TEST CONDITIONS FOR ISOLATION TESTS*
MOUNTED
FULLY ISOLATED
PACKAGE
MOUNTED
FULLY ISOLATED
MOUNTED
FULLY ISOLATED
PACKAGE
CLIP
CLIP
0.107
″
MIN
0.107″ MIN
PACKAGE
LEADS
LEADS
LEADS
HEATSINK
0.110 MIN
HEATSINK
HEATSINK
″
Figure 22a. Screw or Clip Mounting Position Figure 22b. Clip Mounting Position
for Isolation Test Number 1 for Isolation Test Number 2
Figure 22c. Screw Mounting Position
for Isolation Test Number 3
* Measurement made between leads and heatsink with all leads shorted together.
MOUNTING INFORMATION**
4–40 SCREW
CLIP
PLAIN WASHER
HEATSINK
COMPRESSION WASHER
HEATSINK
NUT
Figure 23a. Screw–Mounted
Figure 23b. Clip–Mounted
Figure 23. Typical Mounting Techniques
for Isolated Package
Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw
.
torque of 6 to 8 in lbs is sufficientto provide maximum power dissipation capability. The compression washer helps to maintain a constant
pressure on the package over time and during large temperature excursions.
Destructive laboratory tests show that using a hex head 4–40 screw, without washers, and applying a torque in excess of 20 in lbs will
.
cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability.
.
Additionaltests on slotted 4–40 screws indicate that the screw slot fails between 15 to 20 in lbs without adversely affectingthepackage.
.
However, in order to positively ensure the package integrity of the fully isolated device, Motorola does not recommend exceeding 10 in lbs
of mounting torque under any mounting conditions.
**For more information about mounting power semiconductors see Application Note AN1040.
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
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9
Motorola Bipolar Power Transistor Device Data