CD54HCT08F3A全新原装原理图各脚功能电路原理芯片引脚定义-中国IC网-芯三七

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产品型号CD54HCT08F3A的概述

CD54HCT08F3A芯片概述 CD54HCT08F3A是一款集成电路芯片，属于HCT（High-speed CMOS TTL-compatible）系列，其主要功能是实现逻辑“与”运算。此芯片为数字电路设计中常用的基础构件之一，广泛应用于各种电子设备中，例如计算机、嵌入式系统以及其他需要逻辑运算的场合。HCT逻辑系列提供了更快的操作速度，兼容TTL（Transistor-Transistor Logic）逻辑电平，为设计者带来了可观的灵活性与多样性。在CD54HCT08F3A的具体设计中，该芯片集成了四个两输入与门，每个与门独立工作。其中输入和输出均以CMOS逻辑电平进行控制，因此该芯片在功耗方面表现出色，适合于对功耗和速度有高要求的应用场合。 CD54HCT08F3A详细参数 1. 电源电压范围：3V至15V 2. 逻辑电平标准： - 输入高电平：大于等于2V（对于5V电...

产品型号CD54HCT08F3A的Datasheet PDF文件预览

CD54HC08, CD74HC08,

CD54HCT08, CD74HCT08

Data sheet acquired from Harris Semiconductor

SCHS118C

High-Speed CMOS Logic

Quad 2-Input AND Gate

August 1997 - Revised July 2004

Features

Description

• Buffered Inputs

The

CD54HC08,

CD54HCT08,

CD74HC08,

and

CD74HCT08 logic gates utilize silicon gate CMOS

technology to achieve operating speeds similar to LSTTL

gates with the low power consumption of standard CMOS

integrated circuits. All devices have the ability to drive 10

LSTTL loads. The 74HCT logic family is functionally pin

compatible with the standard 74LS logic family.

• Typical Propagation Delay: 7ns at V

= 5V,

[ /Title

(CD54H

C08,

CD54H

CT08,

CD74H

C08,

CD74H

CT08)

/Sub-

C = 15pF, T = 25 C

• Fanout (Over Temperature Range)

- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads

- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads

• Wide Operating Temperature Range . . . -55 C to 125 C

• Balanced Propagation Delay and Transition Times

Ordering Information

TEMP. RANGE

PART NUMBER

CD54HC08F3A

CD54HCT08F3A

CD74HC08E

( C)

PACKAGE

14 Ld CERDIP

14 Ld PDIP

• Signiﬁcant Power Reduction Compared to LSTTL

Logic ICs

-55 to 125

• HC Types

ject

(High

- 2V to 6V Operation

- High Noise Immunity: N = 30%, N = 30% of V

IL IH CC

at V

= 5V

CD74HC08M

14 Ld SOIC

14 Ld TSSOP

14 Ld PDIP

• HCT Types

CD74HC08MT

CD74HC08M96

CD74HC08PW

CD74HC08PWR

CD74HCT08E

CD74HCT08M

CD74HCT08MT

CD74HCT08M96

- 4.5V to 5.5V Operation

- Direct LSTTL Input Logic Compatibility,

V = 0.8V (Max), V = 2V (Min)

IL IH

• CMOS Input Compatibility, I ≤ 1µA at V , V

OL OH

14 Ld SOIC

NOTE: When ordering, use the entire part number. The sufﬁx 96

denotes tape and reel. The sufﬁx T denotes a small-quantity reel

of 250.

CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.

CD54HC08, CD74HC08, CD54HCT08, CD74HCT08

Pinout

CD54HC08, CD54HCT08,

(CERDIP)

CD74HC08

(PDIP, SOIC, TSSOP)

CD74HCT08

(PDIP, SOIC)

TOP VIEW

14 V

13 4B

12 4A

11 4Y

10 3B

GND

Functional Diagram

GND

TRUTH TABLE

INPUTS

OUTPUT

H = High Voltage Level, L = Low Voltage Level

CD54HC08, CD74HC08, CD54HCT08, CD74HCT08

HCT Logic Symbol

HC Logic Symbol

CD54HC08, CD74HC08, CD54HCT08, CD74HCT08

Absolute Maximum Ratings

Thermal Information

DC Supply Voltage, V

. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V

Thermal Resistance (Typical, Note 1)

( C/W)

DC Input Diode Current, I

For V < -0.5V or V > V

E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

Maximum Junction Temperature (Hermetic Package or Die) . . . 175 C

Maximum Junction Temperature (Plastic Package) . . . . . . . . 150 C

+ 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA

For V < -0.5V or V > V

DC Output Diode Current, I

+ 0.5V . . . . . . . . . . . . . . . . . . . .±20mA

DC Output Source or Sink Current per Output Pin, I

For V > -0.5V or V < V

+ 0.5V . . . . . . . . . . . . . . . . . . . .±25mA

Maximum Storage Temperature Range . . . . . . . . . .-65 C to 150 C

Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300 C

DC V

or Ground Current, I

. . . . . . . . . . . . . . . . . .±50mA

CC or GND

(SOIC - Lead Tips Only)

Operating Conditions

Temperature Range (T ) . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C

Supply Voltage Range, V

HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V

HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V

DC Input or Output Voltage, V , V . . . . . . . . . . . . . . . . . 0V to V

Input Rise and Fall Time

2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)

4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)

6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation

of the device at these or any other conditions above those indicated in the operational sections of this speciﬁcation is not implied.

NOTE:

1. The package thermal impedance is calculated in accordance with JESD 51-7.

DC Electrical Speciﬁcations

TEST

CONDITIONS

25 C

-40 C TO 85 C

-55 C TO 125 C

PARAMETER

HC TYPES

SYMBOL V (V)

(mA)

(V) MIN TYP MAX

MIN

MAX

MIN

MAX

UNITS

High Level Input

Voltage

1.5

µA

4.5

3.15

4.2

Low Level Input

Voltage

0.5

1.35

1.8

0.5

1.35

1.8

0.5

1.35

1.8

4.5

High Level Output

Voltage

CMOS Loads

-0.02

1.9

-0.02

4.5

4.4

5.9

High Level Output

Voltage

TTL Loads

-4

4.5

3.98

3.84

3.7

-5.2

0.02

5.48

5.34

5.2

Low Level Output

Voltage

CMOS Loads

0.1

4.5

Low Level Output

Voltage

TTL Loads

4.5

0.26

±0.1

0.33

±1

0.4

±1

5.2

Input Leakage

Current

GND

CD54HC08, CD74HC08, CD54HCT08, CD74HCT08

DC Electrical Speciﬁcations (Continued)

TEST

CONDITIONS

25 C

-40 C TO 85 C

-55 C TO 125 C

PARAMETER

SYMBOL V (V)

(mA)

(V) MIN TYP MAX

MIN

MAX

MIN

MAX

UNITS

Quiescent Device

Current

GND

µA

HCT TYPES

High Level Input

Voltage

4.5 to

5.5

0.8

Low Level Input

Voltage

4.5 to

5.5

High Level Output

Voltage

CMOS Loads

-0.02

4.5

5.5

4.4

High Level Output

Voltage

TTL Loads

-4

3.98

3.84

3.7

Low Level Output

Voltage

CMOS Loads

0.02

0.1

0.33

±1

0.1

0.4

±1

Low Level Output

Voltage

TTL Loads

0.26

±0.1

Input Leakage

Current

µA

and

GND

Quiescent Device

Current

µA

GND

Additional Quiescent

Device Current Per

Input Pin: 1 Unit Load

∆I

(Note 2)

4.5 to

5.5

100

360

450

490

- 2.1

NOTE:

2. For dual-supply systems theoretical worst case (V = 2.4V, V

= 5.5V) specification is 1.8mA.

HCT Input Loading Table

INPUT

All

UNIT LOADS

0.6

NOTE: Unit Load is ∆I

Speciﬁcations table, e.g. 360µA max at 25 C.

limit speciﬁed in DC Electrical

Switching Speciﬁcations Input t , t = 6ns

25 C

-40 C TO 85 C -55 C TO 125 C

TEST

PARAMETER

HC TYPES

SYMBOL CONDITIONS (V)

MIN TYP MAX

MIN

MAX

MIN

MAX

UNITS

Propagation Delay,

Input to Output (Figure 1)

, t

PLH PHL

C = 50pF

4.5

115

135

Propagation Delay, Data Input to

Output Y

t , t

PLH PHL

C = 15pF

Switching Speciﬁcations Input t , t = 6ns (Continued)

25 C

-40 C TO 85 C -55 C TO 125 C

TEST

PARAMETER

SYMBOL CONDITIONS (V)

MIN TYP MAX

MIN

MAX

MIN

MAX

110

UNITS

Transition Times (Figure 1)

, t

TLH THL

C = 50pF

4.5

Input Capacitance

Power Dissipation Capacitance

(Notes 3, 4)

HCT TYPES

Propagation Delay, Input to

Output Y (Figure 2)

, t

PLH PHL

C = 50pF

4.5

Propagation Delay, Data Input to

Output Y

t , t

PLH PHL

C = 15pF

Transition Times (Figure 2)

Input Capacitance

, t

TLH THL

C = 50pF

4.5

C = 50pF

Power Dissipation Capacitance

(Notes 3, 4)

NOTES:

3. C

is used to determine the dynamic power consumption, per gate.

4. P = V

f (C

+ C ) where f = input frequency, C = output load capacitance, V = supply voltage.

Test Circuits and Waveforms

t = 6ns

90%

50%

10%

2.7V

1.3V

0.3V

INPUT

GND

THL

TLH

THL

TLH

90%

1.3V

90%

50%

10%

INVERTING

OUTPUT

INVERTING

OUTPUT

10%

PLH

PHL

PLH

PHL

FIGURE 3. HC AND HCU TRANSITION TIMES AND PROPAGA-

TION DELAY TIMES, COMBINATION LOGIC

FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION

DELAY TIMES, COMBINATION LOGIC

PACKAGE OPTION ADDENDUM

www.ti.com

8-Mar-2005

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

CDIP

PDIP

Drawing

5962-8688301CA

CD54HC08F

ACTIVE

None

Call TI

Level-NC-NC-NC

CD54HC08F3A

CD54HCT08F

CD54HCT08F3A

CD74HC08E

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

CD74HC08M

CD74HC08M96

CD74HC08MT

CD74HC08PW

CD74HC08PWR

CD74HCT08E

CD74HCT08M

CD74HCT08M96

CD74HCT08MT

ACTIVE

SOIC

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SOIC

250

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

TSSOP

PDIP

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

CU NIPDAU Level-NC-NC-NC

2000

Pb-Free

(RoHS)

Pb-Free

(RoHS)

SOIC

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

SOIC

2500

250

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

SOIC

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

8-Mar-2005

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 2

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,30

0,19

0,10

0,65

0,15 NOM

4,50

4,30

6,60

6,20

Gage Plane

0,25

0°–8°

0,75

0,50

Seating Plane

0,10

0,15

0,05

1,20 MAX

PINS **

DIM

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

9,80

9,60

A MAX

A MIN

7,70

4040064/F 01/97

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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CD54HCT08F3A相关文章

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CD54HCT08F3A产品参数

型号:	CD54HCT08F3A
是否Rohs认证：	不符合
生命周期：	Obsolete
包装说明：	DIP, DIP14,.3
Reach Compliance Code：	not_compliant
风险等级：	5.8
JESD-30 代码：	R-XDIP-T14
JESD-609代码：	e0
负载电容（CL）：	50 pF
逻辑集成电路类型：	AND GATE
最大I（ol）：	0.004 A
端子数量：	14
最高工作温度：	125 °C
最低工作温度：	-55 °C
封装主体材料：	CERAMIC
封装代码：	DIP
封装等效代码：	DIP14,.3
封装形状：	RECTANGULAR
封装形式：	IN-LINE
电源：	5 V
Prop。Delay @ Nom-Sup：	38 ns
认证状态：	Not Qualified
施密特触发器：	NO
筛选级别：	38535Q/M;38534H;883B
子类别：	Gates
标称供电电压 (Vsup)：	5 V
表面贴装：	NO
技术：	CMOS
温度等级：	MILITARY
端子面层：	Tin/Lead (Sn/Pb)
端子形式：	THROUGH-HOLE
端子节距：	2.54 mm
端子位置：	DUAL
Base Number Matches：	1

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