CD4093BF各脚功能电路原理芯片引脚定义引脚图及功能IC贸易商-中国IC网-芯三七

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产品型号CD4093BF的概述

芯片CD4093BF的概述 CD4093BF是一款高性能的集成电路，属于CMOS逻辑系列。其内部包含了四个双输入与非门（NAND Gate），能够以低功耗的方式实现各种逻辑运算。由于CD4093BF采用了独特的CMOS技术，使其在功耗方面相比于TTL逻辑门显著减少，因此在许多应用中备受青睐。CD4093BF的主要特性包括高噪声容限、宽电压操作范围以及优良的温度稳定性，这使得该芯片在数字电路设计中极具适应性。芯片CD4093BF的详细参数 CD4093BF的主要技术参数如下： - 工作电压（V_DD）: 3V 至 15V，标准工作电压为 5V 或 10V。 - 输入电压范围（V_IN）: 0V 至 V_DD。 - 输出电流（I_OUT）: 最大可达 10mA。 - 输入漏电流（I_L）: 最大为 10nA。 - 功耗（P_D）: 典型值为 0.3μA，取决于工作条件。 - 极限工作温度...

产品型号CD4093BF的Datasheet PDF文件预览

Data sheet acquired from Harris Semiconductor

SCHS115D – Revised September 2003

The CD4093B types are supplied in 14-lead

hermetic dual-in-line ceramic packages (F3A

suffix), 14-lead dual-in-line plastic packages (E

suffix), 14-lead small-outline packages (M, MT,

M96, and NSR suffixes), and 14-lead thin shrink

small-outline packages (PW and PWR suffixes).

PACKAGE THERMAL IMPEDANCE, θ (See Note 1):

^{E package}. . . . . . . . . . . . .^J.^A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ⁸⁰°C/W

M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W

NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W

NOTE 1:

Package thermal impedance is calculated in accordance with JESD 51-7.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PACKAGE OPTION ADDENDUM

www.ti.com

26-Sep-2005

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

CDIP

PDIP

Drawing

7704602CA

CD4093BE

ACTIVE

TBD

Call TI

Level-NC-NC-NC

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

CD4093BEE4

ACTIVE

PDIP

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

CD4093BF

CD4093BF3A

CD4093BM

ACTIVE

CDIP

SOIC

TBD

Call TI

Level-NC-NC-NC

50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

CD4093BM96

CD4093BM96E4

CD4093BM96G4

CD4093BME4

CD4093BMT

ACTIVE

SOIC

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

CD4093BMTE4

CD4093BNSR

CD4093BNSRE4

CD4093BPW

250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TSSOP

90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

CD4093BPWE4

CD4093BPWR

CD4093BPWRE4

90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan

The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS

no Sb/Br)

please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

26-Sep-2005

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 2

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,30

0,19

0,10

0,65

0,15 NOM

4,50

4,30

6,60

6,20

Gage Plane

0,25

0°–8°

0,75

0,50

Seating Plane

0,10

0,15

0,05

1,20 MAX

PINS **

DIM

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

9,80

9,60

A MAX

A MIN

7,70

4040064/F 01/97

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,

enhancements, improvements, and other changes to its products and services at any time and to discontinue

any product or service without notice. Customers should obtain the latest relevant information before placing

orders and should verify that such information is current and complete. All products are sold subject to TI’s terms

and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI

deems necessary to support this warranty. Except where mandated by government requirements, testing of all

parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for

their products and applications using TI components. To minimize the risks associated with customer products

and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,

in which TI products or services are used. Information published by TI regarding third-party products or services

does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.

Use of such information may require a license from a third party under the patents or other intellectual property

of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of information in TI data books or data sheets is permissible only if reproduction is without

alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction

of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for

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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that

product or service voids all express and any implied warranties for the associated TI product or service and

is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Following are URLs where you can obtain information on other Texas Instruments products and application

solutions:

Products

Applications

Audio

Amplifiers

amplifier.ti.com

www.ti.com/audio

Data Converters

dataconverter.ti.com

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www.ti.com/automotive

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dsp.ti.com

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www.ti.com/broadband

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Logic

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logic.ti.com

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power.ti.com

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Security

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Telephony

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Wireless

www.ti.com/wireless

Mailing Address:

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Post Office Box 655303 Dallas, Texas 75265

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CD4093BF产品参数

型号:	CD4093BF
是否Rohs认证：	不符合
生命周期：	Obsolete
包装说明：	DIP, DIP14,.3
Reach Compliance Code：	unknown
风险等级：	5.83
JESD-30 代码：	R-XDIP-T14
逻辑集成电路类型：	NAND GATE
端子数量：	14
最高工作温度：	125 °C
最低工作温度：	-55 °C
封装主体材料：	CERAMIC
封装代码：	DIP
封装等效代码：	DIP14,.3
封装形状：	RECTANGULAR
封装形式：	IN-LINE
电源：	5/15 V
认证状态：	Not Qualified
施密特触发器：	YES
子类别：	Gates
表面贴装：	NO
技术：	CMOS
温度等级：	MILITARY
端子形式：	THROUGH-HOLE
端子节距：	2.54 mm
端子位置：	DUAL
Base Number Matches：	1

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