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产品型号CD40106BF的概述

CD40106BF概述 CD40106BF属于CD4000系列的逻辑器件，具体是一种Schmitt触发器。Schmitt触发器是一种具有滞回特性（hysteresis）的逻辑门，其输出状态会受到输入信号的过去状态影响。这种设计允许CD40106BF在处理噪声信号或信号快速切换时保持稳定的输出状态，从而提高系统的可靠性。其工作电压范围广泛，从3V到15V（典型的工作电压为5V），使其在各类电子电路设计中具有广泛的适用性。 CD40106BF具有多种功能，通常用于构建时钟脉冲发生器、信号整形、边缘检测等应用。其内部使用CMOS技术，低功耗并且具有较强的抗干扰能力。这种电路在数字电路设计中扮演了重要角色，特别是在与其他逻辑电路连接时，能够有效地消除数据线的抖动问题。 CD40106BF详细参数 CD40106BF的主要 electrical characteristics 如下所示： - 供...

产品型号CD40106BF的Datasheet PDF文件预览

Data sheet acquired from Harris Semiconductor

SCHS097D – Revised September 2003

The CD40106B types are supplied in 14-lead

hermetic dual-in-line ceramic packages (F3A

suffix), 14-lead dual-in-line plastic packages (E

suffix), 14-lead small-outline packages (M, MT,

M96, and NSR suffixes), and 14-lead thin shrink

small-outlinepackages(PWandPWRsuffixes).

PACKAGE OPTION ADDENDUM

www.ti.com

10-Mar-2005

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

CD40106BE

ACTIVE

PDIP

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

CD40106BF

CD40106BF3A

CD40106BM

ACTIVE

CDIP

SOIC

None

Call TI

Level-NC-NC-NC

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD40106BM96

CD40106BMT

CD40106BNSR

CD40106BPW

CD40106BPWR

ACTIVE

SOIC

2500

250

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

2000

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

TSSOP

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

2000

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 1

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,30

0,19

0,10

0,65

0,15 NOM

4,50

4,30

6,60

6,20

Gage Plane

0,25

0°–8°

0,75

0,50

Seating Plane

0,10

0,15

0,05

1,20 MAX

PINS **

DIM

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

9,80

9,60

A MAX

A MIN

7,70

4040064/F 01/97

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,

enhancements, improvements, and other changes to its products and services at any time and to discontinue

any product or service without notice. Customers should obtain the latest relevant information before placing

orders and should verify that such information is current and complete. All products are sold subject to TI’s terms

and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI

deems necessary to support this warranty. Except where mandated by government requirements, testing of all

parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for

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Use of such information may require a license from a third party under the patents or other intellectual property

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CD40106BF产品参数

型号:	CD40106BF
是否无铅：	含铅
是否Rohs认证：	不符合
生命周期：	Obsolete
零件包装代码：	DIP
包装说明：	DIP, DIP14,.3
针数：	14
Reach Compliance Code：	unknown
HTS代码：	8542.39.00.01
风险等级：	5.42
Is Samacsys：	N
系列：	4000/14000/40000
JESD-30 代码：	R-CDIP-T14
JESD-609代码：	e0
逻辑集成电路类型：	INVERTER
功能数量：	6
输入次数：	1
端子数量：	14
最高工作温度：	125 °C
最低工作温度：	-55 °C
封装主体材料：	CERAMIC, METAL-SEALED COFIRED
封装代码：	DIP
封装等效代码：	DIP14,.3
封装形状：	RECTANGULAR
封装形式：	IN-LINE
峰值回流温度（摄氏度）：	NOT SPECIFIED
电源：	5/15 V
Prop。Delay @ Nom-Sup：	280 ns
传播延迟（tpd）：	280 ns
认证状态：	Not Qualified
施密特触发器：	YES
子类别：	Gates
最大供电电压 (Vsup)：	18 V
最小供电电压 (Vsup)：	3 V
标称供电电压 (Vsup)：	5 V
表面贴装：	NO
技术：	CMOS
温度等级：	MILITARY
端子面层：	Tin/Lead (Sn/Pb)
端子形式：	THROUGH-HOLE
端子节距：	2.54 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
Base Number Matches：	1

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