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    • 北京元坤伟业科技有限公司

           该会员已使用本站17年以上

    • CSD95480RWJ
    • 数量-
    • 厂家-
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    • 批号-
    • -
    • QQ:857273081QQ：857273081 复制
      QQ:1594462451QQ：1594462451 复制
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    • CSD95480RWJ图

    • 集好芯城

       该会员已使用本站13年以上
    • CSD95480RWJ 现货库存
    • 数量22002 
    • 厂家TI(德州仪器) 
    • 封装 
    • 批号22+ 
    • 原装原厂现货
    • QQ:3008092965QQ：3008092965 复制
      QQ:3008092965QQ：3008092965 复制
    • 0755-83239307 QQ:3008092965QQ:3008092965
    • CSD95480RWJ图

    • 深圳市恒达亿科技有限公司

       该会员已使用本站16年以上
    • CSD95480RWJ 现货库存
    • 数量8000 
    • 厂家TI 
    • 封装VQFN-41 
    • 批号24+ 
    • 只做原装正品现货销售
    • QQ:867789136QQ：867789136 复制
      QQ:1245773710QQ：1245773710 复制
    • 0755-82723761 QQ:867789136QQ:1245773710
    • CSD95480RWJ图

    • 深圳市雅维特电子有限公司

       该会员已使用本站15年以上
    • CSD95480RWJ 现货库存
    • 数量5000 
    • 厂家TI 
    • 封装VQFN41 
    • 批号23+ 
    • 原装正品假一赔十支持实单
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      QQ:1152937841QQ：1152937841 复制
    • 0755-83975781 QQ:767621813QQ:1152937841
    • CSD95480RWJ图

    • 深圳市广百利电子有限公司

       该会员已使用本站6年以上
    • CSD95480RWJ 现货库存
    • 数量18500 
    • 厂家TI(德州仪器) 
    • 封装VQFN-41 
    • 批号24+ 
    • ★★全网低价，原装原包★★
    • QQ:1483430049QQ：1483430049 复制
    • 0755-83235525 QQ:1483430049
    • CSD95480RWJ图

    • 深圳市芯脉实业有限公司

       该会员已使用本站11年以上
    • CSD95480RWJ 现货库存
    • 数量2500 
    • 厂家TI 
    • 封装(RWJ) 
    • 批号新批次 
    • 新到现货、一手货源、当天发货、bom配单
    • QQ:2881512844QQ：2881512844 复制
    • 075584507705 QQ:2881512844
    • CSD95480RWJ图

    • 深圳市雅维特电子有限公司

       该会员已使用本站15年以上
    • CSD95480RWJ 优势库存
    • 数量5000 
    • 厂家TI 
    • 封装VQFN41 
    • 批号19 
    • 公司正品现货 欢迎咨询
    • QQ:767621813QQ：767621813 复制
      QQ:1152937841QQ：1152937841 复制
    • 0755-83975781 QQ:767621813QQ:1152937841
    • CSD95480RWJ图

    • 深圳市拓森弘电子有限公司

       该会员已使用本站1年以上
    • CSD95480RWJ
    • 数量5000 
    • 厂家TI/德州仪器 
    • 封装VQFN-41 
    • 批号21+ 
    • 原厂原包装，库存现货实报
    • QQ:1300774727QQ：1300774727 复制
    • 13714410484 QQ:1300774727
    • CSD95480RWJT图

    • 北京耐芯威科技有限公司

       该会员已使用本站12年以上
    • CSD95480RWJT
    • 数量5000 
    • 厂家Texas Instruments 
    • 封装41-VQFN-CLIP（5x6） 
    • 批号21+ 
    • 全新原装、现货库存，欢迎询价
    • QQ:2880824479QQ：2880824479 复制
      QQ:1344056792QQ：1344056792 复制
    • 96-010-62104931 QQ:2880824479QQ:1344056792
    • CSD95480RWJ图

    • 深圳市得捷芯城科技有限公司

       该会员已使用本站11年以上
    • CSD95480RWJ
    • 数量100 
    • 厂家TI/德州仪器 
    • 封装NA/ 
    • 批号23+ 
    • 优势代理渠道,原装正品,可全系列订货开增值税票
    • QQ:3007977934QQ：3007977934 复制
      QQ:3007947087QQ：3007947087 复制
    • 0755-82546830 QQ:3007977934QQ:3007947087
    • CSD95480RWJ图

    • 集好芯城

       该会员已使用本站13年以上
    • CSD95480RWJ
    • 数量20463 
    • 厂家TI/德州仪器 
    • 封装QFN 
    • 批号最新批次 
    • 原装原厂 现货现卖
    • QQ:3008092965QQ：3008092965 复制
      QQ:3008092965QQ：3008092965 复制
    • 0755-83239307 QQ:3008092965QQ:3008092965
    • CSD95480RWJ图

    • 深圳市和诚半导体有限公司

       该会员已使用本站11年以上
    • CSD95480RWJ
    • 数量5600 
    • 厂家TI 
    • 封装QFN 
    • 批号23+ 
    • 100%深圳原装现货库存
    • QQ:2276916927QQ：2276916927 复制
      QQ:1977615742QQ：1977615742 复制
    • 18929336553 QQ:2276916927QQ:1977615742
    • CSD95480RWJ图

    • 深圳市得捷芯城科技有限公司

       该会员已使用本站11年以上
    • CSD95480RWJ
    • 数量12048 
    • 厂家TI(德州仪器) 
    • 封装VQFN-41 
    • 批号23+ 
    • 原厂可订货，技术支持，直接渠道。可签保供合同
    • QQ:3007947087QQ：3007947087 复制
      QQ:3007947087QQ：3007947087 复制
    • 0755-83061789 QQ:3007947087QQ:3007947087
    • CSD95480RWJT图

    • 深圳市美思瑞电子科技有限公司

       该会员已使用本站12年以上
    • CSD95480RWJT
    • 数量12245 
    • 厂家TI/德州仪器 
    • 封装QFN 
    • 批号22+ 
    • 现货，原厂原装假一罚十！
    • QQ:2885659458QQ：2885659458 复制
      QQ:2885657384QQ：2885657384 复制
    • 0755-83952260 QQ:2885659458QQ:2885657384
    • CSD95480RWJ图

    • 深圳市西源信息科技有限公司

       该会员已使用本站9年以上
    • CSD95480RWJ
    • 数量8800 
    • 厂家TI 
    • 封装SON8 
    • 批号最新批号 
    • 原装现货零成本有接受价格就出
    • QQ:3533288158QQ：3533288158 复制
      QQ:408391813QQ：408391813 复制
    • 0755-84876394 QQ:3533288158QQ:408391813
    • CSD95480RWJT图

    • 北京齐天芯科技有限公司

       该会员已使用本站15年以上
    • CSD95480RWJT
    • 数量5000 
    • 厂家Texas Instruments 
    • 封装41-VQFN-CLIP（5x6） 
    • 批号2024+ 
    • 全新原装、现货库存，欢迎询价
    • QQ:2880824479QQ：2880824479 复制
      QQ:1344056792QQ：1344056792 复制
    • 010-62104931 QQ:2880824479QQ:1344056792
    • CSD95480RWJ图

    • 深圳市宏世佳电子科技有限公司

       该会员已使用本站13年以上
    • CSD95480RWJ
    • 数量3565 
    • 厂家TI 
    • 封装41-PowerTFQFN 
    • 批号2023+ 
    • 全新原厂原装产品、公司现货销售
    • QQ:2881894393QQ：2881894393 复制
      QQ:2881894392QQ：2881894392 复制
    • 0755- QQ:2881894393QQ:2881894392
    • CSD95480RWJT图

    • 北京齐天芯科技有限公司

       该会员已使用本站15年以上
    • CSD95480RWJT
    • 数量5000 
    • 厂家Texas Instruments 
    • 封装41-VQFN-CLIP（5x6） 
    • 批号2024+ 
    • 全新原装、现货库存，欢迎询价
    • QQ:2880824479QQ：2880824479 复制
      QQ:1344056792QQ：1344056792 复制
    • 010-62104931 QQ:2880824479QQ:1344056792
    • CSD95480RWJ图

    • 深圳市拓亿芯电子有限公司

       该会员已使用本站12年以上
    • CSD95480RWJ
    • 数量30000 
    • 厂家TI 
    • 封装QFN 
    • 批号23+ 
    • 代理全新原装现货，价格优势
    • QQ:1774550803QQ：1774550803 复制
      QQ:2924695115QQ：2924695115 复制
    • 0755-82777855 QQ:1774550803QQ:2924695115
    • CSD95480RWJ图

    • 深圳市华芯盛世科技有限公司

       该会员已使用本站13年以上
    • CSD95480RWJ
    • 数量865000 
    • 厂家TI/德州仪器 
    • 封装QFN 
    • 批号最新批号 
    • 一级代理,原装特价现货！
    • QQ:2881475757QQ：2881475757 复制
    • 0755-83225692 QQ:2881475757
    • CSD95480RWJ图

    • 深圳市芯福林电子有限公司

       该会员已使用本站15年以上
    • CSD95480RWJ
    • 数量13880 
    • 厂家TI/德州仪器 
    • 封装41-VQFN-CLIP 
    • 批号21+ 
    • 公司只售原装 支持实单
    • QQ:2881495751QQ：2881495751 复制
    • 0755-88917743 QQ:2881495751
    • CSD95480RWJT图

    • 深圳市芯鹏泰科技有限公司

       该会员已使用本站8年以上
    • CSD95480RWJT
    • 数量6538 
    • 厂家TI/德州仪器 
    • 封装VQFN-41 
    • 批号23+ 
    • 原装现货，实货实报
    • QQ:892152356QQ：892152356 复制
    • 0755-82777852 QQ:892152356
    • CSD95480RWJ图

    • 深圳市惊羽科技有限公司

       该会员已使用本站11年以上
    • CSD95480RWJ
    • 数量6328 
    • 厂家TI-德州仪器 
    • 封装QFN-41 
    • 批号▉▉：2年内 
    • ▉▉￥38.5元一有问必回一有长期订货一备货HK仓库
    • QQ:43871025QQ：43871025 复制
    • 131-4700-5145---Q-微-恭-候---有-问-秒-回 QQ:43871025
    • CSD95480RWJ图

    • 深圳市雅维特电子有限公司

       该会员已使用本站15年以上
    • CSD95480RWJ
    • 数量5000 
    • 厂家TI 
    • 封装VQFN41 
    • 批号19+ 
    • 原装正品假一赔十支持实单
    • QQ:767621813QQ：767621813 复制
      QQ:1152937841QQ：1152937841 复制
    • 0755-83975781 QQ:767621813QQ:1152937841
    • CSD95480RWJ图

    • 深圳市一呈科技有限公司

       该会员已使用本站9年以上
    • CSD95480RWJ
    • 数量5280 
    • 厂家TI(德州仪器) 
    • 封装VQFN-41 
    • 批号23+ 
    • ▉原装正品▉力挺实单可含税可拆样
    • QQ:3003797048QQ：3003797048 复制
      QQ:3003797050QQ：3003797050 复制
    • 0755-82779553 QQ:3003797048QQ:3003797050
    • CSD95480RWJ图

    • 现代芯城（深圳）科技有限公司

       该会员已使用本站15年以上
    • CSD95480RWJ
    • 数量60000 
    • 厂家一级代理 
    • 封装一级代理 
    • 批号一级代理 
    • 一级代理正品采购
    • QQ:3007226851QQ：3007226851 复制
      QQ:3007226849QQ：3007226849 复制
    • 0755-82542579 QQ:3007226851QQ:3007226849
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    • 深圳市英德州科技有限公司

       该会员已使用本站2年以上
    • CSD95480RWJ
    • 数量45000 
    • 厂家TI(德州仪器) 
    • 封装VQFN-41-CLIP(5x6) 
    • 批号2年内 
    • 全新原装 货源稳定 长期供应 提供配单
    • QQ:2355734291QQ：2355734291 复制
    • -0755-88604592 QQ:2355734291
    • CSD95480RWJ图

    • 深圳市芯福林电子有限公司

       该会员已使用本站15年以上
    • CSD95480RWJ
    • 数量85000 
    • 厂家TI/德州仪器 
    • 封装QFN 
    • 批号23+ 
    • 真实库存全新原装正品！代理此型号
    • QQ:2881495753QQ：2881495753 复制
    • 0755-23605827 QQ:2881495753
    • CSD95480RWJ图

    • 深圳市惠诺德电子有限公司

       该会员已使用本站7年以上
    • CSD95480RWJ
    • 数量29500 
    • 厂家Texas Instruments 
    • 封装SYNCHRONOUS BUCK 
    • 批号21+ 
    • 只做原装现货代理
    • QQ:1211267741QQ：1211267741 复制
      QQ:1034782288QQ：1034782288 复制
    • 159-7688-9073 QQ:1211267741QQ:1034782288
    • CSD95480RWJ图

    • 宇芯通实业(深圳)有限公司

       该会员已使用本站8年以上
    • CSD95480RWJ
    • 数量5000 
    • 厂家TI 
    • 封装VQFN-CLIP|41 
    • 批号21+ 
    • 只做品牌原装假一赔十
    • QQ:2903107741QQ：2903107741 复制
    • 0755-84535756 QQ:2903107741
    • CSD95480RWJ图

    • 深圳市婷轩实业有限公司

       该会员已使用本站6年以上
    • CSD95480RWJ
    • 数量10000 
    • 厂家TI 
    • 封装VQFN41 
    • 批号23+ 
    • 原装正品 公司现货
    • QQ:2881943288QQ：2881943288 复制
      QQ:3026548067QQ：3026548067 复制
    • 0755-89608519 QQ:2881943288QQ:3026548067
    • CSD95480RWJ图

    • 深圳市西源信息科技有限公司

       该会员已使用本站9年以上
    • CSD95480RWJ
    • 数量8800 
    • 厂家TI 
    • 封装VQFN-41 
    • 批号最新批号 
    • 原装现货零成本有接受价格就出
    • QQ:840638855QQ：840638855 复制
    • 0755-84876394 QQ:840638855
    • CSD95480RWJT图

    • 北京耐芯威科技有限公司

       该会员已使用本站13年以上
    • CSD95480RWJT
    • 数量5000 
    • 厂家Texas Instruments 
    • 封装41-VQFN-CLIP（5x6） 
    • 批号21+ 
    • 全新原装、现货库存，欢迎询价
    • QQ:2880824479QQ：2880824479 复制
      QQ:1344056792QQ：1344056792 复制
    • 86-010-010-62104931 QQ:2880824479QQ:1344056792
    • CSD95480RWJ图

    • 深圳市龙腾新业科技有限公司

       该会员已使用本站17年以上
    • CSD95480RWJ
    • 数量20463 
    • 厂家TI/德州仪器 
    • 封装QFN 
    • 批号24+ 
    • 原装原厂 现货现卖
    • QQ:562765057QQ：562765057 复制
      QQ:370820820QQ：370820820 复制
    • 0755-84509636 QQ:562765057QQ:370820820
    • CSD95480RWJ图

    • 深圳市中空科技有限公司

       该会员已使用本站11年以上
    • CSD95480RWJ
    • 数量12000 
    • 厂家VQFN-41 
    • 封装24+ 
    • 批号TI 
    • 原装正品可含税
    • QQ:1785982448QQ：1785982448 复制
    • 86-0755-83746109 QQ:1785982448
    • CSD95480RWJ图

    • 深圳市芯柏然科技有限公司

       该会员已使用本站7年以上
    • CSD95480RWJ
    • 数量23480 
    • 厂家TI 
    • 封装QFN 
    • 批号21+ 
    • 新到现货、一手货源、当天发货、价格低于市场
    • QQ:287673858QQ：287673858 复制
    • 0755-82533534 QQ:287673858

    产品型号CSD95480RWJ的概述

    CSD95480RWJ芯片的概述 CSD95480RWJ是一款高效能的功率管理IC，主要应用于DC-DC转换器、车载电源供应、便携式设备以及各种消费电子类产品。这款芯片是由德州仪器（Texas Instruments）设计和生产的，专门用于提供高效率、低EMI的电源解决方案。凭借其高度集成的设计，CSD95480RWJ能够满足现代电力管理系统对效率和性能的严格要求，尤其适用于需要快速充电、低功耗和高密度的应用场景。 CSD95480RWJ的详细参数 CSD95480RWJ芯片具备诸多显著参数，可以为应用提供有效的支持。以下是一些关键参数： - 输入电压范围: 4.5V至16V，适用于多种供电情境。 - 输出电流: 最大支持20A，能够满足高负载需求。 - 开关频率: 可调范围从200kHz至2MHz，用户可以根据需要选择频率，以优化效能。 - 效率: 在大多数应用条件下，提供超过95%...

    产品型号CSD95480RWJ的Datasheet PDF文件预览

    Support &  
    Community  
    Product  
    Folder  
    Order  
    Now  
    Tools &  
    Software  
    Technical  
    Documents  
    CSD95480RWJ  
    SLPS670 –JUNE 2017  
    CSD95480RWJ Synchronous Buck NexFET™ Smart Power Stage  
    1 Features  
    2 Applications  
    1
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    70-A Continuous Operating Current Capability  
    Over 95% System Efficiency at 30 A  
    High-Frequency Operation (up to 1.25 MHz)  
    Diode Emulation Function  
    •
    Multiphase Synchronous Buck Converters  
    –
    –
    High-Frequency Applications  
    High-Current, Low-Duty Cycle Applications  
    •
    •
    •
    POL DC-DC Converters  
    Temperature Compensated Bi-Directional Current  
    Sense  
    Memory and Graphic Cards  
    Desktop and Server VR12.x / VR13.x V-Core  
    Synchronous Buck Converters  
    •
    •
    •
    •
    •
    •
    Analog Temperature Output  
    Fault Monitoring  
    3 Description  
    3.3-V and 5-V PWM Signal Compatible  
    Tri-State PWM Input  
    The CSD95480RWJ NexFET™ power stage is a  
    highly optimized design for use in a high-power, high-  
    density synchronous buck converter. This product  
    integrates the driver IC and power MOSFETs to  
    complete the power stage switching function. This  
    combination produces high-current, high-efficiency,  
    and high-speed switching capability in a small 5-mm  
    × 6-mm outline package. It also integrates the  
    accurate current sensing and temperature sensing  
    functionality to simplify system design and improve  
    accuracy. In addition, the PCB footprint has been  
    optimized to help reduce design time and simplify the  
    completion of the overall system design.  
    Integrated Bootstrap Switch  
    Optimized Dead Time for Shoot-Through  
    Protection  
    •
    •
    •
    •
    •
    •
    High-Density QFN 5-mm × 6-mm Footprint  
    Ultra-Low-Inductance Package  
    System Optimized PCB Footprint  
    Thermally Enhanced Topside Cooling  
    RoHS Compliant – Lead-Free Terminal Plating  
    Halogen Free  
    Device Information(1)  
    DEVICE  
    MEDIA  
    QTY  
    PACKAGE  
    SHIP  
    Application Diagram  
    CSD95480RWJ  
    13-Inch Reel  
    2500  
    QFN  
    Tape  
    and  
    Reel  
    5.00-mm × 6.00-mm  
    Package  
    P12V  
    CSD95480RWJT  
    7-Inch Reel  
    250  
    TPS53679  
    BOOT BOOT_R  
    AVSP  
    AVSN  
    VIN  
    VOS  
    PWM  
    PWM1  
    CSD95480RWJ  
    ASKIP#  
    EN/FCCM  
    (1) For all available packages, see the orderable addendum at  
    the end of the data sheet.  
    P5V  
    VSW  
    TAO  
    VDD  
    LOAD  
    PVDD  
    LSET  
    PGND IOUT REFIN  
    ACSP1  
    TSEN  
    Typical Power Stage Efficiency and Power Loss  
    100  
    90  
    80  
    70  
    60  
    50  
    40  
    30  
    17.5  
    P12V  
    P5V  
    15  
    BOOT BOOT_R  
    VOS  
    VIN  
    APWM6  
    PWM  
    CSD95480RWJ  
    EN/FCCM  
    VREF  
    3.3V  
    VSW  
    TAO  
    ADDR  
    VDD  
    12.5  
    10  
    PVDD  
    LSET  
    PGND IOUT REFIN  
    VDD = 5 V  
    VIN = 12 V  
    VOUT = 1.8 V  
    LOUT = 150 nH  
    fSW = 600 kHz  
    TA = 25èC  
    V3P3  
    ACSP6  
    VREF  
    P12V  
    VIN_CSNIN  
    7.5  
    5
    CSPIN  
    BVSN  
    BVSP  
    VCCIO  
    BEN_VCCIO  
    P12V  
    P5V  
    SCLK  
    SDIO  
    BOOT BOOT_R  
    VIN  
    SALERT#  
    PIN_ALT#  
    VR_HOT#  
    SMB_CLK  
    SMB_ALERT#  
    SMB_DIO  
    AVR_RDY  
    BVR_RDY  
    AVR_EN  
    2.5  
    0
    VOS  
    PWM  
    BPWM1  
    BSKIP#  
    CSD95492QVM  
    EN/FCCM  
    VSW  
    TAO  
    VDD  
    LOAD  
    PVDD  
    LSET  
    PGND IOUT REFIN  
    0
    10  
    20  
    30  
    40  
    50  
    60  
    70  
    Output Current (A)  
    D000  
    VR_FAULT#  
    RESET#  
    BCSP1  
    AGND  
    Copyright  
    © 2016, Texas Instruments Incorporated  
    1
    An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
    intellectual property matters and other important disclaimers. PRODUCTION DATA.  
     
     
     
    CSD95480RWJ  
    SLPS670 –JUNE 2017  
    www.ti.com  
    Table of Contents  
    1
    2
    3
    4
    5
    6
    Features.................................................................. 1  
    8
    Device and Documentation Support.................... 7  
    8.1 Receiving Notification of Documentation Updates.... 7  
    8.2 Community Resources.............................................. 7  
    8.3 Trademarks............................................................... 7  
    8.4 Electrostatic Discharge Caution................................ 7  
    8.5 Glossary.................................................................... 7  
    Applications ........................................................... 1  
    Description ............................................................. 1  
    Revision History..................................................... 2  
    Pin Configuration and Functions......................... 3  
    Specifications......................................................... 4  
    6.1 Absolute Maximum Ratings ...................................... 4  
    6.2 ESD Ratings.............................................................. 4  
    6.3 Recommended Operating Conditions....................... 4  
    6.4 Thermal Information.................................................. 5  
    Application Schematic .......................................... 6  
    9
    Mechanical, Packaging, and Orderable  
    Information ............................................................. 8  
    9.1 Mechanical Drawing.................................................. 8  
    9.2 Recommended PCB Land Pattern............................ 9  
    9.3 Recommended Stencil Opening ............................. 10  
    7
    4 Revision History  
    DATE  
    REVISION  
    NOTES  
    June 2017  
    *
    Initial release.  
    2
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    SLPS670 –JUNE 2017  
    5 Pin Configuration and Functions  
    Top View  
    39 38 37 36 35 34 33 32 31 30  
    VOS  
    AGND  
    VDD  
    1
    2
    3
    4
    5
    6
    VIN  
    29  
    28 VIN  
    27 VIN  
    26 VIN  
    25 VIN  
    VIN  
    40  
    PVDD  
    PGND  
    NC  
    41  
    PGND  
    24  
    23 PGND  
    22 PGND  
    21 PGND  
    PGND  
    PGND  
    PGND  
    7
    8
    9
    PGND  
    PGND  
    20  
    10 11 12 13 14 15 16 17 18 19  
    Pin Functions  
    PIN  
    DESCRIPTION  
    NAME  
    VOS  
    NUMBER  
    1
    2
    Output voltage sensing pin for the internal current sensing circuitry.  
    This pin is internally connected to PGND.  
    AGND  
    VDD  
    3
    Supply voltage for internal circuitry. This pin should be bypassed directly to pin 2.  
    Supply voltage for gate drivers. This pin should be bypassed to PGND.  
    Power ground.  
    PVDD  
    PGND  
    NC  
    4
    5
    6
    Not connected. This pin needs to be left floating in application.  
    Power ground.  
    PGND  
    VSW  
    PGND  
    VIN  
    7-9  
    10-19  
    20-24  
    25-30  
    31  
    Phase node connecting the HS MOSFET source and LS MOSFET drain – pin connection to the output inductor.  
    Power ground.  
    Input voltage pin. Connect input capacitors close to this pin.  
    Not connected. This pin needs to be left floating in application.  
    Return path for HS gate driver. It is connected to VSW internally.  
    NC  
    BOOTR  
    32  
    Bootstrap capacitor connection. Connect a minimum 0.1-µF, 16-V, X5R ceramic capacitor from BOOT to  
    BOOTR pins. The bootstrap capacitor provides the charge to turn on the control FET. The bootstrap diode is  
    integrated.  
    BOOT  
    PWM  
    33  
    34  
    Tri-state input from external controller. Logic low sets control FET gate low and sync FET gate high. Logic high  
    sets control FET gate high and sync FET gate low. Both MOSFET gates are set low if PWM stays in Hi-Z for  
    greater than the tri-state shutdown holdoff time (T3HT).  
    This dual function pin either enables the diode emulation function or can be used as a simple enable for the  
    device. When this pin is driven into the tri-state window and held there for more than the tri-state holdoff time,  
    diode emulation mode is enabled for sync FET. When the pin is high, device operates in forced continuous  
    conduction mode. When the pin is low, both FETs are held off. An internal resistor pulls this pin low if left  
    floating.  
    EN/FCCM  
    35  
    Temperature amplifier output. Reports a voltage proportional to the IC temperature. An ORing diode is integrated  
    in the IC. When used in multiphase application, a single wire can be used to connect the TAO pins of all the ICs.  
    Only the highest temperature will be reported. TAO will be pulled up to 3.3 V if thermal shutdown LSOC or HSS  
    detection circuit is tripped.  
    TAO/FLT  
    36  
    LSET  
    IOUT  
    REFIN  
    PGND  
    NC  
    37  
    38  
    39  
    40  
    41  
    A resistor from this pin to PGND pin sets the inductor value for the internal current sensing circuitry.  
    Output of current sensing amplifier. V(IOUT) – V(REFIN) is proportional to the phase current.  
    External reference voltage input for current sensing amplifier.  
    Power ground.  
    Not connected. This pin needs to be left floating in application.  
    Copyright © 2017, Texas Instruments Incorporated  
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    6 Specifications  
    6.1 Absolute Maximum Ratings  
    TA = 25°C (unless otherwise stated)(1)  
    MIN  
    –0.3  
    –0.3  
    MAX  
    UNIT  
    V
    VIN to PGND  
    20  
    VIN to VSW  
    20  
    V
    VIN to VSW (10 ns)  
    VSW to PGND  
    23  
    V
    –0.3  
    –7  
    20  
    V
    VSW to PGND (10 ns)  
    VDD to PGND  
    23  
    V
    –0.3  
    –0.3  
    –0.3  
    –0.3  
    –0.3  
    –0.3  
    –0.3  
    –55  
    –55  
    7
    V
    PVDD to PGND  
    7
    VDD + 0.3  
    7
    V
    EN/FCCM, TAO/FLT, LSET to PGND  
    IOUT, VOS, PWM to PGND  
    REFIN  
    V
    V
    3.6  
    V
    BOOT to BOOTR(2)  
    VDD + 0.3  
    30  
    V
    BOOT to PGND  
    V
    TJ  
    Operating junction temperature  
    Storage temperature  
    150  
    °C  
    °C  
    Tstg  
    150  
    (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
    only, and functional operation of the device at these or any other conditions beyond those indicated in the Recommended Operating  
    Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
    (2) Should not exceed 7 V.  
    6.2 ESD Ratings  
    VALUE  
    ±2000  
    ±500  
    UNIT  
    Human-body model (HBM)  
    V(ESD)  
    Electrostatic discharge  
    V
    Charged-device model (CDM)  
    6.3 Recommended Operating Conditions  
    TA = 25°C (unless otherwise stated)  
    MIN  
    4.5  
    4.5  
    4.5  
    MAX  
    5.5  
    UNIT  
    VDD  
    Driver supply voltage  
    Gate drive voltage  
    Input supply voltage(1)  
    Output voltage  
    V
    V
    PVDD  
    VIN  
    5.5  
    16  
    V
    VOUT  
    5.5  
    V
    PWM to PGND  
    VDD + 0.3  
    70  
    V
    IOUT  
    Continuous output current  
    IOUT-PK Peak output current(3)  
    A
    VIN = 12 V, VDD = 5 V, PVDD = 5 V, VOUT = 1.2 V,  
    ƒSW = 500 kHz(2)  
    90  
    A
    ƒSW  
    Switching frequency  
    CBST = 0.1 µF (min), VOUT = 2.5 V (max)  
    ƒSW = 1 MHz  
    1250  
    85%  
    kHz  
    On-time duty cycle  
    Minimum PWM on-time  
    Operating junction temperature  
    20  
    ns  
    °C  
    –40  
    125  
    (1) Operating at high VIN can create excessive AC voltage overshoots on the switch node (VSW) during MOSFET switching transients. For  
    reliable operation, the switch node (VSW) to ground voltage must remain at or below the Absolute Maximum Ratings.  
    (2) Measurement made with six 10-µF (TDK C3216X7R1C106KT or equivalent) ceramic capacitors across VIN to PGND pins.  
    (3) System conditions as defined in Note 2. Peak output current is applied for tp = 50 µs.  
    4
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    6.4 Thermal Information  
    TA = 25°C (unless otherwise stated)  
    THERMAL METRIC  
    MIN  
    TYP  
    MAX UNIT  
    °C/W  
    θJC  
    θJB  
    ΨJT  
    Thermal resistance, junction-to-case (top of package)  
    Thermal resistance, junction-to-board(1)  
    7.4  
    2.2  
    0.9  
    °C/W  
    Junction-to-top characterization parameter  
    °C/W  
    (1) θJB is determined with the device mounted on a 1-in2 (6.45-cm2), 2-oz (0.071-mm) thick Cu pad on a 1.5-in × 1.5-in, 0.06-in (1.52-mm)  
    thick FR4 board based on hottest board temperature within 1 mm of the package.  
    Copyright © 2017, Texas Instruments Incorporated  
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    7 Application Schematic  
    P12V  
    P5V  
    TPS53679  
    BOOT BOOT_R  
    AVSP  
    AVSN  
    VIN  
    VOS  
    PWM  
    PWM1  
    CSD95480RWJ  
    ASKIP#  
    EN/FCCM  
    VSW  
    TAO  
    VDD  
    LOAD  
    PVDD  
    LSET  
    PGND IOUT REFIN  
    ACSP1  
    TSEN  
    P12V  
    P5V  
    BOOT BOOT_R  
    VOS  
    VIN  
    PWM  
    APWM6  
    CSD95480RWJ  
    EN/FCCM  
    VREF  
    3.3V  
    VSW  
    TAO  
    ADDR  
    VDD  
    PVDD  
    LSET  
    PGND IOUT REFIN  
    V3P3  
    ACSP6  
    VREF  
    P12V  
    VIN_CSNIN  
    CSPIN  
    BVSN  
    BVSP  
    VCCIO  
    BEN_VCCIO  
    P12V  
    P5V  
    SCLK  
    SDIO  
    BOOT BOOT_R  
    VIN  
    SALERT#  
    PIN_ALT#  
    VR_HOT#  
    SMB_CLK  
    SMB_ALERT#  
    SMB_DIO  
    AVR_RDY  
    BVR_RDY  
    AVR_EN  
    VOS  
    PWM  
    BPWM1  
    BSKIP#  
    CSD95492QVM  
    EN/FCCM  
    VSW  
    TAO  
    VDD  
    LOAD  
    PVDD  
    LSET  
    PGND IOUT REFIN  
    VR_FAULT#  
    RESET#  
    BCSP1  
    AGND  
    Copyright © 2016, Texas Instruments Incorporated  
    Figure 1. Application Schematic  
    Note: The schematic in Figure 1 is a conceptual drawing only. Actual designs may require additional components  
    not shown.  
    6
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    SLPS670 –JUNE 2017  
    8 Device and Documentation Support  
    8.1 Receiving Notification of Documentation Updates  
    To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper  
    right corner, click on Alert me to register and receive a weekly digest of any product information that has  
    changed. For change details, review the revision history included in any revised document.  
    8.2 Community Resources  
    The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective  
    contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of  
    Use.  
    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration  
    among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help  
    solve problems with fellow engineers.  
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and  
    contact information for technical support.  
    8.3 Trademarks  
    NexFET, E2E are trademarks of Texas Instruments.  
    All other trademarks are the property of their respective owners.  
    8.4 Electrostatic Discharge Caution  
    These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
    during storage or handling to prevent electrostatic damage to the MOS gates.  
    8.5 Glossary  
    SLYZ022 — TI Glossary.  
    This glossary lists and explains terms, acronyms, and definitions.  
    Copyright © 2017, Texas Instruments Incorporated  
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    9 Mechanical, Packaging, and Orderable Information  
    The following pages include mechanical, packaging, and orderable information. This information is the most  
    current data available for the designated devices. This data is subject to change without notice and revision of  
    this document. For browser-based versions of this data sheet, refer to the left-hand navigation.  
    9.1 Mechanical Drawing  
    5.1  
    4.9  
    A
    B
    PIN 1 INDEX AREA  
    6.1  
    5.9  
    C
    1.05 MAX  
    SEATING PLANE  
    0.08  
    (0.203) TYP  
    0.05  
    0.00  
    0.3  
    0.2  
    9X 0.45  
    10X  
    0.13 TYP  
    10  
    19  
    0.3  
    0.2  
    13X  
    2.6 0.1  
    2.2 0.1  
    9
    20  
    2.05  
    1.95  
    7
    6
    10X 0.45  
    0.8 0.1  
    0.4 0.1  
    0.1 0.1  
    R0.05  
    TYP  
    24  
    25  
    41  
    0.000  
    PKG  
    0.3 0.1  
    0.45  
    0.35  
    16X  
    40  
    2.25 0.1  
    2.275  
    2.175  
    29  
    1
    PIN 1 ID  
    39  
    30  
    (45 X0.3)  
    0.3  
    0.2  
    14X 0.45  
    16X  
    0.1  
    C A B  
    0.05  
    4221590/C 01/2017  
    1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning  
    and tolerancing per ASME Y14.5M.  
    2. This drawing is subject to change without notice.  
    3. The package thermal pads must be soldered to the printed circuit board for optimal thermal and mechanical  
    performance.  
    8
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    9.2 Recommended PCB Land Pattern  
    METAL UNDER  
    SOLDER MASK  
    TYP  
    16X (0.6)  
    39  
    30  
    (2.9)  
    16X (0.25)  
    1
    (2.25)  
    (2.175)  
    (2.05)  
    (2.25)  
    29  
    SOLDER MASK  
    OPENING, TYP  
    40  
    (1.275)  
    14X (0.45)  
    (0.5)  
    (0.3)  
    25  
    24  
    (0.3)  
    (0.025)  
    6
    (0.1)  
    0.000 PKG  
    (0.3)  
    41  
    (0.4)  
    (R0.05) TYP  
    5X (1.15)  
    (0.8)  
    7
    (1.05)  
    19X (0.45)  
    (
    0.2) VIA  
    TYP  
    9
    5X (2)  
    (2.05)  
    20  
    (2.2)  
    (0.05) MIN  
    TYP  
    (2.6)  
    (2.75) TYP  
    (3.2) TYP  
    19  
    10  
    PKG  
    20X (0.25)  
    1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning  
    and tolerancing per ASME Y14.5M.  
    2. This drawing is subject to change without notice.  
    3. This package is designed to be soldered to thermal pads on the board. For more information, see QFN/SON  
    PCB Attachment (SLUA271).  
    Copyright © 2017, Texas Instruments Incorporated  
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    9.3 Recommended Stencil Opening  
    29X (0.6)  
    39  
    30  
    29X (0.25)  
    1
    EXPOSED  
    METAL  
    4X (2.245)  
    29  
    24X (0.45)  
    4X (1.375)  
    4X (1.175)  
    40  
    EXPOSED  
    METAL  
    SOLDER MASK  
    OPENING  
    TYP  
    25  
    24  
    (0.375)  
    4X (0.305)  
    (0.025)  
    6
    (0.1)  
    (0.4)  
    0.000 PKG  
    3X (0.13)  
    (0.25)  
    41  
    (0.84)  
    (1.05)  
    7
    9
    3X (1.05)  
    3X (1.25)  
    (R0.05) TYP  
    20  
    EXPOSED  
    METAL  
    4X (2.17)  
    (2.6)  
    (2.75) TYP  
    METAL UNDER  
    SOLDER MASK  
    TYP  
    10  
    (3.2) TYP  
    19  
    10X (0.25)  
    9X (0.45)  
    SOLDER PAST EXAMPLE  
    BASED ON 0.125 mm THICK STENCIL  
    1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning  
    and tolerancing per ASME Y14.5M.  
    2. This drawing is subject to change without notice.  
    3. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525  
    may have alternate design recommendations.  
    10  
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    PACKAGE OPTION ADDENDUM  
    www.ti.com  
    10-Dec-2020  
    PACKAGING INFORMATION  
    Orderable Device  
    Status Package Type Package Pins Package  
    Eco Plan  
    Lead finish/  
    Ball material  
    MSL Peak Temp  
    Op Temp (°C)  
    Device Marking  
    Samples  
    Drawing  
    Qty  
    2500  
    250  
    (1)  
    (2)  
    (3)  
    (4/5)  
    (6)  
    CSD95480RWJ  
    CSD95480RWJT  
    ACTIVE  
    VQFN-CLIP  
    VQFN-CLIP  
    RWJ  
    41  
    41  
    RoHS-Exempt  
    & Green  
    NIPDAU | SN  
    Level-2-260C-1 YEAR  
    Level-2-260C-1 YEAR  
    -55 to 150  
    -55 to 150  
    95480RWJ  
    95480RWJ  
    ACTIVE  
    RWJ  
    RoHS-Exempt  
    & Green  
    NIPDAU | SN  
    (1) The marketing status values are defined as follows:  
    ACTIVE: Product device recommended for new designs.  
    LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
    NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
    PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
    OBSOLETE: TI has discontinued the production of the device.  
    (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
    do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
    reference these types of products as "Pb-Free".  
    RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
    Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
    flame retardants must also meet the <=1000ppm threshold requirement.  
    (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
    (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
    (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
    of the previous line and the two combined represent the entire Device Marking for that device.  
    (6)  
    Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
    lines if the finish value exceeds the maximum column width.  
    Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
    provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
    continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
    TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
    In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
    Addendum-Page 1  
    PACKAGE OPTION ADDENDUM  
    www.ti.com  
    10-Dec-2020  
    Addendum-Page 2  
    PACKAGE MATERIALS INFORMATION  
    www.ti.com  
    3-Jun-2023  
    TAPE AND REEL INFORMATION  
    REEL DIMENSIONS  
    TAPE DIMENSIONS  
    K0  
    P1  
    W
    B0  
    Reel  
    Diameter  
    Cavity  
    A0  
    A0 Dimension designed to accommodate the component width  
    B0 Dimension designed to accommodate the component length  
    K0 Dimension designed to accommodate the component thickness  
    Overall width of the carrier tape  
    W
    P1 Pitch between successive cavity centers  
    Reel Width (W1)  
    QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE  
    Sprocket Holes  
    Q1 Q2  
    Q3 Q4  
    Q1 Q2  
    Q3 Q4  
    User Direction of Feed  
    Pocket Quadrants  
    *All dimensions are nominal  
    Device  
    Package Package Pins  
    Type Drawing  
    SPQ  
    Reel  
    Reel  
    A0  
    B0  
    K0  
    P1  
    W
    Pin1  
    Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
    (mm) W1 (mm)  
    CSD95480RWJT  
    CSD95480RWJT  
    VQFN-  
    CLIP  
    RWJ  
    RWJ  
    41  
    41  
    250  
    250  
    180.0  
    12.4  
    5.3  
    6.3  
    1.2  
    8.0  
    12.0  
    Q1  
    VQFN-  
    CLIP  
    180.0  
    12.4  
    5.3  
    6.3  
    1.2  
    8.0  
    12.0  
    Q1  
    Pack Materials-Page 1  
    PACKAGE MATERIALS INFORMATION  
    www.ti.com  
    3-Jun-2023  
    TAPE AND REEL BOX DIMENSIONS  
    Width (mm)  
    H
    W
    L
    *All dimensions are nominal  
    Device  
    Package Type Package Drawing Pins  
    SPQ  
    Length (mm) Width (mm) Height (mm)  
    CSD95480RWJT  
    CSD95480RWJT  
    VQFN-CLIP  
    VQFN-CLIP  
    RWJ  
    RWJ  
    41  
    41  
    250  
    250  
    213.0  
    210.0  
    191.0  
    185.0  
    35.0  
    35.0  
    Pack Materials-Page 2  
    IMPORTANT NOTICE AND DISCLAIMER  
    TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE  
    DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”  
    AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY  
    IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD  
    PARTY INTELLECTUAL PROPERTY RIGHTS.  
    These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate  
    TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable  
    standards, and any other safety, security, regulatory or other requirements.  
    These resources are subject to change without notice. TI grants you permission to use these resources only for development of an  
    application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license  
    is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you  
    will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these  
    resources.  
    TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with  
    such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for  
    TI products.  
    TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE  
    Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
    Copyright © 2023, Texas Instruments Incorporated  
    配单直通车
    CSD95480RWJ产品参数
    型号:CSD95480RWJ
    Brand Name：Texas Instruments
    是否无铅： 不含铅
    是否Rohs认证： 符合
    生命周期：Active
    包装说明：HQCCN,
    Reach Compliance Code：not_compliant
    Factory Lead Time：12 weeks
    风险等级：1.72
    其他特性：ADJUSTABLE VOLTAGE RANGE IS UPTO 5.5V
    模拟集成电路 - 其他类型：SWITCHING REGULATOR
    控制技术：PULSE WIDTH MODULATION
    最大输入电压：16 V
    最小输入电压：4.5 V
    标称输入电压：12 V
    JESD-30 代码：R-XQCC-N41
    JESD-609代码：e3
    长度：6 mm
    湿度敏感等级：2
    功能数量：1
    端子数量：41
    最高工作温度：150 °C
    最低工作温度：-55 °C
    最大输出电流：90 A
    封装主体材料：UNSPECIFIED
    封装代码：HQCCN
    封装形状：RECTANGULAR
    封装形式：CHIP CARRIER, HEAT SINK/SLUG
    座面最大高度：1.05 mm
    表面贴装：YES
    切换器配置：BUCK
    最大切换频率：1250 kHz
    温度等级：MILITARY
    端子面层：Matte Tin (Sn)
    端子形式：NO LEAD
    端子节距：1.05 mm
    端子位置：QUAD
    宽度：5 mm
    Base Number Matches：1
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