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产品型号BU8859GV的Datasheet PDF文件预览

1/4  
S t r u c t u r e  
Product Name  
Silicon Monolithic Integrated Circuit  
Sound Generator for Cellular Phone  
Product No.  
F e a t u r e s  
BU8859GV  
64 polyphony 128 sounds + drum set 47 sounds generation  
ADPCM decoder/PCM player functions are mounted, and mixing with sounds is  
possible  
Absolute Maximum RatingsTa=25 oC)  
Parameter  
Symbol  
Limits  
Unit  
Conditions  
-0.3 4.5  
-0.3 4.5  
Analog supply voltage  
Digital I/O supply voltage  
CORE supply voltage  
Voltage applied to pins  
Power dissipation  
AVDD  
VDDIO  
VDDCO  
VIN  
V
V
-0.3 2.5  
V
DVSS-0.3 VDDIO+0.3  
490 *1  
V
Warranty setting of single IC.  
Pd  
mW  
-50 125  
Storage temperature range  
Operating temperature range  
Tstg  
-30 85  
Topr  
*1 When Ta is above 25, reduce 4.5mW per 1.  
Recommended operating conditions(unless otherwise noted, Ta = 25oC)  
Parameter  
Symbol  
Ratings  
Typ  
Unit  
Conditions  
Min  
Max  
Analog supply voltage  
Digital I/O supply voltage  
Digital CORE supply voltage  
Ambient temperature  
MCLK input frequency  
SCLK input frequency  
MCLK duty  
AVDD  
VDDIO  
VDDCO  
Ta  
2.6  
VDDCO  
1.62  
-30  
3.0  
3.0  
1.8  
25  
-
3.3  
3.3  
1.98  
85  
26  
15  
60  
-
V
V
V
FMCLK  
FSCLK  
DMCLK  
RL  
2.688  
-
MHz  
MHz  
-
40  
50  
-
kΩ  
Analog pin's load resistance  
10  
This chip is not designed to protect itself against radioactive rays.  
REV. B  
2/4  
Electrical Characteristics  
(unless otherwise noted, Ta = 25oC)  
Parameter  
Symbol  
rating  
Typ  
Unit  
Conditions  
Min  
Max  
Digital DC characteristics  
High-level input voltage  
Low-level input voltage  
High-level input voltage  
Low-level input voltage  
High-level output voltage  
Low-level output voltage  
Analog DC characteristics  
F pin voltage  
VIH  
VIL  
DVDD_IO-0.5  
-
-
-
-
-
-
-
V
V
-
DVSS+0.5  
IIH  
-
1
uA  
uA  
V
VIH=VDDIO  
VIL=DVSS  
IOH=-0.8mA  
IOL=0.8mA  
IIL  
-1  
-
VOH  
VOL  
DVDD_IO-0.3  
-
-
DVSS+0.3  
V
VAGND  
VOUT  
0.475AVDD  
0.47AVDD  
0.5AVDD  
0.5AVDD  
0.525AVDD  
0.53AVDD  
V
V
IOUT=0A(noload)  
IOUT=0A(noload)  
Not playing  
Analog pin voltage  
General characteristics  
VREF pin rise time  
When CVREF =  
1uF, NRST=LH  
TRVR  
VMAX  
-
-
20  
30  
-
mS  
Analog pin characteristics  
Analog amplitude  
Theoretical value  
for dynamic range  
0.6AVDD  
Vp-p  
Power consumption  
DVDD_CORE=1.8[V], DVDD_IO=3.0[V], AVDD=3.0[V]  
AIDD1  
-
1.7  
2.5  
35  
mA  
mA  
Playing  
Analog Idd1  
Degital Idd11  
(DVDD_CORE)  
Degital Idd12  
(DVDD_IO)  
DIDD11  
-
25  
Playing 64POLY  
Playing(not using  
Digital Output)  
DIDD12  
-
0.1  
1
mA  
Analog Idd2  
AIDD2  
-
-
-
-
2
uA  
uA  
Standby mode  
Standby mode  
Degital Idd20  
(DVDD_CORE)  
Degital Idd21  
(DVDD_IO)  
DIDD20  
20  
DIDD21  
-
-
10  
uA  
Standby mode  
REV. B  
3/4  
External measure and View  
Pin layout diagram  
Pin  
NO.  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
B8  
C1  
C2  
C3  
C4  
C5  
C6  
C7  
C8  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
D8  
Pin name  
Pin  
NO.  
E1  
E2  
E3  
E4  
E5  
E6  
E7  
E8  
F1  
F2  
F3  
F4  
F5  
F6  
F7  
F8  
G1  
G2  
G3  
G4  
G5  
G6  
G7  
G8  
H1  
H2  
H3  
H4  
H5  
H6  
H7  
H8  
Pin name  
1PIN  
MARK  
NC  
LED1  
LED3  
NC  
DVSS  
MCLK2  
DVDD_IO  
NC  
NC  
DVDD_CORE  
NC  
SCLK  
AVSS  
TMODE0  
NC  
TMODE1  
D4  
D5  
D7  
DACMCK  
NC  
BU8859  
D2  
D0  
6.0±0.1  
LED2  
DVDD_CORE  
NC  
Lot No.  
MCLK1  
DVSS  
AVDD  
NC  
D3  
VIB  
NC  
S
MONO_OUT  
NC  
0.10  
S
D6  
SIO  
SEL  
NC  
DIGCK  
NC  
AVDD  
VREF  
NC  
P=0.65x7  
0.65  
0.725±0.1  
63-φ0.33±0.05  
NC  
NC  
PLL_FILTER  
NC  
IFSEL  
DVSS  
CD  
DVDD_IO  
D1  
NRST  
NC  
TMODE2  
NC  
A
M
φ0.08 S AB  
H
G
F
B
E
D
C
B
A
SO  
INT  
DIGDT  
DIGLR  
L_OUT  
R_OUT  
NC  
1
2 3 4 5 6 7 8  
(UNIT: mm)  
SBGA063T060  
Block diagram  
MIDI Core  
Program  
ROM  
Parametric  
Equlizer  
Sequencer Core  
LED 3ch/VIB  
D7~D0  
IFSEL  
LED,VIB  
Control  
LED1~3  
VIB  
Each ch  
Status  
MIDI FIFO  
L/R  
Output  
Sequencer  
CPU  
MIDI  
DSP  
Voice  
Parameter  
UCS  
Parameter  
FIFO  
SO(/WR)  
SIO(/A0)  
SCLK(/RD)  
SEL(/CS)  
Work RAM  
DIGLR  
Digital  
Output  
Format  
Work RAM  
DIGDT  
DIGCK  
Program ROM  
Mixing  
CPU I/F  
Standard/IIS  
DACMCK  
Wave Table ROM  
Hard Logic  
for MIDI  
OverSa  
mpling  
D/A  
VREF  
Converter  
UCS  
RAM  
Wave  
ROM  
INT  
L_OUT  
R_OUT  
ADPCM Core  
MONO_OUT  
NRST  
Digital  
filter  
Master ch  
FIFO  
ADPCM/PCM  
Decoder  
DSP  
clock  
control  
TMODE0~2  
Slave ch  
FIFO  
test  
pll  
PLL_FILTER  
MCLK1  
32kHz  
Timing Generator  
MCLK2  
REV. B  
4/4  
Cautions on use  
(1) Absolute Maximum Ratings  
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can  
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any  
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety  
measures including the use of fuses, etc.  
(2) Operating conditions  
These conditions represent a range within which characteristics can be provided approximately as expected. The  
electrical characteristics are guaranteed under the conditions of each parameter.  
(3) Reverse connection of power supply connector  
The reverse connection of power supply connector can break down ICs. Take protective measures against the  
breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s  
power supply terminal.  
(4) Power supply line  
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines.In this regard,  
for the digital block power supply and the analog block power supply, even though these power supplies has the same  
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing  
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.  
For the GND line, give consideration to design the patterns in a similar manner.  
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal.  
At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor  
to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the  
constant.  
(5) GND voltage  
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.  
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric  
transient.  
(6) Short circuit between terminals and erroneous mounting  
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting  
can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or  
between the terminal and the power supply or the GND terminal, the ICs can break down.  
(7) Operation in strong electromagnetic field  
Be noted that using ICs in the strong electromagnetic field can malfunction them.  
(8) Inspection with set PCB  
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.  
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set  
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the  
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In  
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention  
to the transportation and the storage of the set PCB.  
(9)Input terminals  
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the  
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of  
the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input  
terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not  
apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power  
supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the  
guaranteed value of electrical characteristics.  
(10) Ground wiring pattern  
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND  
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that  
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of  
the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.  
(11) External capacitor  
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a  
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.  
(12) Others  
In case of use this LSI, please peruse some other detail documents, we called ,Technical note, Functinal description,  
Application note.  
REV. B  
Appendix  
Notes  
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM  
CO.,LTD.  
The content specified herein is subject to change for improvement without notice.  
The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you  
wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM  
upon request.  
Examples of application circuits, circuit constants and any other information contained herein illustrate the  
standard usage and operations of the Products. The peripheral conditions must be taken into account  
when designing circuits for mass production.  
Great care was taken in ensuring the accuracy of the information specified in this document. However, should  
you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no re-  
sponsibility for such damage.  
The technical information specified herein is intended only to show the typical functions of and examples  
of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to  
use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no re-  
sponsibility whatsoever for any dispute arising from the use of such technical information.  
The Products specified in this document are intended to be used with general-use electronic equipment  
or devices (such as audio visual equipment, office-automation equipment, communication devices, elec-  
tronic appliances and amusement devices).  
The Products are not designed to be radiation tolerant.  
While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or  
malfunction for a variety of reasons.  
Please be sure to implement in your equipment using the Products safety measures to guard against the  
possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as  
derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your  
use of any Product outside of the prescribed scope or not in accordance with the instruction manual.  
The Products are not designed or manufactured to be used with any equipment, device or system  
which requires an extremely high level of reliability the failure or malfunction of which may result in a direct  
threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment,  
aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear  
no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intend-  
ed to be used for any such special purpose, please contact a ROHM sales representative before purchasing.  
If you intend to export or ship overseas any Product or technology specified herein that may be controlled under  
the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.  
Thank you for your accessing to ROHM product informations.  
More detail product informations and catalogs are available, please contact your nearest sales office.  
THE AMERICAS / EUROPE / ASIA / JAPAN  
ROHM Customer Support System  
Contact us : webmaster@ rohm.co.jp  
www.rohm.com  
TEL : +81-75-311-2121  
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Appendix-Rev4.0  
配单直通车
BU8859GV产品参数
型号:BU8859GV
生命周期:Active
零件包装代码:BGA
包装说明:TFBGA,
针数:63
Reach Compliance Code:compliant
HTS代码:8542.39.00.01
风险等级:5.77
JESD-30 代码:S-PBGA-B63
长度:6 mm
功能数量:1
端子数量:63
最高工作温度:85 °C
最低工作温度:-30 °C
封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA
封装形状:SQUARE
封装形式:GRID ARRAY
认证状态:Not Qualified
座面最大高度:1.2 mm
标称供电电压:1.8 V
表面贴装:YES
电信集成电路类型:BASEBAND CIRCUIT
温度等级:OTHER
端子形式:BALL
端子节距:0.65 mm
端子位置:BOTTOM
宽度:6 mm
Base Number Matches:1
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