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产品型号CM32Y5V106Z16AT的Datasheet PDF文件预览

Multilayer Ceramic Chip Capacitors  
Kyocera's series of Multilayer Ceramic Chip Capacitors are  
designed to meet a wide variety of needs. We offer a  
complete range of products for both general and  
specialized applications, including the general-purpose  
CM series, the high-voltage CF series , the low profile CT  
series, and the DN series for automotive uses.  
Features  
• We have factories worldwide in order to supply our global customer bases  
quickly and efficiently and to maintain our reputation as one of the  
highest-volume producers in the industry.  
• All our products are highly reliable due to their monolithic structure of  
high-purity and superfine uniform ceramics and their integral internal  
electrodes.  
• By combining superior manufacturing technology and materials with high  
dielectric constants, we produce extremely compact components with  
exceptional specifications.  
• Our stringent quality control in every phase of production from material  
procurement to shipping ensures consistent manufacturing and super  
quality.  
• Kyocera components are available in a wide choice of dimensions,  
temperature characteristics, rated voltages, and terminations to meet  
specific configurational requirements.  
CM  
CA  
series  
series  
Arrays  
General  
CU  
DN/DR  
Multilayer  
Ceramic Chip  
Capacitors  
series  
series  
Low ESR  
Automotive  
CT  
CF  
series  
series  
Low Profile High-Voltage  
Structure  
External Termination  
Electrodes  
Nickel Barrier Termination Products  
Ag or Cu or  
CuNi  
Internal Electrodes  
(Pd, Pd/Ag, Ni or Cu)  
Ni Plating  
Dielectric Ceramic Layer  
Temperature compensation :Titanate family  
High dielectric constant :  
Sn Plating or  
Sn/Pb Plating  
Barium Titanate family  
Tape and Reel  
Bulk Cassette  
Please contact your local AVX, Kyocera sales office or distributor for  
specifications not covered in this catalog.  
Our products are continually being improved. As a result, the  
capacitance range of each series is subject to change without notice.  
Please contact an sales representative to confirm compatibility with  
your application.  
Multilayer Ceramic Chip Capacitors  
Kyocera Ceramic Chip Capacitors are available for different applications as classified below:  
Series  
Dieletric Options  
Typical Applications  
Features  
Terminations  
Available Size (EIA)  
C0G (NP0)  
X5R  
X7R  
X6S  
X7S  
0201, 0402, 0603  
0805, 1206, 1210  
1812, 2211, 2220  
CM  
General Purpose  
Wide Cap Range  
Nickel Barrier  
Y5V  
NTC  
High Voltage  
High Voltage  
&
Power Circuits  
0805, 1206, 1210  
1812, 2208, 1808  
2220  
C0G (NP0)  
X7R  
250VDC, 630VDC  
1000VDC, 2000VDC  
3000VDC, 4000VDC  
CF  
Nickel Barrier  
C0G (NP0)  
X5R  
PLCC  
(Decoupling)  
0402, 0603, 0805  
1206, 1210  
CT  
Nickel Barrier  
Nickel Barrier  
X7R  
Y5V  
Low Profile  
C0G (NP0)  
U (750)  
X7R  
Thermal shock  
Resistivity  
High Reliability  
DN/DR  
Automotive  
RF Circuit  
0603, 0805, 1206  
CU  
CA  
C0G (NP0)  
Low ESR  
Nickel Barrier  
Nickel Barrier  
0402, 0603  
C0G (NP0)  
X5R  
Digital Signal  
Pass line  
Reduction in  
Placing Costs  
0405, 0508, 0612  
NTC: Negative Temperature coefficient types are available on request.  
DN Series: Silver Palladium termination is available on request.  
CA Series: X7R, Y5V are available on request.  
Multilayer Ceramic Chip Capacitors  
Dimensions  
W
L
T
P
P~P  
P
External  
Terminations  
Electrode  
External Dimensions  
Tape & Reel  
Dimensions (mm)  
Size  
EIA CODE  
EIAJ CODE  
L
W
P min  
0.10  
0.15  
0.20  
0.20  
0.30  
0.30  
0.15  
0.30  
0.15  
0.15  
0.30  
P max  
0.20  
0.35  
0.60  
0.75  
0.85  
1.00  
0.85  
1.10  
0.85  
0.85  
1.40  
P to P min  
0.20  
T max  
0.33  
0.55  
0.90  
1.35  
1.75  
2.70  
2.20  
3.0  
03  
05  
0201  
0402  
0603  
0805  
1206  
1210  
1808  
1812  
2208  
2211  
2220  
0603  
1005  
1608  
2012  
3216  
3225  
4520  
4532  
5720  
5728  
5750  
0.6±0.03  
0.3±0.03  
0.5±0.05  
1.0±0.05  
1.6±0.10  
2.0±0.10  
3.2±0.20  
3.2±0.20  
4.5±0.20  
4.5±0.30  
5.7±0.40  
5.7±0.40  
5.7±0.40  
0.30  
105  
21  
0.8±0.10  
0.50  
1.25±0.10  
1.60±0.15  
2.50±0.20  
2.00±0.20  
3.20±0.20  
2.00±0.20  
2.80±0.20  
5.00±0.40  
0.70  
316  
32  
1.40  
1.40  
42  
2.60  
43  
2.00  
52  
4.20  
2.20  
2.80  
2.70  
53  
4.20  
55  
2.50  
• CT21, CT316 : (L) 3.2±0.2mm and (W)1.6±0.2mm  
• T (Thickness) depends on capacitance value.  
Standard thickness is shown on the appropriate product pages.  
• DR series 105, 21 size (L)(W)(T) Tolerance ±0.15mm  
• CA series (please refer page 19)  
Bulk Cassette  
P
P to P  
min  
Size  
EIA CODE  
EIAJ CODE  
L
W
T
min  
max  
05  
0402  
0603  
1005  
1608  
1.0±0.05  
1.6±0.07  
0.5±0.05  
0.8±0.07  
0.5±0.05  
0.8±0.07  
0.15  
0.20  
0.35  
0.60  
0.30  
0.50  
105  
21  
0805  
2012  
2.0±0.1  
1.25±0.1  
0.6±0.1/1.25±0.1  
0.20  
0.75  
0.70  
Multilayer Ceramic Chip Capacitors  
Ordering Information  
KYOCERA PART NUMBER:  
SERIES CODE  
CM 21 X7R 104  
K
50  
A
T
CM  
CF  
CT  
=
=
=
General Purpose  
High Voltage  
Low Profile  
CA = Capacitor Arrays  
CU = Low ESR  
DN/DR = Automotive  
SIZE CODE  
SIZE  
03  
05  
EIA (EIAJ)  
0201 (0603)  
0402 (1005)  
0603 (1608)  
SIZE  
EIA (EIAJ)  
0805 (2012)  
1206 (3216)  
1210 (3225)  
1808 (4520)  
1812 (4532)  
SIZE  
EIA (EIAJ)  
= 2208 (5720)  
= 5728 (2211)  
= 2220 (5750)  
=
=
=
21  
316  
32  
42  
43  
=
=
=
=
=
52  
53  
55  
105  
F12 = 0508 (1220)/4cap  
F13 = 0612 (1632)/4cap  
D11 = 0405 (1012)/2cap  
D12 = 0508 (1220)/2cap  
DIELECTRIC CODE  
CODE  
CG  
EIA CODE  
C0G (NPO)  
=
X7S = X7S  
X5R = X5R  
X7R = X7R  
X6S = X6S (Option)  
Y5V = Y5V  
Negative dielectric types are available on request.  
CAPACITANCE CODE  
Capacitance expressed in pF. 2 significant digits plus  
number of zeros.  
For Values < 10pF, Letter R denotes decimal point,  
eg. 100000pF  
0.1µF  
=
=
=
104  
104  
472  
1.5pF  
0.5pF  
100µF  
=
=
=
1R5  
R50  
107  
4700pF  
TOLERANCE CODE  
A = ±0.05pF  
B = ±0.1pF  
C = ±0.25pF  
D = ±0.5pF  
F = ±1pF  
G = ±2%  
J
= ±5%  
Z = -20 to +80%  
K = ±10%  
M = ±20%  
VOLTAGE CODE  
04  
06  
10  
16  
25  
35  
50  
= 4VDC  
100  
250  
400  
630  
=
=
=
=
100VDC  
1000  
2000  
3000  
4000  
=
=
=
=
1000VDC  
2000VDC  
3000VDC  
4000VDC  
= 6.3VDC  
= 10VDC  
= 16VDC  
= 25VDC  
= 35VDC  
= 50VDC  
250VDC  
400VDC  
630VDC  
TERMINATION CODE  
A = Nickel Barrier  
C = Silver ( option)  
B = Silver Palladium ( option)  
PACKAGING CODE  
B = Bulk  
C = Bulk Cassette  
T = 7" Reel Taping & 4mm Cavity pitch  
L = 13" Reel Taping & 4mm Cavity pitch  
H = 7" Reel Taping & 2mm Cavity pitch  
N = 13" Reel Taping & 2mm Cavity pitch  
OPTION  
Thickness max value is indicated in CT series  
EX. 125  
095  
1.25mm max  
0.95mm max  
Multilayer Ceramic Chip Capacitors  
Temperature Characteristics and Tolerance  
High Dielectric Constant  
EIA Dielectric  
X5R  
Temperature Range  
Cmax  
±15%  
55 to 85°C  
55 to 125°C  
55 to 125°C  
55 to 105°C  
30 to 85°C  
X7R  
X7S  
±22%  
X6S  
Y5V  
82 to +22%  
Temperature Compensation Type  
Electric Code  
Value (pF)  
P∆  
N150  
R∆  
N220  
S∆  
N330  
T∆  
N470  
U∆  
N750  
SL  
1B/C0G  
+350 to 1000  
0.5-2.7  
3.0-3.9  
4.0-9.0  
10  
CK  
CJ  
PK  
PJ  
RK  
SK  
SJ  
TK  
TJ  
UK  
UJ  
UJ  
UJ  
SL  
SL  
SL  
SL  
RJ  
CH  
CG  
PH  
PH  
RH  
RH  
SH  
SH  
TH  
TH  
K = ±250ppm/°C, J = ±120ppm/°C, H = ±60ppm/°C, G = ±30ppm/°C  
e.g. CG = 0±30ppm/°C, PH = 150±60ppm/°C  
Note: All parts will be marked as "CG" but will conform to the above table.  
Available Tolerances  
Dielectric materials, capacitance values and tolerances are  
available in the following combinations only:  
E Standard Number  
E3  
E6  
E12  
1.0  
1.2  
1.5  
1.8  
2.2  
2.7  
3.3  
3.9  
4.7  
5.6  
6.8  
8.2  
E24 (Option)  
1.0  
1.2  
1.5  
1.8  
2.2  
2.7  
3.3  
3.9  
4.7  
5.6  
6.8  
8.2  
1.1  
1.3  
1.6  
2.0  
2.4  
3.0  
3.6  
4.3  
5.1  
6.2  
7.5  
9.1  
EIA Dielectric  
Standard Tolerance  
Capacitance  
0.5pF  
1.0  
4
A0.05pF  
1.0  
4
B0.1pF  
5pF  
1.5  
2.2  
3.3  
4.7  
6.8  
C0.25pF  
D0.50pF  
F1pF  
2
<10pF  
COG  
NTC  
1
G2%  
2.2  
4.7  
10pF  
J5%  
E12 Series  
K10%  
3
X5R  
X6R  
X7R  
K10%  
E6 Series  
E3 Series  
M20%  
Y5V  
Z=−20% to +80%  
Note:  
1 NTC : Negative Temperature Compensation types are available on request as shown on  
product pages.  
2 Nominal values below 10pF are available in the standard values of 0.5pF, 1.0pF, 1.5pF,  
2.0pF, 3.0pF, 4.0pF, 5.0pF, 6.0pF, 7.0pF, 8.0pF, 9.0pF, 10pF.  
3 J = ±5% for X7R(X5R) is available on request.  
4 option  
CM Series  
Nickel Barrier Terminations  
Features  
Application  
We offer a diverse product line ranging from ultra-compact (0.6×0.3  
mm) to large (5.7×5.0 mm) components configured for a variety of  
temperature characteristics, rated voltages, and packages. We offer the  
choice and flexibility for almost any applications.  
This standard type is ideal for use in a wide range of applications, from  
commercial to industrial equipment.  
Temperature Compensation Dielectrics  
CM03  
(0603)  
CM05  
(1005)  
CM105  
(1608)  
CM21  
(2012)  
CM316  
(3216)  
CM32  
(3225)  
Size (mm)  
Temperature  
C∆  
U∆  
SL  
25  
C∆  
U∆  
SL  
50  
C∆  
C∆  
C∆  
C∆  
Characteristics  
Rated Voltage (VDC)  
Capacitance (pF)  
10  
16  
25  
16  
25  
16  
25  
50  
50  
50 100 16  
25  
50 100 25  
50 100 50  
R20  
R50  
1R0  
1R5  
0.2  
0.5  
1.0  
1.5  
2.0  
3.0  
4.0  
5.0  
6.0  
7.0  
8.0  
9.0  
A
A
A
A
B
B
B
C
100  
120  
10  
12  
15  
18  
22  
27  
33  
39  
47  
A
56  
68  
82  
A
101  
121  
100  
120  
150  
D
180  
B
220  
270  
B
330  
D
D
D
D
D
E
C
390  
D
E
470  
560  
680  
820  
102  
122  
1000  
1200  
1500  
1800  
2200  
2700  
3300  
3900  
4700  
5600  
6800  
8200  
10000  
12000  
15000  
18000  
E
E
E
G
E
F
H
H
G
103  
123  
Thickness and standard package quantity  
Size  
03  
05  
105  
105  
21, 316, 32  
Thickness  
(mm)  
A
B
C
C
0.8±0.1  
D
0.6±0.1  
E
F
G
H
1.4max  
I
J
K
2.0±0.2  
L
2.5±0.2  
0.3±0.03 0.5±0.05 0.8±0.1  
0.85±0.1 1.15±0.1 1.25±0.1  
1.6max 1.6±0.15  
Taping(180 dia reel)  
Taping(330 dia reel)  
15kp(P8) 10kp(P8) 4kp(P8)  
8kp(P8)  
4kp(P8)  
4kp(P8)  
3kp(E8) 3kp(E8)  
3kp(E8) 2.5kp(E8) 2.5kp(E8) 2kp(E8)  
1kp(E8)  
———  
———  
50kp(P8) 10kp(P8) 20kp(P8) 10kp(P8) 10kp(P8) 10kp(E8) 10kp(E8) 10kp(E8)  
5kp(E8) 5kp(E8) 5kp(E8)  
Note : P8 = 8mm width paper tape  
Size  
43, 55  
E8 = 8mm width plastic tape  
E12 = 12mm width plastic tape  
Thickness  
(mm)  
J
K
2.0±0.2  
L
2.5±0.2  
M
2.8±0.2  
Carrier tape 2mm pitch from one capacitor to another.  
1.6±0.15  
Taping(178 dia reel)  
Taping(330 dia reel)  
1kp(E12) 1kp(E12) 0.5kp(E12) 0.5kp(E12)  
——— ——— ——— ———  
CM Series  
Nickel Barrier Terminations  
X5R Dielectric  
CM03  
(0603)  
CM05  
(1005)  
CM105  
(1608)  
CM21  
(2012)  
Size (mm)  
Rated Voltage (VDC)  
10  
16  
25  
4
6.3 10  
16  
25  
50  
4
6.3 10  
16  
25  
35  
50 6.3 10  
16  
25  
35  
50  
Capacitance (pF)  
101  
151  
100  
150  
220  
330  
A
470  
680  
B
102  
152  
1000  
1500  
A
2200  
C
3300  
4700  
A
6800  
103  
153  
10000  
15000  
22000  
33000  
47000  
68000  
100000  
150000  
220000  
330000  
470000  
680000  
1000000  
1500000  
2200000  
3300000  
4700000  
6800000  
10000000  
B
D
E
C
B
G
104  
154  
C
B
G
B
C
G
B
105  
155  
C
1
1
C  
G
1
1
1
G
1
1
C  
1
1
2
G
106  
CM316  
(3216)  
CM32  
(3225)  
CM43  
(4532)  
Size (mm)  
Rated Voltage (VDC)  
Capacitance (pF)  
6.3  
10  
16  
25  
35  
50  
6.3  
10  
16  
25  
35  
50  
6.3  
10  
25  
50  
104  
105  
106  
107  
100000  
220000  
F
470000  
F
J
H
K
1000000  
2200000  
4700000  
10000000  
22000000  
47000000  
100000000  
H
K
L
J
2
2
J
2
L
I
J
K
L
L
L
J
2
L
L
2
L
M
2
Non standard specification, please contact us for further information.  
Optional Spec.  
1 Length(L, T) tolerance ±0.15  
2 Length(L, T) tolerance ±0.2  
CM Series  
Nickel Barrier Terminations  
X7R, X7S Dielectric  
CM03  
(0201)  
CM05  
(0402)  
CM105  
(0603)  
CM21  
(0805)  
Size (mm)  
Rated Voltage (VDC)  
16  
6.3  
16  
25  
50  
6.3  
10  
16  
25  
50  
100  
4
10  
16  
25  
50  
100  
Capacitance (pF)  
101  
100  
150  
151  
220  
330  
A
470  
680  
B
102  
152  
1000  
C
C
1500  
2200  
3300  
4700  
D
E
B
6800  
103  
153  
10000  
15000  
22000  
33000  
47000  
68000  
100000  
150000  
220000  
330000  
470000  
680000  
1000000  
1500000  
2200000  
3300000  
4700000  
B
G
D
E
C
B
C
G
104  
154  
C
G
G
C
G
105  
155  
G
CM316  
(1206)  
CM32  
(1210)  
CM43  
(1812)  
CM55  
(2220)  
Size (mm)  
Rated Voltage (VDC)  
Capacitance (pF)  
6.3  
10  
16  
25  
50  
100  
6.3  
10  
16  
25  
50  
100  
16  
50  
100  
100  
103  
104  
105  
106  
10000  
22000  
47000  
F
J
100000  
E
F
H
K
L
220000  
470000  
F
J
H
K
L
1000000  
2200000  
4700000  
10000000  
22000000  
J
L
F
H
K
L
J
2
I
L
L
J
L
L
Only X7S available  
2 Length(W, T) Tolerance ±0.2, X7S available  
Y5V Dielectric  
CM03  
(0201)  
CM05  
(0402)  
CM105  
(0603)  
CM21  
(0805)  
CM316  
(1206)  
CM32  
(1210)  
Size (mm)  
Rated Voltage (VDC)  
Capacitance (pF)  
6.3  
10  
16  
25  
50  
10  
16  
25  
50  
10  
16  
25  
50  
10  
16  
25  
50  
10  
16  
25  
50  
102  
1000  
2200  
A
472  
103  
4700  
B
10000  
B
22000  
A
C
B
473  
104  
47000  
100000  
220000  
470000  
1000000  
2200000  
4700000  
10000000  
22000000  
47000000  
C
E
G
D
E
E
474  
105  
C
F
G
C
H
G
F
G
F
J
H
J
475  
106  
J
J
K
476  
Thickness and standard package quantity  
Size  
03  
05  
105  
105  
21, 316, 32  
Thickness  
(mm)  
A
B
C
C
D
E
F
G
H
I
J
K
L
2.5±0.2  
1kp(E8)  
———  
0.3±0.03 0.5±0.05 0.8±0.1  
0.8±0.1  
0.6±0.1  
0.85±0.1 1.15±0.1 1.25±0.1  
1.4max  
1.6max 1.6±0.15  
2.0±0.2  
Taping(180 dia reel)  
Taping(330 dia reel)  
15kp(P8) 10kp(P8) 4kp(P8)  
8kp(P8)  
4kp(P8)  
4kp(P8)  
3kp(E8) 3kp(E8)  
3kp(E8) 2.5kp(E8) 2.5kp(E8) 2kp(E8)  
———  
50kp(P8) 10kp(P8) 20kp(P8) 10kp(P8) 10kp(P8) 10kp(E8) 10kp(E8) 10kp(E8)  
5kp(E8) 5kp(E8) 5kp(E8)  
Note : P8 = 8mm width paper tape  
Size  
43, 55  
E8 = 8mm width plastic tape  
E12 = 12mm width plastic tape  
Thickness  
(mm)  
J
K
2.0±0.2  
L
2.5±0.2  
M
2.8±0.2  
Carrier tape 2mm pitch from one capacitor to another.  
1.6±0.15  
Taping(178 dia reel)  
Taping(330 dia reel)  
1kp(E12) 1kp(E12) 0.5kp(E12) 0.5kp(E12)  
——— ——— ——— ———  
Multilayer Ceramic Chip Capacitors  
Electrical Characteristics  
Capacitance-Temperature  
Aging  
(temperature compensation)  
(change of capacitance over time)  
For temperature compensation : 1MHz, 1 Vrms/for high dielectric constant : 1,kHZ, 1 Vrms  
at 1MHz, 1Vrms  
10  
0
10  
5
C∆  
X7R  
-10  
-20  
-30  
0
C∆  
P∆  
R∆  
S∆  
T∆  
U∆  
Y5V  
-5  
Initial value should be after 48hr of Heat treatment.  
-10  
10  
100  
1,000  
10,000  
100,000  
-60  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
Duration(hrs)  
Temperature(°C)  
Capacitance-Temperature  
Impedance-Frequency  
(high dielectric constant)  
Y5U, X7R, Y5V  
at 1kHz, 1Vrms  
at 1Vrms  
100  
10  
20  
0
X7R(X5R) at 0VDC  
-20  
-40  
-60  
-80  
X7R(X5R) at RV/2  
1
0.1  
Y5V at 0VDC  
Y5V at RV/2  
0.01  
-100  
0.001  
-60  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
0.1  
1
10  
100  
1,000  
10,000  
Temperature(˚C)  
Frequency(MHz)  
AC Voltage  
DC Bias  
Rated at 25V : Y5U  
Rated at 25V : C, X7R, Y5V  
For temperature compensation at 1MHz, 1Vrms  
For high dielectric constant at 1kHz, 1Vrms  
Rated at 25V : Y5U  
Rated at 25V : C, X7R, Y5V  
For temperature compensation : 1MHz  
1 Vrms/for high dielectric constant : 1kHz  
20  
0
25  
20  
15  
10  
5
CH  
X7R(X5R)  
20  
40  
60  
80  
100  
Y5V  
X7R  
Y5V  
0
C∆  
-5  
-10  
0
5
10  
15  
20  
25  
1
2
3
4
5
VDC  
AC Voltage(Vrms)  
Please verify individual characteristics at the design stage to ensure total suitability  
Multilayer Ceramic Chip Capacitors  
Test Conditions and Standards  
Test conditions and Specification for Temperature Compensation type(C to U • SL characteristics)  
Test Items  
Capacitance Value  
Q
Specification (C: nominal capacitance)  
Within tolerance  
Test Conditions  
C1000pF  
1MHz±10%  
1kHz±10%  
0.5 to  
C30pF: Q1000  
C>1000pF  
5Vrms  
C<30pF: Q400+20C  
Measured after the rated voltage is applied for one  
minute at normal room temperature and humidity. ( 4)  
Insulation resistance (IR)( 6) 10,000Mor 500MµF min, whichever is less  
( 1) Apply 3 times of the rated voltage for 1 to 5 seconds.  
( 6)  
Dielectric Resistance  
Appearance  
No problem observed  
No problem observed  
Microscope(10×magnification)  
Apply a sideward force of 500g(5N) ( 7) to a PCB-mounted  
sample.  
( 2)  
( 2)  
Termination strength  
Bending strength  
No problem observed  
Glass epoxy PCB (t=1.6mm); fulcrum  
Spacing: 90mm; for 10 seconds.  
No mechanical damage at 1mm bent  
No significant change is detected.  
Within tolerance  
Vibration  
test  
Appearance  
Vibration frequency: 10 to 55(Hz)  
Amplitude: 1.5mm  
Sweeping condition: 105510Hz/min  
In X, Y and Z directions:  
C  
C30pF: Q1000  
Q
2 hours each Total 6 hours  
C<30pF: Q400+20C  
Soak the sample in 260°C±5°C  
solder for 10±0.5seconds  
and place in a room at normal temperature  
and humidity; measure after 24±2hours.  
(Preheating Conditions)  
Soldering  
heat  
resistance  
Appearance  
No significant change is detected.  
C  
±2.5% or ±0.25pF max, whichever is larger.  
C30pF: Q1000  
Q
C<30pF: Q400+20C  
Order  
Temperature  
80 to 100°C  
150 to 200°C  
Time  
( 6)  
IR  
10,000Mor 500MµF min, whichever is smaller  
1
2
2minutes  
2minutes  
Withstand voltage  
Resists without problem  
( 6)  
Soaking Condition  
Solderability  
Ni/Br termination: 90% min  
Sn63 Solder  
235±5°C  
2±0.5sec.  
3±0.5sec.  
Sn-3Ag-0.5Cu 245±5°C  
Temperature  
cycle ( 3)  
Appearance  
No significant change is detected.  
(Cycle)  
Normal room temperature (3min)→  
Lowest operation temperature (30min)→  
Normal room temperature (3min)→  
Highest operation temperature (30min)→  
C  
±2.5% or ±0.25pF max, whichever is larger.  
C30pF: Q1000  
Q
C<30pF: Q400+20C  
( 6)  
IR  
10,000Mor 500MµF min, whichever is samller  
Resists without problem  
After five cycles ( 3), measure after  
24±2hours.  
Withstand voltage  
( 6)  
Humidity  
Appearance  
No significant change is detected.  
Measure the test sample after storing it  
24±2hours at a temperature of 40°C±2°C  
and a relative humidity of 90-95% Rh.  
for 500+24/0hours.  
test  
( 5)  
C  
±7.5% or ±0.75pF max, whichever is larger.  
C30pF: Q200  
Q
C<30pF: Q100+10C/3  
( 6)  
IR  
500Mor 25MµF min, whichever is smaller  
No significant change is detected.  
After applying ( 1) twice of the rated voltage  
at a temperature of 125±3°C for  
1000+48/0hours, measure the sample  
after storing 24±2hours.  
High-  
Appearance  
temperature  
with  
C  
±3% or ±0.3pF max, whichever is larger.  
loading  
C30pF: Q350  
Q
10pFC<30pF: Q275+5C/2  
C<10pF: Q200+10C  
( 6)  
IR  
1,000Mor 50MµF min, whichever is smaller  
1
For the CF series, use 1.5 times when the rated voltage is 250V; use/1.2 times when  
the rated voltage exceeds 630V.  
Except CT series  
Different specification for Nickel Barrier termination DN/DR series. (Alumina Substrate)  
Apply 500V for 1minite in case the rated voltage is 1000V or higher.  
5
6
7
Except CF series.  
The charge and discharge current of the capacitor must not exceed 50mA.  
2N at 0201 Size  
2
3
4
Multilayer Ceramic Chip Capacitors  
Test Conditions and Standards  
Test conditions and Specification for High Dielectric Type (X5R, X7R, Y5V)  
Specification  
Test Items  
Capacitance Value  
tanδ(%)  
Test Condition  
X7R/X5R  
Within tolerance  
Y5V  
( 8, 14)  
Do previous treatment  
Capacitance  
C10µF  
Fire  
Vol  
1kHz±10% 1.0±0.1Vrms  
120Hz±10% 0.5±0.1Vrms  
2.5%max, 3.5%max ( 2)  
,
7.0%max ( 12)  
5.0%max, 7.0%max ( 13)  
C>10µF  
5.0%max ( 3), 7.5%max ( 17)  
9.0%max ( 4), 12.5%max ( 5)  
Measured after the rated voltage is applied for 2minutes  
at normal room temperature and humidity. ( 10)  
Insulation resistance (IR)( 15) 10,000Mor 500MµF min, whichever is less  
( 1) Apply 2.5 times of the rated voltage for 1 to 5 seconds.  
( 15)  
Dielectric Resistance  
Appearance  
No problem observed  
No problem observed  
Microscope(10×magnification)  
Apply a sideward force of 500g(5N) ( 16) to a  
PCB-mounted sample.  
( 6)  
( 6)  
Termination strength  
Bending strength test  
No problem observed  
Glass epoxy PCB (t=1.6mm); fulcrum  
Spacing: 90mm; for 10 seconds.  
No problem observed at 1mm bent  
No significant change is detected.  
Within tolerance  
Vibration frequency: 10 to 55(Hz)  
Amplitude: 1.5mm  
Sweeping condition: 105510Hz/min  
In X, Y and Z directions:  
Vibration  
test  
Appearance  
C  
tanδ(%)  
Appearance  
C  
Satisfies the initial value.  
No significant change is detected.  
Within ±7.5%  
2 hours each Total 6 hours  
Do previous treatment ( 8)  
Soak the sample in 260°C±5°C  
solder for 10±0.5seconds  
and place in a room at normal temperature  
and humidity; measure after 48±4hours.  
(Preheating Conditions)  
Soldering  
heat  
resistance  
Within ±20%  
tanδ(%)  
Satisfies the initial value.  
Order  
1
2
Temperature  
80 to 100°C  
150 to 200°C  
Time  
2minutes  
2minutes  
( 15)  
IR  
10,000Mor 500MµF min, whichever is smaller  
Withstand voltage  
Resists without problem  
( 15)  
Ni/Br termination: 90% min  
Soaking Condition  
Solderability  
Sn63 Solder  
235±5°C  
2±0.5sec.  
3±0.5sec.  
Sn-3Ag-0.5Cu 245±5°C  
Do previous treatment ( 8)  
(Cycle)  
Normal room temperature (3min)→  
Lowest operation temperature (30min)→  
Normal room temperature (3min)→  
Highest operation temperature (30min)→  
Temperature  
cycle ( 7)  
Appearance  
C  
No significant change is detected.  
Within ±7.5%  
Within ±20%  
tanδ(%)  
Satisfies the initial value.  
( 15)  
IR  
10,000Mor 500MµF min, whichever is smaller  
Resists without problem  
After five cycles ( 7), measure after  
48±4hours.  
Withstand voltage  
( 15)  
Do previous treatment ( 9)  
Humidity  
Appearance  
C  
No significant change is detected.  
( 11)  
test  
After storing it at a temperature of  
40°C±2°C and a relative humidity of  
90-95% for 500+24/0hours, measure  
the sample after storing 48±4hours.  
Within ±12.5%  
Within ±30%  
200% max of  
initial value  
150% max of  
initial value  
tanδ(%)  
( 15)  
IR  
500Mor 25MµF min, whichever is smaller  
Do previous treatment ( 9)  
High-  
temperature  
with  
Appearance  
C  
No significant change is detected.  
After applying twice ( 18) of the rated  
voltage at the highest operating temperature  
for 1000+48/0hours, measure the sample  
after storing 48±4hours.  
Within ±12.5%  
Within ±30%  
loading  
200% max of  
initial value  
150% max of  
initialvalue
tanδ(%)  
( 15)  
IR  
1,000Mor 50MµF min, whichever is smaller  
*1 Use 1.5 times when the rated voltage is 250V or over.  
*10 For the CF series over 1000V, apply 500V for 1 minutes at room ambient.  
Use 1.2 times when the rated voltage is 630V or over.  
*11 Except CF series.  
*2 Apply to X5R 35V type, X7R 16V/25V type.  
*12 Apply to X5R 10V type, X7S 4V type.  
*3 Apply to X5R16V/25V type, X7R/X7S 6.3V/10V type.  
*4 Apply to Y5V 16V type, CM32Y5V335 to 106 (25V Type).  
*13 Apply to 25V series of CM105Y5V154 over, CM21Y5V105 over, 316Y5V155 over.  
*14 Measurement condition 1kHz, 1Vrms for Y5V, C < 47µF type.  
*15 The charge/discharge current of the capacitor must not exceed 50mA.  
*16 2N at 0201 Size  
*17 Apply to X5R 4V and 6.3V type.  
*18 Use 1.5times when the rated voltage is 4V/6.3V/10V/250V and 100V (32X7R474/43X7R105/55X7R105).  
Use 1.2times when the rated voltage is 630V or over.  
*5 Apply to Y5V 6.3V/10V type. Apply 16% to CM21Y5V106/CM316Y5V226.  
*6 Exclude CT series with thickness of less than 0.66mm and CA series.  
*7 Different Specification for Nickel Barrier termination DN/DR series. (Alumina Substrate)  
*8 Keep specimen at 150°C+0/10°C for one hour, leave specimen at room ambient for 48±4 hours.  
*9 Apply the same test condition for one hour, then leave the specimen at room ambient for 48±4 hours.  
Multilayer Ceramic Chip Capacitors  
Packaging Options  
(Unit : mm)  
Tape and Reel  
• Reel  
Reel (code : T)  
W2  
Code  
Reel  
A
B
C
D
7-inch Reel  
E
178±2.0  
330±2.0  
φ60min  
(CODE : T, H)  
C
13±0.5  
21±0.8  
13-inch Reel  
(CODE : L, N)  
φ100±1.0  
B
D
R
Code  
Reel  
E
W1  
W2  
R
7-inch Reel  
10.0±1.5  
9.5±1.0  
(CODE : T, H)  
2.0±0.5  
16.5max  
1.0  
A
W1  
13-inch Reel  
(CODE : L, N)  
Carrier tape width 8mm. For size 42(1808) or over, Tape width 12mm and W1 : 14±1.5,  
W2 : 18.4mm max  
F=2mm(03, 05, 105 Type)  
(Unit : mm)  
Carrier Tape  
Punched rectangular hole to hold capacitor  
E
Feed Hole  
J
(Paper)  
Type  
A
B
F
A
D
C
B
03 (0.6×0.3)  
05 (1.0×0.5)  
105 (1.6×0.8)  
D11 (1.37×1.0)  
D12 (1.25×2.0)  
F12 (1.25×2.0)  
F13 (1.6×3.2)  
21 (2.0×1.25)  
316 (3.2×1.6)  
32 (3.2×2.5)  
42 (4.5×2.0)  
43 (4.5×3.2)  
52 (5.7×2.0)  
53 (5.7×2.8)  
55 (5.7×5.0)  
0.37±0.03  
0.65±0.1  
1.0±0.2  
1.15±0.1  
1.5±0.2  
1.5±0.2  
2.0±0.2  
1.5±0.2  
2.0±0.2  
2.9±0.2  
2.4±0.2  
3.6±0.2  
2.4±0.2  
3.2±0.2  
5.3±0.2  
0.67±0.03  
1.15±0.1  
1.8±0.2  
1.55±0.1  
2.3±0.2  
2.3±0.2  
3.6±0.2  
2.3±0.2  
3.6±0.2  
3.6±0.2  
4.9±0.2  
4.9±0.2  
6.0±0.2  
6.0±0.2  
6.0±0.2  
2.0±0.05  
2.0±0.05  
4.0±0.1  
4.0±0.1  
4.0±0.1  
4.0±0.1  
4.0±0.1  
4.0±0.1  
4.0±0.1  
4.0±0.1  
4.0±0.1  
8.0±0.1  
4.0±0.1  
8.0±0.1  
8.0±0.1  
F
F
H
03 Type: 0.5MAX  
05 Type: 0.75MAX  
F=4mm(105, D11, D12, F12, F13, 21, 316, 32, 42, 52 Type)  
(Plastic)  
2.8MAX  
(Paper)  
Punched rectangular hole to hold capacitor  
E
Feed Hole  
J
A
D
+0.2  
C
B
φ1.0  
0  
F
H
G
0.6MAX  
1.1MAX  
Holes only for plastic carrier tape.  
F=8mm(43, 53, 55 Type)  
(Plastic)  
2.8MAX  
Punched rectangular hole to hold capacitor  
E
Feed Hole  
J
A
D
+0.2  
0  
B
C
φ1.0  
(Unit : mm)  
Carrier Tape  
C
D
E
G
H
J
F
F
H
G
0.6MAX  
2.0  
±0.05  
8mm  
Paper  
8.0  
3.5  
Bulk Cassette  
(Unit : mm)  
±0.3 ±0.05  
12  
4.0  
±0.1  
8mm  
Plastic  
1.75  
2.0  
4.0  
1.5  
±0.1 ±0.05 ±0.1 +0.1/0  
12mm  
Plastic  
36  
12.0  
5.5  
8.0  
±0.1  
±0.3 ±0.05  
Slider  
Shutter  
110  
Connection Area  
Multilayer Ceramic Chip Capacitors  
Precautions  
Circuit Design  
1. Once application and assembly environments have been checked, the capacitor may be used in conformance with the rating and performance  
which are provided in both the catalog and the specifications. Use exceeding that which is specified may result in inferior performance or cause  
a short, open, smoking, or flaming to occur, etc.  
2. Please consult the manufacturer in advance when the capacitor is used in devices such as: devices which deal with human life, i.e. medical  
devices; devices which are highly public orientated; and devices which demand a high standard of liability.  
Accident or malfunction of devices such as medical devices, space equipment and devices having to do with atomic power could generate grave  
consequence with respect to human lives or, possibly, a portion of the public. Capacitors used in these devices may require high reliability  
design different from that of general purpose capacitors.  
3. Please use the capacitors in conformance with the operating temperature provided in both the catalog and the specifications.  
Be especially cautious not to exceed the maximum temperature. In the situation the maximum temperature set forth in both the catalog and  
specifications is exceeded, the capacitor’s insulation resistance may deteriorate, power may suddenly surge and short-circuit may occur.  
The capacitor has a loss, and may self-heat due to equivalent series resistance when alternating electric current is passed therethrough. As this  
effect becomes especially pronounced in high frequency circuits, please exercise caution.  
When using the capacitor in a (self-heating) circuit, please make sure the surface of the capacitor remains under the maximum temperature for  
usage. Also, please make certain temperature rises remain below 20ºC.  
4. Please keep voltage under the rated voltage which is applied to the capacitor. Also, please make certain the peak voltage remains below the  
rated voltage when AC voltage is super-imposed to the DC voltage.  
In the situation where AC or pulse voltage is employed, ensure average peak voltage does not exceed the rated voltage.  
Exceeding the rated voltage provided in both catalog and specifications may lead to defective withstanding voltage or, in worst case situations,  
may cause the capacitor to smoke or flame.  
5. When the capacitor is to be employed in a circuit in which there is continuous application of a high frequency voltage or a steep pulse voltage,  
even though it is within the rated voltage, please inquire to the manufacturer.  
In the situation the capacitor is to be employed using a high frequency AC voltage or a extremely fast rising pulse voltage, even though it is  
within the rated voltage, it is possible capacitor reliability will deteriorate.  
6. It is a common phenomenon of high-dielectric products to have a deteriorated amount of static electricity due to the application of DC voltage.  
Due caution is necessary as the degree of deterioration varies depending on the quality of capacitor materials, capacity, as well as the load  
voltage at the time of operation.  
7. Do not use the capacitor in an environment where it might easily exceed the respective provisions concerning shock and vibration specified in  
the catalog and specifications.  
In addition, it is a common piezo phenomenon of high dielectric products to have some Voltage due to vibration or to have noise due to Voltage  
change. Please contact sales in such case.  
8. If the electrostatic capacity value of the delivered capacitor is within the specified tolerance, please consider this when designing the respective  
product in order that the assembled product function appropriately.  
Storage  
1. If the component is stored in minimal packaging (a heat-sealed or chuck-type plastic bag), the bag should be kept closed. Once the bag has  
been opened, reseal it or store it in a desiccator.  
2. Keep storage place temperature +5 to +35 degree C, humidity 45 to 70% RH.  
3. The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the product is  
exposed to such atmospheres, the terminals will oxidize and solderability will be effected.  
4. Precautions 1)-3) apply to chip capacitors packaged in carrier tapes and bulk cases.  
5. The solderability is assured for 12 months from our shipping date (six months for silver palladium) if the above storage precautions are followed.  
6. Chip capacitors may crack if exposed to hydrogen (H2) gas while sealed or if coated with silicon, which generates hydrogen gas.  
Multilayer Ceramic Chip Capacitors  
Surface Mounting Information  
(Unit : mm)  
Dimensions for recommended typical land  
Standard  
Size  
L×W  
a
b
c
Land Pattern  
03  
0.6×0.3  
1.0×0.5  
1.6×0.8  
2.0×1.25  
3.2×1.6  
3.2×2.5  
4.5×2.0  
4.5×3.2  
5.7×2.0  
5.7×2.8  
5.7×5.0  
0.20 to 0.30 0.25 to 0.35 0.30 to 0.40  
0.30 to 0.50 0.35 to 0.45 0.40 to 0.60  
0.70 to 1.00 0.80 to 1.00 0.60 to 0.80  
1.00 to 1.30 1.00 to 1.20 0.80 to 1.10  
2.10 to 2.50 1.10 to 1.30 1.00 to 1.30  
2.10 to 2.50 1.10 to 1.30 1.90 to 2.30  
2.50 to 3.20 1.80 to 2.30 1.50 to 1.80  
2.50 to 3.20 1.80 to 2.30 2.60 to 3.00  
4.20 to 4.70 2.00 to 2.50 1.50 to 1.80  
4.20 to 4.70 2.00 to 2.50 2.20 to 2.60  
4.20 to 4.70 2.00 to 2.50 4.20 to 4.70  
Sample capacitor  
05  
105  
21  
c
316  
32  
b
a
Soldering resist  
42  
43  
52  
53  
When mounting the capacitor to the substrate, it is important to  
consider carefully that the amount of solder (size of fillet) used has a  
direct effect upon the capacitor once it is mounted.  
55  
CA series : Please refer Page 19.  
a) The greater the amount of solder, the greater the stress to the  
elements. As this may cause the substrate to break or crack, it is  
important to establish the appropriate dimensions with regard to the  
amount of solder when designing the land of the substrate.  
b) In the situation where two or more devices are mounted onto a  
common land, separate the device into exclusive pads by using  
soldering resist  
(Unit : mm)  
DN/DR Automotive Series  
Size  
105  
21  
L×W  
a
b
c
1.6×0.8  
2.0×1.25  
3.2×1.6  
0.60 to 0.90 0.80 to 1.00 0.70 to 1.00  
0.90 to 1.20 0.80 to 1.20 0.90 to 1.40  
1.40 to 1.90 1.00 to 1.30 1.30 to 1.80  
316  
Ideal Solder Thickness  
T/3 to T/2  
Chip Capacitor  
T
Solder  
PCB  
Typical mounting problems  
Item  
Not recommended example  
Recommended example/Separated by solder resist  
Solder resist  
Multiple parts mount  
Solder resist  
Mount with  
leaded parts  
Leaded parts  
Leaded parts  
Solder resist  
Soldering iron  
Wire  
Wire soldering  
after mounting  
Solder resist  
Solder resist  
Overview  
Multilayer Ceramic Chip Capacitors  
Surface Mounting Information  
Mounting Design  
The chip could crack if the PCB warps during processing after the chip has been soldered.  
Recommended chip position on PCB to minimize stress from PCB warpage  
(Not recommended)  
(Ideal)  
Actual Mounting  
1) If the position of the vacuum nozzle is too low, a large force may be applied to the chip capacitor during mounting, resulting in cracking.  
2) During mounting, set the nozzle pressure to a static load of 100 to 300 gf.  
3) To minimize the shock of the vaccum nozzle, provide a support pin on the back of the PCB to minimize PCB flexture.  
Crack  
Support pin  
4) When the positioning hook begins to wear, unstable mechanical shock may be applied to the chip capacitor, resulting in cracking.  
5) To reduce the possibility of chipping and cracks, minimize vibration to chips stored in a bulk case.  
6) The discharge pressure must be adjusted to the part size. Verify the pressure during setup to avoid fracturing or cracking the chips capacitors.  
Resin Mold  
1) If a large amount of resin is used for molding the chip, cracks may occur due to contraction stress during curing. To avoid such cracks, use a low  
shrinkage resin.  
2) The insulation resistance of the chip will degrade due to moisture absorption. Use a low moisture absorption resin.  
3) Check carefully that the resin does not generate a decomposition gas or reaction gas during the curing process or during normal storage. Such  
gases may crack the chip capacitor or damage the device itself.  
Multilayer Ceramic Chip Capacitors  
Surface Mounting Information  
Soldering Method  
1) Ceramic is easily damaged by rapid heating or cooling. If some heat shock is unavoidable, preheat enough to limit the temperature difference  
(Delta T) to within 130 degree Celsius.  
2) The product size 1.0×0.5mm to 3.2×1.6mm can be used in reflow and wave soldering, and the product size of over 3.2×2.5mm, 0.6×0.3mm, and  
capacitor arrays can be used in reflow.  
Circuit shortage and smoking can be created by using capacitors which are used neglecting the above caution.  
3) Please see our recommended soldering conditions.  
Please contact us if you use lead free solder because the peak temperature of lead free is different from non-lead free.  
Recommendable Temperature Profile(62Sn Solder)  
Recommendable Temperature Profile(Sn-3Ag-0.5Cu)  
Reflow  
Reflow  
Peak temperature  
230°C±5°C  
250°C±5°C  
15seconds maximum  
5 to 10sec. Max.  
300  
Preheat  
300  
Preheat  
Cool at normal room  
250  
200  
150  
100  
50  
250  
200  
150  
100  
50  
temperature after  
removing from  
furnace.  
T  
1 to 3°C/sec.  
170 to 180°C  
More than180°C,  
40seconds maximum  
220°C Max.  
0
0
60seconds  
60seconds  
90±30sec.  
q Minimize soldering time.  
q Minimize soldering time.  
w Ensure that allowable temperature difference does not exceed 130˚C.  
w Ensure that allowable temperature difference does not exceed 130˚C.  
Wave  
Wave  
300  
300  
Preheat  
245 to 260˚C  
Cool at normal  
room temperature  
250  
200  
150  
100  
250  
200  
150  
100  
50  
T  
T  
230°C  
to  
260°C  
Preheat  
0
90±30sec.  
60 to 120sec.  
3sec. max  
q Ensure that the chip capacitor is preheated adequately.  
w Ensure that the temperature difference (T) does not exceed 150°C.  
e Cool naturally after soldering.  
q Ensure that the chip capacitor is preheated adequately.  
w Ensure that the temperature difference (T) does not exceed 150°C.  
e Cool naturally after soldering.  
r Stop wave in more than CM32.  
Sodering iron  
1) Temperature of iron chip  
2) Wattage  
350°C max  
5) Cautions  
30W max  
a) Pre-heating is necessary Rapid heating must be avoided.  
Delta T130˚C.  
3) Tip shape of soldering iron φ3.0mm max  
4) Soldering Time 3sec. max  
b) Avoid direct touching to capacitors.  
c) Avoid rapid cooling after soldering. Natural cooling is recommended.  
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