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  • 北京元坤伟业科技有限公司

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  • C2225C911MZGACTU
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  • 深圳市惊羽科技有限公司

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  • C2225C911MZGACTU
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产品型号C2225H393BBGACTU的Datasheet PDF文件预览

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C,  
C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Overview  
KEMET’s High Voltage-High Temperature (HV-HT) series  
surface mount C0G Multilayer Ceramic Capacitors (MLCCs) are  
constructed of a robust and proprietary base metal electrode  
reference to ambient temperature. Capacitance change is limited  
to ±30ppm/ºC from −55°C to +200°C. In addition, these capacitors  
exhibit high insulation resistance with low dissipation factor at  
(BME) dielectric system that offers industry-leading performance elevated temperatures up to 200°C. They also exhibit low ESR  
at extreme temperatures. These surface mountable devices  
feature a 200ºC maximum operating temperature and are  
specifically designed to withstand the demands of harsh  
industrial environments such as oil exploration and automotive/  
avionics engine compartment circuitry. They also offer  
higher and more uniform breakdown voltage performance  
than competitive products, resulting in increased yields in  
customer field applications. When dealing with expensive high  
temperature circuitry and systems, higher yields can quickly  
result in significant cost savings.  
at high frequencies and offer superior volumetric efficiency over  
competitive high temperature precious metal electrode (PME) and  
base metal electrode (BME) dielectric system devices.  
These devices are Lead (Pb)-Free, RoHS and REACH compliant  
without the need of any exemptions.  
KEMET’s HV-HT series MLCCs are temperature compensating  
and are suited for resonant circuit applications or those where  
Q and stability of capacitance characteristics are required.  
They exhibit no change in capacitance with respect to time  
and voltage and boast a negligible change in capacitance with  
Click image above for interactive 3D content  
Open PDF in Adobe Reader for full functionality  
Ordering Information  
C
2225  
H
393  
J
C
G
A
C
TU  
Case Size Specification/  
Capacitance  
Code (pF)  
Capacitance Rated Voltage  
Failure Rate/  
Design  
Packaging/Grade  
(C-Spec)  
Ceramic  
Dielectric  
G = C0G  
Termination Finish2  
(L" x W")  
Series  
Tolerance1  
(VDC)  
0805  
1206  
1210  
1808  
1812  
1825  
2220  
2225  
2824  
3040  
3640  
4540  
H = High  
Temperature  
(200°C)  
Two significant B = ±0.10 pF  
digits + C = ±0.25 pF  
number of zeros. D = ±0.5 pF  
F = ±1%  
C = 500  
B = 630  
A = N/A  
C = 100% Matte Sn  
See “Packaging  
C-Spec Ordering  
Options Table”  
below  
L = SnPb (5% Pb min.)  
E = Gold (Au) 1.97 – 11.8 µin  
F = Gold (Au) 30 – 50 µin  
G = Gold (Au) 100 µin min.  
D = 1,000  
F = 1,500  
G = 2,000  
G = ±2%  
J = ±5%  
K = ±10%  
M = ±20%  
1 Additional capacitance tolerance offerings may be available. Contact KEMET for details.  
2 Gold(Au) termination finish options are not available on 2824, 3040, 3640 and 4540 case sizes.  
One world. One KEMET  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 1  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Packaging C-Spec Ordering Options Table  
Packaging  
Ordering Code (C-Spec)  
Termination Finish Options  
Packaging Type/Options  
Standard Packaging – Unmarked3  
Bulk Bag  
Waffle Tray2  
Blank1  
7292  
TU  
7" Tape & Reel  
7411 (EIA 0603 and smaller case sizes)  
7210 (EIA 0805 and larger case sizes)  
13" Reel  
C = 100% Matte Sn  
7” Tape & Reel/2 mm pitch4  
7" Tape & Reel – 50 pcs  
7" Tape & Reel – 100 pcs  
7" Tape & Reel – 250 pcs  
7" Tape & Reel – 500 pcs  
7" Tape & Reel – 1,000 pcs  
7081  
T050  
T100  
T250  
T500  
T1K0  
L = SnPb (5% Pb min.)  
F = Gold (Au) 30 – 50 µin  
G = Gold (Au) 100 µin min.  
Moisture Sensitive Packaging5 – Unmarked3  
Waffle Tray2  
7282  
7130  
7" Tape & Reel  
7" Tape & Reel – 50 pcs  
7" Tape & Reel – 100 pcs  
7" Tape & Reel – 250 pcs  
7" Tape & Reel – 500 pcs  
7" Tape & Reel – 1,000 pcs  
E = Gold (Au) 1.97 – 11.8 µin  
F = Gold (Au) 30 – 50 µin  
G = Gold (Au) 100 µin min.  
Contact KEMET6  
1 Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging.  
1 “Bulk Bag” packaging option is not available for Gold (Au) termination finish options and case sizes larger than 2225 (5664 Metric).  
2 “Waffle Tray” packaging option is not available for case sizes larger than 2225 (5664 Metric).  
3 The terms “Marked” and “Unmarked” pertain to laser marking option of components. All packaging options labeled as “Unmarked” will contain capacitors that  
have not been laser marked. The option to laser mark is not available on these devices.  
3 Reeling quantities are dependent upon chip size and thickness dimension. When ordering using the “T1K0” packaging option, 1812 thru 2225 case size devices  
with chip thickness of ≥ 1.9mm (nominal) may be shipped on multiple 7” reels or a single 13” reel. Additional reeling or packaging options may be available.  
Contact KEMET for details.  
4 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case size  
devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.  
5 Moisture sensitive packaging is required for Gold (Au) termination option “E” (1.97 – 11.8 µin)  
6 Additional reeling or packaging options may be available. Contact KEMET for details.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 2  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Benefits  
• Operating temperature range of −55°C to +200°C  
• Lead (Pb)-Free, RoHS, and REACH compliant  
• EIA 0805, 1206, 1210, 1808, 1812, 1825, 2220, 2225, 2824,  
3040, 3640 and 4540 case sizes  
• No capacitance change with respect to applied rated  
DC voltage  
• Negligible capacitance change with respect to temperature  
from −55°C to +125°C  
• DC voltage ratings of 500 V, 630 V, 1 KV, 1.5 KV, and 2 KV  
• Capacitance offerings ranging from 1 pF to 0.150 μF  
• Available capacitance tolerances of ±0.10 pF, ±0.25 pF,  
±0.5 pF, ±1%, ±2%, ±5%, ±10%, and ±20%  
• No piezoelectric noise  
• No capacitance decay with time  
• Non-polar device, minimizing installation concerns  
• 100% pure matte tin-plated termination finish allowing for  
excellent solderability  
• SnPb plated termination finish option available upon request  
(5% Pb minimum)  
• Extremely low ESR & ESL  
• High thermal stability  
• High ripple current capability  
• Gold (Au), Tin/Lead (Sn/Pb) and 100% pure matte Tin (Sn)  
termination finishes available  
Applications  
Typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, switch mode power  
supplies (input filters, resonators, tank circuits, snubbed circuits, output filters), high voltage coupling, DC blocking and voltage  
multiplier circuits in extreme environments such as down-hole exploration, aerospace engine compartments and geophysical probes.  
Markets include power supply, HID lighting, industrial equipment/control, automotive, aerospace, and munitions.  
Qualification/Certification  
High temperature (200ºC) Industrial grade products meet or exceed the requirements outlined in Table 4, Performance & Reliability.  
Qualification packages are available for review and download on our website at www.kemet.com/hightemp  
Environmental Compliance  
Lead (Pb)-Free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 3  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Dimensions – Millimeters (Inches)  
L
W
T
B
S
EIA  
Size  
Code  
Metric  
Size  
Code  
S
L
W
Width  
T
B
Mounting  
Technique  
Separation  
Minimum  
Length  
Thickness  
Bandwidth  
0805  
1206  
1210  
1808  
1812  
1825  
2220  
2225  
2824  
3040  
3640  
4540  
2012  
3216  
3225  
4520  
4532  
4564  
5650  
5664  
7260  
7610  
9210  
-
2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)  
3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008)  
3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008)  
4.70 (.185) ± 0.50 (.020) 2.00 (.079) ± 0.20 (.008)  
4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012)  
4.50 (.177) ± 0.30 (.012) 6.40 (.252) ± 0.40 (.016)  
5.70 (.224) ± 0.40 (.016) 5.00 (.197) ± 0.40 (.016)  
5.60 (.220) ± 0.40 (.016) 6.40 (.248) ± 0.40 (.016)  
7.10 (.280) ± 0.40 (.016) 6.10 (.240) ± 0.40 (.016)  
7.60 (.300) ± 0.40 (.016) 10.20 (.402) ± 0.40 (.016)  
9.10 (.358) ± 0.40 (.016) 10.20 (.402) ± 0.40 (.016)  
11.40 (.449) ± 0.40 (.016) 10.20 (.402) ± 0.40 (.016)  
0.50 (0.02) ± 0.25 (.010)  
0.50 (0.02) ± 0.25 (.010)  
0.50 (0.02) ± 0.25 (.010)  
0.60 (.024) ± 0.35 (.014)  
0.60 (.024) ± 0.35 (.014)  
0.60 (.024) ± 0.35 (.014)  
0.60 (.024) ± 0.35 (.014)  
0.60 (.024) ± 0.35 (.014)  
1.27 (.050) ± 0.40 (.016)  
1.27 (.050) ± 0.40 (.016)  
1.27 (.050) ± 0.40 (.016)  
1.27 (.050) ± 0.40 (.016)  
0.75 (.030)  
"Solder Wave or  
Solder Reflow"  
See Table 2 for  
Thickness  
N/A  
Solder Reflow Only  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 4  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Electrical Parameters/Characteristics  
Item  
Parameters/Characteristics  
Operating Temperature Range  
−55°C to +200°C  
±30 ppm/ºC (up to +200ºC)  
0%  
Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC)  
Aging Rate (Maximum % Capacitance Loss/Decade Hour)  
150% of rated voltage for voltage rating of < 1000 V  
120% of rated voltage for voltage rating of ≥ 1000 V  
(5 ±1 seconds and charge/discharge not exceeding 50 mA)  
1Dielectric Withstanding Voltage (DWV)  
2Dissipation Factor (DF) Maximum Limit @ 25ºC  
0.1%  
1000 megohm microfarads or 100 GΩ  
(500 VDC applied for 120 ±5 secs @ 25°C)  
3Insulation Resistance (IR) Minimum Limit @ 25°C  
1DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor.  
2Capacitance and dissipation factor (DF) measured under the following conditions:  
1 MHz ±100 kHz and 1.0 Vrms ±0.2 V if capacitance ≤ 1,000 pF  
1 kHz ± 50 Hz and 1.0 Vrms ±0.2 V if capacitance > 1,000 pF  
3To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.  
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as  
Automatic Level Control (ALC). The ALC feature should be switched to "ON."  
Post Environmental Limits  
High Temperature Life, Biased Humidity, Moisture Resistance  
Rated DC  
Voltage  
Capacitance  
Value  
Dissipation Factor  
(Maximum %)  
Capacitance  
Shift  
Insulation  
Resistance  
Dielectric  
C0G  
All  
All  
0.5  
0.3% or ±0.25 pF 10% of Initial Limit  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 5  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Table 1A – Capacitance Range/Selection Waterfall (0805 – 1808 Case Sizes)  
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)  
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within  
the same form factor (configuration and dimensions).  
These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts..  
Case Size/Series  
C0805H  
C1206H  
C1210H  
C1808H  
Voltage Code  
C
B
D
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
Cap  
Code  
Capacitance  
Rated Voltage (VDC)  
Capacitance  
Tolerance  
Product Availability and Chip Thickness Codes  
See Table 2 for Chip Thickness Dimensions  
1.0 - 9.1 pF*  
10 pF - 47pF*  
51 pF  
109 - 919*  
100 - 470*  
510  
B
C
D
DG DG DG  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LA  
LA  
LA  
LA  
LA  
LA  
LA  
LA  
LA  
LA  
LA  
LA  
LA  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LC  
LC  
LC  
LC  
LC  
LC  
LA  
LA  
LA  
LA  
LA  
LA  
LB  
LB  
LC  
LC  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LA  
LA  
LA  
LA  
LA  
LA  
LA  
LA  
LA  
LA  
LA  
LA  
LA  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LC  
LC  
LC  
LC  
LC  
LC  
LB  
LB  
LB  
LC  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LA  
LA  
LA  
LA  
LA  
LA  
LA  
LB  
LB  
LB  
LB  
LB  
LB  
LC  
LC  
LC  
LC  
LA  
LA  
LA  
LA  
LA  
LB  
LB  
LC  
LC  
LC  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LB  
LC  
LC  
LC  
LC  
LC  
LC  
LC  
LC  
LA  
LA  
LA  
LA  
LB  
LB  
LC  
LC  
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
DG DG DG ED ED ED ED ED FM FM FM FM FM LB  
DG DG DG ED ED ED ED ED FM FM FM FM FM LB  
DG DG DG ED ED ED ED ED FM FM FM FM FM LB  
DG DG DG ED ED ED ED ED FM FM FM FM FM LB  
DG DG DG ED ED ED ED ED FM FM FM FM FM LB  
DG DG DG ED ED ED ED EF FM FM FM FM FM LB  
DG DG DG ED ED ED ED EF FM FM FM FM FM LB  
DG DG DG ED ED ED ED EF FM FM FM FM FM LB  
DG DG DG ED ED ED ED EF FM FM FM FM FM LB  
DG DG DG ED ED ED ED EG FM FM FM FM FM LB  
DG DG DG ED ED ED ED EG FG FG FG FM FM LA  
DG DG DG ED ED ED ED EG FG FG FG FM FM LA  
DG DG DG ED ED ED EF EG FG FG FG FM FM LA  
DG DG DG ED ED ED EF EG FG FG FG FM FM LA  
DG DG DG ED ED ED EF EG FG FG FG FM FM LA  
DG DG DG ED ED ED EF EG FG FG FG FM FM LA  
DG DG DG ED ED ED EG EG FG FG FG FM FM LA  
DG DG DG ED ED ED EG EG FG FG FG FM FM LA  
56 pF  
62 pF  
68 pF  
75 pF  
82 pF  
91 pF  
100 pF  
110 pF  
120 pF  
130 pF  
150 pF  
160 pF  
560  
620  
680  
750  
820  
910  
101  
111  
121  
131  
151  
161  
181  
201  
221  
241  
271  
301  
331  
361  
391  
431  
471  
180 pF  
200 pF  
220 pF  
240 pF  
270 pF  
DG DG DG ED ED ED EG EG FG FG FG FK  
FK  
FK  
FK  
FS  
FS  
FS  
FS  
FS  
FS  
FS  
FS  
LA  
LA  
LA  
LA  
LA  
LA  
LA  
LA  
LA  
LA  
LB  
LB  
LB  
LB  
LB  
LC  
LC  
LC  
LC  
LC  
LC  
LC  
LC  
LC  
LC  
LA  
LA  
LA  
LA  
LA  
LA  
300 pF  
330 pF  
360 pF  
390 pF  
430 pF  
470 pF  
510 pF  
560 pF  
620 pF  
DG DG  
DG DG  
DG DG  
DG DG  
DG DG  
DG DG  
DG DG  
DG DG  
DG  
ED ED EF EG  
ED ED EF EG  
ED ED EF EG  
ED ED EF EG  
ED ED EF EG  
ED ED EG EG  
ED ED EG EG  
ED ED EG EG  
ED ED EG  
ED ED EG  
ED EF EG  
ED EF EG  
ED EF EG  
ED EF EG  
EF EG  
EF EG  
EF EG  
EF EG  
EF EG  
EF EG  
EG  
EG  
EG  
FG FG FG FK  
FG FG FG FK  
FG FG FG FK  
FG FG FG FK  
FG FM FM FS  
FG FM FM FS  
FG FM FM FS  
FG FM FM FS  
FG FM FM FS  
FG FM FM FS  
FG FM FM FM  
FG FM FM FM  
FM FM FM FY  
FM FM FM FY  
511  
561  
621  
681  
751  
821  
911  
680 pF  
750 pF  
820 pF  
DG  
DG  
DG  
910 pF  
1,000 pF  
1,100 pF  
1,200 pF  
1,300 pF  
1,500 pF  
1,600 pF  
1,800 pF  
2,000 pF  
2,200 pF  
2,400 pF  
2,700 pF  
3,000 pF  
3,300 pF  
3,600 pF  
3,900 pF  
4,300 pF  
4,700 pF  
102  
112  
FM FK  
FM FK  
FM FS  
FK FS  
122  
132  
152  
162  
182  
202  
222  
242  
272  
302  
332  
362  
392  
432  
472  
FK  
FS  
FS  
FS  
FS  
FS  
FS  
FS  
FS  
FS  
FK  
FK  
FK  
FK  
FK  
FS  
FS  
FS  
FS  
FS  
FS  
FL  
FL  
FL  
FL  
FL  
EG  
FS FM  
FL FM  
FL  
FY  
FM FY  
FM FY  
Rated Voltage (VDC)  
Cap  
Code  
Capacitance  
Voltage Code  
C
B
D
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
Case Size/Series  
C0805H  
C1206H  
C1210H  
C1808H  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 6  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Table 1A – Capacitance Range/Selection Waterfall (0805 – 1808 Case Sizes) cont’d  
Case Size/Series  
C0805H  
C1206H  
C1210H  
C1808H  
Voltage Code  
C
B
D
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
Cap  
Code  
Capacitance  
Rated Voltage (VDC)  
Capacitance  
Tolerance  
Product Availability and Chip Thickness Codes  
See Table 2 for Chip Thickness Dimensions  
5,100 pF  
5,600 pF  
6,200pF  
6,800pF  
7,500pF  
8,200 pF  
512  
562  
622  
682  
752  
822  
F
F
F
F
F
F
G
G
G
G
G
G
J
J
J
J
J
J
K
K
K
K
K
K
M
M
M
M
M
M
FY  
FY  
FY  
FY  
FS  
FS  
FS  
FS  
LA  
LB  
LC  
LC  
Rated Voltage (VDC)  
Cap  
Code  
Capacitance  
Voltage Code  
C
B
D
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
Case Size/Series  
C0805H  
C1206H  
C1210H  
C1808H  
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)  
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within  
the same form factor (configuration and dimensions).  
These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts..  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 7  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Table 1B – Capacitance Range/Selection Waterfall (1812 – 2225 Case Sizes)  
Case Size/Series  
C1812H  
C1825H  
C2220H  
C2225H  
Voltage Code  
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
Cap  
Code  
Capacitance  
Rated Voltage (VDC)  
Capacitance  
Tolerance  
Product Availability and Chip Thickness Codes  
See Table 2 for Chip Thickness Dimensions  
10 pF - 47pF*  
51 pF  
100 - 470*  
510  
560  
620  
680  
750  
820  
910  
101  
111  
121  
131  
151  
161  
181  
201  
221  
241  
271  
301  
331  
361  
391  
431  
471  
511  
561  
621  
681  
751  
821  
911  
102  
112  
122  
132  
152  
162  
182  
202  
222  
242  
272  
302  
332  
362  
392  
432  
472  
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
GK GK GK GK GK HG HG HG HG HG JK JK JK JK JK KF KF KF KF KF  
GK GK GK GK GK HG HG HG HG HG JK JK JK JK JK KF KF KF KF KF  
GK GK GK GK GK HG HG HG HG HG JK JK JK JK JK KF KF KF KF KF  
GK GK GK GK GK HG HG HG HG HG JK JK JK JK JK KF KF KF KF KF  
GK GK GK GK GK HG HG HG HG HG JK JK JK JK JK KF KF KF KF KF  
GK GK GK GK GK HG HG HG HG HG JK JK JK JK JK KF KF KF KF KF  
GK GK GK GK GK HG HG HG HG HG JK JK JK JK JK KF KF KF KF KF  
GK GK GK GK GK HG HG HG HG HG JK JK JK JK JK KF KF KF KF KF  
GK GK GK GK GK HG HG HG HG HG JK JK JK JK JK KF KF KF KF KF  
GK GK GK GK GK HG HG HG HG HG JK JK JK JK JK KF KF KF KF KF  
GK GK GK GK GK HG HG HG HG HG JK JK JK JK JK KF KF KF KF KF  
GK GK GK GK GK HG HG HG HG HG JK JK JK JK JK KF KF KF KF KF  
GK GK GK GK GK HG HG HG HG HG JK JK JK JK JK KF KF KF KF KF  
GK GK GK GK GK HG HG HG HG HG JK JK JK JK JK KF KF KF KF KF  
GK GK GK GK GK HG HG HG HG HG JK JK JK JK JK KF KF KF KF KF  
GH GH GH GH GH HE HE HE HE HE JK JK JK JK JK KF KF KF KF KF  
GH GH GH GH GH HE HE HE HE HE JK JK JK JK JK KF KF KF KF KF  
GH GH GH GH GH HE HE HE HE HE JK JK JK JK JK KE KE KE KE KE  
GH GH GH GH GH HE HE HE HE HE JK JK JK JK JK KE KE KE KE KE  
GH GH GH GH GH HE HE HE HE HE JK JK JK JK JK KE KE KE KE KE  
GH GH GH GH GH HE HE HE HE HE JE JE JE JE JE KE KE KE KE KE  
GK GK GK GK GH HE HE HE HE HE JE JE JE JE JE KE KE KE KE KE  
GK GK GK GK GK HE HE HE HE HE JE JE JE JE JE KE KE KE KE KE  
GK GK GK GK GK HE HE HE HE HE JE JE JE JE JE KE KE KE KE KE  
GK GK GK GK GK HE HE HE HE HE JE JE JE JE JE KF KF KF KF KE  
GH GH GH GK GH HE HE HE HE HE JK JK JK JK JK KF KF KF KF KE  
GH GH GH GK GH HE HE HE HE HG JK JK JK JK JK KF KF KF KF KE  
GH GH GH GK GH HE HE HE HE HG JK JK JK JK JK KF KF KF KF KE  
GH GH GH GK GH HE HE HE HE HG JE JE JE JK JK KF KF KF KF KE  
GH GH GH GK GK HE HE HE HG HG JE JE JE JK JK KE KE KE KF KE  
GH GH GH GK GK HE HE HE HG HG JE JE JE JK JK KE KE KE KF KE  
GH GH GH GH GM HE HE HE HG HG JE JK JK JK JK KE KE KE KF KE  
GH GH GH GH GM HE HE HE HG HG JE JK JK JK JK KE KE KE KF KE  
GH GK GK GH GO HE HE HE HG HG JE JK JK JK JK KE KE KE KF KF  
GH GK GK GH GO HE HE HE HG HG JE JK JK JK JK KE KE KE KF KF  
GH GK GK GH GO HE HE HE HG HE JE JK JK JK JE KE KE KE KF KF  
GK GK GK GK GO HE HE HE HG HE JE JK JK JK JE KE KE KE KF KF  
56 pF  
62 pF  
68 pF  
75 pF  
82 pF  
91 pF  
100 pF  
110 pF  
120 pF  
130 pF  
150 pF  
160 pF  
180 pF  
200 pF  
220 pF  
240 pF  
270 pF  
300 pF  
330 pF  
360 pF  
390 pF  
430 pF  
470 pF  
510 pF  
560 pF  
620 pF  
680 pF  
750 pF  
820 pF  
910 pF  
1,000 pF  
1,100 pF  
1,200 pF  
1,300 pF  
1,500 pF  
1,600 pF  
1,800 pF  
2,000 pF  
2,200 pF  
2,400 pF  
2,700 pF  
3,000 pF  
3,300 pF  
3,600 pF  
3,900 pF  
4,300 pF  
4,700 pF  
GK GK GK GK  
GK GK GK GM  
GK GK GK GM  
GK GK GK GO  
GK GH GK GO  
GK GH GK GO  
GK GH GK  
HE HG HG HG HG JE JK JK JK JE KE KE KE KF KE  
HE HG HG HG HG JE JK JK JK JE KE KE KE KF KE  
HE HG HG HE HJ JE JK JK JE JK KE KE KE KF KE  
HE HG HG HE HJ JE JK JK JE JK KE KE KE KF KF  
HE HG HG HE HJ JK JK JK JE JL KE KE KE KE KH  
HE HG HG HE HK JK JK JK JE JL KE KE KE KE KH  
HG HG HG HE HK JK JK JK JE JL KE KE KE KE KH  
GK GH GK  
GK GH GM  
GK GH GM  
GH GH GO  
HG HG HG HG  
HG HG HG HG  
HG HG HG HJ  
HG HG HG HJ  
HG HG HG HJ  
JK JK JK JK JN KE KE KE KE KJ  
JK JK JK JK JN KE KF KF KF KJ  
JK JK JK JK JN KE KF KF KF KJ  
JK JK JK JK  
JK JK JK JL  
KE KF KF KF  
KE KF KF KH  
GH GH GO  
Rated Voltage (VDC)  
Voltage Code  
Cap  
Code  
Capacitance  
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
Case Size/Series  
C1812H  
C1825H  
C2220H  
C2225H  
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)  
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within  
the same form factor (configuration and dimensions).  
These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts..  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 8  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Table 1B – Capacitance Range/Selection Waterfall (1812 – 2225 Case Sizes) cont’d  
Case Size/Series  
C1812H  
C1825H  
C2220H  
C2225H  
Voltage Code  
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
Cap  
Code  
Capacitance  
Rated Voltage (VDC)  
Capacitance  
Tolerance  
Product Availability and Chip Thickness Codes  
See Table 2 for Chip Thickness Dimensions  
5,100 pF  
5,600 pF  
6,200pF  
6,800pF  
7,500pF  
8,200 pF  
9,100 pF  
10,000 pF  
12,000 pF  
15,000 pF  
18,000 pF  
22,000 pF  
27,000 pF  
33,000 pF  
39,000 pF  
512  
562  
622  
682  
752  
822  
912  
103  
123  
153  
183  
223  
273  
333  
393  
F
F
F
F
F
F
G
G
G
G
G
G
J
J
J
J
J
J
K
K
K
K
K
K
M
M
M
M
M
M
GH GK GO  
GH GK GO  
GH GK  
GH GM  
GH GM  
GK GO  
GM GO  
GM GO  
GO  
HG HE HG HK  
HG HE HG HK  
HG HE HG  
HG HE HJ  
HG HE HJ  
HG HE HJ  
HE HG HK  
HE HG HK  
HE HG  
HE HJ  
HG HK  
HJ  
HJ  
JK JK JK JL  
JK JK JK JN  
JK JE JE JN  
JK JE JK JN  
JK JE JK  
JK JE JL  
JE JE JL  
JE JE JL  
JE JK JN  
JE JL  
KE KF KF KH  
KE KF KF KH  
KE KF KF KJ  
KE KF KF KJ  
KF KE KF  
KF KE KF  
KF KE KH  
KF KE KH  
KE KE KH  
KE KF KJ  
KE KH  
GO  
JE JL  
JK JN  
JL JN  
JN  
KF KJ  
KF KJ  
KH  
KJ  
HK  
Rated Voltage (VDC)  
Voltage Code  
Cap  
Code  
Capacitance  
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
Case Size/Series  
C1812H  
C1825H  
C2220H  
C2225H  
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)  
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within  
the same form factor (configuration and dimensions).  
These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts..  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 9  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Table 1C – Capacitance Range/Selection Waterfall (2824 – 4540 Case Sizes)  
Case Size/  
Series  
C2824H  
C3040H  
C3640H  
C4540H  
Cap  
Code  
Voltage Code  
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
Capacitance  
Rated  
Voltage (VDC)  
Product Availability and Chip Thickness Codes  
See Table 2 for Chip Thickness Dimensions  
Capacitance  
Tolerance  
10 - 2,000 pF  
2,200 pF  
2,400 pF  
2,700 pF  
3,000 pF  
3,300 pF  
3,600 pF  
3,900 pF  
4,300 pF  
4,700 pF  
5,100 pF  
5,600 pF  
6,200 pF  
6,800 pF  
7,500 pF  
8,200 pF  
9,100 pF  
10,000 pF  
12,000 pF  
15,000 pF  
18,000 pF  
22,000 pF  
27,000 pF  
33,000 pF  
39,000 pF  
47,000 pF  
56,000 pF  
68,000 pF  
82,000 pF  
0.1 µF  
100 - 202  
222  
242  
272  
302  
332  
362  
392  
432  
472  
512  
562  
622  
682  
752  
822  
912  
103  
123  
153  
183  
223  
273  
333  
393  
473  
563  
683  
823  
104  
124  
154  
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA  
TA QB QB QB QB QB  
TB QB QB QB QB QB MA MA MA MA MA  
TB TB QB QB QB QB QB MA MA MA MA MA SA SA SA SA SA  
TB TC QB QB QB QB QB MA MA MA MA MA SA SA SA SA SA  
TB  
TC  
QB QB QB QB QC MA MA MA MA MA SA SA SA SA SA  
QB QB QB QC QC MA MA MA MA MB SA SA SA SA SA  
QB QB QB QC QD MA MA MA MA MB SA SA SA SA SB  
TA  
TA  
TA  
TA  
TA  
TA  
TB TB  
TB TC  
TB  
TA  
TA  
TA  
TA  
TB TC  
TB  
TA  
TA  
TB  
TB  
QB QB QB QD  
QB QB QB QD  
QB QB QB  
QB QB QC  
QB QB QC  
QB QC QC  
QB QC QD  
QB QC  
MA MA MA MB MB SA SA SA SA SB  
MA MA MA MB MC SA SA SA SB SB  
MA MA MA MC  
MA MA MA  
MA MA MA  
MA MA MB  
MA MA MB  
MA MB MC  
MA MB  
SA SA SA SB SC  
SA SA SA SB  
SA SA SA SC  
SA SA SA  
SA SA SB  
SA SA SB  
SA SA SB  
SA SB SC  
SA SB  
TC  
QC QD  
QC QD  
MB MC  
QC  
MB  
QD  
MC  
SB SC  
SB  
SC  
0.12 µF  
0.15 µF  
MC  
Rated Voltage (VDC)  
Voltage Code  
Cap  
Code  
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
Capacitance  
Case Size/Series  
C2824H  
C3040H  
C3640H  
C4540H  
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)  
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within  
the same form factor (configuration and dimensions).  
These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 10  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Table 2A – Chip Thickness/Tape & Reel Packaging Quantities  
Paper Quantity  
7" Reel 13" Reel  
Plastic Quantity  
7" Reel 13" Reel  
Thickness Case Thickness ±  
Code  
Size  
Range (mm)  
DG  
ED  
EF  
EG  
FG  
FL  
FM  
FY  
FK  
FS  
LA  
LB  
LC  
GH  
GK  
GM  
GO  
HE  
HG  
HJ  
0805  
1206  
1206  
1206  
1210  
1210  
1210  
1210  
1210  
1210  
1808  
1808  
1808  
1812  
1812  
1812  
1812  
1825  
1825  
1825  
1825  
2220  
2220  
2220  
2220  
2225  
2225  
2225  
2225  
2824  
2824  
2824  
3040  
3040  
3040  
3640  
3640  
3640  
4540  
4540  
4540  
1.25 ± 0.15  
1.00 ± 0.10  
1.20 ± 0.15  
1.60 ± 0.15  
1.25 ± 0.15  
1.40 ± 0.15  
1.70 ± 0.20  
2.00 ± 0.20  
2.10 ± 0.20  
2.50 ± 0.30  
1.40 ± 0.15  
1.60 ± 0.15  
2.00 ± 0.15  
1.40 ± 0.15  
1.60 ± 0.20  
2.00 ± 0.20  
2.50 ± 0.20  
1.40 ± 0.15  
1.60 ± 0.20  
2.00 ± 0.20  
2.50 ± 0.20  
1.40 ± 0.15  
1.60 ± 0.20  
2.00 ± 0.20  
2.50 ± 0.20  
1.40 ± 0.15  
1.60 ± 0.20  
2.00 ± 0.20  
2.50 ± 0.20  
1.40 ± 0.15  
2.00 ± 0.20  
2.50 ± 0.20  
1.40 ± 0.15  
2.00 ± 0.20  
2.50 ± 0.20  
1.40 ± 0.15  
2.00 ± 0.20  
2.50 ± 0.20  
1.40 ± 0.15  
2.00 ± 0.20  
2.50 ± 0.20  
0
0
2,500  
2,500  
2,500  
2,000  
2,500  
2,000  
2,000  
2,000  
2,000  
1,000  
1,000  
1,000  
1,000  
1,000  
1,000  
500  
10,000  
10,000  
10,000  
8,000  
10,000  
8,000  
8,000  
8,000  
8,000  
4,000  
4,000  
4,000  
4,000  
4,000  
4,000  
2,000  
2,000  
4,000  
4,000  
2,000  
2,000  
4,000  
4,000  
2,000  
2,000  
4,000  
4,000  
2,000  
2,000  
2,500  
2,000  
2,000  
1,650  
1,650  
1,400  
1,550  
1,550  
1,550  
1,500  
1,500  
1,500  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
500  
1,000  
1,000  
500  
HK  
JE  
JK  
500  
1,000  
1,000  
500  
JL  
JN  
KE  
KF  
KH  
KJ  
500  
1,000  
1,000  
500  
500  
750  
300  
300  
500  
500  
350  
250  
250  
250  
200  
200  
200  
TA  
TB  
TC  
QB  
QC  
QD  
MA  
MB  
MC  
SA  
SB  
SC  
7" Reel  
13" Reel  
7" Reel  
13" Reel  
Thickness  
Code  
Case  
Size  
Thickness ±  
Range (mm)  
Paper Quantity  
Plastic Quantity  
Package quantity based on finished chip thickness specifications.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 11  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Table 2B – Bulk Packaging Quantities  
Loose Packaging  
Bulk Bag (default)  
N/A2  
Secure Packaging  
2” x 2” Waffle Pack/Tray3  
Packaging Type  
Packaging C-Spec1  
7282 / 7292  
Case Size  
Packaging Quantities (pieces/unit packaging)  
Chip Thickness  
(mm)  
EIA (in)  
Metric (mm)  
Minimum  
Maximum  
Minimum  
Maximum  
0402  
0603  
0805  
1206  
1206  
1210  
1808  
1812  
1825  
2220  
2225  
1005  
1608  
2012  
3216  
3216  
3225  
4520  
4532  
4564  
5650  
5664  
368  
368  
100  
126  
50  
All  
50,000  
≤ 1.25 (nominal)  
> 1.25 (nominal)  
1
1
80  
50  
42  
All  
20,000  
20  
20  
20  
1 The "Packaging C-Spec" is a 4-digit code which identifies the packaging type. When ordering, the proper code must be included in the 15th through 18th  
character positions of the ordering code. See "Ordering Information" section of this document for further details. Product ordered without a packaging C-Spec will  
default to our standard " bulk bag" packaging.  
2 A packaging C-Spec (see note 1 above) is not required For "bulk bag" packaging (excluding Anti-Static Bulk Bag). The 15th through 18th character positions of  
the ordering code should be left blank. All product ordered without a packaging C-Spec will default to out standard "bulk bag" packaging.  
3 Also commonly referred to as “Chip Carrier” or “Molded Tray”. All tray packaging options offer static protection.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 12  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351  
Density Level A:  
Maximum (Most)  
Land Protrusion (mm)  
Density Level B:  
Median (Nominal)  
Land Protrusion (mm)  
Density Level C:  
Minimum (Least)  
Land Protrusion (mm)  
EIA  
Size  
Code  
Metric  
Size  
Code  
C
Y
X
V1  
V2  
C
Y
X
V1  
V2  
C
Y
X
V1  
V2  
0805  
1206  
1210  
1808  
1812  
1825  
2220  
2225  
2824  
3040  
3640  
4540  
2012  
3216  
3225  
4520  
4532  
4564  
5650  
5664  
7260  
7610  
9210  
-
1.00  
1.35  
1.55  
4.40  
2.60  
0.90  
1.15  
1.45  
3.50  
2.00  
0.75  
0.95  
1.35  
2.80  
1.70  
1.60  
1.60  
2.30  
2.15  
2.15  
2.75  
2.70  
3.45  
3.70  
4.45  
5.60  
1.35  
1.35  
1.75  
1.60  
1.60  
1.70  
1.70  
1.70  
1.70  
1.70  
1.70  
1.90  
2.80  
2.30  
3.60  
6.90  
5.50  
6.90  
6.60  
5.60  
5.65  
7.40  
6.90  
6.90  
8.20  
8.10  
9.60  
2.90  
3.80  
3.30  
4.60  
7.90  
6.50  
7.90  
7.60  
1.50  
1.50  
2.20  
2.05  
2.05  
2.65  
2.60  
3.35  
3.60  
4.35  
5.50  
1.15  
1.15  
1.55  
1.40  
1.40  
1.50  
1.50  
1.50  
1.50  
1.50  
1.50  
1.80  
2.70  
2.20  
3.50  
6.80  
5.40  
6.80  
6.50  
10.60  
4.70  
4.70  
6.50  
6.00  
6.00  
7.30  
7.20  
8.70  
9.20  
2.30  
3.20  
2.70  
4.00  
7.30  
5.90  
7.30  
7.00  
11.10  
1.40  
1.40  
2.10  
1.95  
1.95  
2.55  
2.50  
3.25  
3.50  
4.25  
5.40  
0.95  
0.95  
1.35  
1.20  
1.20  
1.30  
1.30  
1.30  
1.30  
1.30  
1.30  
1.70  
2.60  
2.10  
4.00  
4.00  
5.80  
5.30  
5.30  
6.60  
6.50  
8.00  
8.50  
2.00  
2.90  
2.40  
3.70  
7.00  
5.60  
7.00  
6.70  
10.80  
3.40  
6.70  
5.30  
6.70  
6.40  
10.50  
10.70 10.10 11.70  
10.70 11.60 11.70  
10.70 13.90 11.70  
10.60 10.70 11.10  
10.60 13.00 11.10  
10.50 10.00 10.80  
10.50 12.30 10.80  
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder  
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.  
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.  
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification  
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).  
Image below based on Density Level B for an EIA 1210 case size.  
V1  
Y
Y
V2  
X
X
C
C
Grid Placement Courtyard  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 13  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Soldering Process  
Recommended Soldering Technique:  
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206  
• All other EIA case sizes are limited to solder reflow only  
Recommended Reflow Soldering Profile:  
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection,  
IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s  
recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture  
sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions.  
TP  
TL  
Termination Finish  
tP  
Maximum Ramp Up Rate = 3°C/sec  
Maximum Ramp Down Rate = 6°C/sec  
Profile Feature  
SnPb  
100% Matte Sn  
tL  
Preheat/Soak  
Tsmax  
Tsmin  
Temperature Minimum (TSmin  
Temperature Maximum (TSmax  
Time (tS) from TSmin to TSmax  
)
100°C  
150°C  
150°C  
200°C  
)
tS  
60 – 120 seconds  
60 – 120 seconds  
Ramp-Up Rate (TL to TP)  
Liquidous Temperature (TL)  
Time Above Liquidous (tL)  
Peak Temperature (TP)  
3°C/second maximum 3°C/second maximum  
25  
183°C  
60 – 150 seconds  
235°C  
217°C  
60 – 150 seconds  
260°C  
25° C to Peak  
Time  
Time Within 5°C of Maximum  
Peak Temperature (tP)  
20 seconds maximum 30 seconds maximum  
Ramp-Down Rate (TP to TL) 6°C/second maximum 6°C/second maximum  
Time 25°C to Peak  
6 minutes maximum  
8 minutes maximum  
Temperature  
Note 1: All temperatures refer to the center of the package, measured on the  
capacitor body surface that is facing up during assembly reflow.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 14  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Table 4 – Performance & Reliability: Test Methods and Conditions  
Product Qualification Test Plan  
Reliability/Environmental Tests per MIL–STD–202//JESD22  
Load Humidity  
Low Voltage Humidity  
Temperature Cycling  
Thermal Shock  
85°C/85%RH and 200 VDC maximum, 1,000 Hours  
85°C/85%RH, 1.5V, 1,000 Hours  
−55°C to +200°C, 50 Cycles  
−55°C to +150°C, 20 seconds transfer, 15 minute dwell, 300 Cycles  
Cycled Temp/RH 0 V, 10 cycles @ 24 hours each  
Moisture Resistance  
Physical, Mechanical & Process Tests per MIL–STD 202/JIS–C–6429  
Resistance to Solvents  
Include Aqueous wash chemical – OKEM Clean or equivalent  
Method 213: Figure 1, Condition F Method 204: 5 gs for 20 minutes, 12 cycles  
Condition B, no per-heat of samples, Single Wave Solder  
Force of 1.8 kg for 60 seconds  
Mechanical Shock and Vibration  
Resistance to Soldering Heat  
Terminal Strength  
Board Flex  
Appendix 2, Note: 3.0 mm (minimum)  
Storage and Handling  
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other  
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term  
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may  
increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum storage humidity not exceed 70%  
relative humidity. In addition, temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should  
be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within the  
time frame outlined in the table below:  
Termination Finish  
100% Matte Tin (Sn)  
SnPb (5% Pb min.)  
Termination Finish Ordering Code1  
Storage Life  
C
L
1.5 years upon receipt  
1.5 years upon receipt  
6 months upon receipt2  
1.5 years upon receipt  
1.5 years upon receipt  
Gold (Au) 1.97 – 11.8 µin2  
Gold (Au) 30 – 50 µin  
Gold (Au) 100 µin min.  
E
F
G
1 The fourteenth (14th) character position of the KEMET part number is assigned to identify and/or define the termination  
finish. For more information, see “Ordering Information” section of this document.  
2 Gold plating option “E” devices should remain in its factory sealed moisture sensitive packaging during storage. If the factory sealed packaging is disturbed please  
store any remaining packaged components in a dry box container to prevent oxidation of the termination finish.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 15  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Construction (Typical)  
Detailed Cross Section  
Termination Finish:  
C = 100% Matte Sn  
L = SnPb - 5% Pb min  
Dielectric Material  
(CaZrO3)  
E = Gold (Au) 1.97 - 11.8 µin  
Dielectric Material  
F = Gold (Au) 30 - 50 µin  
(CaZrO3)  
G = Gold (Au) 100 µin min  
Barrier Layer  
(Ni)  
End Termination/  
External Electrode  
(Cu)  
Inner Electrodes  
(Ni)  
End Termination/  
External Electrode  
(Cu)  
Barrier Layer  
(Ni)  
Termination Finish  
(See options at left)  
Inner Electrodes  
(Ni)  
Capacitor Marking (Optional):  
Laser marking option is not available on:  
• C0G, Ultra Stable X8R and Y5V dielectric devices  
• EIA 0402 case size devices  
• EIA 0603 case size devices with Flexible Termination option.  
• KPS Commercial and Automotive grade stacked devices.  
These capacitors are supplied unmarked only.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 16  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Tape & Reel Packaging Information  
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12, 16 and 24 mm tape on 7" and 13" reels in accordance with EIA  
Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on  
reeling quantities for commercial chips.  
Bar Code Label  
Anti-Static Reel  
®
Embossed Plastic* or  
Punched Paper Carrier.  
Chip and KPS Orientation in Pocket  
(except 1825 Commercial, and 1825 and 2225 Military)  
KEMET  
Sprocket Holes  
Embossment or Punched Cavity  
8 mm, 12 mm  
or 16 mm Carrier Tape  
Anti-Static Cover Tape  
(.10 mm (.004") Maximum Thickness)  
178 mm (7.00")  
or  
330 mm (13.00")  
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.  
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)  
Embossed Plastic Punched Paper  
Tape  
7" Reel  
13" Reel  
7" Reel  
13" Reel  
EIA Case Size Size  
(W)*  
New 2 mm Pitch Reel Options*  
Packaging  
Pitch (P1)*  
Pitch (P1)*  
01005 – 0402  
0603  
8
8
2
2/4  
4
2
2/4  
4
Ordering Code  
(C-Spec)  
C-3190  
Packaging Type/Options  
Automotive grade 7" reel unmarked  
Automotive grade 13" reel unmarked  
Commercial grade 7" reel unmarked  
Commercial grade 13" reel unmarked  
0805  
8
4
4
4
4
C-3191  
1206 – 1210  
1805 – 1808  
≥ 1812  
8
4
4
C-7081  
12  
12  
16  
24  
12  
16  
8
4
4
C-7082  
* 2 mm pitch reel only available for 0603 EIA case size.  
2 mm pitch reel for 0805 EIA case size under development.  
8
8
2824  
12  
16  
8
12  
16  
8
Benefits of Changing from 4 mm to 2 mm Pitching Spacing  
• Lower placement costs  
• Double the parts on each reel results in fewer reel  
changes and increased efficiency  
• Fewer reels result in lower packaging, shipping and  
storage costs, reducing waste  
3040 – 4540  
KPS 1210  
KPS 1812 & 2220  
Array 0508 & 0612  
12  
4
12  
4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.  
*Refer to Tables 6 & 7 for tolerance specifications.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 17  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions  
T
T
P2  
[10 pitches cumulative  
tolerance on tape ± 0.2 mm]  
2
E
1
Po  
ØDo  
Ao  
F
Ko  
W
E
2
B
1
Bo  
S
1
P
1
T
1
Embossment  
For cavity size,  
see Note 1 Table 4  
Center Lines of Cavity  
ØD  
1
Cover Tape  
is for tape feeder reference only,  
including draft concentric about B  
B
1
o
.
User Direction of Unreeling  
Table 6 – Embossed (Plastic) Carrier Tape Dimensions  
Metric will govern  
Constant Dimensions — Millimeters (Inches)  
R Reference S1 Minimum  
T
T1  
Maximum  
Tape Size  
8 mm  
D0  
E1  
P0  
P2  
Note 2  
Note 3  
Maximum  
25.0  
(0.984)  
1.5 +0.10/−0.0  
1.75 ± 0.10  
4.0 ± 0.10  
2.0 ± 0.05  
0.600  
0.600  
0.100  
12 mm  
16 mm  
24 mm  
(0.059 +0.004/−0.0)  
(0.069 ± 0.004)  
(0.157 ± 0.004)  
(0.079 ± 0.002)  
(0.024)  
(0.024)  
(0.004)  
30  
(1.181)  
1.5 +0.10/−0.0  
(0.059 +0.004/−0.0)  
1.75 ± 0.10  
(0.069 ± 0.004)  
4.0 ± 0.10  
(0.157 ± 0.004)  
2.0 ± 0.10  
(0.078 ± 0.003)  
30  
(1.181)  
5
0.250  
(0.009)  
0.350  
(0.013)  
(0.196)  
Variable Dimensions — Millimeters (Inches)  
E2  
T2  
W
Tape Size  
8 mm  
Pitch  
F
P1  
A0,B0 & K0  
Minimum  
Maximum  
Maximum  
6.25  
(0.246)  
3.5 ± 0.05  
(0.138 ± 0.002)  
4.0 ± 0.10  
(0.157 ± 0.004)  
2.5  
(0.098)  
8.3  
(0.327)  
Single (4 mm)  
Single (4 mm) &  
Double (8 mm)  
10.25  
5.5 ± 0.05  
8.0 ± 0.10  
4.6  
12.3  
12 mm  
16 mm  
24 mm  
(0.404)  
(0.217 ± 0.002)  
(0.315 ± 0.004)  
(0.181)  
(0.484)  
Note 5  
14.25  
(0.561)  
7.5 ± 0.05  
(0.138 ± 0.002)  
12.0 ± 0.10  
(0.157 ± 0.004)  
4.6  
(0.181)  
16.3  
(0.642)  
Triple (12 mm)  
16 mm  
22.25  
(0.875)  
11.5 ± 0.10  
(0.452 ± 0.003) (0.629 ± 0.004)  
16.0 ± 0.10  
3
24.3  
(0.956)  
(0.118)  
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and  
hole location shall be applied independent of each other.  
2. The tape with or without components shall pass around R without damage (see Figure 6).  
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).  
4. B1 dimension is a reference dimension for tape feeder clearance only.  
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:  
(a) the component does not protrude above the top surface of the carrier tape.  
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.  
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).  
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).  
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.  
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 18  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Figure 2 – Punched (Paper) Carrier Tape Dimensions  
T
P2  
[10 pitches cumulative  
tolerance on tape ± 0.2 mm]  
E
1
Po  
ØDo  
0
A
F
W
2
E
0
B
Bottom Cover Tape  
P
1
G
Cavity Size,  
See  
1
T
1
T
Top Cover Tape  
Center Lines of Cavity  
Note 1, Table 7  
Bottom Cover Tape  
User Direction of Unreeling  
Table 7 – Punched (Paper) Carrier Tape Dimensions  
Metric will govern  
Constant Dimensions — Millimeters (Inches)  
R Reference  
Note 2  
Tape Size  
8 mm  
D0  
E1  
P0  
P2  
T1 Maximum  
G Minimum  
0.10  
1.5 +0.10/−0.0  
(0.059 +0.004/−0.0)  
1.75 ±0.10  
(0.069 ±0.004)  
4.0 ±0.10  
(0.157 ±0.004)  
2.0 ±0.05  
(0.079 ±0.002)  
0.75  
(0.030)  
25  
(0.984)  
(0.004)  
Maximum  
Variable Dimensions — Millimeters (Inches)  
Tape Size  
8 mm  
Pitch  
E2 Minimum  
F
P1  
T Maximum  
W Maximum  
A0 B0  
2.0 ±0.05  
(0.079 ±0.002)  
4.0 ±0.10  
8.3  
(0.327)  
8.3  
Half (2 mm)  
Single (4 mm)  
6.25  
(0.246)  
3.5 ±0.05  
(0.138 ±0.002)  
1.1  
(0.098)  
Note 1  
8 mm  
(0.157 ±0.004)  
(0.327)  
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:  
a) the component does not protrude beyond either surface of the carrier tape.  
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.  
c) rotation of the component is limited to 20° maximum (see Figure 3).  
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).  
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.  
2. The tape with or without components shall pass around R without damage (see Figure 6).  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 19  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Packaging Information Performance Notes  
1. Cover Tape Break Force: 1.0 Kg minimum.  
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:  
Tape Width  
8 mm  
Peel Strength  
0.1 to 1.0 Newton (10 to 100 gf)  
0.1 to 1.3 Newton (10 to 130 gf)  
0.1 to 1.6 Newton (10 to 160 gf)  
12 and 16 mm  
24 mm  
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°  
from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.  
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA  
Standards 556 and 624.  
Figure 3 – Maximum Component Rotation  
°
T
Maximum Component Rotation  
Top View  
Maximum Component Rotation  
Side View  
Typical Pocket Centerline  
Tape  
Maximum  
°
°
T
s
Width (mm) Rotation (  
)
8,12  
16 – 200  
20  
10  
Bo  
Tape  
Maximum  
°
S
Width (mm) Rotation (  
)
8,12  
16 – 56  
72 – 200  
20  
10  
5
Typical Component Centerline  
Ao  
Figure 5 – Bending Radius  
Figure 4 – Maximum Lateral Movement  
Embossed  
Carrier  
Punched  
Carrier  
8 mm & 12 mm Tape  
16 mm Tape  
0.5 mm maximum  
0.5 mm maximum  
1.0 mm maximum  
1.0 mm maximum  
R
Bending  
Radius  
R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 20  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Figure 6 – Reel Dimensions  
Full Radius,  
W3 (Includes  
flange distortion  
at outer edge)  
Access Hole at  
Slot Location  
(Ø 40 mm minimum)  
See Note  
W
2 (Measured at hub)  
D
(See Note)  
A
N
C
(Arbor hole  
W
1 (Measured at hub)  
diameter)  
If present,  
tape slot in core  
for tape start:  
2.5 mm minimum width x  
10.0 mm minimum depth  
B
(see Note)  
Note: Drive spokes optional; if used, dimensions B and D shall apply.  
Table 8 – Reel Dimensions  
Metric will govern  
Constant Dimensions — Millimeters (Inches)  
Tape Size  
8 mm  
A
B Minimum  
C
D Minimum  
178 ±0.20  
(7.008 ±0.008)  
or  
330 ±0.20  
(13.000 ±0.008)  
1.5  
(0.059)  
13.0 +0.5/−0.2  
(0.521 +0.02/−0.008)  
20.2  
(0.795)  
12 mm  
16 mm  
24 mm  
1.2  
(0.047)  
13.0 + −0.2  
(0.521 + −0.008)  
21  
(0.826)  
Variable Dimensions — Millimeters (Inches)  
Tape Size  
8 mm  
N Minimum  
W1  
W2 Maximum  
W3  
8.4 +1.5/−0.0  
(0.331 +0.059/−0.0)  
14.4  
(0.567)  
12.4 +2.0/−0.0  
18.4  
12 mm  
16 mm  
24 mm  
(0.488 +0.078/−0.0)  
(0.724)  
50  
(1.969)  
Shall accommodate tape width  
without interference  
16.4 +2.0/−0.0  
(0.646 +0.078/−0.0)  
25 +1.0/−0.0  
(0.984 +0.039/−0.0)  
22.4  
(0.882)  
27.4 +1.0/−1.0  
(1.078+0.039/−0.039)  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 21  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Figure 7 – Tape Leader & Trailer Dimensions  
Embossed Carrier  
Carrier Tape  
Round Sprocket Holes  
Punched Carrier  
8 mm & 12 mm only  
START  
END  
Top Cover Tape  
Elongated Sprocket Holes  
(32 mm tape and wider)  
100 mm  
Minimum Leader  
400 mm Minimum  
Trailer  
160 mm Minimum  
Components  
Top Cover Tape  
Figure 8 – Maximum Camber  
Elongated sprocket holes  
(32 mm & wider tapes)  
Carrier Tape  
Round Sprocket Holes  
1 mm Maximum, either direction  
Straight Edge  
250 mm  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 22  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Waffle Tray Packaging Information – 2" x 2" w/ Static Protection  
Figure 9 – Waffle Tray Dimensions – Inches (Millimeters)  
M
M3  
0.10 (2.54) X 45°  
M1  
M2  
Y
X
X
A
Z
0.098  
(2.489)  
0.156 +0.002/-0.003  
(3.962 +0.051/-0.076)  
0.086  
(2.184)  
0.004  
90°  
(0.102)  
2.000 ±0.004 SQ  
(50.800 ±0.102 SQ)  
1.800 ±0.004 SQ  
(45.720 ±0.102 SQ)  
1.812 ±0.004 SQ  
(46.025 ±0.102 SQ)  
STANDARD RIB MATRIX  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 23  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Table 9A – Waffle Tray Dimensions – Inches  
2" x 2" Waffle Tray Dimensions – Inches  
Case Size  
Packaging Quantity  
(pcs/unit packaging)  
M
M1  
M2  
M3  
X
Y
Z
A°  
MATRIX  
EIA (in) Metric (mm) ±0.003  
±0.003  
0.153  
0.226  
0.153  
0.186  
0.240  
0.228  
0.250  
0.244  
0.285  
0.285  
0.362  
0.362  
0.362  
±0.002  
0.077  
0.172  
0.077  
0.181  
0.190  
0.193  
0.375  
0.215  
0.286  
0.286  
0.424  
0.424  
0.424  
±0.002  
0.110  
0.170  
0.110  
0.171  
0.140  
0.124  
0.167  
0.174  
0.243  
0.243  
0.34  
±0.002  
0.073  
0.080  
0.073  
0.062  
0.060  
0.067  
0.100  
0.110  
0.150  
0.150  
0.24  
±0.002  
0.042  
0.090  
0.042  
0.092  
0.110  
0.130  
0.200  
0.145  
0.200  
0.200  
0.32  
±0.003  
0.041  
0.055  
0.041  
0.036  
0.075  
0.065  
0.070  
0.080  
0.075  
0.075  
0.032  
0.032  
0.032  
± 1/2°  
7
5
7
10  
5
5
5
5
5
(X x Y)  
16 X 23  
10 X 10  
16 X 23  
10 X 10  
12 X 9  
14 X 9  
10 X 5  
10 X 8  
7 X 6  
0402  
0504  
0603  
0805  
1005  
12061,2  
12061,3  
1210  
1808  
1812  
1825  
2220  
2225  
1005  
1210  
1608  
2012  
2512  
3216  
3216  
3225  
4520  
4532  
4564  
5650  
5664  
0.175  
0.235  
0.175  
0.232  
0.230  
0.194  
0.250  
0.217  
0.271  
0.271  
0.318  
0.318  
0.318  
368  
100  
368  
100  
108  
126  
50  
80  
42  
42  
20  
5
5
5
5
7 X 6  
5 X 4  
5 X 4  
5 X 4  
0.34  
0.34  
0.24  
0.24  
0.32  
0.32  
20  
20  
1 Packaging of 1206 (3216 metric) case size capacitors is dependent upon the nominal chip thickness of the device. See "Capacitance Range/Selection Waterfall"  
and "Chip Thickness/Tape & Reel Packaging Quantities" to identify the nominal chip thickness of the capacitor.  
2 Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of ≤ 1.25mm (0.049 inches).  
3 Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of > 1.25mm (0.049 inches).  
Table 9B – Waffle Tray Dimensions – Millimeters  
2" x 2" Waffle Tray Dimensions – Millimeters  
Case Size  
Packaging Quantity  
(pcs/unit packaging)  
M
M1  
M2  
M3  
X
Y
Z
A°  
MATRIX  
EIA (in) Metric (mm) ±0.08  
±0.08  
±0.05  
±0.05  
±0.05  
±0.05  
±0.08  
± 1/2°  
(X x Y)  
0402  
0504  
0603  
0805  
1005  
12061,2  
12061,3  
1210  
1808  
1812  
1825  
2220  
2225  
1005  
1210  
1608  
2012  
2512  
3216  
3216  
3225  
4520  
4532  
4564  
5650  
5664  
4.45  
5.97  
4.45  
5.89  
5.84  
4.93  
6.35  
5.51  
6.88  
6.88  
8.08  
8.08  
8.08  
3.89  
5.74  
3.89  
4.72  
6.10  
5.79  
6.35  
6.20  
7.24  
7.24  
9.19  
9.19  
9.19  
1.96  
4.37  
1.96  
4.60  
4.83  
4.90  
9.53  
5.46  
7.26  
2.79  
4.32  
2.79  
4.34  
3.56  
3.15  
4.24  
4.42  
6.17  
6.17  
8.64  
8.64  
8.64  
1.85  
2.03  
1.85  
1.57  
1.52  
1.70  
2.54  
2.79  
3.81  
3.81  
6.10  
6.10  
6.10  
1.07  
2.29  
1.07  
2.34  
2.79  
3.30  
5.08  
3.68  
5.08  
5.08  
8.13  
8.13  
8.13  
1.04  
1.40  
1.04  
0.91  
1.91  
1.65  
1.78  
2.03  
1.91  
1.91  
0.81  
0.81  
0.81  
7
5
7
10  
5
5
5
5
5
5
16 X 23  
10 X 10  
16 X 23  
10 X 10  
12 X 9  
14 X 9  
10 X 5  
10 X 8  
7 X 6  
7 X 6  
5 X 4  
5 X 4  
5 X 4  
368  
100  
368  
100  
108  
126  
50  
80  
42  
42  
20  
7.26  
10.77  
10.77  
10.77  
5
5
5
20  
20  
1 Packaging of 1206 (3216 metric) case size capacitors is dependent upon the nominal chip thickness of the device. See "Capacitance Range/Selection Waterfall"  
and "Chip Thickness/Tape & Reel Packaging Quantities" to identify the nominal chip thickness of the capacitor.  
2 Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of ≤ 1.25mm (0.049 inches).  
3 Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of > 1.25mm (0.049 inches).  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 24  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
KEMET Corporation  
World Headquarters  
Europe  
Asia  
Southern Europe  
Sasso Marconi, Italy  
Tel: 39-051-939111  
Northeast Asia  
Hong Kong  
Tel: 852-2305-1168  
2835 KEMET Way  
Simpsonville, SC 29681  
Skopje, Macedonia  
Tel: 389-2-55-14-623  
Shenzhen, China  
Tel: 86-755-2518-1306  
Mailing Address:  
P.O. Box 5928  
Greenville, SC 29606  
Beijing, China  
Central Europe  
Landsberg, Germany  
Tel: 49-8191-3350800  
Tel: 86-10-5877-1075  
www.kemet.com  
Tel: 864-963-6300  
Fax: 864-963-6521  
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Tel: 86-21-6447-0707  
Kamen, Germany  
Tel: 49-2307-438110  
Corporate Offices  
Fort Lauderdale, FL  
Tel: 954-766-2800  
Seoul, South Korea  
Tel: 82-2-6294-0550  
Northern Europe  
Wyboston, United Kingdom  
Tel: 44-1480-273082  
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Tel: 886-2-27528585  
North America  
Northeast  
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Tel: 978-658-1663  
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Tel: 358-9-5406-5000  
Southeast Asia  
Singapore  
Tel: 65-6701-8033  
Southeast  
Lake Mary, FL  
Tel: 407-855-8886  
Penang, Malaysia  
Tel: 60-4-6430200  
Central  
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Tel: 248-994-1030  
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Tel: 91-806-53-76817  
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Tel: 972-915-6041  
West  
Milpitas, CA  
Tel: 408-433-9950  
Mexico  
Guadalajara, Jalisco  
Tel: 52-33-3123-2141  
Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not  
assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of  
KEMET Electronics Corporation.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 25  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)  
Disclaimer  
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and  
verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.  
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.  
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are  
not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only  
by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise  
provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.  
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still  
occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective  
circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.  
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not  
be required.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1069_C0G_HV_HT_200C • 3/24/2016 26  
配单直通车
C2225P产品参数
型号:C2225P
生命周期:Active
包装说明:, 2225
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8532.24.00.20
风险等级:5.77
电容器类型:CERAMIC CAPACITOR
介电材料:CERAMIC
制造商序列号:C2225P
安装特点:SURFACE MOUNT
多层:Yes
端子数量:2
最高工作温度:125 °C
最低工作温度:-55 °C
封装形状:RECTANGULAR PACKAGE
包装方法:BULK; TR, 7 INCH
参考标准:MIL-C-55681
尺寸代码:2225
表面贴装:YES
端子形状:WRAPAROUND
Base Number Matches:1
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