CD4011BM96原理图各脚功能电路原理芯片引脚定义引脚图及功能-中国IC网-芯三七

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产品型号CD4011BM96的概述

芯片CD4011BM96的概述 CD4011BM96是一款广泛应用的数字IC，属于CD4000系列，是一种双输入的与门（NAND Gate）。该芯片的设计基于CMOS（互补金属氧化物半导体）技术，因此具有低功耗和高噪声容忍能力，适用于各种逻辑电路设计。由于其灵活性和兼容性，CD4011BM96被广泛应用于计算机到消费电子等多个领域。在现代电子设备中，逻辑门是构建复杂逻辑系统的基本单元，而CD4011BM96作为与门，可以实现基本的逻辑运算。其结构通常包括两个单独的与门，并且它们共享同一电源和接地。此外，CD4011BM96还可以与其他CD4000系列的逻辑门一起工作，形成多种不同的逻辑电路。芯片CD4011BM96的详细参数 1. 电源电压(VDD): 3V 至 15V，适应广泛的应用需求。 2. 输入电压范围(Vin): 0V 至 VDD。 3. 输出电压(Vout): 可接近于...

产品型号CD4011BM96的Datasheet PDF文件预览

Data sheet acquired from Harris Semiconductor

SCHS021D – Revised September 2003

The CD4011B, CD4012B, and CD4023B types

are supplied in 14-lead hermetic dual-in-line

ceramic packages (F3A suffix), 14-lead

dual-in-line plastic packages (E suffix), 14-lead

small-outline packages (M, MT, M96, and NSR

suffixes), and 14-lead thin shrink small-outline

packages (PWR suffix). The CD4011B and

CD4023Btypes also are supplied in 14-lead thin

shrink small-outline packages (PW suffix).

PACKAGE OPTION ADDENDUM

www.ti.com

10-Mar-2005

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

CFP

PDIP

Drawing

89265AKB3T

89266AKB3T

89273AKB3T

CD4011BE

OBSOLETE

ACTIVE

None

Call TI

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

CD4011BF

CD4011BF3A

CD4011BM

ACTIVE

CDIP

SOIC

None

Call TI

Level-NC-NC-NC

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD4011BM96

CD4011BMT

CD4011BNSR

CD4011BPW

CD4011BPWR

CD4012BE

ACTIVE

SOIC

2500

250

2000

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

TSSOP

PDIP

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

CU NIPDAU Level-NC-NC-NC

2000

Pb-Free

(RoHS)

Pb-Free

(RoHS)

CD4012BF3A

CD4012BM

ACTIVE

CDIP

SOIC

None

Call TI

Level-NC-NC-NC

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD4012BM96

CD4012BMT

CD4012BNSR

CD4012BPWR

CD4023BE

ACTIVE

SOIC

2500

250

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

2000

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

TSSOP

PDIP

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

CD4023BF

CD4023BF3A

CD4023BM

ACTIVE

CDIP

SOIC

None

Call TI

Level-NC-NC-NC

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD4023BM96

CD4023BMT

CD4023BNSR

CD4023BPW

CD4023BPWR

ACTIVE

SOIC

2500

250

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

2000

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

TSSOP

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

2000

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

10-Mar-2005

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

CDIP

Drawing

JM38510/05051BCA

JM38510/05052BCA

JM38510/05053BCA

ACTIVE

None

Call TI

Level-NC-NC-NC

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 2

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,30

0,19

0,10

0,65

0,15 NOM

4,50

4,30

6,60

6,20

Gage Plane

0,25

0°–8°

0,75

0,50

Seating Plane

0,10

0,15

0,05

1,20 MAX

PINS **

DIM

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

9,80

9,60

A MAX

A MIN

7,70

4040064/F 01/97

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,

enhancements, improvements, and other changes to its products and services at any time and to discontinue

any product or service without notice. Customers should obtain the latest relevant information before placing

orders and should verify that such information is current and complete. All products are sold subject to TI’s terms

and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI

deems necessary to support this warranty. Except where mandated by government requirements, testing of all

parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for

their products and applications using TI components. To minimize the risks associated with customer products

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TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,

in which TI products or services are used. Information published by TI regarding third-party products or services

does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.

Use of such information may require a license from a third party under the patents or other intellectual property

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Reproduction of information in TI data books or data sheets is permissible only if reproduction is without

alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction

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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that

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Following are URLs where you can obtain information on other Texas Instruments products and application

solutions:

Products

Applications

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Amplifiers

amplifier.ti.com

www.ti.com/audio

Data Converters

dataconverter.ti.com

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dsp.ti.com

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logic.ti.com

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microcontroller.ti.com

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Wireless

www.ti.com/wireless

Mailing Address:

Texas Instruments

Post Office Box 655303 Dallas, Texas 75265

CD4011BM96相关文章

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CD4011BM96产品参数

型号:	CD4011BM96
Brand Name：	Texas Instruments
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Active
零件包装代码：	SOIC
包装说明：	SOP, SOP14,.25
针数：	14
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
Factory Lead Time：	1 week
风险等级：	0.68
系列：	4000/14000/40000
JESD-30 代码：	R-PDSO-G14
JESD-609代码：	e4
长度：	8.65 mm
负载电容（CL）：	50 pF
逻辑集成电路类型：	NAND GATE
最大I（ol）：	0.0068 A
湿度敏感等级：	1
功能数量：	4
输入次数：	2
端子数量：	14
最高工作温度：	125 °C
最低工作温度：	-55 °C
封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP
封装等效代码：	SOP14,.25
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
包装方法：	TR
峰值回流温度（摄氏度）：	260
电源：	5/15 V
最大电源电流（ICC）：	0.03 mA
Prop。Delay @ Nom-Sup：	250 ns
传播延迟（tpd）：	250 ns
认证状态：	Not Qualified
施密特触发器：	NO
座面最大高度：	1.75 mm
子类别：	Gate
最大供电电压 (Vsup)：	18 V
最小供电电压 (Vsup)：	3 V
标称供电电压 (Vsup)：	5 V
表面贴装：	YES
技术：	CMOS
温度等级：	MILITARY
端子面层：	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：	GULL WING
端子节距：	1.27 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	3.91 mm
Base Number Matches：	1

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