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产品型号C0805C102J5GACAUTO的Datasheet PDF文件预览

SurfaceꢀMountꢀMultilayerꢀCeramicꢀChipꢀCapacitorsꢀ(SMDꢀMLCCs)  
C0G Dielectric, 10 – 250 VDC (Automotive Grade)  
Overview  
KEMET’sꢀAutomotiveꢀGradeꢀSeriesꢀsurfaceꢀmountꢀ  
capacitorsꢀinꢀC0Gꢀdielectricꢀareꢀsuitedꢀforꢀaꢀvarietyꢀofꢀ  
applicationsꢀrequiringꢀproven,ꢀreliableꢀperformanceꢀinꢀ  
harshꢀenvironments.ꢀWhetherꢀunder-hoodꢀorꢀin-cabin,ꢀ  
theseꢀdevicesꢀemphasizeꢀtheꢀvitalꢀandꢀrobustꢀnatureꢀ  
ofꢀcapacitorsꢀrequiredꢀforꢀmissionꢀandꢀsafetyꢀcriticalꢀ  
C0Gꢀdielectricꢀfeaturesꢀaꢀ125°Cꢀmaximumꢀoperatingꢀ  
temperatureꢀandꢀisꢀconsideredꢀ“stable.”ꢀTheꢀElectronicsꢀ  
IndustriesꢀAllianceꢀ(EIA)ꢀcharacterizesꢀC0Gꢀdielectricꢀasꢀ  
aꢀClassꢀIꢀmaterial.ꢀComponentsꢀofꢀthisꢀclassificationꢀareꢀ  
temperatureꢀcompensatingꢀandꢀareꢀsuitedꢀforꢀresonantꢀcircuitꢀ  
applicationsꢀorꢀthoseꢀwhereꢀQꢀandꢀstabilityꢀofꢀcapacitanceꢀ  
automotiveꢀcircuits.ꢀStricterꢀtestingꢀprotocolꢀandꢀinspectionꢀ characteristicsꢀareꢀrequired.ꢀC0Gꢀexhibitsꢀnoꢀchangeꢀinꢀ  
criteriaꢀhaveꢀbeenꢀestablishedꢀforꢀautomotiveꢀgradeꢀ  
productsꢀinꢀrecognitionꢀofꢀpotentiallyꢀharshꢀenvironmentalꢀ  
conditions.ꢀKEMETꢀautomotiveꢀgradeꢀseriesꢀcapacitorsꢀ  
meetꢀtheꢀdemandingꢀAutomotiveꢀElectronicsꢀCouncil'sꢀ  
AEC–Q200ꢀqualificationꢀrequirements.  
capacitanceꢀwithꢀrespectꢀtoꢀtimeꢀandꢀvoltageꢀandꢀboastsꢀaꢀ  
negligibleꢀchangeꢀinꢀcapacitanceꢀwithꢀreferenceꢀtoꢀambientꢀ  
temperature.ꢀCapacitanceꢀchangeꢀisꢀlimitedꢀtoꢀ±30ꢀppm/ºCꢀ  
fromꢀ−55°Cꢀtoꢀ+125°C.ꢀ  
Benefits  
•ꢀ AEC–Q200ꢀautomotiveꢀqualified  
•ꢀ −55°Cꢀtoꢀ+125°Cꢀoperatingꢀtemperatureꢀrange  
•ꢀ Leadꢀ(Pb)-Free,ꢀRoHSꢀandꢀREACHꢀcompliant  
•ꢀ EIAꢀ0402,ꢀ0603,ꢀ0805,ꢀ1206,ꢀ1210,ꢀ1812,ꢀand  
2220 case sizes  
•ꢀ DCꢀvoltageꢀratingsꢀofꢀ10ꢀV,ꢀ16ꢀV,ꢀ25ꢀV,ꢀ50ꢀV,ꢀ100ꢀV,ꢀ200ꢀV,  
andꢀ250ꢀV  
•ꢀ Capacitanceꢀofferingsꢀrangingꢀfromꢀ0.5ꢀpFꢀupꢀtoꢀ0.47ꢀμFꢀ  
•ꢀ Availableꢀcapacitanceꢀtolerancesꢀofꢀ±0.10ꢀpF,ꢀ±0.25ꢀpF,ꢀ±0.5ꢀ  
pF,ꢀ±1%,ꢀ±2%,ꢀ±5%,ꢀ±10%,ꢀandꢀ±20%  
Click image above for interactive 3D content  
Open PDF in Adobe Reader for full functionality  
Ordering Information  
C
1206  
C
104  
J
3
G
A
C
AUTO  
Case Size Specification/  
Capacitance  
Codeꢀ(pF)  
Capacitance RatedꢀVoltageꢀ  
FailureꢀRate/  
Design  
Packaging/Gradeꢀ  
(C-Spec)  
Ceramic  
Dielectric  
G = C0G  
TerminationꢀFinish2  
(L"ꢀxꢀW")  
Series  
Tolerance1  
(VDC)  
0402  
0603  
0805  
1206  
1210  
1812  
2220  
Cꢀ=ꢀStandard Twoꢀsignificantꢀ Bꢀ=ꢀ±0.10ꢀpF  
digitsꢀ+ꢀnumberꢀ Cꢀ=ꢀ±0.25ꢀpF  
8 = 10  
A = N/A  
Cꢀ=ꢀ100%ꢀMatteꢀSn Seeꢀ"Packagingꢀ  
C-SpecꢀOrderingꢀ  
4 = 16  
ofꢀzeros  
Useꢀ9ꢀforꢀ  
1.0ꢀ–ꢀ9.9ꢀpF  
Useꢀ8ꢀforꢀ  
0.5ꢀ–ꢀ.99ꢀpF  
Dꢀ=ꢀ±0.5ꢀpF  
Fꢀ=ꢀ±1%  
Gꢀ=ꢀ±2%  
Jꢀ=ꢀ±5%  
3 = 25  
5 = 50  
1 = 100  
2 = 200  
A = 250  
OptionsꢀTable"ꢀ  
below  
Kꢀ=ꢀ±10%  
ex.ꢀ2.2ꢀpFꢀ=ꢀ229 Mꢀ=ꢀ±20%  
ex.ꢀ0.5ꢀpFꢀ=ꢀ508  
1 Additional capacitance tolerance offerings may be available. Contact KEMET for details.  
2 Additional termination finish options may be available. Contact KEMET for details.  
One world. One KEMET  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com  
C1022_C0G_AUTO_SMD • 1/9/2017  
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)  
Packaging C-Spec Ordering Options Table  
Packaging/Grade  
Packaging Type1  
Ordering Code (C-Spec)3  
7"ꢀReel  
AUTO  
AUTO7411ꢀ(EIAꢀ0603ꢀandꢀsmallerꢀcaseꢀsizes)  
AUTO7210ꢀ(EIAꢀ0805ꢀandꢀlargerꢀcaseꢀsizes)  
3190  
13"ꢀReel/Unmarked  
7"ꢀReel/Unmarked/2ꢀmmꢀpitch2  
13"ꢀReel/Unmarked/2ꢀmmꢀpitch2  
3191  
1 Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel  
Packaging Quantities" and "Tape & Reel Packaging Information".  
2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case  
size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".  
3 All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For  
more information see "Capacitor Marking".  
3 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information".  
Benefits cont'd  
• No piezoelectric noise  
•ꢀ ExtremelyꢀlowꢀESRꢀandꢀESL  
•ꢀ Highꢀthermalꢀstability  
•ꢀ Negligibleꢀcapacitanceꢀchangeꢀwithꢀrespectꢀtoꢀtemperatureꢀ  
fromꢀ−55°Cꢀtoꢀ+125°C  
•ꢀ Noꢀcapacitanceꢀdecayꢀwithꢀtime  
•ꢀ Highꢀrippleꢀcurrentꢀcapability  
•ꢀ Non-polarꢀdevice,ꢀminimizingꢀinstallationꢀconcerns  
•ꢀ Preferredꢀcapacitanceꢀsolutionꢀatꢀlineꢀfrequenciesꢀandꢀintoꢀ •ꢀ 100%ꢀpureꢀmatteꢀtin-platedꢀterminationꢀfinishꢀallowingꢀforꢀ  
theꢀMHzꢀrange  
excellentꢀsolderability  
•ꢀ NoꢀcapacitanceꢀchangeꢀwithꢀrespectꢀtoꢀappliedꢀratedꢀDCꢀ  
voltage  
•ꢀ SnPbꢀplatedꢀterminationꢀfinishꢀoptionꢀavailableꢀuponꢀ  
requestꢀ(5%ꢀminimum)  
Applications  
Typicalꢀapplicationsꢀincludeꢀcriticalꢀtiming,ꢀtuning,ꢀcircuitsꢀrequiringꢀlowꢀloss,ꢀcircuitsꢀwithꢀpulse,ꢀhighꢀcurrent,ꢀdecoupling,ꢀ  
bypass,ꢀfiltering,ꢀtransientꢀvoltageꢀsuppression,ꢀblockingꢀandꢀenergyꢀstorage.ꢀ  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com  
C1022_C0G_AUTO_SMD • 1/9/2017  
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)  
Automotive C-Spec Information  
KEMETꢀAutomotiveꢀGradeꢀproductsꢀmeetꢀorꢀexceedꢀtheꢀrequirementsꢀoutlinedꢀbyꢀtheꢀAutomotiveꢀElectronicsꢀCouncil.ꢀ  
DetailsꢀregardingꢀtestꢀmethodsꢀandꢀconditionsꢀareꢀreferencedꢀinꢀdocumentꢀAEC–Q200,ꢀStressꢀTestꢀQuali ꢀcationꢀforꢀPassiveꢀ  
Components.ꢀTheseꢀproductsꢀareꢀsupportedꢀbyꢀaꢀProductꢀChangeꢀNoti ꢀcationꢀ(PCN)ꢀandꢀProductionꢀPartꢀApprovalꢀProcessꢀ  
warrantꢀ(PPAP).  
AutomotiveꢀproductsꢀofferedꢀthroughꢀourꢀdistributionꢀchannelꢀhaveꢀbeenꢀassignedꢀanꢀinclusiveꢀorderingꢀcodeꢀC-Spec,ꢀ  
“AUTO”.ꢀThisꢀC-Specꢀwasꢀdevelopedꢀinꢀorderꢀtoꢀbetterꢀserveꢀsmallꢀandꢀmediumꢀsizedꢀcompaniesꢀthatꢀpreferꢀanꢀautomotiveꢀ  
gradeꢀcomponentꢀwithoutꢀtheꢀrequirementꢀtoꢀsubmitꢀaꢀcustomerꢀSourceꢀControlledꢀDrawingꢀ(SCD)ꢀorꢀspeci ꢀcationꢀforꢀreviewꢀ  
byꢀaꢀKEMETꢀengineeringꢀspecialist.ꢀThisꢀC-SpecꢀisꢀthereforeꢀnotꢀintendedꢀforꢀuseꢀbyꢀKEMET’sꢀOEMꢀAutomotiveꢀcustomersꢀ  
andꢀareꢀnotꢀgrantedꢀtheꢀsameꢀ“privileges”ꢀasꢀotherꢀautomotiveꢀC-Specs.ꢀCustomerꢀPCNꢀapprovalꢀandꢀPPAPꢀrequestꢀlevelsꢀareꢀ  
limitedꢀ(seeꢀdetailsꢀbelow).ꢀ  
Product Change Notification (PCN)  
TheꢀKEMETꢀProductꢀChangeꢀNoti ꢀcationꢀsystemꢀisꢀusedꢀtoꢀcommunicateꢀprimarilyꢀtheꢀfollowingꢀtypesꢀofꢀchanges:  
ꢀ •ꢀProduct/processꢀchangesꢀthatꢀaffectꢀproductꢀform,ꢀ ꢀt,ꢀfunction,ꢀand/orꢀreliabilityꢀ  
ꢀ •ꢀChangesꢀinꢀmanufacturingꢀsite  
ꢀ •ꢀProductꢀobsolescence  
Customer Notification due to:  
KEMET Automotive  
C-Spec  
Days prior to  
implementation  
Process/Productꢀchange  
Obsolescence*  
KEMETꢀassigned1  
Yesꢀ(withꢀapprovalꢀandꢀsignꢀoff)  
Yesꢀ(withoutꢀapproval)  
Yes  
Yes  
180ꢀdaysꢀMinimum  
90ꢀdaysꢀMinimum  
AUTO  
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.  
Production Part Approval Process (PPAP)  
TheꢀpurposeꢀofꢀtheꢀProductionꢀPartꢀApprovalꢀProcessꢀis:  
ꢀ •ꢀToꢀensureꢀthatꢀsupplierꢀcanꢀmeetꢀtheꢀmanufacturabilityꢀandꢀqualityꢀrequirementsꢀforꢀtheꢀpurchasedꢀparts.  
ꢀ •ꢀToꢀprovideꢀtheꢀevidenceꢀthatꢀallꢀcustomerꢀengineeringꢀdesignꢀrecordꢀandꢀspeci ꢀcationꢀrequirementsꢀareꢀproperlyꢀ  
understoodꢀand  
ꢀꢀꢀful ꢀlledꢀbyꢀtheꢀmanufacturingꢀorganization.  
ꢀ •ꢀToꢀdemonstrateꢀthatꢀtheꢀestablishedꢀmanufacturingꢀprocessꢀhasꢀtheꢀpotentialꢀtoꢀproduceꢀtheꢀpart  
PPAP (Product Part Approval Process) Level  
KEMET Automotive  
C-Spec  
1
2
3
4
5
KEMETꢀassigned1  
AUTO  
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.  
ꢀPartꢀNumberꢀspeci ꢀcꢀPPAPꢀavailable  
ꢀProductꢀfamilyꢀPPAPꢀonly  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com  
C1022_C0G_AUTO_SMD • 1/9/2017  
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)  
Dimensions – Millimeters (Inches)  
L
S
S
EIA Size  
Code  
Metric Size  
Code  
L
W
Width  
T
B
Mounting  
Technique  
Separation  
Minimum  
Length  
Thickness  
Bandwidth  
1.00ꢀ(0.040)  
±0.05ꢀ(0.002)  
1.60ꢀ(0.063)  
±0.15ꢀ(0.006)  
2.00ꢀ(0.079)  
±0.20ꢀ(0.008)  
3.20ꢀ(0.126)  
±0.20ꢀ(0.008)  
3.20ꢀ(0.126)  
±0.20ꢀ(.008)  
4.50ꢀ(0.177)  
±0.30ꢀ(0.012)  
5.70ꢀ(0.224)  
±0.40ꢀ(0.016)  
0.50ꢀ(0.020)  
±0.05ꢀ(0.002)  
0.80ꢀ(0.032)  
±0.15ꢀ(0.006)  
1.25ꢀ(0.049)  
±0.20ꢀ(0.008)  
1.60ꢀ(0.063)  
±0.20ꢀ(0.008)  
2.50ꢀ(0.098)  
±0.20ꢀ(0.008)  
3.20ꢀ(0.126)  
±0.30ꢀ(0.012)  
5.00ꢀ(0.197)  
±0.40ꢀ(0.016)  
0.30ꢀ(0.012)  
±0.10ꢀ(0.004)  
0.35ꢀ(0.014)  
±0.15ꢀ(0.006)  
0.50ꢀ(0.02)  
±0.25ꢀ(0.010)  
0.50ꢀ(0.02)  
±0.25ꢀ(0.010)  
0.50ꢀ(0.02)  
±0.25ꢀ(0.010)  
0.60ꢀ(0.024)  
±0.35ꢀ(0.014)  
0.60ꢀ(0.024)  
±0.35ꢀ(0.014)  
SolderꢀReflowꢀ  
Only  
0402  
0603  
0805  
1206  
1210  
1812  
2220  
1005  
1608  
2012  
3216  
3225  
4532  
5650  
0.30ꢀ(0.012)  
0.70ꢀ(0.028)  
0.75ꢀ(0.030)  
SolderꢀWaveꢀorꢀ  
SolderꢀReflow  
SeeꢀTableꢀ2ꢀforꢀ  
Thickness  
N/A  
SolderꢀReflowꢀ  
Only  
Qualification/Certification  
AutomotiveꢀGradeꢀproductsꢀmeetꢀorꢀexceedꢀtheꢀrequirementsꢀoutlinedꢀbyꢀtheꢀAutomotiveꢀElectronicsꢀCouncil.ꢀDetailsꢀ  
regardingꢀtestꢀmethodsꢀandꢀconditionsꢀareꢀreferencedꢀinꢀdocumentꢀAEC–Q200,ꢀStressꢀTestꢀQualificationꢀforꢀPassiveꢀ  
Components.ꢀForꢀadditionalꢀinformationꢀregardingꢀtheꢀAutomotiveꢀElectronicsꢀCouncilꢀandꢀAEC–Q200,ꢀpleaseꢀvisitꢀtheirꢀ  
websiteꢀ@www.aecouncil.com.  
Environmental Compliance  
Leadꢀ(Pb)-free,ꢀRoHS,ꢀandꢀREACHꢀcompliantꢀwithoutꢀexemptions.ꢀ  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com  
C1022_C0G_AUTO_SMD • 1/9/2017  
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)  
Electrical Parameters/Characteristics  
Item  
Parameters/Characteristics  
OperatingꢀTemperatureꢀRange  
−55°Cꢀtoꢀ+125°Cꢀꢀ  
±30ꢀppm/ºCꢀ  
0%  
CapacitanceꢀChangeꢀwithꢀReferenceꢀto  
+25°Cꢀandꢀ0ꢀVDCꢀAppliedꢀ(TCC)  
AgingꢀRateꢀ(Maximumꢀ%ꢀCapacitanceꢀLoss/DecadeꢀHour)  
1DielectricꢀWithstandingꢀVoltageꢀ(DWV)  
250%ꢀofꢀratedꢀvoltage  
(5±1ꢀsecondsꢀandꢀcharge/dischargeꢀnotꢀexceedingꢀ50ꢀmA)  
2DissipationꢀFactorꢀ(DF)ꢀMaximumꢀLimitꢀatꢀ25ºC  
0.1%  
1,000ꢀmegohmꢀmicrofaradsꢀorꢀ100ꢀGΩ  
(Ratedꢀvoltageꢀappliedꢀforꢀ120±5ꢀsecondsꢀatꢀ25°C)  
3InsulationꢀResistanceꢀ(IR)ꢀLimitꢀatꢀ25°C  
1 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the  
capacitor.  
2 Capacitance and dissipation factor (DF) measured under the following conditions:  
1 MHz ±100 kHz and 1.0 Vrms ±0.2 V if capacitance ≤ 1,000 pF  
1 kHz ±50 Hz and 1.0 Vrms ±0.2 V if capacitance > 1,000 pF  
3 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.  
Capacitance and Dissipation Factor (DF) measured under the following conditions:  
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known  
as Automatic Level Control (ALC). The ALC feature should be switched to "ON."  
Post Environmental Limits  
High Temperature Life, Biased Humidity, Moisture Resistance  
Capacitance DissipationꢀFactorꢀ Capacitance  
Insulation  
Dielectric  
C0G  
RatedꢀDCꢀVoltage  
Value  
(Maximumꢀ%)ꢀ  
Shiftꢀ  
Resistance  
10%ꢀofꢀInitialꢀ  
All  
All  
0.5  
0.3%ꢀorꢀ±0.25ꢀpFꢀ  
Limit  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com  
C1022_C0G_AUTO_SMD • 1/9/2017  
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)  
Table 1A – Capacitance Range/Selection Waterfall (0402 – 0805 Case Sizes)  
Case Size/Series  
Voltage Code  
C0402C  
C0603C  
C0805C  
8
4
3
5
1
2
A
8
4
3
5
1
2
A
8
4
3
5
1
2
A
Cap  
Code  
Capacitance  
Rated Voltage (VDC)  
Product Availability and Chip Thickness Codes  
See Table 2 for Chip Thickness Dimensions  
Capacitance Tolerance  
0.50ꢀ&ꢀ0.75ꢀpF  
1.0ꢀ–ꢀ9.1ꢀpF*  
10ꢀ–ꢀ91ꢀpF*  
100ꢀpF  
110ꢀ–ꢀ180ꢀpF*  
200ꢀ–ꢀ270ꢀpF*  
300ꢀpF  
508 & 758  
109ꢀ–ꢀ919*  
100ꢀ–ꢀ910*  
101  
111ꢀ–ꢀ181*  
201ꢀ–ꢀ271*  
301  
B
B
C
C
D
D
BB BB BB BB  
BB BB BB BB  
BB BB BB BB  
CF CF CF CF CF CF CF DN DN DN DN DN DN DN  
CF CF CF CF CF CF CF DN DN DN DN DN DN DN  
CF CF CF CF CF CF CF DN DN DN DN DN DN DN  
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
BB BB BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN  
BB BB BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN  
BB BB BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN  
BB BB BB BB BB BD BD CF CF CF CF CF CF CF DN DN DN DN DN DN DN  
BB BB BB BB BB BD BD CF CF CF CF CF CF CF DN DN DN DN DN DN DN  
BB BB BB BB BB  
BB BB BB BB BB  
BB BB BB BB BB  
BB BB BB BB BB  
BB BB BB BB BB  
BB BB BB BB BB  
BB BB BB BB BB  
BB BB BB BB  
BB BB BB BB  
BB BB BB BB  
BB BB BB BB  
BB BB BB  
330ꢀpF  
360ꢀpF  
390ꢀpF  
430ꢀpF  
331  
361  
391  
431  
CF CF CF CF CF CF CF DN DN DN DN DN DN DN  
CF CF CF CF CF CF CF DN DN DN DN DN DN DN  
CF CF CF CF CF CF CF DN DN DN DN DN DN DN  
CF CF CF CF CF CF CF DN DN DN DN DN DP DP  
CF CF CF CF CF CF CF DN DN DN DN DN DN DN  
CF CF CF CF CF CF CF DN DN DN DN DP DP DP  
CF CF CF CF CF CF CF DN DN DN DN DP DP DP  
CF CF CF CF CF CH CH DN DN DN DN DN DN DN  
CF CF CF CF CF CH CH DN DN DN DN DN DN DN  
CF CF CF CF CF CH CH DP DP DP DP DP DN DN  
CF CF CF CF CF CH CH DP DP DP DP DP DN DN  
CF CF CF CF CF CH CH DP DP DP DP DP DN DN  
CF CF CF CF CF CH CH DP DP DP DP DP DN DN  
CF CF CF CF CF CH CH DN DN DN DN DN DN DN  
CF CF CF CF CF CH CH DN DN DN DN DN DN DN  
470ꢀpF  
471  
510ꢀ–ꢀ820ꢀpF*  
910ꢀpF  
1,000ꢀpF  
1,100ꢀpF  
511ꢀ–ꢀ821*  
911  
102  
112  
122  
132  
152  
162  
182  
202  
222  
242  
272  
302  
332  
362  
392  
432  
472  
512  
562  
622  
682  
752  
822  
912  
103  
123  
153  
183  
1,200ꢀpF  
1,300ꢀpF  
1,500ꢀpF  
1,600ꢀpF  
1,800ꢀpF  
2,000ꢀpF  
2,200ꢀpF  
2,400ꢀpF  
2,700ꢀpF  
3,000ꢀpF  
3,300ꢀpF  
3,600ꢀpF  
3,900ꢀpF  
4,300ꢀpF  
4,700ꢀpF  
5,100ꢀpF  
5,600ꢀpF  
6,200ꢀpF  
6,800ꢀpF  
7,500ꢀpF  
8,200ꢀpF  
9,100ꢀpF  
10,000ꢀpF  
12,000ꢀpF  
15,000ꢀpF  
18,000ꢀpF  
22,000ꢀpF  
27,000ꢀpF  
33,000ꢀpF  
39,000ꢀpF  
47,000ꢀpF  
BB BB BB  
BB BB BB  
BB BB BB  
CF CF CF CF CF  
CF CF CF CF CF  
CF CF CF CF CF  
CF CF CF CF CF  
CF CF CF CF CF  
CF CF CF CF CF  
CF CF CF CF CF  
CF CF CF CF CF  
CF CF CF CF  
CF CF CF CF  
CF CF CF CF  
CF CF CF CF  
CF CF CF  
DN DN DN DN DN DN DN  
DN DN DN DN DN DN DN  
DP DP DP DP DN DN DN  
DP DP DP DP DN DN DN  
DP DP DP DP DN DP DP  
DE DE DE DE DN DP DP  
DE DE DE DE DN DP DP  
DE DE DE DE DN DP DP  
DE DE DE DE DN DP DP  
DN DN DN DN DN DP DP  
DN DN DN DN DN DG DG  
DN DN DN DN DN DG DG  
DN DN DN DN DN DG DG  
DN DN DN DN DN DG DG  
DN DN DN DN DN  
CF CF CF  
CF CF CF  
CF CF CF  
DN DN DN DN DP  
CF CF CF  
DN DN DN DN DE  
CF CF CF  
DN DN DN DP DG  
DN DN DN DP  
DP DP DP DF  
DF DF DF  
DG DG DG  
DG DG DG  
DG DG DG  
223  
273  
333  
393  
473  
Rated Voltage (VDC)  
Voltage Code  
8
4
3
5
1
2
A
8
4
3
5
1
2
A
8
4
3
5
1
2
A
Capacitance  
Cap Code  
Case Size/Series  
C0402C  
C0603C  
C0805C  
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91)  
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage  
capability within the same form factor (configuration and dimensions).  
These products are protected under US Patents 7,172,985 & 7,670,981, other patents pending, and any foreign counterparts.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com  
C1022_C0G_AUTO_SMD • 1/9/2017  
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)  
Table 1B – Capacitance Range/Selection Waterfall (1206 – 2220 Case Sizes)  
Case Size/Series  
Voltage Code  
C1206C  
C1210C  
C1812C  
C2220C  
8
4
3
5
1
2
A
8
4
3
5
1
2
A
5
1
2
A
5
1
2
Cap  
Cap Code  
Rated Voltage (VDC)  
Product Availability and Chip Thickness Codes  
See Table 2 for Chip Thickness Dimensions  
EB EB EB EB EB EB EB FB FB FB FB FB FB FB  
EB EB EB EB EB EB EB FB FB FB FB FB FB FB  
EB EB EB EB EB EB EB FB FB FB FB FB FB FB  
EB EB EB EB EB EB EB FB FB FB FB FB FB FB GB GB GB GB  
EB EB EB EB EB EE EE FB FB FB FB FB FB FB GB GB GB GB  
EB EB EB EB EB EB EB FB FB FB FB FB FB FB GB GB GB GB  
EB EB EB EB EB EB EB FB FB FB FB FB FB FB GB GB GB GB  
EB EB EB EB EC EC EC FB FB FB FB FB FC FC GB GB GB GB  
EB EB EB EB ED EC EC FB FB FB FB FB FE FE GB GB GB GB  
EB EB EB EB ED ED ED FB FB FB FB FB FE FE GB GB GB GB  
EB EB EB EB ED ED ED FB FB FB FB FB FE FE GB GB GB GB  
EB EB EB EB ED ED ED FB FB FB FB FC FE FE GB GB GB GB  
EB EB EB EB EE EE ED FB FB FB FB FC FG FG GB GB GB GB  
EB EB EB EB EC EC EC FB FB FB FB FC FC FC  
EB EB EB EB EC EC EC FB FB FB FB FC FC FC GB GB GB GB  
EC EC EC EC EC EB EB FB FB FB FB FC FF FF  
EC EC EC EC EE EB EB FB FB FB FB FF FF FF GB GB GB GB  
EC EC EC EC EE EB EB FB FB FB FB FF FF FF  
EC EC EC EC EF EB EB FB FB FB FB FF FF FF GB GB GB GB  
EC EC EC EC EC EB EB FB FB FB FB FF FF FF  
EC EC EC EC EC EB EB FF FF FF FF FG FG FG GB GB GD GD  
ED ED ED ED ED EB EB FB FB FB FB FG FG FG  
ED ED ED ED ED EB EB FB FB FB FB FG FG FG GB GB GH GH  
EB EB EB EB EB EB EB FB FB FB FB FG FB FB  
EB EB EB EB EB EB EB FB FB FB FB FG FB FB GB GB GJ GJ JE JE JB  
EB EB EB EB EB EB EB FC FC FC FC FC FB FB  
EC EC EC EC EB EC EC FC FC FC FC FC FB FB GB GH GB GB JE JE JB  
EC EC EC EC EB EC EC FE FE FE FE FE FB FB  
ED ED ED ED EB EC EC FF FF FF FF FF FB FB GB GH GB GB JE JE JB  
EB EB EB EB EB ED ED FG FG FG FG FB FB FB GB GG GB GB JE JE JB  
EB EB EB EB EB EF EF FG FG FG FG FB FC FC GB GB GB GB JE JE JB  
EB EB EB EB EB EH EH FB FB FB FB FB FC FC GB GB GB GB JE JE JB  
EB EB EB EB EC EH EH FB FB FB FB FB FF FF GB GB GB GB JE JB JB  
Capacitance Tolerance  
1.0ꢀ–ꢀ9.1ꢀpF*  
10ꢀ–ꢀ91ꢀpF*  
100ꢀ–ꢀ430ꢀpF*  
470ꢀ–ꢀ910ꢀpF*  
1,000ꢀpF  
1,100ꢀpF  
1,200ꢀpF  
1,300ꢀpF  
1,500ꢀpF  
1,600ꢀpF  
1,800ꢀpF  
2,000ꢀpF  
2,200ꢀpF  
2,400ꢀpF  
2,700ꢀpF  
3,000ꢀpF  
3,300ꢀpF  
3,600ꢀpF  
3,900ꢀpF  
4,300ꢀpF  
4,700ꢀpF  
5,100ꢀpF  
5,600ꢀpF  
6,200ꢀpF  
6,800ꢀpF  
7,500ꢀpF  
8,200ꢀpF  
9,100ꢀpF  
10,000ꢀpF  
12,000ꢀpF  
15,000ꢀpF  
18,000ꢀpF  
22,000ꢀpF  
27,000ꢀpF  
33,000ꢀpF  
39,000ꢀpF  
47,000ꢀpF  
56,000ꢀpF  
68,000ꢀpF  
82,000ꢀpF  
0.10ꢀµF  
109ꢀ–ꢀ919*  
100ꢀ–ꢀ910*  
101ꢀ–ꢀ431*  
471ꢀ–ꢀ911*  
102  
B
C
D
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
112  
122  
132  
152  
162  
182  
202  
222  
242  
272  
302  
332  
362  
392  
432  
472  
512  
562  
622  
682  
752  
822  
912  
103  
123  
153  
183  
223  
273  
333  
393  
473  
EB EB EB EB EE  
EB EB EB EB EE  
EC EC EC EE EH  
EC EC EC EE EH  
ED ED ED EF  
EF EF EF EH  
EH EH EH EH  
EH EH EH  
FB FB FB FB FB FG FG GB GB GB GB JE JB JB  
FB FB FB FB FB FH FH GB GB GB GB JB JB JB  
FB FB FB FB FE FH FH GB GB GB GB JB JB JB  
FB FB FB FB FE FJ FJ GB GB GD GD JB JB JB  
563  
683  
823  
104  
124  
154  
184  
224  
274  
334  
394  
474  
FB FB FB FB FF  
FB FB FB FC FG  
FC FC FC FF FH  
FE FE FE FG FM  
FG FG FG FH  
FH FH FH FM  
FJ FJ FJ  
GB GB GD GD JB JB JB  
GB GB GK GK JB JB JB  
GB GB GM GM JB JB JB  
GB GD GM GM JB JB JD  
GB GH  
GD GN  
GH  
0.12ꢀµF  
0.15ꢀµF  
0.18ꢀµF  
0.22ꢀµF  
0.27ꢀµF  
0.33ꢀµF  
0.39ꢀµF  
0.47ꢀµF  
JB JB JD  
JB JB JG  
JB JD JG  
JB JD JL  
JB JF  
JD JG  
JG  
JG  
FK FK FK  
GK  
Rated Voltage (VDC)  
Voltage Code  
8
4
3
5
1
2
A
8
4
3
5
1
2
A
5
1
2
A
5
1
2
Cap  
Cap Code  
Case Size/Series  
C1206C  
C1210C  
C1812C  
C2220C  
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91)  
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage  
capability within the same form factor (configuration and dimensions).  
These products are protected under US Patents 7,172,985 & 7,670,981, other patents pending, and any foreign counterparts.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com  
C1022_C0G_AUTO_SMD • 1/9/2017  
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)  
Table 2 – Chip Thickness/Tape & Reel Packaging Quantities  
Paper Quantity1  
Plastic Quantity  
7" Reel 13" Reel  
Thickness Case Thickness ±  
Code  
Size1 Range (mm)  
7" Reel  
13" Reel  
BB  
BD  
CF  
CH  
DN  
DP  
DE  
DF  
DG  
EB  
EC  
ED  
EE  
EF  
0402  
0402  
0603  
0603  
0805  
0805  
0805  
0805  
0805  
1206  
1206  
1206  
1206  
1206  
1206  
1210  
1210  
1210  
1210  
1210  
1210  
1210  
1210  
1210  
1812  
1812  
1812  
1812  
1812  
1812  
1812  
1812  
2220  
2220  
2220  
2220  
2220  
2220  
0.50ꢀ±ꢀ0.05  
0.55ꢀ±ꢀ0.05  
0.80ꢀ±ꢀ0.07  
0.85ꢀ±ꢀ0.07  
0.78ꢀ±ꢀ0.10  
0.90ꢀ±ꢀ0.10  
1.00ꢀ±ꢀ0.10  
1.10ꢀ±ꢀ0.10  
1.25ꢀ±ꢀ0.15  
0.78ꢀ±ꢀ0.10  
0.90ꢀ±ꢀ0.10  
1.00ꢀ±ꢀ0.10  
1.10ꢀ±ꢀ0.10  
1.20ꢀ±ꢀ0.15  
1.60ꢀ±ꢀ0.20  
0.78ꢀ±ꢀ0.10  
0.90ꢀ±ꢀ0.10  
1.00ꢀ±ꢀ0.10  
1.10ꢀ±ꢀ0.10  
1.25ꢀ±ꢀ0.15  
1.55ꢀ±ꢀ0.15  
1.70ꢀ±ꢀ0.20  
1.85ꢀ±ꢀ0.20  
2.10ꢀ±ꢀ0.20  
1.00ꢀ±ꢀ0.10  
1.25ꢀ±ꢀ0.15  
1.40ꢀ±ꢀ0.15  
1.55ꢀ±ꢀ0.10  
1.60ꢀ±ꢀ0.20  
1.70ꢀ±ꢀ0.15  
1.70ꢀ±ꢀ0.20  
2.00ꢀ±ꢀ0.20  
1.00ꢀ±ꢀ0.15  
1.30ꢀ±ꢀ0.15  
1.40ꢀ±ꢀ0.15  
1.50ꢀ±ꢀ0.15  
1.70ꢀ±ꢀ0.15  
2.00ꢀ±ꢀ0.20  
10,000  
10,000  
4,000  
4,000  
4,000  
4,000  
0
0
0
4,000  
0
0
0
0
0
0
0
0
50,000  
50,000  
15,000  
10,000  
15,000  
15,000  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2,500  
2,500  
2,500  
4,000  
4,000  
2,500  
2,500  
2,500  
2,000  
4,000  
4,000  
2,500  
2,500  
2,500  
2,000  
2,000  
2,000  
2,000  
1,000  
1,000  
1,000  
1,000  
1,000  
1,000  
1,000  
500  
10,000  
10,000  
10,000  
10,000  
10,000  
10,000  
10,000  
10,000  
8,000  
10,000  
10,000  
10,000  
10,000  
10,000  
8,000  
8,000  
8,000  
8,000  
4,000  
4,000  
4,000  
4,000  
4,000  
4,000  
4,000  
2,000  
4,000  
4,000  
4,000  
4,000  
4,000  
2,000  
0
10,000  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
EH  
FB  
FC  
FE  
FF  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
FG  
FH  
FM  
FJ  
FK  
GB  
GD  
GH  
GG  
GK  
GJ  
GN  
GM  
JB  
JD  
JE  
1,000  
1,000  
1,000  
1,000  
1,000  
500  
0
0
0
0
JF  
JG  
JL  
7" Reel  
13" Reel  
7" Reel  
13" Reel  
Thickness  
Code  
Case  
Size1  
Thickness ±  
Range (mm)  
Paper Quantity1  
Plastic Quantity  
Package quantity based on finished chip thickness specifications.  
1 If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA  
0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com  
C1022_C0G_AUTO_SMD • 1/9/2017  
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)  
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351  
Density Level A:  
Maximum (Most)  
Land Protrusion (mm)  
Density Level B:  
Median (Nominal)  
Land Protrusion (mm)  
Density Level C:  
Minimum (Least)  
Land Protrusion (mm)  
EIA  
Size  
Code  
Metric  
Size  
Code  
C
Y
X
V1  
V2  
C
Y
X
V1  
V2  
C
Y
X
V1  
V2  
0402  
0603  
0805  
1206  
1210  
12101  
1812  
2220  
1005  
1608  
2012  
3216  
3225  
3225  
4532  
5650  
0.50  
0.72  
0.72  
2.20  
1.20  
0.45  
0.62  
0.62  
1.90  
1.00  
0.40  
0.52  
0.52  
1.60  
0.80  
0.90  
1.00  
1.60  
1.60  
1.50  
2.15  
2.75  
1.15  
1.35  
1.35  
1.35  
1.60  
1.60  
1.70  
1.10  
1.55  
1.90  
2.80  
2.90  
3.60  
5.50  
4.00  
4.40  
5.60  
5.65  
5.60  
6.90  
8.20  
2.10  
2.60  
2.90  
3.80  
3.90  
4.60  
6.50  
0.80  
0.90  
1.50  
1.50  
1.40  
2.05  
2.65  
0.95  
1.15  
1.15  
1.15  
1.40  
1.40  
1.50  
1.00  
1.45  
1.80  
2.70  
2.80  
3.50  
5.40  
3.10  
3.50  
4.70  
4.70  
4.70  
6.00  
7.30  
1.50  
2.00  
2.30  
3.20  
3.30  
4.00  
5.90  
0.60  
0.75  
1.40  
1.40  
1.30  
1.95  
2.55  
0.75  
0.95  
0.95  
0.95  
1.20  
1.20  
1.30  
0.90  
1.35  
1.70  
2.60  
2.70  
3.40  
5.30  
2.40  
2.80  
4.00  
4.00  
4.00  
5.30  
6.60  
1.20  
1.70  
2.00  
2.90  
3.00  
3.70  
5.60  
1 Only for capacitance values ≥ 22 µF  
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow  
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.  
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.  
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform  
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).  
Image below based on Density Level B for an EIA 1210 case size.  
V1  
V2  
C
C
Grid ꢂlacement Courtyard  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com  
C1022_C0G_AUTO_SMD • 1/9/2017  
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)  
Soldering Process  
Recommended Soldering Technique:  
ꢀ •ꢀSolderꢀwaveꢀorꢀsolderꢀreflowꢀforꢀEIAꢀcaseꢀsizesꢀ0603,ꢀ0805ꢀandꢀ1206  
ꢀ •ꢀAllꢀotherꢀEIAꢀcaseꢀsizesꢀareꢀlimitedꢀtoꢀsolderꢀreflowꢀonly  
Recommended Reflow Soldering Profile:  
KEMET’sꢀfamiliesꢀofꢀsurfaceꢀmountꢀmultilayerꢀceramicꢀcapacitorsꢀ(SMDꢀMLCCs)ꢀareꢀcompatibleꢀwithꢀwaveꢀ(singleꢀorꢀdual),ꢀ  
convection,ꢀIRꢀorꢀvaporꢀphaseꢀreflowꢀtechniques.ꢀPreheatingꢀofꢀtheseꢀcomponentsꢀisꢀrecommendedꢀtoꢀavoidꢀextremeꢀthermalꢀ  
stress.ꢀKEMET’sꢀrecommendedꢀprofileꢀconditionsꢀforꢀconvectionꢀandꢀIRꢀreflowꢀreflectꢀtheꢀprofileꢀconditionsꢀofꢀtheꢀIPC/ꢀ  
J-STD-020ꢀstandardꢀforꢀmoistureꢀsensitivityꢀtesting.ꢀTheseꢀdevicesꢀcanꢀsafelyꢀwithstandꢀaꢀmaximumꢀofꢀthreeꢀreflowꢀpassesꢀ  
atꢀtheseꢀconditions.  
Termination Finish  
ꢂ  
L  
tꢂ  
Profile Feature  
Maꢁimum ꢃamp ꢄp ꢃate ꢅ ꢆꢇCꢈsec  
Maꢁimum ꢃamp Doꢉn ꢃate ꢅ ꢊꢇCꢈsec  
SnPb  
100%ꢀMatteꢀSn  
tL  
Preheat/Soak  
TemperatureꢀMinimumꢀ(TSmin  
)
100°C  
150°C  
150°C  
200°C  
smaꢁ  
smin  
TemperatureꢀMaximumꢀ(TSmax  
)
Timeꢀ(tS)ꢀfromꢀTSmin to TSmax  
60ꢀ–ꢀ120ꢀseconds  
60ꢀ–ꢀ120ꢀseconds  
ts  
3°C/secondꢀ  
maximum  
3°C/secondꢀ  
maximum  
Ramp-UpꢀRateꢀ(TL to TP)  
25  
25ꢇC to ꢂeaꢋ  
LiquidousꢀTemperatureꢀ(TL)  
TimeꢀAboveꢀLiquidousꢀ(tL)  
PeakꢀTemperatureꢀ(TP)  
183°C  
60ꢀ–ꢀ150ꢀseconds  
235°C  
217°C  
60ꢀ–ꢀ150ꢀseconds  
260°C  
ꢀiꢁe  
TimeꢀWithinꢀ5°CꢀofꢀMaximumꢀ  
PeakꢀTemperatureꢀ(tP)  
20ꢀsecondsꢀ  
maximum  
30ꢀsecondsꢀ  
maximum  
6°C/secondꢀ  
maximum  
6°C/secondꢀ  
maximum  
Ramp-DownꢀRateꢀ(TP to TL)  
Timeꢀ25°CꢀtoꢀPeakꢀ  
6 minutes  
maximum  
8 minutes  
maximum  
Temperature  
Note 1: All temperatures refer to the center of the package, measured on the  
capacitor body surface that is facing up during assembly reflow.  
Storage and Handling  
Ceramicꢀchipꢀcapacitorsꢀshouldꢀbeꢀstoredꢀinꢀnormalꢀworkingꢀenvironments.ꢀWhileꢀtheꢀchipsꢀthemselvesꢀareꢀquiteꢀrobustꢀinꢀ  
otherꢀenvironments,ꢀsolderabilityꢀwillꢀbeꢀdegradedꢀbyꢀexposureꢀtoꢀhighꢀtemperatures,ꢀhighꢀhumidity,ꢀcorrosiveꢀatmospheres,ꢀ  
andꢀlongꢀtermꢀstorage.ꢀInꢀaddition,ꢀpackagingꢀmaterialsꢀwillꢀbeꢀdegradedꢀbyꢀhighꢀtemperature–reelsꢀmayꢀsoftenꢀorꢀwarpꢀ  
andꢀtapeꢀpeelꢀforceꢀmayꢀincrease.ꢀKEMETꢀrecommendsꢀthatꢀmaximumꢀstorageꢀtemperatureꢀnotꢀexceedꢀ40ºCꢀandꢀmaximumꢀ  
storageꢀhumidityꢀnotꢀexceedꢀ70%ꢀrelativeꢀhumidity.ꢀTemperatureꢀfluctuationsꢀshouldꢀbeꢀminimizedꢀtoꢀavoidꢀcondensationꢀonꢀ  
theꢀpartsꢀandꢀatmospheresꢀshouldꢀbeꢀfreeꢀofꢀchlorineꢀandꢀsulfurꢀbearingꢀcompounds.ꢀForꢀoptimizedꢀsolderabilityꢀchipꢀstockꢀ  
shouldꢀbeꢀusedꢀpromptly,ꢀpreferablyꢀwithinꢀ1.5ꢀyearsꢀofꢀreceipt.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com  
C1022_C0G_AUTO_SMD • 1/9/2017 10  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)  
Construction  
ꢀeꢁꢂiꢃeꢄ Crꢅꢆꢆ ꢇeꢈꢁiꢅꢉ  
Dielectric Material  
(Caꢂrꢃ)  
ꢀarrier Layer  
(ꢁi)  
Dielectric  
Material (Caꢂrꢃ)  
ꢅnd ꢆerminationꢇ  
ꢅꢈternal ꢅlectrode  
(Cu)  
ꢆermination ꢉinish  
(100ꢊ Matte Sn)  
ꢋnner ꢅlectrodes  
(ꢁi)  
ꢅnd ꢆerminationꢇ  
ꢅꢈternal ꢅlectrode  
(Cu)  
ꢀarrier Layer  
(ꢁi)  
ꢆermination ꢉinish  
(100ꢊ Matte Sn)  
ꢋnner ꢅlectrodes  
(ꢁi)  
Capacitor Marking (Optional):  
Laserꢀmarkingꢀoptionꢀisꢀnotꢀavailableꢀon:  
•ꢀ C0G,ꢀUltraꢀStableꢀX8RꢀandꢀY5Vꢀdielectricꢀdevicesꢀ  
•ꢀ EIAꢀ0402ꢀcaseꢀsizeꢀdevicesꢀ  
•ꢀ EIAꢀ0603ꢀcaseꢀsizeꢀdevicesꢀwithꢀFlexibleꢀTerminationꢀoption.  
•ꢀ KPSꢀCommercialꢀandꢀAutomotiveꢀgradeꢀstackedꢀdevices.  
Theseꢀcapacitorsꢀareꢀsuppliedꢀunmarkedꢀonly.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com  
C1022_C0G_AUTO_SMD • 1/9/2017 11  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)  
Tape & Reel Packaging Information  
KEMETꢀoffersꢀmultilayerꢀceramicꢀchipꢀcapacitorsꢀpackagedꢀinꢀ8,ꢀ12ꢀandꢀ16ꢀmmꢀtapeꢀonꢀ7"ꢀandꢀ13"ꢀreelsꢀinꢀaccordanceꢀwithꢀ  
EIAꢀStandardꢀ481.ꢀThisꢀpackagingꢀsystemꢀisꢀcompatibleꢀwithꢀallꢀtape-fedꢀautomaticꢀpickꢀandꢀplaceꢀsystems.ꢀSeeꢀTableꢀ2ꢀforꢀ  
detailsꢀonꢀreelingꢀquantitiesꢀforꢀcommercialꢀchips.  
ꢔar Code Laꢊel  
AntiꢇStatic ꢈeel  
®
ꢉmꢊossed ꢋlasticꢌ or  
ꢋunched ꢋaper Carrierꢄ  
Chip and ꢐꢋS ꢑrientation in ꢋocꢏet  
(eꢎcept 1ꢀ25 Commercial, and 1ꢀ25 and 2225 Military)  
KEMET  
Sprocꢏet ꢕoles  
ꢉmꢊossment or ꢋunched Cavity  
ꢀ mm, 12 mm  
or 1ꢁ mm Carrier ꢂape  
AntiꢇStatic Cover ape  
(ꢄ10 mm (ꢄ00ꢍꢅ) Maꢎimum ꢂhicꢏness)  
1ꢃꢀ mm (ꢃꢄ00ꢅ)  
or  
ꢆꢆ0 mm (1ꢆꢄ00ꢅ)  
ꢌꢉꢒA 01005, 0201, 0ꢍ02 and 0ꢁ0ꢆ case siꢓes availaꢊle on punched paper carrier onlyꢄ  
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)  
New 2 mm Pitch Reel Options*  
Embossed Plastic Punched Paper  
Tape  
Packaging  
Ordering Code  
(C-Spec)  
C-3190  
7"ꢀReel 13"ꢀReel 7"ꢀReel 13"ꢀReel  
EIA Case Size Size  
(W)*  
Packaging Type/Options  
Pitchꢀ(P1)* Pitchꢀ(P1)*  
01005 – 0402  
0603  
8
8
2
2
2/4  
4
Automotiveꢀgradeꢀ7"ꢀreelꢀunmarked  
Automotiveꢀgradeꢀ13"ꢀreelꢀunmarked  
Commercialꢀgradeꢀ7"ꢀreelꢀunmarked  
Commercialꢀgradeꢀ13"ꢀreelꢀunmarked  
C-3191  
2/4  
4
C-7081  
0805  
8
4
4
4
C-7082  
1206 – 1210  
1805 – 1808  
≥ꢀ1812  
8
4
4
4
4
* 2 mm pitch reel only available for 0603 EIA case size.  
2 mm pitch reel for 0805 EIA case size under development.  
12  
12  
12  
16  
8
4
8
8
Benefits of Changing from 4 mm to 2 mm Pitching Spacing  
• Lower placement costs  
•ꢀ Doubleꢀtheꢀpartsꢀonꢀeachꢀreelꢀresultsꢀinꢀfewerꢀreelꢀ  
changesꢀandꢀincreasedꢀef ꢀciency  
•ꢀ Fewerꢀreelsꢀresultꢀinꢀlowerꢀpackaging,ꢀshippingꢀandꢀ  
storageꢀcosts,ꢀreducingꢀwaste  
KPS 1210  
8
8
KPS 1812 & 2220  
Arrayꢀ0508ꢀ&ꢀ0612  
12  
4
12  
4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.  
*Refer to Tables 6 & 7 for tolerance specifications.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com  
C1022_C0G_AUTO_SMD • 1/9/2017 12  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)  
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions  
2  
ꢍ10 pitches cumulative  
tolerance on tape ꢎ 0ꢏ2 mmꢐ  
2
1
ꢀo  
ꢈDo  
Ao  
ꢅo  
2
1
ꢄo  
S
1
1
1
ꢉmꢇossment  
ꢂor cavity siꢊe,  
see ꢋote 1 ꢁaꢇle ꢌ  
Center Lines of Cavity  
ꢈD  
1
Cover ꢁape  
is for tape feeder reference only,  
includinꢆ draft concentric aꢇout ꢄ  
1
o
.
ꢀꢁer ꢂireꢃꢄiꢅꢆ ꢅꢇ ꢀꢆreeꢈiꢆꢉ  
Table 6 – Embossed (Plastic) Carrier Tape Dimensions  
Metricꢀwillꢀgovern  
Constant Dimensions — Millimeters (Inches)  
D1 Minimum  
Note 1  
1.0  
(0.039)  
RꢀReference S1 Minimum  
T
T1  
Tape Size  
8 mm  
D0  
E1  
P0  
P2  
Note 2  
Note 3  
Maximum Maximum  
25.0  
(0.984)  
1.5ꢀ+0.10/-0.0ꢀ  
(0.059ꢀ+0.004/-  
0.0)  
1.75ꢀ±0.10ꢀ  
4.0ꢀ±0.10ꢀ  
2.0ꢀ±0.05  
0.600  
0.600  
(0.024)  
0.100  
(0.004)  
12 mm  
16 mm  
(0.069ꢀ±0.004) (0.157ꢀ±0.004) (0.079ꢀ±0.002)  
(0.024)  
1.5  
(0.059)  
30  
(1.181)  
Variable Dimensions — Millimeters (Inches)  
B1 Maximum  
Note 4  
E2  
T2  
W
Tape Size  
8 mm  
Pitch  
Fꢀ  
P1  
A0,B0 & K0  
Minimum  
6.25  
(0.246)  
Maximum Maximum  
2.5  
(0.098)  
4.35  
(0.171)  
3.5ꢀ±0.05ꢀ  
(0.138ꢀ±0.002) (0.157ꢀ±0.004)  
4.0ꢀ±0.10  
8.3  
(0.327)  
Singleꢀ(4ꢀmm)  
Singleꢀ(4ꢀmm)ꢀ&ꢀ  
Doubleꢀ(8ꢀmm)  
8.2  
10.25  
5.5ꢀ±0.05ꢀ  
8.0ꢀ±0.10  
4.6  
12.3  
12 mm  
16 mm  
Note 5  
(0.323)  
(0.404)  
(0.217ꢀ±0.002) (0.315ꢀ±0.004)  
(0.181)  
(0.484)  
12.1  
(0.476)  
14.25  
(0.561)  
7.5ꢀ±0.05 12.0ꢀ±0.10  
(0.138ꢀ±0.002)ꢀ (0.157ꢀ±0.004)ꢀ  
4.6  
(0.181)  
16.3  
(0.642)  
Tripleꢀ(12ꢀmm)  
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment  
location and hole location shall be applied independent of each other.  
2. The tape with or without components shall pass around R without damage (see Figure 6).  
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).  
4. B1 dimension is a reference dimension for tape feeder clearance only.  
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:  
(a) the component does not protrude above the top surface of the carrier tape.  
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.  
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).  
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see  
Figure 4).  
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.  
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com  
C1022_C0G_AUTO_SMD • 1/9/2017 13  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)  
Figure 2 – Punched (Paper) Carrier Tape Dimensions  
ꢋ10 pitches cumulative  
1  
ꢁo  
ꢂDo  
tolerance on tape ꢌ 0ꢍ2 mmꢎ  
A0  
2  
0  
ꢆottom Cover ꢀape  
1  
G
Cavity Siꢇe,  
See  
1  
1  
Center Lines of Cavity  
ꢀop Cover ꢀape  
ꢈote 1, ꢀaꢉle ꢊ  
ꢆottom Cover ꢀape  
ꢀꢁer ꢂireꢃꢄiꢅꢆ ꢅꢇ ꢀꢆreeꢈiꢆꢉ  
Table 7 – Punched (Paper) Carrier Tape Dimensions  
Metricꢀwillꢀgovern  
Constant Dimensions — Millimeters (Inches)  
RꢀReference  
Tape Size  
8 mm  
D0  
E1  
P0  
P2  
T1 Maximum  
G Minimum  
Note 2  
0.10  
1.5ꢀ+0.10ꢀ-0.0ꢀ  
(0.059ꢀ+0.004ꢀ-0.0)  
1.75ꢀ±0.10ꢀ  
(0.069ꢀ±0.004)  
4.0ꢀ±0.10ꢀ  
(0.157ꢀ±0.004)  
2.0ꢀ±0.05ꢀ  
(0.079ꢀ±0.002)  
0.75  
(0.030)ꢀ  
25  
(0.984)ꢀ  
(0.004)ꢀ  
Maximum  
Variable Dimensions — Millimeters (Inches)  
Tape Size  
8 mm  
Pitch  
E2 Minimum  
Fꢀ  
P1  
T Maximum  
W Maximum  
A0 B0  
2.0ꢀ±0.05ꢀ  
(0.079ꢀ±0.002)  
ꢀ4.0ꢀ±0.10ꢀ  
(0.157ꢀ±0.004)  
8.3  
(0.327)ꢀ  
8.3  
(0.327)  
Halfꢀ(2ꢀmm)  
Singleꢀ(4ꢀmm)  
6.25  
(0.246)  
3.5ꢀ±0.05ꢀ  
(0.138ꢀ±0.002)  
1.1  
(0.098)ꢀ  
Note 1  
8 mm  
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:  
a) the component does not protrude beyond either surface of the carrier tape.  
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.  
c) rotation of the component is limited to 20° maximum (see Figure 3).  
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).  
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.  
2. The tape with or without components shall pass around R without damage (see Figure 6).  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com  
C1022_C0G_AUTO_SMD • 1/9/2017 14  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)  
Packaging Information Performance Notes  
1. Cover Tape Break Force:ꢀ1.0ꢀKgꢀminimum.  
2. Cover Tape Peel Strength: Theꢀtotalꢀpeelꢀstrengthꢀofꢀtheꢀcoverꢀtapeꢀfromꢀtheꢀcarrierꢀtapeꢀshallꢀbe:ꢀ  
Tape Width  
8 mm  
Peel Strength  
0.1ꢀtoꢀ1.0ꢀNewtonꢀ(10ꢀtoꢀ100ꢀgf)  
0.1ꢀtoꢀ1.3ꢀNewtonꢀ(10ꢀtoꢀ130ꢀgf)  
12ꢀandꢀ16ꢀmm  
Theꢀdirectionꢀofꢀtheꢀpullꢀshallꢀbeꢀoppositeꢀtheꢀdirectionꢀofꢀtheꢀcarrierꢀtapeꢀtravel.ꢀTheꢀpullꢀangleꢀofꢀtheꢀcarrierꢀtapeꢀshallꢀbeꢀ  
165°ꢀtoꢀ180°ꢀfromꢀtheꢀplaneꢀofꢀtheꢀcarrierꢀtape.ꢀDuringꢀpeeling,ꢀtheꢀcarrierꢀand/orꢀcoverꢀtapeꢀshallꢀbeꢀpulledꢀatꢀaꢀvelocityꢀofꢀ  
300ꢀ±10ꢀmm/minute.  
3. Labeling:ꢀBarꢀcodeꢀlabelingꢀ(standardꢀorꢀcustom)ꢀshallꢀbeꢀonꢀtheꢀsideꢀofꢀtheꢀreelꢀoppositeꢀtheꢀsprocketꢀholes.ꢀRefer to EIA  
Standards 556 and 624.  
Figure 3 – Maximum Component Rotation  
°
ꢀꢁꢂiꢃꢄꢃ Cꢅꢃꢆꢅꢇeꢇꢈ ꢉꢅꢈꢁꢈiꢅꢇ  
ꢊꢅꢆ ꢋiew  
ꢀꢁꢂiꢃꢄꢃ Cꢅꢃꢆꢅꢇeꢇꢈ ꢉꢅꢈꢁꢈiꢅꢇ  
ꢌiꢍe ꢋiew  
ꢁypical ꢅocꢆet Centerline  
ꢊꢁꢆe  
ꢀꢁꢂiꢃꢄꢃ  
°
°
s
Wiꢍꢈꢎ ꢏꢃꢃꢐ ꢉꢅꢈꢁꢈiꢅꢇ ꢏ  
)
ꢂ,12  
1ꢃ – 200  
20  
10  
ꢀo  
ꢊꢁꢆe  
ꢀꢁꢂiꢃꢄꢃ  
°
S
Wiꢍꢈꢎ ꢏꢃꢃꢐ ꢉꢅꢈꢁꢈiꢅꢇ ꢏ  
)
ꢂ,12  
1ꢃ – 5ꢃ  
ꢄ2 – 200  
20  
10  
5
ꢁypical Component Centerline  
Ao  
Figure 4 – Maximum Lateral Movement  
Figure 5 – Bending Radius  
ꢃmꢄossed  
Carrier  
ꢅunched  
Carrier  
ꢂ mm ꢃ 12 mm ꢄape  
1ꢅ mm ꢄape  
0ꢀ5 mm maꢁimum  
0ꢀ5 mm maꢁimum  
1ꢀ0 mm maꢁimum  
1ꢀ0 mm maꢁimum  
ꢁendinꢂ  
ꢀadius  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com  
C1022_C0G_AUTO_SMD • 1/9/2017 15  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)  
Figure 6 – Reel Dimensions  
ꢁull ꢂadius,  
See ꢀote  
ꢌꢍ (ꢇncludes  
Access ꢄole at  
Slot Location  
(ꢅ ꢆ0 mm minimum)  
flanꢎe distortion  
at outer edꢎe)  
ꢌ2 (Measured at huꢏ)  
D
(See ꢀote)  
A
C
(Arꢏor hole  
ꢌ1 (Measured at huꢏ)  
diameter)  
ꢇf present,  
tape slot in core  
for tape startꢈ  
2ꢉ5 mm minimum ꢊidth ꢋ  
10ꢉ0 mm minimum depth  
(see ꢀote)  
ꢀoteꢈ Drive spoꢐes optionalꢑ if used, dimensions ꢃ and D shall applyꢉ  
Table 8 – Reel Dimensions  
Metricꢀwillꢀgovern  
Constant Dimensions — Millimeters (Inches)  
Tape Size  
8 mm  
A
B Minimum  
C
D Minimum  
178ꢀ±0.20ꢀ  
(7.008ꢀ±0.008)ꢀ  
or  
1.5  
(0.059)  
13.0ꢀ+0.5/-0.2ꢀ  
(0.521ꢀ+0.02/-0.008)  
20.2  
(0.795)  
12 mm  
16 mm  
330ꢀ±0.20  
(13.000ꢀ±0.008)  
Variable Dimensions — Millimeters (Inches)  
Tape Size  
8 mm  
N Minimum  
W1  
W2 Maximum  
W3  
8.4ꢀ+1.5/-0.0  
(0.331ꢀ+0.059/-0.0)  
14.4  
(0.567)  
50  
(1.969)  
12.4ꢀ+2.0/-0.0  
18.4  
Shallꢀaccommodateꢀtapeꢀ  
widthꢀwithoutꢀinterference  
12 mm  
16 mm  
(0.488ꢀ+0.078/-0.0)ꢀꢀ  
(0.724)  
16.4ꢀ+2.0/-0.0  
(0.646ꢀ+0.078/-0.0)  
22.4  
(0.882)  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com  
C1022_C0G_AUTO_SMD • 1/9/2017 16  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)  
Figure 7 – Tape Leader & Trailer Dimensions  
ꢅmꢌossed Carrier  
Carrier ꢀape  
ꢉunched Carrier  
ꢊ mm ꢋ 12 mm only  
ꢂound Sprocꢃet ꢄoles  
ꢃꢄꢅꢆꢄ  
ꢀꢁꢂ  
ꢀop Cover ꢀape  
ꢅlonꢆated Sprocꢃet ꢄoles  
(ꢇ2 mm tape and ꢈider)  
100 mm  
Minimum Leader  
ꢍ00 mm Minimum  
ꢀrailer  
Components  
1ꢁ0 mm Minimum  
ꢀop Cover ꢀape  
Figure 8 – Maximum Camber  
ꢆlonꢅated sprocꢂet holes  
(ꢇ2 mm ꢈ ꢉider tapes)  
Carrier ꢀape  
ꢁound Sprocꢂet ꢃoles  
1 mm Maꢄimum, either direction  
Straiꢅht ꢆdꢅe  
250 mm  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com  
C1022_C0G_AUTO_SMD • 1/9/2017 17  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)  
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(suchꢀasꢀinstallationꢀofꢀprotectiveꢀcircuitryꢀorꢀredundancies)ꢀinꢀorderꢀtoꢀensureꢀthatꢀtheꢀfailureꢀofꢀanꢀelectricalꢀcomponentꢀdoesꢀnotꢀresultꢀinꢀaꢀriskꢀofꢀpersonalꢀinjuryꢀorꢀ  
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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com  
C1022_C0G_AUTO_SMD • 1/9/2017 18  
配单直通车
C0805C102J5GACAUTO产品参数
型号:C0805C102J5GACAUTO
是否无铅: 不含铅
是否Rohs认证: 符合
生命周期:Active
零件包装代码:0805
包装说明:, 0805
Reach Compliance Code:compliant
风险等级:1.02
电容:0.001 µF
电容器类型:CERAMIC CAPACITOR
介电材料:CERAMIC
高度:0.78 mm
JESD-609代码:e3
长度:2 mm
安装特点:SURFACE MOUNT
多层:Yes
负容差:5%
端子数量:2
最高工作温度:125 °C
最低工作温度:-55 °C
封装形状:RECTANGULAR PACKAGE
封装形式:SMT
包装方法:TR, PUNCHED PAPER, 7 INCH
正容差:5%
额定(直流)电压(URdc):50 V
参考标准:AEC-Q200
尺寸代码:0805
表面贴装:YES
温度特性代码:C0G
温度系数:30ppm/Cel ppm/ °C
端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状:WRAPAROUND
宽度:1.25 mm
Base Number Matches:1
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