CD4001BF各脚功能电路原理芯片引脚定义引脚图及功能IC贸易商-中国IC网-芯三七

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产品型号CD4001BF的概述

芯片CD4001BF的概述 CD4001BF 是一款广泛应用的数字集成电路，它属于 CMOS（互补金属氧化物半导体）系列逻辑门。该芯片内含四个双输入的NOR门，广泛应用于各种数字电路中。NOR门是构造其他复杂逻辑门的基石，因此，CD4001BF 在数字设计中占有重要地位。由于其低功耗和高噪声容限，CD4001BF 常被用于各种高频、高速和流行的电子设备中。 CD4001BF 的工作电压范围是3V到15V，使其适用于广泛的电源配置。这种灵活性使其在不同类型的电子应用中具有极高的适应能力。从简单的阀门控制到复杂的计算机电路，CD4001BF 都能发挥其独特优势。芯片CD4001BF的详细参数 CD4001BF 的一些基本参数如下： - 工作电压：3V 到 15V - 输入电压范围：-0.3V 到 V_DD + 0.3V - 输入电流：最大 -1µA（在确保逻辑状态变化时） - 输出电流：...

产品型号CD4001BF的Datasheet PDF文件预览

Data sheet acquired from Harris Semiconductor

SCHS015C – Revised August 2003

The CD4001B, CD4002B, and CD4025B

types are supplied in 14-lead hermetic

dual-in-line ceramic packages (F3A

suffix), 14-lead dual-in-line plastic

packages (E suffix), 14-lead small-outline

packages (M, MT, M96, and NSR suffixes),

and 14-lead thin shrink small-outline

packages (PW and PWR suffixes).

PACKAGE OPTION ADDENDUM

www.ti.com

28-Feb-2005

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

CDIP

CFP

Drawing

7704403CA

89263AKB3T

CD4001BE

ACTIVE

OBSOLETE

ACTIVE

None

Call TI

Level-NC-NC-NC

Call TI

PDIP

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

CD4001BF

CD4001BF3A

CD4001BM

ACTIVE

CDIP

SOIC

None

Call TI

Level-NC-NC-NC

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD4001BM96

CD4001BMT

CD4001BNSR

CD4001BPW

CD4001BPWR

CD4002BE

ACTIVE

SOIC

2500

250

2000

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

TSSOP

PDIP

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

CU NIPDAU Level-NC-NC-NC

2000

Pb-Free

(RoHS)

Pb-Free

(RoHS)

CD4002BF

CD4002BF3A

CD4002BM

ACTIVE

CDIP

SOIC

None

Call TI

Level-NC-NC-NC

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD4002BM96

CD4002BMT

CD4002BNSR

CD4002BPW

CD4002BPWR

CD4025BE

ACTIVE

SOIC

2500

250

2000

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

TSSOP

PDIP

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

CU NIPDAU Level-NC-NC-NC

2000

Pb-Free

(RoHS)

Pb-Free

(RoHS)

CD4025BF

CD4025BF3A

CD4025BM

ACTIVE

CDIP

SOIC

None

Call TI

Level-NC-NC-NC

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD4025BM96

CD4025BMT

CD4025BNSR

CD4025BPW

ACTIVE

SOIC

2500

250

2000

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

TSSOP

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

28-Feb-2005

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

CD4025BPWR

ACTIVE

TSSOP

2000

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

JM38510/05252BCA

JM38510/05254BCA

ACTIVE

CDIP

None

Call TI

Level-NC-NC-NC

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 2

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,30

0,19

0,10

0,65

0,15 NOM

4,50

4,30

6,60

6,20

Gage Plane

0,25

0°–8°

0,75

0,50

Seating Plane

0,10

0,15

0,05

1,20 MAX

PINS **

DIM

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

9,80

9,60

A MAX

A MIN

7,70

4040064/F 01/97

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,

enhancements, improvements, and other changes to its products and services at any time and to discontinue

any product or service without notice. Customers should obtain the latest relevant information before placing

orders and should verify that such information is current and complete. All products are sold subject to TI’s terms

and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI

deems necessary to support this warranty. Except where mandated by government requirements, testing of all

parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for

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CD4001BF相关文章

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CD4001BF产品参数

型号:	CD4001BF
是否Rohs认证：	不符合
生命周期：	Obsolete
包装说明：	DIP, DIP14,.3
Reach Compliance Code：	unknown
HTS代码：	8542.39.00.01
风险等级：	5.37
系列：	4000/14000/40000
JESD-30 代码：	R-GDIP-T14
JESD-609代码：	e0
负载电容（CL）：	50 pF
逻辑集成电路类型：	NOR GATE
最大I（ol）：	0.00036 A
功能数量：	4
输入次数：	2
端子数量：	14
最高工作温度：	125 °C
最低工作温度：	-55 °C
封装主体材料：	CERAMIC, GLASS-SEALED
封装代码：	DIP
封装等效代码：	DIP14,.3
封装形状：	RECTANGULAR
封装形式：	IN-LINE
峰值回流温度（摄氏度）：	NOT SPECIFIED
电源：	5/15 V
Prop。Delay @ Nom-Sup：	250 ns
认证状态：	Not Qualified
施密特触发器：	NO
子类别：	Gates
最大供电电压 (Vsup)：	18 V
最小供电电压 (Vsup)：	3 V
标称供电电压 (Vsup)：	5 V
表面贴装：	NO
技术：	CMOS
温度等级：	MILITARY
端子面层：	Tin/Lead (Sn/Pb)
端子形式：	THROUGH-HOLE
端子节距：	2.54 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
Base Number Matches：	1

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