M C C
Micro Commercial Components
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents
20736 Marilla Street Chatsworth
ꢆꢋꢅꢌꢍꢎꢍꢍ
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ
$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ
BZT52C2V4
THRU
BZT52C43
TM
Features
xꢀ Planar Die Construction
xꢀ 500mW Power Dissipation on Ceramic PCB
xꢀ General Purpose Medium Current
xꢀ Ideally Suited for Automated Assembly Processes
500 mW
Zener Diode
2.4 to 43 Volts
x
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0 and MSL Rating 1
Lead Free Finish/RoHS Compliant("P" Suffix
•
designates RoHS Compliant. See ordering information)
SOD123
A
B
Absolute Maximum Ratings
Symbol
Rating
Rating
500
Unit
mW
к
C
E
PD
Power dissipation
TJ
Junction Temperature
-65 to +150
-65 to +150
к
TSTG
Storage Temperature Range
H
D
J
G
Absolute Maximum Ratings
Symbol
DIMENSIONS
DIM
INCHES
MIN
MM
NOTE
Rating
Rating
Unit
MAX
.152
.112
.071
.053
.031
-----
.01
MIN
3.55
2.55
1.40
-----
0.30
0.15
-----
-----
MAX
3.85
2.85
1.80
1.35
.78
Thermal Resistance Junction to
Ambient*
A
B
C
D
E
G
H
J
.140
.100
.055
-----
.012
.006
-----
-----
к/W
RthJA
250
* Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with
pad areas 25 mm2
-----
.25
Electrical Characteristics
.006
.15
Symbol
Rating
Rating
Unit
SUGGESTED SOLDER
PAD LAYOUT
Maximum Forward Voltage
(IF=10mAdc)
VF
0.9
V
0.093"
0.048”
0.036”
www.mccsemi.com
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Revision: 10
2010/03/01