KEMET®
CERAMIC CHIP CAPACITORS
FEATURES
• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics
• Tape and reel packaging per EIA481-1. (See page
• 10, 16, 25, 50, 100 and 200 Volts
• Standard End Metalization: Tin-plate over nickel
barrier
61 for specific tape and reel information.) Bulk
Cassette packaging (0402, 0603, 0805 only) per
IEC60286-6 and EIAJ 7201.
• Available Capacitance Tolerances: ±0.10 pF; ±0.25
pF; ±0.5 pF; ±1% ; ±2% ; ±5% ; ±10% ; ±20% ; and
+80% -20%
CAPACITOR OUTLINE DRAWINGS
TIN PLATE
L
W
B
T
NICKEL PLATE
S
CONDUCTIVE
METALLIZATION
ELECTRODES
DIMENSIONS—MILLIMETERS AND (INCHES)
METRIC
SIZE CODE
(Ref only)
L #
W #
B
S
MOUNTING
TECHNIQUE
Solder Reflow
EIA
SIZE CODE
LENGTH
WIDTH
BANDWIDTH
MIN. SEPARATION
1.0 (.04) ± .05(.002)
0.5 (.02) ± .05 (.002)
0.20 (0.008)-0.40 (0.016)
0.3 (.012)
0402*
0603*
0805*
1206*
1210*
1812
1005
1608
2012
3216
3225
4532
4564
5650
5664
1.6 (.063) ± 0.15 (.006)
2.0 (.079) ± 0.2 (.008)
3.2 (.126) ± 0.2 (.008)
3.2 (.126) ± 0.2 (.008)
4.5 (.177) ± 0.3 (.012)
4.5 (.177) ± 0.3 (.012)
5.6 (.220) ± 0.4 (.016)
5.6 (.220) ± 0.4 (.016)
0.8 (.032) ± 0.15 (.006)
1.25 (.049) ± 0.2 (.008)
1.6 (.063) ± 0.2 (.008)
2.5 (.098) ± 0.2 (.008)
3.2 (.126) ± 0.3 (.012)
6.4 (.252) ± 0.4 (.016)
5.0 (.197) ± 0.4 (.016)
6.3 (.248) ± 0.4 (.016)
0.35 (.014) ±0.15 (.006)
0.5 (.02) ±.25 (.010)
0.5 (.02) ±.25 (.010)
0.5 (.02) ±.25 (.010)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
0.7 (.028)
0.75 (.030)
N/A
See pages
48-52 for
thickness
Solder Wave †
or
Solder Reflow
N/A
dimensions.
N/A
N/A
1825*
2220
Solder
Reflow
N/A
N/A
2225
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette, see page 65.)
#Note: These thicknesses are EIA maximums. Most chips are considerably thinner. Consult factory for details. Also, some extended values may be slightly thicker than EIA maximums.
† For extended value 1210 case size – solder reflow only.
(Standard Chips - For
Military see page 55)
CAPACITOR ORDERING INFORMATION
C 0805 C 103 K 5 R A C*
CERAMIC
SIZE CODE
END METALLIZATION
C-Standard
SPECIFICATION
C - Standard
CAPACITANCE CODE
(Tin-plated nickel barrier)
FAILURE RATE LEVEL
A- Not Applicable
Expressed in Picofarads (pF)
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
Change Over Temperature Range
G – C0G (NP0) (±30 PPM/°C)
R – X7R (±15% ) (-55°C + 125°C)
P– X5R (±15% ) (-55°C + 85°C)
U – Z5U (+22% , -56% ) (+10°C + 85°C)
V – Y5V (+22% , -82% ) (-30°C + 85°C)
VOLTAGE
B – ±0.10pF J – ±5%
C – ±0.25pF K – ±10%
D – ±0.5pF
F – ±1%
G – ±2%
M – ±20%
P – (GMV) – special order only
Z – +80% , -20%
1 - 100V
2 - 200V
5 - 50V
3 - 25V
4 - 16V
8 - 10V
9 - 6.3V
* Part Number Example: C0805C103K5RAC (14 digits - no spaces)
49
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300