CD4081BF3A原理图各脚功能电路原理芯片引脚定义引脚图及功能-中国IC网-芯三七

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产品型号CD4081BF3A的概述

芯片CD4081BF3A的概述 CD4081BF3A是一种广泛应用的数字集成电路，属于CMOS逻辑系列中的双四输入与门（AND gate）芯片。该芯片是基于CMOS（互补金属氧化物半导体）技术制造的，具有低功耗和高噪声容忍度的优点，适合于多种数字电路的设计与构建。CD4081BF3A的特点使其成为现代数字系统中不可或缺的一部分，广泛用于计算机、通信系统、家庭电器等领域。芯片CD4081BF3A的详细参数 CD4081BF3A的主要技术参数包括： - 工作电压范围：3V至15V - 输入电流：最大为100 nA（在高阻状态下） - 逻辑高阈值电压：通常为2.5V - 逻辑低阈值电压：通常为0.5V - 速率：最大传播延迟时间通常在100 ns至500 ns之间（取决于供电电压） - 引脚数量：14个 - 工作温度范围：-55°C至125°C（军事级别）或0°C至70°C（工业级别）这...

产品型号CD4081BF3A的Datasheet PDF文件预览

Data sheet acquired from Harris Semiconductor

SCHS057C – Revised September 2003

The CD4073B, CD4081B, and CD4082B types

are supplied in 14-lead hermetic dual-in-line

ceramic packages (F3A suffix), 14-lead

dual-in-lineplasticpackages(Esuffix),14-lead

small-outline packages (M, MT, M96, and NSR

suffixes), and 14-lead thin shrink small-outline

packages (PW and PWR suffixes).

PACKAGE OPTION ADDENDUM

www.ti.com

28-Feb-2005

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

CDIP

PDIP

Drawing

7702402CA

7705102CA

7705902CA

CD4073BE

ACTIVE

None

Call TI

Level-NC-NC-NC

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

CD4073BF

CD4073BF3A

CD4073BM

ACTIVE

CDIP

SOIC

None

Call TI

Level-NC-NC-NC

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD4073BM96

CD4073BMT

CD4073BNSR

CD4073BPW

CD4073BPWR

CD4081BE

ACTIVE

SOIC

2500

250

2000

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

TSSOP

PDIP

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

CU NIPDAU Level-NC-NC-NC

2000

Pb-Free

(RoHS)

Pb-Free

(RoHS)

CD4081BF

CD4081BF3A

CD4081BFB3A

CD4081BM

ACTIVE

CDIP

SOIC

None

Call TI

Level-NC-NC-NC

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD4081BM96

CD4081BMT

CD4081BNSR

CD4081BPW

CD4081BPWR

CD4082BE

ACTIVE

SOIC

2500

250

2000

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

TSSOP

PDIP

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

CU NIPDAU Level-NC-NC-NC

2000

Pb-Free

(RoHS)

Pb-Free

(RoHS)

CD4082BF

CD4082BF3A

CD4082BM

ACTIVE

CDIP

SOIC

None

Call TI

Level-NC-NC-NC

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD4082BM96

CD4082BMT

CD4082BNSR

ACTIVE

SOIC

2500

250

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

2000

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

28-Feb-2005

Orderable Device

CD4082BPW

Status ⁽¹⁾

ACTIVE

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

TSSOP

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

CD4082BPWR

TSSOP

2000

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

JM38510/17001BCA

JM38510/17002BCA

JM38510/17003BCA

ACTIVE

CDIP

None

Call TI

Level-NC-NC-NC

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 2

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,30

0,19

0,10

0,65

0,15 NOM

4,50

4,30

6,60

6,20

Gage Plane

0,25

0°–8°

0,75

0,50

Seating Plane

0,10

0,15

0,05

1,20 MAX

PINS **

DIM

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

9,80

9,60

A MAX

A MIN

7,70

4040064/F 01/97

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,

enhancements, improvements, and other changes to its products and services at any time and to discontinue

any product or service without notice. Customers should obtain the latest relevant information before placing

orders and should verify that such information is current and complete. All products are sold subject to TI’s terms

and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI

deems necessary to support this warranty. Except where mandated by government requirements, testing of all

parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for

their products and applications using TI components. To minimize the risks associated with customer products

and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,

in which TI products or services are used. Information published by TI regarding third-party products or services

does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.

Use of such information may require a license from a third party under the patents or other intellectual property

of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of information in TI data books or data sheets is permissible only if reproduction is without

alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction

of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for

such altered documentation.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that

product or service voids all express and any implied warranties for the associated TI product or service and

is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Following are URLs where you can obtain information on other Texas Instruments products and application

solutions:

Products

Applications

Audio

Amplifiers

amplifier.ti.com

www.ti.com/audio

Data Converters

dataconverter.ti.com

Automotive

www.ti.com/automotive

DSP

dsp.ti.com

Broadband

Digital Control

Military

www.ti.com/broadband

www.ti.com/digitalcontrol

www.ti.com/military

Interface

Logic

interface.ti.com

logic.ti.com

Power Mgmt

Microcontrollers

power.ti.com

Optical Networking

Security

www.ti.com/opticalnetwork

www.ti.com/security

www.ti.com/telephony

www.ti.com/video

microcontroller.ti.com

Telephony

Video & Imaging

Wireless

www.ti.com/wireless

Mailing Address:

Texas Instruments

Post Office Box 655303 Dallas, Texas 75265

CD4081BF3A相关文章

配单直通车

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CD4081BF3A产品参数

型号:	CD4081BF3A
是否Rohs认证：	不符合
生命周期：	Obsolete
IHS 制造商：	INTERSIL CORP
Reach Compliance Code：	not_compliant
风险等级：	5.64
Is Samacsys：	N
JESD-30 代码：	R-XDIP-T14
JESD-609代码：	e0
负载电容（CL）：	50 pF
逻辑集成电路类型：	AND GATE
最大I（ol）：	0.00036 A
端子数量：	14
最高工作温度：	125 °C
最低工作温度：	-55 °C
封装主体材料：	CERAMIC
封装代码：	DIP
封装等效代码：	DIP14,.3
封装形状：	RECTANGULAR
封装形式：	IN-LINE
电源：	5/15 V
Prop。Delay @ Nom-Sup：	250 ns
认证状态：	Not Qualified
施密特触发器：	NO
筛选级别：	38535Q/M;38534H;883B
子类别：	Gates
表面贴装：	NO
技术：	CMOS
温度等级：	MILITARY
端子面层：	Tin/Lead (Sn/Pb)
端子形式：	THROUGH-HOLE
端子节距：	2.54 mm
端子位置：	DUAL
Base Number Matches：	1

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