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产品型号CD4043BDR的概述

芯片CD4043BDR的概述 CD4043BDR是一个广泛应用于数字电路中的高性能CMOS双向传输门芯片。它采用了设计具有低功耗、高噪声容限的CMOS技术，适合多种模拟和数字信号的处理需求。CD4043BDR能够执行信号的选择性传递，有效实现信号的隔离和重定向，因而得到了广泛的应用。该芯片通常被用于切换逻辑信号、模拟信号以及实现快锁存的功能，广泛应用于数据采集、信号处理等领域。其优越的电源电压范围（可以在3V至15V的范围内工作），使CD4043BDR成为多种电源适配应用的理想选择。芯片CD4043BDR的详细参数 CD4043BDR的关键性能参数包括： - 工作电压（V_DD）： 3V 至 15V - 最高工作频率：通常可达 5MHz - 输入高电平电压（V_IH）： 0.7V_DD（典型），适合0.9V_DD的正常工作 - 输入低电平电压（V_IL）： 0.3V_DD（典型）...

产品型号CD4043BDR的Datasheet PDF文件预览

Data sheet acquired from Harris Semiconductor

SCHS041D − Revised October 2003

The CD4043B and CD4044B types are supplied

in 16-lead hermetic dual-in-line ceramic

packages (F3A suffix), 16-lead dual-in-line

plastic

packages

suffix),

16-lead

small-outline packages (D, DR, DT, DW, DWR,

and NSR suffixes), and 16-lead thin shrink

small-outline packages (PW and PWR

suffixes).

PACKAGE OPTION ADDENDUM

www.ti.com

28-Feb-2005

PACKAGING INFORMATION

Orderable Device

CD4043BD

Status ⁽¹⁾

ACTIVE

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

SOIC

2500

250

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD4043BDR

CD4043BDT

CD4043BDW

CD4043BDWR

CD4043BE

SOIC

PDIP

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-250C-1 YEAR/

Level-1-235C-UNLIM

2000

Pb-Free

(RoHS)

CU NIPDAU Level-2-250C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

CD4043BF3A

CD4043BM

ACTIVE

OBSOLETE

ACTIVE

CDIP

SOIC

None

Call TI

Level-NC-NC-NC

Call TI

CD4043BNSR

2000

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD4043BPW

CD4043BPWR

CD4044BD

ACTIVE

TSSOP

SOIC

PDIP

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

2000

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD4044BDR

CD4044BDT

CD4044BDW

CD4044BDWR

CD4044BE

2500

250

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-250C-1 YEAR/

Level-1-235C-UNLIM

2000

Pb-Free

(RoHS)

CU NIPDAU Level-2-250C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

CD4044BF

CD4044BF3A

CD4044BM

ACTIVE

CDIP

SOIC

None

Call TI

Level-NC-NC-NC

Call TI

OBSOLETE

ACTIVE

CD4044BNSR

2000

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD4044BPW

ACTIVE

TSSOP

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

CD4044BPWR

2000

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

28-Feb-2005

(2)

Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 2

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,30

0,19

0,10

0,65

0,15 NOM

4,50

4,30

6,60

6,20

Gage Plane

0,25

0°–8°

0,75

0,50

Seating Plane

0,10

0,15

0,05

1,20 MAX

PINS **

DIM

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

9,80

9,60

A MAX

A MIN

7,70

4040064/F 01/97

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,

enhancements, improvements, and other changes to its products and services at any time and to discontinue

any product or service without notice. Customers should obtain the latest relevant information before placing

orders and should verify that such information is current and complete. All products are sold subject to TI’s terms

and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI

deems necessary to support this warranty. Except where mandated by government requirements, testing of all

parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for

their products and applications using TI components. To minimize the risks associated with customer products

and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,

in which TI products or services are used. Information published by TI regarding third-party products or services

does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.

Use of such information may require a license from a third party under the patents or other intellectual property

of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of information in TI data books or data sheets is permissible only if reproduction is without

alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction

of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for

such altered documentation.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that

product or service voids all express and any implied warranties for the associated TI product or service and

is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Following are URLs where you can obtain information on other Texas Instruments products and application

solutions:

Products

Applications

Audio

Amplifiers

amplifier.ti.com

www.ti.com/audio

Data Converters

dataconverter.ti.com

Automotive

www.ti.com/automotive

DSP

dsp.ti.com

Broadband

Digital Control

Military

www.ti.com/broadband

www.ti.com/digitalcontrol

www.ti.com/military

Interface

Logic

interface.ti.com

logic.ti.com

Power Mgmt

Microcontrollers

power.ti.com

Optical Networking

Security

www.ti.com/opticalnetwork

www.ti.com/security

www.ti.com/telephony

www.ti.com/video

microcontroller.ti.com

Telephony

Video & Imaging

Wireless

www.ti.com/wireless

Mailing Address:

Texas Instruments

Post Office Box 655303 Dallas, Texas 75265

CD4043BDR相关文章

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CD4043BDR产品参数

型号:	CD4043BDR
Brand Name：	Texas Instruments
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Active
IHS 制造商：	TEXAS INSTRUMENTS INC
零件包装代码：	SOIC
包装说明：	SOIC-16
针数：	16
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
Factory Lead Time：	6 weeks
风险等级：	0.62
Samacsys Confidence：	3
Samacsys Status：	Released
Samacsys PartID：	750748
Samacsys Pin Count：	16
Samacsys Part Category：	Integrated Circuit
Samacsys Package Category：	Small Outline Packages
Samacsys Footprint Name：	D (R-PDSO-G16)
Samacsys Released Date：	2019-02-23 06:20:07
Is Samacsys：	N
系列：	4000/14000/40000
JESD-30 代码：	R-PDSO-G16
JESD-609代码：	e4
长度：	9.9 mm
负载电容（CL）：	50 pF
逻辑集成电路类型：	R-S LATCH
最大I（ol）：	0.0015 A
湿度敏感等级：	1
位数：	4
功能数量：	1
端子数量：	16
最高工作温度：	125 °C
最低工作温度：	-55 °C
输出特性：	3-STATE
输出极性：	TRUE
封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP
封装等效代码：	SOP16,.25
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
包装方法：	TR
峰值回流温度（摄氏度）：	260
电源：	5/15 V
最大电源电流（ICC）：	0.06 mA
Prop。Delay @ Nom-Sup：	140 ns
传播延迟（tpd）：	300 ns
认证状态：	Not Qualified
施密特触发器：	No
座面最大高度：	1.75 mm
子类别：	FF/Latches
最大供电电压 (Vsup)：	18 V
最小供电电压 (Vsup)：	3 V
标称供电电压 (Vsup)：	5 V
表面贴装：	YES
技术：	CMOS
温度等级：	MILITARY
端子面层：	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：	GULL WING
端子节距：	1.27 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
触发器类型：	HIGH LEVEL
宽度：	3.9 mm
Base Number Matches：	1

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产品型号CD4043BDR的概述

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