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  • 北京元坤伟业科技有限公司

         该会员已使用本站17年以上

  • CSD97374Q4M
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  • QQ:857273081QQ:857273081 复制
    QQ:1594462451QQ:1594462451 复制
  • 010-62104931、62106431、62104891、62104791 QQ:857273081QQ:1594462451
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  • CSD97374Q4M图
  • 深圳市恒达亿科技有限公司

     该会员已使用本站12年以上
  • CSD97374Q4M 现货库存
  • 数量5000 
  • 厂家TI 
  • 封装VSON8 
  • 批号25+ 
  • 全新原装,欢迎查询
  • QQ:867789136QQ:867789136 复制
    QQ:1245773710QQ:1245773710 复制
  • 0755-82772189 QQ:867789136QQ:1245773710
  • CSD97374Q4M图
  • 深圳市金嘉锐电子有限公司

     该会员已使用本站14年以上
  • CSD97374Q4M 现货库存
  • 数量32560 
  • 厂家TI 
  • 封装QFN 
  • 批号2024+ 
  • 【原装优势★★★绝对有货】
  • QQ:2643490444QQ:2643490444 复制
  • 0755-22929859 QQ:2643490444
  • CSD97374Q4M图
  • 集好芯城

     该会员已使用本站13年以上
  • CSD97374Q4M 现货库存
  • 数量18210 
  • 厂家TI(德州仪器) 
  • 封装 
  • 批号22+ 
  • 原装原厂现货
  • QQ:3008092965QQ:3008092965 复制
    QQ:3008092965QQ:3008092965 复制
  • 0755-83239307 QQ:3008092965QQ:3008092965
  • CSD97374Q4M图
  • 深圳市宏诺德电子科技有限公司

     该会员已使用本站8年以上
  • CSD97374Q4M 现货库存
  • 数量36800 
  • 厂家TI 
  • 封装SON 
  • 批号22+ 
  • 全新进口原厂原装,优势现货库存,有需要联系电话:15817309912 QQ:783839662
  • QQ:84556259QQ:84556259 复制
    QQ:783839662QQ:783839662 复制
  • 0755- QQ:84556259QQ:783839662
  • CSD97374Q4M图
  • 深圳市广百利电子有限公司

     该会员已使用本站6年以上
  • CSD97374Q4M 现货库存
  • 数量18500 
  • 厂家TI(德州仪器) 
  • 封装VSON-CLIP-8 
  • 批号23+ 
  • ★★全网低价,原装原包★★
  • QQ:1483430049QQ:1483430049 复制
  • 0755-83235525 QQ:1483430049
  • CSD97374Q4M图
  • 深圳市华来深电子有限公司

     该会员已使用本站13年以上
  • CSD97374Q4M 现货库存
  • 数量2500 
  • 厂家TI 
  • 封装VSON8 
  • 批号20+ 
  • 受权代理!全新原装现货特价热卖!
  • QQ:1258645397QQ:1258645397 复制
    QQ:876098337QQ:876098337 复制
  • 0755-83238902 QQ:1258645397QQ:876098337
  • CSD97374Q4M图
  • 深圳市宗天技术开发有限公司

     该会员已使用本站10年以上
  • CSD97374Q4M 现货库存
  • 数量8000 
  • 厂家TI(德州仪器) 
  • 封装VSON-CLIP-8 
  • 批号22+ 
  • 宗天技术 原装现货/假一赔十
  • QQ:444961496QQ:444961496 复制
    QQ:2824256784QQ:2824256784 复制
  • 0755-88601327 QQ:444961496QQ:2824256784
  • CSD97374Q4M图
  • 深圳市裕诚科通电子有限公司

     该会员已使用本站1年以上
  • CSD97374Q4M 现货库存
  • 数量38000 
  • 厂家TI正品现货 
  • 封装VSON8 
  • 批号2219+ 
  • 2500/卷特价支持深圳原装现货
  • QQ:2885765644QQ:2885765644 复制
  • 00755-83776933 QQ:2885765644
  • CSD97374Q4M图
  • 深圳市芯脉实业有限公司

     该会员已使用本站11年以上
  • CSD97374Q4M 现货库存
  • 数量2500 
  • 厂家TI 
  • 封装(DPC) 
  • 批号新批次 
  • 新到现货、一手货源、当天发货、bom配单
  • QQ:2881512844QQ:2881512844 复制
  • 075584507705 QQ:2881512844
  • CSD97374Q4M图
  • 深圳市宏捷佳电子科技有限公司

     该会员已使用本站12年以上
  • CSD97374Q4M 热卖库存
  • 数量82000 
  • 厂家TI/德州仪器 
  • 封装VSON8 
  • 批号2023+ 
  • 原装原包现货支持实单
  • QQ:2885134554QQ:2885134554 复制
    QQ:2885134398QQ:2885134398 复制
  • 0755-22669259 QQ:2885134554QQ:2885134398
  • CSD97374Q4M图
  • 深圳市裕诚科通电子有限公司

     该会员已使用本站1年以上
  • CSD97374Q4M 热卖库存
  • 数量38000 
  • 厂家TI正品现货 
  • 封装VSON8 
  • 批号2219+ 
  • 2500/卷特价支持深圳原装现货
  • QQ:2885765644QQ:2885765644 复制
  • 00755-83776933 QQ:2885765644
  • CSD97374Q4M图
  • 深圳市拓森弘电子有限公司

     该会员已使用本站1年以上
  • CSD97374Q4M
  • 数量5790 
  • 厂家TI/德州仪器 
  • 封装VSON8 
  • 批号21+ 
  • 全新原装正品,库存现货实报
  • QQ:1300774727QQ:1300774727 复制
  • 13714410484 QQ:1300774727
  • CSD97374Q4M图
  • 深圳市芯福林电子有限公司

     该会员已使用本站15年以上
  • CSD97374Q4M
  • 数量85000 
  • 厂家TI/德州仪器 
  • 封装VSON-8 
  • 批号23+ 
  • 真实库存全新原装正品!代理此型号
  • QQ:2881495753QQ:2881495753 复制
  • 0755-23605827 QQ:2881495753
  • CSD97374Q4M图
  • 深圳市芯福林电子有限公司

     该会员已使用本站15年以上
  • CSD97374Q4M
  • 数量13880 
  • 厂家TI 
  • 封装8VSON (3.5x4.5) 
  • 批号21+ 
  • 公司只售原装 支持实单
  • QQ:2881495751QQ:2881495751 复制
  • 0755-88917743 QQ:2881495751
  • CSD97374Q4M图
  • 深圳市旺能芯科技有限公司

     该会员已使用本站4年以上
  • CSD97374Q4M
  • 数量15000 
  • 厂家TI/德州仪器 
  • 封装VSON-8 
  • 批号22+ 
  • 深圳全新原装库存现货
  • QQ:2881495751QQ:2881495751 复制
  • 13602549709 QQ:2881495751
  • CSD97374Q4M图
  • 深圳市龙腾新业科技有限公司

     该会员已使用本站17年以上
  • CSD97374Q4M
  • 数量19777 
  • 厂家TI/德州仪器 
  • 封装QFN8 
  • 批号24+ 
  • 原装原厂 现货现卖
  • QQ:562765057QQ:562765057 复制
    QQ:370820820QQ:370820820 复制
  • 0755-84509636 QQ:562765057QQ:370820820
  • CSD97374Q4M图
  • 千层芯半导体(深圳)有限公司

     该会员已使用本站9年以上
  • CSD97374Q4M
  • 数量12000 
  • 厂家TI 
  • 封装SMD 
  • 批号2017+ 
  • 原厂/代理渠道价格优势
  • QQ:2685694974QQ:2685694974 复制
    QQ:2593109009QQ:2593109009 复制
  • 0755-83978748,0755-23611964,13760152475 QQ:2685694974QQ:2593109009
  • CSD97374Q4M图
  • 深圳市恒益昌科技有限公司

     该会员已使用本站6年以上
  • CSD97374Q4M
  • 数量5000 
  • 厂家TI 
  • 封装VSON8 
  • 批号25+ 
  • 原装正品长期供货
  • QQ:3336148967QQ:3336148967 复制
    QQ:974337758QQ:974337758 复制
  • 0755-82723761 QQ:3336148967QQ:974337758
  • CSD97374Q4M图
  • 深圳市恒达亿科技有限公司

     该会员已使用本站12年以上
  • CSD97374Q4M
  • 数量6500 
  • 厂家TI 
  • 封装VSON8 
  • 批号25+ 
  • 只做原装正品 现货销售
  • QQ:867789136QQ:867789136 复制
    QQ:1245773710QQ:1245773710 复制
  • 0755-82772189 QQ:867789136QQ:1245773710
  • CSD97374Q4M图
  • 深圳市羿芯诚电子有限公司

     该会员已使用本站7年以上
  • CSD97374Q4M
  • 数量54 
  • 厂家TI/德州仪器 
  • 封装QFN 
  • 批号21+ 
  • 羿芯诚只做原装 原厂渠道 价格优势
  • QQ:2881498351QQ:2881498351 复制
  • 0755-22968581 QQ:2881498351
  • CSD97374Q4M图
  • 深圳市和诚半导体有限公司

     该会员已使用本站11年以上
  • CSD97374Q4M
  • 数量5600 
  • 厂家TI 
  • 封装QFN 
  • 批号23+ 
  • 100%深圳原装现货库存
  • QQ:2276916927QQ:2276916927 复制
    QQ:1977615742QQ:1977615742 复制
  • 18929336553 QQ:2276916927QQ:1977615742
  • CSD97374Q4M图
  • 深圳市欧立现代科技有限公司

     该会员已使用本站12年以上
  • CSD97374Q4M
  • 数量5000 
  • 厂家TI 
  • 封装QFN 
  • 批号24+ 
  • 全新原装现货,欢迎询购!
  • QQ:1950791264QQ:1950791264 复制
    QQ:221698708QQ:221698708 复制
  • 0755-83222787 QQ:1950791264QQ:221698708
  • CSD97374Q4M图
  • 深圳市得捷芯城科技有限公司

     该会员已使用本站11年以上
  • CSD97374Q4M
  • 数量33250 
  • 厂家TI/德州仪器 
  • 封装NA/ 
  • 批号23+ 
  • 原装现货,当天可交货,原型号开票
  • QQ:3007977934QQ:3007977934 复制
    QQ:3007947087QQ:3007947087 复制
  • 0755-82546830 QQ:3007977934QQ:3007947087
  • CSD97374Q4M图
  • 集好芯城

     该会员已使用本站13年以上
  • CSD97374Q4M
  • 数量19777 
  • 厂家TI/德州仪器 
  • 封装QFN8 
  • 批号最新批次 
  • 原装原厂 现货现卖
  • QQ:3008092965QQ:3008092965 复制
    QQ:3008092965QQ:3008092965 复制
  • 0755-83239307 QQ:3008092965QQ:3008092965
  • CSD97374Q4M图
  • 深圳市羿芯诚电子有限公司

     该会员已使用本站7年以上
  • CSD97374Q4M
  • 数量8800 
  • 厂家TI/德州仪器 
  • 封装VSON8 
  • 批号新年份 
  • 羿芯诚只做原装,原厂渠道,价格优势可谈!
  • QQ:2853992132QQ:2853992132 复制
  • 0755-82570683 QQ:2853992132
  • CSD97374Q4M图
  • 深圳市得捷芯城科技有限公司

     该会员已使用本站11年以上
  • CSD97374Q4M
  • 数量9548 
  • 厂家TI(德州仪器) 
  • 封装VSON8 
  • 批号23+ 
  • 原厂可订货,技术支持,直接渠道。可签保供合同
  • QQ:3007947087QQ:3007947087 复制
    QQ:3007947087QQ:3007947087 复制
  • 0755-83061789 QQ:3007947087QQ:3007947087
  • CSD97374Q4M图
  • 深圳市宏诺德电子科技有限公司

     该会员已使用本站8年以上
  • CSD97374Q4M
  • 数量68000 
  • 厂家TI 
  • 封装VSON8 
  • 批号22+ 
  • 全新进口原厂原装,优势现货库存,有需要联系电话:18818596997 QQ:84556259
  • QQ:84556259QQ:84556259 复制
    QQ:783839662QQ:783839662 复制
  • 0755- QQ:84556259QQ:783839662
  • CSD97374Q4M图
  • 深圳市华斯顿电子科技有限公司

     该会员已使用本站16年以上
  • CSD97374Q4M
  • 数量64567 
  • 厂家TI 
  • 封装VSON8 
  • 批号2023+ 
  • 绝对原装全新正品现货/优势渠道商、原盘原包原盒
  • QQ:364510898QQ:364510898 复制
    QQ:515102657QQ:515102657 复制
  • 0755-83777708“进口原装正品专供” QQ:364510898QQ:515102657
  • CSD97374Q4M图
  • 深圳市华斯顿电子科技有限公司

     该会员已使用本站16年以上
  • CSD97374Q4M
  • 数量12500 
  • 厂家TI/德州仪器 
  • 封装VSON-CLIP-8 
  • 批号2023+ 
  • 绝对原装正品全新深圳进口现货,优质渠道供应商!
  • QQ:1002316308QQ:1002316308 复制
    QQ:515102657QQ:515102657 复制
  • 美驻深办0755-83777708“进口原装正品专供” QQ:1002316308QQ:515102657
  • CSD97374Q4M图
  • 深圳市集创讯科技有限公司

     该会员已使用本站5年以上
  • CSD97374Q4M
  • 数量9500 
  • 厂家TI/德州仪器 
  • 封装 
  • 批号24+ 
  • 原装进口正品现货,假一罚十价格优势
  • QQ:2885393494QQ:2885393494 复制
    QQ:2885393495QQ:2885393495 复制
  • 0755-83244680 QQ:2885393494QQ:2885393495
  • CSD97374Q4M图
  • 深圳市晶美隆科技有限公司

     该会员已使用本站14年以上
  • CSD97374Q4M
  • 数量16851 
  • 厂家TI/德州仪器 
  • 封装TI-2019 
  • 批号23+ 
  • 全新原装正品现货热卖
  • QQ:2885348339QQ:2885348339 复制
    QQ:2885348317QQ:2885348317 复制
  • 0755-82519391 QQ:2885348339QQ:2885348317
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  • 深圳市惠诺德电子有限公司

     该会员已使用本站7年以上
  • CSD97374Q4M
  • 数量29500 
  • 厂家Texas Instruments 
  • 封装IC SYNC BUCK NEXFET 8VSON 
  • 批号21+ 
  • 只做原装现货代理
  • QQ:1211267741QQ:1211267741 复制
    QQ:1034782288QQ:1034782288 复制
  • 159-7688-9073 QQ:1211267741QQ:1034782288
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  • 深圳市华芯盛世科技有限公司

     该会员已使用本站13年以上
  • CSD97374Q4M
  • 数量865000 
  • 厂家TI/德州仪器 
  • 封装SOIC 
  • 批号最新批号 
  • 一级代理,原装特价现货!
  • QQ:2881475757QQ:2881475757 复制
  • 0755-83225692 QQ:2881475757
  • CSD97374Q4M图
  • 深圳市美思瑞电子科技有限公司

     该会员已使用本站12年以上
  • CSD97374Q4M
  • 数量12245 
  • 厂家TI/德州仪器 
  • 封装VSON-8 
  • 批号22+ 
  • 现货,原厂原装假一罚十!
  • QQ:2885659458QQ:2885659458 复制
    QQ:2885657384QQ:2885657384 复制
  • 0755-83952260 QQ:2885659458QQ:2885657384
  • CSD97374Q4M图
  • 深圳市惊羽科技有限公司

     该会员已使用本站11年以上
  • CSD97374Q4M
  • 数量9328 
  • 厂家TI-德州仪器 
  • 封装DFN-8.贴片 
  • 批号▉▉:2年内 
  • ▉▉¥17.6元一有问必回一有长期订货一备货HK仓库
  • QQ:43871025QQ:43871025 复制
  • 131-4700-5145---Q-微-恭-候---有-问-秒-回 QQ:43871025
  • CSD97374Q4M图
  • 深圳市能元时代电子有限公司

     该会员已使用本站10年以上
  • CSD97374Q4M
  • 数量50000 
  • 厂家TI 
  • 封装VSON-8 
  • 批号24+ 
  • 公司原装现货可含税!假一罚十!
  • QQ:2885637848QQ:2885637848 复制
    QQ:2885658492QQ:2885658492 复制
  • 0755-84502810 QQ:2885637848QQ:2885658492
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  • 深圳市英德州科技有限公司

     该会员已使用本站2年以上
  • CSD97374Q4M
  • 数量9800 
  • 厂家TI(德州仪器) 
  • 封装VSON-CLIP-8 
  • 批号2年内 
  • 原厂渠道 正品保障 长期供应
  • QQ:2355734291QQ:2355734291 复制
  • -0755-88604592 QQ:2355734291
  • CSD97374Q4M图
  • 深圳市拓亿芯电子有限公司

     该会员已使用本站12年以上
  • CSD97374Q4M
  • 数量9800 
  • 厂家TI 
  • 封装VSON8 
  • 批号23+ 
  • 全新原装现货,假一赔十PCA9306DC1
  • QQ:1774550803QQ:1774550803 复制
    QQ:2924695115QQ:2924695115 复制
  • 0755-82777855 QQ:1774550803QQ:2924695115
  • CSD97374Q4M.图
  • 深圳市创德丰电子有限公司

     该会员已使用本站15年以上
  • CSD97374Q4M.
  • 数量
  • 厂家专营TI/BB 
  • 封装长期收购 
  • 批号1506+ 
  • 长期收购此型号/专收TI/BB全系列
  • QQ:2851807192QQ:2851807192 复制
    QQ:2851807191QQ:2851807191 复制
  • 86-755-83226910, QQ:2851807192QQ:2851807191
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  • 深圳市毅创腾电子科技有限公司

     该会员已使用本站16年以上
  • CSD97374Q4M
  • 数量15000 
  • 厂家TI 渠道特价 
  • 封装DPC8 
  • 批号22+ 
  • ★只做原装★正品现货★原盒原标★
  • QQ:2355507168QQ:2355507168 复制
    QQ:2355507169QQ:2355507169 复制
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产品型号CSD97374Q4M的概述

芯片CSD97374Q4M的概述 CSD97374Q4M是一款高效能、低功耗的功率MOSFET驱动芯片,主要应用于电源管理、高频开关电源、LED驱动和电动汽车等多个领域。作为一种新型半导体器件,CSD97374Q4M以其优异的热稳定性和电流承载能力而倍受工程师们的青睐。它采用了先进的工艺技术,旨在满足当今电子设备对高效率、低损耗的严格需求。 在当今电子设备逐步趋向高集成度、多功能化的背景下,复杂的电源管理要求设计师们不断寻求新的解决方案。CSD97374Q4M所提供的解决方案使得电源设计更为简便,能够有效降低系统设计的复杂性,从而提高产品的市场竞争力。 芯片CSD97374Q4M的详细参数 在深入了解CSD97374Q4M的详细参数之前,有必要了解其核心性能指标。该芯片的特点主要体现在以下几个方面: 1. 输入电压范围:CSD97374Q4M的输入电压范围为4.5V至18V,适合于多种...

产品型号CSD97374Q4M的Datasheet PDF文件预览

CSD97374Q4M  
www.ti.com  
SLPS382C JANUARY 2013REVISED JULY 2013  
Synchronous Buck NexFET™ Power Stage  
1
FEATURES  
APPLICATIONS  
23  
Over 92% System Efficiency at 15A  
Max Rated Continuous Current 25A, Peak 60A  
High Frequency Operation (up to 2 MHz)  
High Density - SON 3.5x4.5-mm Footprint  
Ultra Low Inductance Package  
System Optimized PCB Footprint  
Ultra Low Quiescent (ULQ) Current Mode  
3.3V and 5V PWM Signal Compatible  
Diode Emulation Mode with FCCM  
Input Voltages up to 24V  
Ultrabook/Notebook DC/DC Converters  
Multiphase Vcore and DDR Solutions  
Point-of-Load Synchronous Buck in  
Networking, Telecom, and Computing Systems  
ORDERING INFORMATION  
Device  
Package  
Media  
Qty  
Ship  
SON 3.5 × 4.5-mm  
Plastic Package  
13-Inch  
Reel  
Tape and  
Reel  
CSD97374Q4M  
2500  
Three-State PWM Input  
Integrated Bootsrap Diode  
Shoot Through Protection  
RoHS Compliant – Lead Free Terminal Plating  
Halogen Free  
DESCRIPTION  
The CSD97374Q4M NexFET™ Power Stage is a highly optimized design for use in a high power, high density  
Synchronous Buck converter. This product integrates the driver IC and NexFET technology to complete the  
power stage switching function. The driver IC has a built-in selectable diode emulation function that enables  
DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables  
Connected Standby for Windows™ 8 . With the PWM input in tri-state, quiescent current is reduced to 130 µA,  
with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is  
required to resume switching). This combination produces a high current, high efficiency, and high speed  
switching device in a small 3.5 × 4.5-mm outline package. In addition, the PCB footprint has been optimized to  
help reduce design time and simplify the completion of the overall system design.  
100  
90  
80  
70  
60  
50  
40  
12  
10  
8
VGS = 5V  
VIN = 12V  
VOUT = 1.8V  
LOUT = .29µH  
fSW = 500kHz  
TA = 25ºC  
6
4
2
0
0
5
10  
15  
20  
25  
Output Current (A)  
G001  
Figure 1. Application Diagram  
Figure 2. Efficiency and Power Loss  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NexFET is a trademark of Texas Instruments.  
2
3
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2013, Texas Instruments Incorporated  
CSD97374Q4M  
SLPS382C JANUARY 2013REVISED JULY 2013  
www.ti.com  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
ABSOLUTE MAXIMUM RATINGS(1)  
TA = 25°C (unless otherwise noted)  
VALUE  
UNIT  
MIN  
-0.3  
-0.3  
-7  
MAX  
30  
VIN to PGND  
V
V
VSW to PGND , VIN to VSW  
VSW to PGND, VIN to VSW (<10ns)  
VDD to PGND  
30  
33  
V
–0.3  
–0.3  
–0.3  
-2  
6
V
PWM, SKIP# to PGND  
BOOT to PGND  
6
V
35  
V
BOOT to PGND (<10ns)  
BOOT to BOOT_R  
38  
V
–0.3  
6
V
Human Body Model (HBM)  
Charged Device Model (CDM)  
2000  
500  
8
V
ESD Rating  
V
Power Dissipation, PD  
W
°C  
°C  
Operating Temperature Range, TJ  
Storage Temperature Range, TSTG  
-40  
150  
150  
–55  
(1) Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only  
and functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating  
Conditions" is not implied. Exposure to Absolute Maximum rated conditions for extended periods may affect device reliability.  
RECOMMENDED OPERATING CONDITIONS  
TA = 25° (unless otherwise noted)  
Parameter  
Gate Drive Voltage, VDD  
Conditions  
MIN  
MAX  
5.5  
24  
UNIT  
V
4.5  
Input Supply Voltage, VIN  
V
Continuous Output Current, IOUT  
VIN = 12V, VDD = 5V, VOUT = 1.8V,  
fSW = 500kHz, LOUT = 0.29µH(1)  
25  
A
(2)  
Peak Output Current, IOUT-PK  
60  
A
Switching Frequency, fSW  
On Time Duty Cycle  
CBST = 0.1µF (min)  
2000  
85  
kHz  
%
Minimum PWM On Time  
Operating Temperature  
40  
ns  
°C  
–40  
125  
(1) Measurement made with six 10-µF (TDK C3216X5R1C106KT or equivalent) ceramic capacitors placed across VIN to PGND pins.  
(2) System conditions as defined in Note 1. Peak Output Current is applied for tp = 10ms, duty cycle 1%  
THERMAL INFORMATION  
TA = 25°C (unless otherwise noted)  
PARAMETER  
Thermal Resistance, Junction-to-Case (Top of package)(1)  
Thermal Resistance, Junction-to-Board(2)  
MIN  
TYP  
MAX UNIT  
22.8 °C/W  
2.5 °C/W  
RθJC  
RθJB  
(1)  
(2)  
R
θJC is determined with the device mounted on a 1-inch² (6.45 -cm²), 2-oz (.071-mm thick) Cu pad on a 1.5-inch x 1.5-inch, 0.06-inch  
(1.52-mm) thick FR4 board.  
RθJB value based on hottest board temperature within 1mm of the package.  
2
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Copyright © 2013, Texas Instruments Incorporated  
 
 
CSD97374Q4M  
www.ti.com  
SLPS382C JANUARY 2013REVISED JULY 2013  
ELECTRICAL CHARACTERISTICS  
TA = 25°C, VDD = POR to 5.5V (unless otherwise noted)  
PARAMETER  
PLOSS  
CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
VIN = 12V, VDD = 5V, VOUT = 1.8V, IOUT = 15A,  
fSW = 500kHz, LOUT = 0.29µH , TJ = 25°C  
Power Loss(1)  
Power Loss(2)  
Power Loss(2)  
2.3  
2.5  
2.8  
W
W
W
VIN = 19V, VDD = 5V, VOUT = 1.8V, IOUT = 15A,  
fSW = 500kHz, LOUT = 0.29µH , TJ = 25°C  
VIN = 19V, VDD = 5V, VOUT = 1.8V, IOUT = 15A,  
fSW = 500kHz, LOUT = 0.29µH , TJ = 125°C  
VIN  
VIN Quiescent Current, IQ  
PWM=Floating, VDD = 5V, VIN= 24V  
1
µA  
VDD  
PWM = Float, SKIP# = VDD or 0V  
SKIP# = Float  
130  
8
µA  
µA  
Standby Supply Current, IDD  
Operating Supply Current, IDD  
PWM = 50% Duty cycle, fSW = 500kHz  
8.2  
mA  
POWER-ON RESET AND UNDER VOLTAGE LOCKOUT  
Power-On Reset, VDD Rising  
UVLO, VDD Falling  
4.15  
V
V
3.7  
Hysteresis  
0.2  
mV  
PWM and SKIP# I/O Specifications  
Pull Up to VDD  
1700  
800  
Input Impedance, RI  
kΩ  
Pull Down (to GND)  
Logic Level High, VIH  
Logic Level Low, VIL  
Hysteresis, VIH  
2.65  
1.3  
0.6  
2
V
0.2  
Tri-State Voltage, VTS  
Tri-state Activation Time (falling) PWM,  
tTHOLD(off1)  
60  
60  
1
ns  
µs  
Tri-state Activation Time (rising) PWM,  
tTHOLD(off2)  
Tri-state Activation Time (falling) SKIP#,  
tTSKF  
Tri-state Activation Time (rising) SKIP#,  
tTSKR  
1
(2)  
Tri-state Exit Time PWM, t3RD(PWM)  
100  
50  
ns  
µs  
(2)  
Tri-state Exit Time SKIP#, t3RD(SKIP#)  
BOOTSTRAP SWITCH  
Forward Voltage, VFBST  
IF = 10mA  
120  
240  
2
mV  
µA  
(2)  
Reverse Leakage, IRLEAK  
VBST – VDD = 25V  
(1) Measurement made with six 10-µF (TDK C3216X5R1C106KT or equivalent) ceramic capacitors placed across VIN to PGND pins.  
(2) Specified by design  
Copyright © 2013, Texas Instruments Incorporated  
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CSD97374Q4M  
SLPS382C JANUARY 2013REVISED JULY 2013  
www.ti.com  
TYPICAL CHARACTERISTICS  
TJ = 125°C, unless stated otherwise.  
9
1.2  
VIN = 12V  
VDD = 5V  
VOUT = 1.8V  
fSW = 500kHz  
VIN = 12V  
VGS = 5V  
VOUT = 1.8V  
fSW = 500kHz  
LOUT = 0.29µH  
8
1.1  
1
7
LOUT = 0.29µH  
6
5
4
3
2
1
0
0.9  
0.8  
0.7  
0.6  
0.5  
Typ  
Max  
1
3
5
7
9
11 13 15 17 19 21 23 25  
Output Current (A)  
−75 −50 −25  
0
25  
50  
75  
100 125 150  
Junction Temperature (ºC)  
G001  
G001  
Figure 3. Power Loss vs Output Current  
Figure 4. Power Loss vs Temperature  
30  
25  
20  
15  
10  
5
30  
25  
20  
15  
10  
5
Typ  
Max  
VIN = 12V  
VDD = 5V  
VOUT = 1.8V  
fSW = 500kHz  
LOUT = 0.29µH  
VIN = 12V  
VGS = 5V  
VOUT = 1.8V  
fSW = 500kHz  
400LFM  
200LFM  
100LFM  
Nat Conv  
LOUT = 0.29µH  
0
0
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
0
20  
40  
60  
80  
100  
120  
140  
Ambient Temperature (ºC)  
Board Temperature (ºC)  
G001  
G001  
Figure 5. Safe Operating Area – PCB Horizontal Mount (1)  
Figure 6. Typical Safe Operating Area (1)  
1.45  
8.0  
7.1  
6.2  
5.3  
4.4  
3.5  
2.7  
1.8  
0.9  
0.0  
−0.9  
1.25  
1.2  
4.4  
3.5  
2.7  
1.8  
0.9  
0.0  
−0.9  
VIN = 12V  
VDD = 5V  
VOUT = 1.8V  
LOUT = 0.29µH  
IOUT = 25A  
VDD = 5V  
1.4  
1.35  
1.3  
VOUT = 1.8V  
LOUT = 0.29µH  
fSW = 500kHz  
IOUT = 25A  
1.15  
1.1  
1.25  
1.2  
1.15  
1.1  
1.05  
1
1.05  
1
0.95  
0.95  
0
400  
800  
1200  
1600  
2000  
2400  
3
5
7
9
11  
13  
15  
17  
19  
21  
23  
Input Voltage (V)  
Switching Frequency (kHz)  
G001  
G001  
Figure 7. Normalized Power Loss vs Frequency  
Figure 8. Normalized Power Loss vs Input Voltage  
4
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CSD97374Q4M  
www.ti.com  
SLPS382C JANUARY 2013REVISED JULY 2013  
TYPICAL CHARACTERISTICS (continued)  
TJ = 125°C, unless stated otherwise.  
1.5  
9
1.25  
1.2  
4.4  
3.5  
2.7  
1.8  
0.9  
0
VIN = 12V  
VDD = 5V  
fSW = 500kHz  
LOUT = 0.29µH  
VIN = 12V  
VDD = 5V  
VOUT = 1.8V  
fSW = 500kHz  
IOUT = 25A  
1.4  
7.2  
5.4  
3.6  
1.8  
0
1.3  
1.15  
1.1  
IOUT = 25A  
1.2  
1.1  
1
1.05  
1
0.9  
0.8  
0.7  
0.6  
−1.8  
−3.6  
−5.4  
−7.2  
0.95  
0.9  
−0.9  
−1.8  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
0
100 200 300 400 500 600 700 800 900 1000 1100  
Output Inductance (nH)  
Output Voltage (V)  
G001  
G001  
Figure 9. Normalized Power Loss vs Output Voltage  
Figure 10. Normalized Power Loss vs Output Inductance  
45  
11  
10.5  
10  
VIN = 12V  
VDD = 5V  
VOUT = 1.8V  
LOUT = 0.29µH  
40  
35  
IOUT = 25A  
30  
25  
20  
15  
10  
5
9.5  
VIN = 12V  
VDD = 5V  
VOUT = 1.8V  
LOUT = 0.29µH  
IOUT = 25A  
9
0
8.5  
0
400  
800  
1200  
1600  
2000  
2400  
−75 −50 −25  
0
25  
50  
75  
100 125 150  
Switching Frequency (kHz)  
Junction Temperature (°C)  
G000  
G000  
Figure 11. Driver Current vs Frequency  
Figure 12. Driver Current vs Temperature  
1. The Typical CSD97374Q4M System Characteristic curves are based on measurements made on a PCB design with  
dimensions of 4.0" (W) x 3.5" (L) x 0.062" (T) and 6 copper layers of 1 oz. copper thickness. See the Application  
Information section for detailed explanation.  
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CSD97374Q4M  
SLPS382C JANUARY 2013REVISED JULY 2013  
www.ti.com  
PIN CONFIGURATION  
SKIP#  
1
2
3
8
PWM  
VDD  
7
6
BOOT  
PGND  
BOOT_R  
9
PGND  
VSW  
VIN  
4
5
Figure 13. Top View  
PIN DESCRIPTION  
PIN  
NAME  
DESCRIPTION  
NO.  
1
SKIP#  
This pin enables the Diode Emulation function. When this pin is held Low, Diode Emulation Mode is enabled for the  
Sync FET. When SKIP# is High, the CSD97374Q4M operates in Forced Continuous Conduction Mode. A tri-state  
voltage on SKIP# puts the driver into a very low power state.  
2
3
4
5
6
7
8
VDD  
Supply Voltage to Gate Drivers and internal circuitry.  
PGND  
VSW  
Power Ground, Needs to be connected to Pin 9 and PCB  
Voltage Switching Node – pin connection to the output inductor.  
Input Voltage Pin. Connect input capacitors close to this pin.  
VIN  
BOOT_R  
BOOT  
PWM  
Bootstrap capacitor connection. Connect a minimum 0.1µF 16V X5R, ceramic cap from BOOT to BOOT_R pins. The  
bootstrap capacitor provides the charge to turn on the Control FET. The bootstrap diode is integrated.  
Pulse Width modulated 3-state input from external controller. Logic Low sets Control FET gate low and Sync FET gate  
high. Logic High sets Control FET gate high and Sync FET gate Low. Open or High Z sets both MOSFET gates low if  
greater than the 3-State Shutdown Hold-off Time (t3HT  
)
9
PGND  
Power Ground  
6
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CSD97374Q4M  
www.ti.com  
SLPS382C JANUARY 2013REVISED JULY 2013  
Figure 14. Functional Block Diagram  
FUNCTIONAL DESCRIPTION  
POWERING CSD97374Q4M AND GATE DRIVERS  
An external VDD voltage is required to supply the integrated gate driver IC and provide the necessary gate drive  
power for the MOSFETS. A 1µF 10V X5R or higher ceramic capacitor is recommended to bypass VDD pin to  
PGND. A bootstrap circuit to provide gate drive power for the Control FET is also included. The bootstrap supply  
to drive the Control FET is generated by connecting a 100nF 16V X5R ceramic capacitor between BOOT and  
BOOT_R pins. An optional RBOOT resistor can be used to slow down the turn on speed of the Control FET and  
reduce voltage spikes on the VSW node. A typical 1Ω to 4.7Ω value is a compromise between switching loss and  
VSW spike amplitude.  
Undervoltage Lockout Protection (UVLO)  
The undervoltage lockout (UVLO) comparator evaluates the VDD voltage level. As VVDD rises, both the Control  
FET and Sync FET gates hold actively low at all times until VVDD reaches the higher UVLO threshold (VUVLO_H).,  
Then the driver becomes operational and responds to PWM and SKIP# commands. If VDD falls below the lower  
UVLO threshold (VUVLO_L = VUVLO_H – Hysteresis), the device disables the driver and drives the outputs of the  
Control FET and Sync FET gates actively low. Figure 15 shows this function.  
CAUTION  
Do not start the driver in the very low power mode (SKIP# = Tri-state).  
V
UVLO_H  
V
UVLO_L  
V
VDD  
Driver On  
UDG-12218  
Figure 15. UVLO Operation  
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CSD97374Q4M  
SLPS382C JANUARY 2013REVISED JULY 2013  
www.ti.com  
PWM Pin  
The PWM pin incorporates an input tri-state function. The device forces the gate driver outputs to low when  
PWM is driven into the tri-state window and the driver enters a low power state with zero exit latency. The pin  
incorporates a weak pull-up to maintain the voltage within the tri-state window during low-power modes.  
Operation into and out of tri-state mode follows the timing diagram outlined in Figure 16.  
When VDD reaches the UVLO_H level, a tri-state voltage range (window) is set for the PWM input voltage. The  
window is defined the PWM voltage range between PWM logic high (VIH) and logic low (VIL) thresholds. The  
device sets high-level input voltage and low-level input voltage threshold levels to accommodate both 3.3 V  
(typical) and 5 V (typical) PWM drive signals.  
When the PWM exits tri-state, the driver enters CCM for a period of 4 µs, regardless of the state of the SKIP#  
pin. Normal operation requires this time period in order for the auto-zero comparator to resume.  
Figure 16. PWM Tri-State Timing Diagram  
SKIP# Pin  
The SKIP# pin incorporates the input tri-state buffer as PWM. The function is somewhat different. When SKIP# is  
low, the zero crossing (ZX) detection comparator is enabled, and DCM mode operation occurs if the load current  
is less than the critical current. When SKIP# is high, the ZX comparator disables, and the converter enters FCCM  
mode. When both SKIP# and PWM are tri-stated, normal operation forces the gate driver outputs low and the  
driver enters a low-power state. In the low-power state, the UVLO comparator remains off to reduce quiescent  
current. When SKIP# is pulled low, the driver wakes up and is able to accept PWM pulses in less than 50 µs.  
Table 1 shows the logic functions of UVLO, PWM, SKIP#, the Control FET Gate and the Sync FET Gate.  
Table 1. Logic Functions of the Driver IC  
UVLO  
Active  
PWM  
SKIP#  
Sync FET Gate  
Control FET Gate  
MODE  
Disabled  
DCM(1)  
FCCM  
Low  
Low  
Low  
Low  
High  
Low  
Low  
Inactive  
Inactive  
Inactive  
Inactive  
Inactive  
Low  
Low  
High(1)  
High  
Low  
High  
High  
Tri-state  
H or L  
H or L  
Tri-state  
Low  
Low  
LQ  
Low  
ULQ  
(1) Until zero crossing protection occurs.  
8
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SLPS382C JANUARY 2013REVISED JULY 2013  
Zero Crossing (ZX) Operation  
The zero crossing comparator is adaptive for improved accuracy. As the output current decreases from a heavy  
load condition, the inductor current also reduces and eventually arrives at a valley, where it touches zero current,  
which is the boundary between continuous conduction and discontinuous conduction modes. The SW pin detects  
the zero-current condition. When this zero inductor current condition occurs, the ZX comparator turns off the  
rectifying MOSFET.  
Integrated Boost-Switch  
To maintain a BST-SW voltage close to VDD (to get lower conduction losses on the high-side FET), the  
conventional diode between the VDD pin and the BST pin is replaced by a FET which is gated by the DRVL  
signal.  
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CSD97374Q4M  
SLPS382C JANUARY 2013REVISED JULY 2013  
www.ti.com  
APPLICATION INFORMATION  
The Power Stage CSD97374Q4M is a highly optimized design for synchronous buck applications using NexFET  
devices with a 5V gate drive. The Control FET and Sync FET silicon are parametrically tuned to yield the lowest  
power loss and highest system efficiency. As a result, a rating method is used that is tailored towards a more  
systems centric environment. The high-performance gate driver IC integrated in the package helps minimize the  
parasitics and results in extremely fast switching of the power MOSFETs. System level performance curves such  
as Power Loss, Safe Operating Area and normalized graphs allow engineers to predict the product performance  
in the actual application.  
Power Loss Curves  
MOSFET centric parameters such as RDS(ON) and Qgd are primarily needed by engineers to estimate the loss  
generated by the devices. In an effort to simplify the design process for engineers, Texas Instruments has  
provided measured power loss performance curves. Figure 3 plots the power loss of the CSD97374Q4M as a  
function of load current. This curve is measured by configuring and running the CSD97374Q4M as it would be in  
the final application (see Figure 17). The measured power loss is the CSD97374Q4M device power loss which  
consists of both input conversion loss and gate drive loss. Equation 1 is used to generate the power loss curve.  
Power Loss = (VIN x IIN) + (VDD x IDD) – (VSW_AVG x IOUT  
)
(1)  
The power loss curve in Figure 3 is measured at the maximum recommended junction temperature of  
TJ = 125°C under isothermal test conditions.  
Safe Operating Curves (SOA)  
The SOA curves in the CSD97374Q4M datasheet give engineers guidance on the temperature boundaries within  
an operating system by incorporating the thermal resistance and system power loss. Figure 5 and Figure 6  
outline the temperature and airflow conditions required for a given load current. The area under the curve  
dictates the safe operating area. All the curves are based on measurements made on a PCB design with  
dimensions of 4.0" (W) x 3.5" (L) x 0.062" (T) and 6 copper layers of 1 oz. copper thickness.  
Normalized Curves  
The normalized curves in the CSD97374Q4M data sheet give engineers guidance on the Power Loss and SOA  
adjustments based on their application specific needs. These curves show how the power loss and SOA  
boundaries will adjust for a given set of systems conditions. The primary Y-axis is the normalized change in  
power loss and the secondary Y-axis is the change is system temperature required in order to comply with the  
SOA curve. The change in power loss is a multiplier for the Power Loss curve and the change in temperature is  
subtracted from the SOA curve.  
Figure 17. Power Loss Test Circuit  
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SLPS382C JANUARY 2013REVISED JULY 2013  
Calculating Power Loss and SOA  
The user can estimate product loss and SOA boundaries by arithmetic means (see the Design Example).  
Though the Power Loss and SOA curves in this datasheet are taken for a specific set of test conditions, the  
following procedure will outline the steps engineers should take to predict product performance for any set of  
system conditions.  
Design Example  
Operating Conditions: Output Current (lOUT) = 15A, Input Voltage (VIN ) = 7V, Output Voltage (VOUT) = 1.5V,  
Switching Frequency (fSW) = 800kHz, Output Inductor (LOUT) = 0.2µH  
Calculating Power Loss  
Typical Power Loss at 15A = 2.8W (Figure 3)  
Normalized Power Loss for switching frequency 1.02 (Figure 7)  
Normalized Power Loss for input voltage 1.07 (Figure 8)  
Normalized Power Loss for output voltage 0.94(Figure 9)  
Normalized Power Loss for output inductor 1.08 (Figure 10)  
Final calculated Power Loss = 2.8W × 1.02 × 1.07 × 0.94 × 1.08 3.1W  
Calculating SOA Adjustments  
SOA adjustment for switching frequency 0.3°C (Figure 7)  
SOA adjustment for input voltage 1.2°C (Figure 8)  
SOA adjustment for output voltage –1.1°C (Figure 9)  
SOA adjustment for output inductor 1.4°C (Figure 10)  
Final calculated SOA adjustment = 0.3 + 1.2 + (–1.1) + 1.4 1.8°C  
Figure 18. Power Stage CSD97374Q4M SOA  
In the design example above, the estimated power loss of the CSD97374Q4M would increase to 3.1W. In  
addition, the maximum allowable board and/or ambient temperature would have to decrease by 1.8°C. Figure 18  
graphically shows how the SOA curve would be adjusted accordingly.  
1. Start by drawing a horizontal line from the application current to the SOA curve.  
2. Draw a vertical line from the SOA curve intercept down to the board/ambient temperature.  
3. Adjust the SOA board/ambient temperature by subtracting the temperature adjustment value.  
In the design example, the SOA temperature adjustment yields a reduction in allowable board/ambient  
temperature of 1.8°C. In the event the adjustment value is a negative number, subtracting the negative number  
would yield an increase in allowable board/ambient temperature.  
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CSD97374Q4M  
SLPS382C JANUARY 2013REVISED JULY 2013  
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RECOMMENDED PCB DESIGN OVERVIEW  
There are two key system-level parameters that can be addressed with a proper PCB design: electrical and  
thermal performance. Properly optimizing the PCB layout will yield maximum performance in both areas. Below  
is a brief description on how to address each parameter.  
Electrical Performance  
The CSD97374Q4M has the ability to switch at voltage rates greater than 10kV/µs. Special care must be then  
taken with the PCB layout design and placement of the input capacitors, inductor and output capacitors.  
The placement of the input capacitors relative to VIN and PGND pins of CSD97374Q4M device should have the  
highest priority during the component placement routine. It is critical to minimize these node lengths. As such,  
ceramic input capacitors need to be placed as close as possible to the VIN and PGND pins (see Figure 19).  
The example in Figure 19 uses 1 x 1nF 0402 25V and 3 x 10µF 1206 25V ceramic capacitors (TDK Part #  
C3216X5R1C106KT or equivalent). Notice there are ceramic capacitors on both sides of the board with an  
appropriate amount of vias interconnecting both layers. In terms of priority of placement next to the Power  
Stage C5, C8 and C6, C19 should follow in order.  
The bootstrap cap CBOOT 0.1µF 0603 16V ceramic capacitor should be closely connected between BOOT and  
BOOT_R pins  
The switching node of the output inductor should be placed relatively close to the Power Stage  
CSD97374Q4M VSW pins. Minimizing the VSW node length between these two components will reduce the  
(2)  
PCB conduction losses and actually reduce the switching noise level.  
Thermal Performance  
The CSD97374Q4M has the ability to use the GND planes as the primary thermal path. As such, the use of  
thermal vias is an effective way to pull away heat from the device and into the system board. Concerns of solder  
voids and manufacturability problems can be addressed by the use of three basic tactics to minimize the amount  
of solder attach that will wick down the via barrel:  
Intentionally space out the vias from each other to avoid a cluster of holes in a given area.  
Use the smallest drill size allowed in your design. The example in Figure 19 uses vias with a 10 mil drill hole  
and a 16 mil capture pad.  
Tent the opposite side of the via with solder-mask.  
In the end, the number and drill size of the thermal vias should align with the end user’s PCB design rules and  
manufacturing capabilities.  
Figure 19. Recommended PCB Layout (Top Down View)  
(2) Keong W. Kam, David Pommerenke, “EMI Analysis Methods for Synchronous Buck Converter EMI Root Cause Analysis”, University of  
Missouri – Rolla  
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SLPS382C JANUARY 2013REVISED JULY 2013  
MECHANICAL DATA  
°
Ө
c1  
a1  
D2  
4
1
0.300  
(x45°)  
8
5
MILLIMETERS  
Nom  
INCHES  
DIM  
Min  
Max  
Min  
Nom  
0.035  
0.000  
0.008  
0.087  
0.008  
0.008  
0.156  
0.177  
0.138  
0.083  
0.016 TYP  
0.012 TYP  
0.016  
0.009  
Max  
A
a1  
b
0.800  
0.000  
0.150  
2.000  
0.150  
0.150  
3.850  
4.400  
3.400  
2.000  
0.900  
1.000  
0.080  
0.250  
2.400  
0.250  
0.250  
4.050  
4.600  
3.600  
2.200  
0.031  
0.000  
0.006  
0.079  
0.006  
0.006  
0.152  
0.173  
0.134  
0.079  
0.039  
0.003  
0.010  
0.095  
0.010  
0.010  
0.160  
0.181  
0.142  
0.087  
0.000  
0.200  
b1  
b2  
c1  
D2  
E
2.200  
0.200  
0.200  
3.950  
4.500  
E1  
E2  
e
3.500  
2.100  
0.400 TYP  
0.300 TYP  
0.400  
K
L
0.300  
0.180  
0.00  
0.500  
0.280  
0.012  
0.007  
0.00  
0.020  
0.011  
L1  
θ
0.230  
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CSD97374Q4M  
SLPS382C JANUARY 2013REVISED JULY 2013  
www.ti.com  
Recommended PCB Land Pattern  
(0.006)  
0.150  
(0.016)  
0.400  
(0.010)  
0.250  
(x18)  
(0.006)  
0.150  
(0.024)  
0.600 (x 2)  
(0.008)  
0.200  
(x2)  
(0.087)  
2.200  
R0.100  
R0.100  
0.225 ( x 2)  
(0.009)  
(0.088)  
2.250  
(0.012)  
0.300  
(0.159)  
4.050  
Recommended Stencil Opening  
(0.016)  
0.400  
(0.029)  
0.738 (x 8)  
(0.008)  
0.200  
(0.008)  
0.200  
(0.015)  
0.390  
(0.014)  
0.350  
0.300  
R0.100  
(0.012)  
0.850 (x8)  
(0.033)  
(0.012)  
0.300  
R0.100  
(0.004)  
0.115  
0.440 (0.017)  
(0.008)  
0.200  
(0.009)  
0.225  
0.200  
(0.008)  
(0.087)  
2.200  
NOTE: Dimensions are in mm (inches).  
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SLPS382C JANUARY 2013REVISED JULY 2013  
REVISION HISTORY  
Changes from Original (January 2013) to Revision A  
Page  
Changed the ROC table, From: VSW to PGND, VIN to VSW (<20ns) MIN = -5 To: VSW to PGND, VIN to VSW (<10ns) MIN  
= -7 ........................................................................................................................................................................................ 2  
Changed the ROC table, From: BOOT to PGND (<20ns) MIN = -3 To: BOOT to PGND (<10ns) MIN = -2 ............................ 2  
Changed Logic Level High, VIH From: MAX = 2.6 To: MIN = 2.65 ....................................................................................... 3  
Changed Logic Level Low, VIL From: MIN = 0.6 To: MAX = 0.6 .......................................................................................... 3  
Changed Tri-State Voltage, VTS From: MIN = 1.2 To: MIN = 1.3 ......................................................................................... 3  
Changes from Revision A (March 2013) to Revision B  
Page  
Changed the Mechanical Drawing image ........................................................................................................................... 13  
Changed the Recommended PCB Land Pattern image ..................................................................................................... 14  
Changed the Recommended Stencil Opening image ........................................................................................................ 14  
Changes from Revision B (May 2013) to Revision C  
Page  
Added dimension row b2 to the MECHANICAL DATA table .............................................................................................. 13  
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PACKAGE MATERIALS INFORMATION  
www.ti.com  
31-May-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
CSD97374Q4M  
VSON  
DPC  
8
2500  
330.0  
12.4  
3.8  
4.8  
1.6  
8.0  
12.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
31-May-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
VSON DPC  
SPQ  
Length (mm) Width (mm) Height (mm)  
367.0 367.0 35.0  
CSD97374Q4M  
8
2500  
Pack Materials-Page 2  
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CSD97374Q4M产品参数
型号:CSD97374Q4M
Brand Name:Texas Instruments
是否无铅: 不含铅
是否Rohs认证: 符合
生命周期:Active
包装说明:HVSON,
Reach Compliance Code:not_compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
风险等级:0.89
Samacsys Confidence:4
Samacsys Status:Released
Samacsys PartID:282831
Samacsys Pin Count:21
Samacsys Part Category:Integrated Circuit
Samacsys Package Category:Other
Samacsys Footprint Name:DPC (VSON-CLIP)_2020
Samacsys Released Date:2020-05-10 10:18:51
Is Samacsys:N
其他特性:ULTRA LOW QUIESCENT (ULQ) CURRENT MODE
模拟集成电路 - 其他类型:SWITCHING REGULATOR
控制技术:PULSE WIDTH MODULATION
最大输入电压:5.5 V
最小输入电压:4.5 V
标称输入电压:5 V
JESD-30 代码:R-PDSO-N8
JESD-609代码:e3
长度:4.5 mm
湿度敏感等级:2
功能数量:1
端子数量:8
最高工作温度:150 °C
最低工作温度:-40 °C
最大输出电流:60 A
封装主体材料:PLASTIC/EPOXY
封装代码:HVSON
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260
座面最大高度:1 mm
表面贴装:YES
切换器配置:BUCK
最大切换频率:2000 kHz
温度等级:AUTOMOTIVE
端子面层:Matte Tin (Sn)
端子形式:NO LEAD
端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3.5 mm
Base Number Matches:1
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