
-5  
0
-
+10  
+5  
μA Output Hiz setting  
Average Voltage Accuracy  
between different Output Pins  
STM driver(1ch,2ch)  
%
Vdiff  
Vdiff setting : 2Bh  
<Current Driver Block 5ch>  
ON-resistance  
IO=±100mA  
(the sum of high and low  
sides)  
Ron  
-
1.0  
1.5  
OFF-leak Current  
Output Current  
IOZ  
IO  
-10  
0
+10  
207  
μA Output Hiz setting  
DAC setting : 80h  
193  
200  
mA  
RRNF=1Ω  
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TSZ02201-0M2M0BC12010-1-2  
2.May.2013 Rev.003  
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Typical Performance Curves  
(Unless otherwise specified, Ta=25°C, DVDDIO=DVDD=3.0V, MVCC=5.0V, DVSS=MGND=0.0V)  
100  
80  
60  
40  
20  
0
100  
80  
60  
40  
20  
0
2.0  
2.5  
3.0  
3.5  
4.0  
-50  
-25  
0
25  
50  
[℃]  
75  
100  
DVDD  
V
[ ]  
Ambient Temperature  
Figure 1. DVDD Static Current  
Voltage Dependency  
Figure 2. DVDD Static Current  
Temperature Dependency  
10  
8
10  
8
6
6
4
4
2
2
0
0
-50  
-25  
0
25  
50  
[℃]  
75  
100  
1.0  
2.0  
3.0  
4.0  
Ambient Temperature  
DVDDIO V  
[ ]  
Figure 3. DVDDIO Static Current  
Voltage Dependency  
Figure 4. DVDDIO Static Current  
Temperature Dependency  
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TSZ02201-0M2M0BC12010-1-2  
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Typical Performance Curves  
(Unless otherwise specified, Ta=25°C, DVDDIO=DVDD=3.0V, MVCC=5.0V, DVSS=MGND=0.0V)  
10  
8
10  
8
6
6
4
4
2
2
0
0
2.0  
3.0  
4.0  
5.0  
6.0  
-50  
-25  
0
25  
50  
[℃]  
75  
100  
MVCC V  
Ambient Temperature  
[ ]  
Figure 5. MVCC Static Current  
Voltage Dependency  
Figure 6. MVCC Static Current  
Temperature Dependency  
5
4
3
2
1
0
5
4
3
2
1
0
IO=±100mA  
IO=±100mA  
-50  
-25  
0
25  
50  
[℃]  
75  
100  
2.0  
3.0  
4.0  
5.0  
6.0  
Ambient Temperature  
MVCC  
V
[ ]  
Figure 7. Output ON-Resistance  
MVCC Dependency  
Figure 8. Output ON-Resistance  
Temperature Dependency  
(Voltage driver block)  
(Voltage driver block)  
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TSZ02201-0M2M0BC12010-1-2  
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Typical Performance Curves  
(Unless otherwise specified, Ta=25°C, DVDDIO=DVDD=3.0V, MVCC=5.0V, DVSS=MGND=0.0V)  
5
4
3
2
1
0
5
4
3
2
1
0
IO=±100mA  
IO=±100mA  
2.0  
3.0  
4.0  
5.0  
6.0  
-50  
-25  
0
25  
50  
[℃]  
75  
100  
MVCC  
V
[ ]  
Ambient Temperature  
Figure 9. Output ON-Resistance  
MVCC Dependency  
Figure 10. Output ON-Resistance  
Temperature Dependency  
(Current driver block)  
(Current driver block)  
400  
300  
200  
100  
0
5
4
3
2
1
0
0
32  
64  
96  
128  
32  
64  
96  
128  
160  
192  
224  
256  
Serial setting code  
Serial setting code  
Figure 11. Average Voltage Accuracy  
between different output pins  
(Voltage driver block)  
Figure 12. Output Current  
(Current driver block, RRNF = 1.0Ω, RL = 5.0Ω)  
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TSZ02201-0M2M0BC12010-1-2  
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Typical Performance Curves  
(Unless otherwise specified, Ta=25°C, DVDDIO=DVDD=3.0V, MVCC=5.0V, DVSS=MGND=0.0V)  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
0.20  
0.15  
0.10  
0.05  
0.00  
800mW  
IIH=30mA  
320mW  
85℃  
0
25  
50  
75  
100  
125  
150  
2.0  
2.5  
3.0  
3.5  
4.0  
Ambient Temperature [  
]
DVDD  
V
[ ]  
Figure 14. Power Dissipation Curve  
Figure 13. Output Voltage  
DVDD Dependency  
(PI driving circuit)  
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TSZ02201-0M2M0BC12010-1-2  
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Timing Chart  
(Unless otherwise specified, Ta=25°C, DVDDIO=DVDD=3.0V)  
Parameter  
Symbol  
tSCLK  
tSCLKL  
tSCLKH  
tsSDATA  
thSDATA  
tCSBH  
tsCSB  
thCSB  
tFCLK  
tFCLKL  
tFCLKH  
Specification  
SCLK input cycle  
More than 100 nsec  
More than 50 nsec  
More than 50 nsec  
More than 50 nsec  
More than 50 nsec  
More than 380 nsec  
More than 50 nsec  
More than 50 nsec  
More than 36 nsec  
More than 18 nsec  
More than 18 nsec  
SCLK L-level input time  
SCLK H-level input time  
SDATA setup time  
SDATA hold time  
CSB H-level input time  
CSB setup time  
CSB hold time  
FCLK input cycle  
FCLK L-level input time  
FCLK H-level input time  
0.7DVDDIO  
0.3DVDDIO  
CSB  
tSCLK  
tCSBH  
tsCSB  
tSCLKH tSCLKL  
thCSB  
thCSB  
tsCSB  
0.7DVDDIO  
0.3DVDDIO  
SCLK  
tsSDATA thSDATA  
0.7DVDDIO  
0.3DVDDIO  
SDATA  
tFCLKL  
tFCLKH  
tFCLK  
0.7DVDDIO  
0.3DVDDIO  
FCLK  
(note1) FCLK is asynchronous with SCLK.  
(note2) Duty of FCLK, SCLK are free.  
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Serial interface  
Control commands are framed by a 16-bit serial input (MSB first) and are sent through CSB, SCLK, and SDATA pins.  
The 4 higher-order bits specify addresses, while the remaining 12 bits specify data. Data of every bit is sent through SDATA  
pin, which is retrieved during the rising edge of SCLK. Data becomes valid when CSB is Low and is registered during the  
rising edge of CSB. Furthermore, the interface will be synchronized with the falling edges of SCLK to output the SOUT data  
of the 12 bits.  
CSB  
SCLK  
SDATA x D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0  
x
Address  
x
Data  
D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0  
SOUT  
Hiz  
Hiz  
Register map>  
Address[3:0]  
Data[11:0]  
15 14 13 12  
11  
10  
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
0
A_Mode[1:0]  
A_SEL[2:0]  
A_different_output_voltage[6:0]  
A_Cycle[5:0]  
A_Cycle[13:6]  
0
0
0
0
0
0
1
1
0
1
0
1
0
0
0
0
A_Start_POS[3:0]  
0
0
0
0
0
0
0
0
0
1
A_BEXC  
A_BSL  
A_AEXC  
0
0
0
A_ASL  
A_Stop  
A_UPDW  
_STOP  
1
1
1
0
0
0
A_POS[1:0]  
A_PS  
0
0
0
0
0
1
1
1
1
0
1
1
A_EN  
A_RT  
A_Pulse[9:0] / A_UPDW_Cycle[9:0]  
A_ACT  
A_BUSY  
L
L
L
L
0
L
L
L
L
L
L
0
L
L
0
L
L
0
L
L
0
L
L
A_Position[9:6]  
0
0
0
0
0
0
A_ANSEL  
Edge  
A_CTL  
1
1
0
1
1
0
1
0
EXT  
_CTL  
0
1
0
0
SO3_SEL  
0
0
0
0
0
0
0
0
0
0
0
1
Chopping[1:0]  
CacheM  
0
0
0
0
0
0
CLK_EN  
CLK_DIV[3:0]  
0
1
0
0
0
0
0
0
0
0
0
0
0
PI_CTL2 PI_CTL1  
3_CHOP[1:0]  
3_State_CTL[1:0]  
4_State_CTL[1:0]  
3_PWM_Duty[6:0]  
4_DET  
_SEL  
1
0
0
0
0
0
4_SPEN  
4_CHOP[1:0]  
4_ISP[2:0]  
1
1
0
1
1
1
1
1
0
0
1
1
0
0
0
1
0
1
0
1
0
1
1
1
0
0
1
0
1
0
1
0
0
0
0
0
0
4_PWM_Duty[6:0]  
4_TARSP[7:0]  
0
0
4_PSP[2:0]  
0
0
0
0
5_IOUT[7:0]  
4_SPC_Limit[3:0]  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
5_State_CTL[2:0]  
HYS3 HYS2 HYS1  
STM_RS CMD_RS  
1
1
1
0
STB  
0
Addresses other  
than those above  
Setting prohibited  
(Note1) The notation A is defined as Ach: 1ch and 2ch driver.  
(Note2) After reset (Power ON reset), the initial condition is saved in all registers.  
(Note3) The addresses 4’b0011, and 4’b0111 have data (ACT, BUSY, Position [9:6]), which are internal register values and output from SOUT pin.  
(Note4) For Mode, different output voltage, Cycle, EN, and RT registers, data that are written before the access to the Pulse register becomes valid and  
determines the rising edge of CSB after the access to the Pulse register.  
(The Mode, different output voltage, Cycle, EN, RT, and Pulse registers contain Cache registers. Any registers other than those do not contain Cache  
registers.)  
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TSZ02201-0M2M0BC12010-1-2  
2.May.2013 Rev.003  
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Application Example  
4ch  
PWM  
+FLL  
1ch/2ch  
μ-step  
3ch  
PWM  
5ch  
C.C.  
STM  
VCM  
DCM  
VCM  
Iris  
Zoom  
Auto Focus  
Shutter  
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TSZ02201-0M2M0BC12010-1-2  
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I/O Equivalence Circuit  
Pin  
Equivalent Circuit Diagram  
DVDDIO DVDDIO  
Pin  
STATE  
Equivalent Circuit Diagram  
DVDDIO  
FCLK  
CSB  
DVDDIO  
SCLK  
SDATA  
IN5  
DVDDIO  
P
P
SI1  
SI2  
SI3  
SO1  
SO2  
SO3/SOUT  
DVDDIO  
DVDDIO  
DVDD DVDD  
P
P
PIOUT1  
PIOUT2  
DVDD  
VDDAMP  
P
P
OUT1A  
OUT1B  
OUT2A  
OUT2B  
OUT3A  
OUT3B  
MVCC12  
MVCC3  
P
P
P
P
OUT4A  
OUT4B  
OUT5A  
OUT5B  
RNF5  
MVCC4  
P
P
P
P
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TSZ02201-0M2M0BC12010-1-2  
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Operational Notes  
1) Absolute maximum ratings  
If applied voltage, operating temperature range, or other absolute maximum ratings are exceeded, the LSI may be  
damaged. Do not apply voltages or temperatures that exceed the absolute maximum ratings. If you expect that any  
voltage or temperature could be exceeding the absolute maximum ratings, take physical safety measures such as  
fuses to prevent any conditions exceeding the absolute maximum ratings from being applied to the LSI.  
2) GND potential  
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no  
pins are at a voltage below the ground pin at any time, even during transient condition.  
3) Thermal design  
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (PD) in  
actual operating conditions.  
4) Short circuit between pins and malfunctions  
Ensure that when mounting the IC on the PCB the direction and position are correct. Incorrect mounting may result in  
damaging the IC. Avoid nearby pins being shorted to each other especially to ground. Inter-pin shorts could be due to  
many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge  
deposited in between pins during assembly to name a few.  
5) Operation in strong magnetic field  
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.  
6) Power ON sequence  
Set DVDD after the setting of DVDDIO or simultaneously. There is no restriction on the setting of MVCC.  
To turn ON DVDD, be sure to reset at CMD_RS register.  
7) Thermal shutdown  
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal  
temperature of the IC reaches a specified value. It is not designed to protect the IC from damage or guarantee its  
operation. Do not continue to operate the IC after this function is activated. Do not use the IC in conditions where this  
function will always be activated.  
8) PI drive circuit  
The output voltage of PIOUT1 should not exceed the voltage of the power supply voltage DVDD.  
The output voltage of PIOUT2 should not exceed the voltage of the power supply voltage VDDAMP.  
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TSZ02201-0M2M0BC12010-1-2  
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Ordering Information  
B
U
2
4
0
3
1
G W  
-
E 2  
Part Number  
Package  
GW  
UCSP75M2  
Packaging and forming specification  
E2: Embossed tape and reel  
:
Marking Diagram  
UCSP75M2  
(TOP VIEW)  
1PIN MARK  
Part Number Marking  
LOT Number  
U24031  
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TSZ02201-0M2M0BC12010-1-2  
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Physical Dimension Tape and Reel Information  
Package Name  
UCSP75M2  
1PIN MARK  
Lot No.  
U24031  
2.50±0.05  
S
0.06  
S
33-φ0.22±0.05  
0.05 A B  
A
F
E
(φ0.15)INDEX POST  
B
D
C
B
A
1
2
3
4
5
6
0.25±0.05  
P=0.4×5  
Tape  
Embossed carriertape  
3,000pcs/Real  
E2  
Quantity  
1234  
1234  
Reel  
1234  
1234  
1234  
1234  
(The direction is 1pin product is at the upper left  
when you hold reel on the hand and you pull out  
the tape on the right hand)  
Direction of feed  
Direction of feed  
1pin  
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TSZ02201-0M2M0BC12010-1-2  
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Revision History  
Date  
Revision  
001  
Changes  
24.July.2012  
New Release  
P.1 Correction of writing error.  
Operating temperature range -25to +85℃ → -20to +85℃  
P.9 Graph Scale is changed.  
Figure.3, Figure.4  
P.10 Graph Scale is changed.  
Figure.5, Figure.6  
26.Sep.2012  
2.May.2013  
002  
003  
P.12 Graph Scale is changed.  
Figure.13  
Update some English words, sentences, description, grammar and formatting.  
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Notice  
Precaution on using ROHM Products  
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific  
Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASS  
CLASSⅣ  
CLASSb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual  
ambient temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the  
ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice - GE  
Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
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Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
QR code printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,  
please consult with ROHM representative in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable  
for infringement of any intellectual property rights or other damages arising from use of such information or data.:  
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the information contained in this document.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice - GE  
Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.  
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s  
representative.  
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2014 ROHM Co., Ltd. All rights reserved.  
配单直通车
BU24031GW-E2产品参数
型号:BU24031GW-E2
是否Rohs认证: 符合
生命周期:Obsolete
包装说明:VFBGA,
Reach Compliance Code:compliant
HTS代码:8542.39.00.01
风险等级:8.05
接口集成电路类型:INTERFACE CIRCUIT
JESD-30 代码:S-PBGA-B33
长度:2.5 mm
功能数量:1
端子数量:33
最高工作温度:85 °C
最低工作温度:-20 °C
封装主体材料:PLASTIC/EPOXY
封装代码:VFBGA
封装形状:SQUARE
封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度):NOT SPECIFIED
座面最大高度:0.85 mm
最大供电电压:3.6 V
最小供电电压:2.7 V
标称供电电压:3 V
电源电压1-最大:5.5 V
电源电压1-分钟:2.7 V
电源电压1-Nom:5 V
表面贴装:YES
温度等级:OTHER
端子形式:BALL
端子节距:0.4 mm
端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:2.5 mm
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