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产品型号CD2520FC-0.101的Datasheet PDF文件预览

Type CD Low Resistance Precision Chip Resistors  
Page 1 of 2  
Low Resistance Chip down to 0.010  
at 1% with unique Pedestal Terminal Design  
±
for Current Sense in Hybrid and SMT Applications  
Type CD Low Resistance Precision Chip Resistors utilize the proven  
Caddock Micronox® resistance films to achieve the unique low resistance  
range in this family. The special performance features of the Type CD  
Low Resistance Precision Film Resistor include:  
Style FC - Flip Chip version for surface mount applications.  
Style WB - Wire Bond version for hybrid applications with metallized  
back surface for solder down heat sinking of the chip, includes  
bondable terminatipedestals to receive aluminum wire bonds  
Resistance as low as 0.010 ohm at ±1%.  
Pedestal terminals in this design provide an ultra low resistance  
connection pad which maintains the precision 0.010Ω ±1% at the  
point of customer Kelvin connection to the resistor chip. The pedestal  
terminal with its copper core also provides heat spreading which  
enhances the high power handling capability.  
Thermal resistance is provided to optimize high power designs when  
utilizing higher thermal conductivity circuit board substrates such as IMS or Alumina.  
High pulse handling and overload capability.  
Low inductance provides excellent high frequency and pulse response.  
Style FC - Flip Chip Version is a surface mount version with solderable pedestal terminals for flip chip soldering.  
Power Capability Information  
Resistance  
Dimensions in inches and (millimeters)  
General Applications High Power Applications  
Comments  
Thermal Resistance -  
Film (J) to Solder Pad (C)  
R
Max. Chip  
Temperature  
Power Rating  
θJC  
Model  
at 70° C  
Min.  
Max.  
0.20  
0.20 Ω  
A
B
C
D
(see note 1)  
(see note 2)  
.200 ±.012  
(5.08 ±.30  
.150 ±.012  
(3.81 ±.30)  
.063 ±.006  
(1.60 ±.15)  
.062 min.  
(1.57 min.)  
.078 min.  
(1.98 min.)  
CD2015FC  
CD2520FC  
0.010  
0.010 Ω  
1.0 Watt  
12.0°C/Watt  
9.0°C/Watt  
150°C  
150°C  
Solderable Pedestal  
Solderable Pedestal  
.250 ±.012  
.200 ±.012  
.063 ±.006  
1.5 Watts  
(6.35 ±.30)  
(5.08 ±.30)  
(1.60 ±.15  
Style FC Derating Curve For General Application  
100  
Note 1: General Applications - The power rating for  
general applications is based upon 0.5 sq. in. (300  
mm2) of termination pad or trace area (2 oz. copper)  
connected to each end of the resistor. Maximum chip  
temperature is 150°C. Use Derating Curve to derate  
appropriately for the maximum ambient temperature  
and for the temperature limitations of the adjacent  
materials.  
CD2015FC Standard Resistance Values:  
Tolerance CD2015FC ±1% Standard.  
80  
60  
40  
0.010  
0.015 Ω  
0.020 Ω  
0.025 Ω  
0.030 Ω  
0.033 Ω  
0.040 Ω  
0.050 Ω  
0.075 Ω  
0.10 Ω  
0.20 Ω  
20  
0
CD2520FC Standard Resistance Values:  
Tolerance CD2520FC ±1% Standard.  
25  
70  
100  
150  
0.010  
0.015 Ω  
0.020 Ω  
0.025 Ω  
0.030 Ω  
0.033 Ω  
0.040 Ω  
0.050 Ω  
0.075 Ω  
0.10 Ω  
0.20 Ω  
AMBIENT TEMPERATURE, oC  
Note 2: Thermal Resistance - In High Power Applications where the circuit board material  
provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of  
the chip resistor is useful to establish the maximum power capability of the chip resistor in the  
application. The film temperature is measured at the center of the resistor element and solder  
pad temperature at the center of the solderable pedestal (point X in the recommended circuit  
layouts shown below). Maximum temperature of the chip resistor (at the center of chip)  
Custom resistance values and non-standard tolerances  
can be manufactured for high quantity applications.  
Please contact Caddock Applications Engineering.  
should not exceed 150°C through the temperature range of the application  
.
Recommended Circuit Board Layout  
(current and sense connections):  
C
C
Note: Actual width of current trace is based on  
magnitudeofcurrent. Pointof connectionshould  
be in the area shown.  
Fig. 1A: Recommended Kelvin layout.  
X
X
C = Current connection  
S = Sense connection  
S
S
Applications Engineering  
Sales and Corporate Office  
17271 North Umpqua Hwy.  
Roseburg, Oregon 97470-9422  
Phone: (541) 496-0700  
Fax: (541) 496-0408  
1717 Chicago Avenue  
Riverside, California 92507-2364  
Phone: (951) 788-1700  
CADDOCK  
e-mail: caddock@caddock.com • web: www.caddock.com  
For Caddock Distributors listed by country see caddock.com/contact/dist.html  
Fax: (951) 369-1151  
Hurst Green Surrey RH8 9AX UK  
Email sales@rhopointcomponents.com  
Web www.rhopointcomponents.com  
UK & Ireland  
Distributors  
Tel: +44 (0) 870 608 1188  
© 2004 Caddock Electronics, Inc.  
Type CD Low Resistance Precision Chip Resistors  
Page 2 of 2  
Style WB - Wire Bond Version is a hybrid mountable version with copper pedestal terminals and an aluminum surface layer for wire  
bonding. The back surface of these devices is metallized for solder attachment of the chip resistor to a heat sinking substrate.  
Power Capability Information  
Resistance  
Dimensions in inches and (millimeters)  
Thermal Resistance  
Comments  
R
Max. Chip  
Temperature  
θJC  
Model  
Film (J) to Solder Pad (C)  
(see note 3)  
Min.  
Max.  
A
B
C
D
.200 ±.012  
(5.08 ±.30)  
.250 ±.012  
(6.35 ±.30)  
.150 ±.012  
(3.81 ±.30)  
.200 ±.012  
(5.08 ±.30)  
.061 ±.005  
(1.55 ±.13)  
.061 ±.005  
(1.55 ±.13)  
.062 min.  
(1.57 min.)  
Terminals have an Aluminum surface layer for  
wire bonding. Aluminum wire to be used for bonding.  
8.33°C/Watt  
5.00°C/Watt  
150°C  
150°C  
CD2015WBA  
CD2520WBA  
0.010 Ω  
0.010 Ω  
0.20 Ω  
0.20 Ω  
Terminals have an Aluminum surface layer for  
wire bonding. Aluminum wire to be used for bonding.  
.078 min.  
(1.98 min.)  
Note 3: Thermal Resistance - In High Power Applications where the circuit board material  
provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of  
the chip resistor is useful to establish the maximum power capability of the chip resistor in the  
application. The film temperature is measured at the center of the resistor element and the  
solder pad temperature is measured at the soldered interface with the circuit board. Maximum  
temperature of the chip resistor (at the center of chip) should not exceed 150°C through the  
temperature range of the application.  
CD2015WBA  
Standard Resistance Values:  
Tolerance CD2015WBA ±1% Standard.  
0.010  
0.015 Ω  
0.020 Ω  
0.025 Ω  
0.030 Ω  
0.033 Ω  
0.040 Ω  
0.050 Ω  
0.075 Ω  
0.10 Ω  
0.20 Ω  
CD2520WBA  
Standard Resistance Values:  
Tolerance CD2520WBA ±1% Standard.  
Location for Sense (Potential) Connection:  
Film Temperature  
Measuring Point  
Note: The sense connection for each  
Sense Wire  
Current Wire  
Sense Wire  
Current Wire  
pedestal is positioned inboard of the current  
connection (single or multiple current wires).  
0.010 Ω  
0.015 Ω  
0.020 Ω  
0.025 Ω  
0.030 Ω  
0.033 Ω  
0.040 Ω  
0.050 Ω  
0.075 Ω  
0.10 Ω  
0.20 Ω  
Solder pad, soldered  
interface with circuit board.  
Circuit board: IMS, Ceramic (Alumina) , or other.  
WB Resistor mounting  
Custom resistance values and non-standard tolerances  
can be manufactured for high quantity applications.  
Please contact Caddock Applications Engineering.  
General Information for Type CD - Style FC and Style WB - Chip Resistors.  
Specifications:  
Packaging information:  
Solder attachment notes:  
Temperature Coefficient: TC referenced to  
+25°C, R taken at +150°C.  
0.050 ohm to 0.20 ohm, 0 to +100 ppm/°C  
0.010 ohm to 0.049 ohm, 0 to +200 ppm/°C  
Style FC, flip chip resistors, are shipped with the bare  
ceramic side up in the pocket, with the solderable pedestals  
facing down.  
Style WB, wire bondable resistors, are shipped with the  
wire bondable pedestals facing up in the pocket.  
During soldering of the Type CD Resistor  
the soldering temperature profile must not  
cause the pedestal terminals of this device  
to exceed 220°C.  
Style FC - Flip Chip version resistors  
have a bare ceramic back surface. The  
recommended solder for flip chip solder  
attachment is 62Sn / 36Pb / 2Ag.  
Inductance: Less than 5 nH typical  
The illustration shows the orientation of the CD2015 chip  
resistors in the tape. The CD2520 resistors chips are ro-  
tated 90° from what is shown in the illustration.  
Load Life: 1000 hours at rated power, based  
upon 150°C max. chip temperature,  
R ± (0.5% + 0.0005 ohm)  
7” dia.  
(178 mm)  
12mm  
0.473”  
Bo  
Momentary Overload: 1.5 times rated  
power, for 5 seconds, R ± (0.5% + 0.0005  
ohm)  
Style WB - Wire Bond version resistors  
have a metallized back surface for  
soldering to a substrate or a heat sink.  
The recommended solders is  
Ao  
Ko signifies tape thickness and dimension  
Operating Temperature: -55°C to +150°C  
62Sn / 36Pb / 2Ag.  
.512” arbor hole  
(13mm)  
Measurement Note: All measurements  
are taken using Kelvin connections per the  
recommended connection locations.  
Size 2015  
Size 2520  
Ao 0.189” (4.80mm) 0.271” (6.88mm)  
Bo 0.209” (5.31mm) 0.216” (5.49mm)  
Ko 0.087” (2.21mm) 0.066” (1.68mm)  
A
Ordering  
Information:  
Physical Size  
2015 = 0.200” x 0.150”  
2520 = 0.250” x 0.200”  
D
Carrier Tape and pocket dimensions:  
Tape is 12mm Carrier Tape (8mm pitch)  
B
CD 2520 FC - 0.10 - 1%  
Full reel quantities:  
1000 pieces per reel for CD2015 and CD2520  
Tolerance:  
Quantities of less than 250 will be shipped in tape without reel  
and without tape leader at the option of Caddock.  
Type CD  
Style:  
±1% 0.010 and above.  
C
FC or WBA  
Tape dimensions and materials will be consistent with EIA-481-1.  
Reels will be marked with a label containing Caddock logo, part  
number, resistor value, tolerance, packaging date, and quantity.  
Dimensions in inches and (millimeters)  
Resistor Value ()  
See charts for availability  
Applications Engineering  
17271 North Umpqua Hwy.  
Roseburg, Oregon 97470-9422  
Phone: (541) 496-0700  
Fax: (541) 496-0408  
Sales and Corporate Office  
1717 Chicago Avenue  
Riverside, California 92507-2364  
Phone: (951) 788-1700  
CADDOCK  
e-mail: caddock@caddock.com • web: www.caddock.com  
For Caddock Distributors listed by country see caddock.com/contact/dist.html  
Fax: (951) 369-1151  
Hurst Green Surrey RH8 9AX UK  
Email sales@rhopointcomponents.com  
Web www.rhopointcomponents.com  
UK & Ireland  
Distributors  
Tel: +44 (0) 870 608 1188  
© 2004 Caddock Electronics, Inc.  
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