SMD Precision Pulse Thick Film Chip Resistor
Performance Specification:
Characteristic Limits
Test Methods
(JIS C 5201-1)
Temperature
Coefficient
±100PPM/°C
*0402:
ꢀΩ-ꢀꢇΩ : ± ꢋꢇꢇ PPM/℃
ꢀꢀΩ-ꢀꢇꢇΩ : ± 200 PPM/℃
>ꢀꢇꢇΩ : ± ꢀꢇꢇ PPM/℃
Natural resistance change per temp.
degree centigrade
R1-R2
--------- xꢀꢇ⁶ ꢌPPM/°Cꢍ
R1(t2-t1)
R1 resistance value at room temperature
(t1)
R2 Resistance value at room temperature
+100°C (t2)
(Sub-clause 4.8)
Short term
overload
Resistance change rate is
±ꢎ% : ±ꢌꢁ.ꢇ% ±ꢇ.ꢀΩꢍ Max.
±ꢀ% : ±ꢌꢀ.ꢇ% ±ꢇ.ꢀΩꢍ Max.
Permanent resistance change after the
application of a potential of 2.5 times
RCWV for 5 seconds
Sub-clause 4.13
Twist of Test Board :
Y/X = 5/90 mm for 10 seconds
(Sub-clause 4.33)
Terminal
Bending
± ꢌꢀ.ꢇ% ±ꢇ.ꢇꢎΩꢍ Max.
ꢀ,ꢇꢇꢇMΩ or ꢂore
Insulation
Resistance
Apply 500V DC between protective coating
and termination for 1 min, then measure
(Sub-clause 5.6)
Dielectric
Withstand
Voltage
No evidence of flashover,
mechanical damage, arcing and termination for 1 minute
Apply 500V AC between protective coating
or insulation breakdown.
(Sub-clause 4.7)
Soldering Heat Resistance change rate is
±ꢌꢀ.ꢇ%+ꢇ.ꢇꢎΩꢍ Max.
Dip the resistor into a solder bath having a
temperature of 260°C±3°C and hold it for
10±1 seconds
(Sub-clause 4.18)
Solderability
95% coverage Min.
Test temperature of solder : 245 ± 3 ℃
Dwell time in solder : 2 ~ 3 seconds
(Sub-clause 4.17)
Solder Temp.
Reference
Electrical characteristics
shall be satisfied without
distinct deformation in
appearance.
Wave soldering condition: (2 cycles Max.)
Pre-heat : 100 ~ 120 ℃, 30 ± 5 sec.
Peak temp.: 260 ℃
Reflow soldering condition: (2 cycles Max.)
Pre-heat : 150 ~ 180 ℃, 90 ~ 120 sec.
Suggestion solder temp.: 235 ~ 255 ℃, 20 ~
40 sec.
(95% coverage Min.)
Peak temp.: 260 ℃
Hand Soldering 300°C 5 seconds
Dimensions in
Dimensions Shown for
9-1773463-9 CIS WR 03/2018
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millimetres unless
otherwise specified
reference purposes only.
Specifications subject to
change