欢迎访问ic37.com |
会员登录 免费注册
发布采购
所在地: 型号: 精确
  • 批量询价
  •  
  • 供应商
  • 型号
  • 数量
  • 厂商
  • 封装
  • 批号
  • 交易说明
  • 询价
更多
  • DAN222图
  • 深圳市芯脉实业有限公司

     该会员已使用本站11年以上
  • DAN222 现货库存
  • 数量6980 
  • 厂家ROHM 
  • 封装SOT-523 
  • 批号22+ 
  • 新到现货、一手货源、当天发货、bom配单
  • QQ:2881512844QQ:2881512844 复制
  • 075584507705 QQ:2881512844
  • DAN222图
  • 深圳市欧立现代科技有限公司

     该会员已使用本站12年以上
  • DAN222 现货库存
  • 数量5000 
  • 厂家ONSEMI 
  • 封装SOT-523 
  • 批号24+ 
  • 全新原装现货,低价出售,欢迎询购!
  • QQ:1950791264QQ:1950791264 复制
    QQ:2216987084QQ:2216987084 复制
  • 0755-83222787 QQ:1950791264QQ:2216987084
  • DAN222TL图
  • 深圳市华斯顿电子科技有限公司

     该会员已使用本站16年以上
  • DAN222TL 现货库存
  • 数量12500 
  • 厂家ROHM 
  • 封装UMD3(SOT 
  • 批号2023+ 
  • 绝对原装正品现货/优势渠道商、原盘原包原盒
  • QQ:364510898QQ:364510898 复制
    QQ:515102657QQ:515102657 复制
  • 0755-83777708“进口原装正品专供” QQ:364510898QQ:515102657
  • DAN222T1G图
  • 深圳市嘉胜威科技有限公司

     该会员已使用本站7年以上
  • DAN222T1G 现货库存
  • 数量29400 
  • 厂家ON 
  • 封装SOT523 
  • 批号22+ 
  • 专注品牌推广原盒原装进口现货
  • QQ:611095588QQ:611095588 复制
  • 0755-82736771 QQ:611095588
  • DAN222图
  • 深圳市芯脉实业有限公司

     该会员已使用本站11年以上
  • DAN222 现货库存
  • 数量26800 
  • 厂家on 
  • 封装SC-75-3 
  • 批号22+ 
  • 新到现货、一手货源、当天发货、bom配单
  • QQ:1435424310QQ:1435424310 复制
  • 0755-84507451 QQ:1435424310
  • DAN222M3T5G图
  • 深圳市鹏睿康科技有限公司

     该会员已使用本站16年以上
  • DAN222M3T5G 现货库存
  • 数量2100 
  • 厂家ON 
  • 封装SOT723 
  • 批号1813+ 
  • 原装现货假一赔万,原包原标,支持实单
  • QQ:2885392746QQ:2885392746 复制
    QQ:2885392744QQ:2885392744 复制
  • 0755-83192793 QQ:2885392746QQ:2885392744
  • DAN222图
  • 宇芯通实业(深圳)有限公司

     该会员已使用本站8年以上
  • DAN222
  • 数量15000 
  • 厂家ON安森美 
  • 封装80V共阴极硅双开关二极管 
  • 批号20+ 
  • 只做品牌原装假一赔十
  • QQ:2903107741QQ:2903107741 复制
  • 0755-84535756 QQ:2903107741
  • DAN222图
  • 深圳市羿芯诚电子有限公司

     该会员已使用本站7年以上
  • DAN222
  • 数量8800 
  • 厂家ON/安森美 
  • 封装原厂封装 
  • 批号新年份 
  • 羿芯诚只做原装,原厂渠道,价格优势可谈!
  • QQ:2853992132QQ:2853992132 复制
  • 0755-82570683 QQ:2853992132
  • DAN222图
  • 深圳市芯脉实业有限公司

     该会员已使用本站11年以上
  • DAN222
  • 数量6980 
  • 厂家ROHM 
  • 封装SOT-523 
  • 批号22+ 
  • 新到现货、一手货源、当天发货、bom配单
  • QQ:2881512844QQ:2881512844 复制
  • 075584507705 QQ:2881512844
  • DAN222图
  • 北京元坤伟业科技有限公司

     该会员已使用本站17年以上
  • DAN222
  • 数量5000 
  • 厂家ROHM 
  • 封装SOT-323 
  • 批号16+ 
  • 百分百原装正品,现货库存
  • QQ:857273081QQ:857273081 复制
    QQ:1594462451QQ:1594462451 复制
  • 010-62106431 QQ:857273081QQ:1594462451
  • DAN222图
  • 深圳市科庆电子有限公司

     该会员已使用本站16年以上
  • DAN222
  • 数量15000 
  • 厂家ROHM 
  • 封装SOT423 
  • 批号23+ 
  • 现货只售原厂原装可含13%税
  • QQ:2850188252QQ:2850188252 复制
    QQ:2850188256QQ:2850188256 复制
  • 0755 QQ:2850188252QQ:2850188256
  • DAN222TL图
  • 深圳市毅创腾电子科技有限公司

     该会员已使用本站16年以上
  • DAN222TL
  • 数量233328 
  • 厂家ROHM 
  • 封装EMD3 
  • 批号22+ 
  • ★只做原装★正品现货★原盒原标★
  • QQ:2355507168QQ:2355507168 复制
    QQ:2355507169QQ:2355507169 复制
  • 86-755-83219286 QQ:2355507168QQ:2355507169
  • DAN222M3T5G图
  • 深圳市得捷芯城科技有限公司

     该会员已使用本站11年以上
  • DAN222M3T5G
  • 数量7398 
  • 厂家ON/安森美 
  • 封装SOT723 
  • 批号23+ 
  • 原厂可订货,技术支持,直接渠道。可签保供合同
  • QQ:3007947087QQ:3007947087 复制
    QQ:3007947087QQ:3007947087 复制
  • 0755-83061789 QQ:3007947087QQ:3007947087
  • DAN222 (N)图
  • 北京中其伟业科技有限公司

     该会员已使用本站16年以上
  • DAN222 (N)
  • 数量20000 
  • 厂家ROHM 
  • 封装SOT-3 
  • 批号16+ 
  • 特价,原装正品,绝对公司现货库存,原装特价!
  • QQ:2880824479QQ:2880824479 复制
  • 010-62104891 QQ:2880824479
  • DAN222图
  • 集好芯城

     该会员已使用本站13年以上
  • DAN222
  • 数量13428 
  • 厂家ROHM/罗姆 
  • 封装SOD323 
  • 批号最新批次 
  • 原装原厂 现货现卖
  • QQ:3008092965QQ:3008092965 复制
    QQ:3008092965QQ:3008092965 复制
  • 0755-83239307 QQ:3008092965QQ:3008092965
  • DAN222 (N9U)图
  • 深圳市晶美隆科技有限公司

     该会员已使用本站14年以上
  • DAN222 (N9U)
  • 数量15830 
  • 厂家ON 
  • 封装3脚 
  • 批号23+ 
  • 全新原装正品现货热卖
  • QQ:2885348317QQ:2885348317 复制
    QQ:2885348339QQ:2885348339 复制
  • 0755-83209630 QQ:2885348317QQ:2885348339
  • DAN222GTL图
  • 深圳市宏捷佳电子科技有限公司

     该会员已使用本站12年以上
  • DAN222GTL
  • 数量12300 
  • 厂家ROHM/罗姆 
  • 封装SOT416 
  • 批号24+ 
  • ★原装真实库存★13点税!
  • QQ:2353549508QQ:2353549508 复制
    QQ:2885134615QQ:2885134615 复制
  • 0755-83201583 QQ:2353549508QQ:2885134615
  • DAN222图
  • 深圳市三得电子有限公司

     该会员已使用本站15年以上
  • DAN222
  • 数量82000 
  • 厂家ROHM 
  • 封装SOT-523 
  • 批号2024 
  • 深圳原装现货库存,欢迎咨询合作
  • QQ:414322027QQ:414322027 复制
    QQ:565106636QQ:565106636 复制
  • 13509684848 QQ:414322027QQ:565106636
  • DAN222图
  • 现代芯城(深圳)科技有限公司

     该会员已使用本站15年以上
  • DAN222
  • 数量50000 
  • 厂家一级代理 
  • 封装一级代理 
  • 批号一级代理 
  • 一级代理正品采购
  • QQ:3007226851QQ:3007226851 复制
    QQ:3007226849QQ:3007226849 复制
  • 0755-82542579 QQ:3007226851QQ:3007226849
  • DAN222TL图
  • 深圳市湘达电子有限公司

     该会员已使用本站10年以上
  • DAN222TL
  • 数量6600 
  • 厂家ROHM/罗姆 
  • 封装UMD3(SOT-323)(SC-70) 
  • 批号20+ 
  • 原盒原装原标签,市场最低价。
  • QQ:215672808QQ:215672808 复制
  • 0755-83229772 QQ:215672808
  • DAN222G图
  • 深圳市正信鑫科技有限公司

     该会员已使用本站12年以上
  • DAN222G
  • 数量87000 
  • 厂家ON 
  • 封装原厂封装 
  • 批号22+ 
  • 原装正品★真实库存★价格优势★欢迎来电洽谈
  • QQ:1686616797QQ:1686616797 复制
    QQ:2440138151QQ:2440138151 复制
  • 0755-22655674 QQ:1686616797QQ:2440138151
  • DAN222MT2L图
  • 深圳市正信鑫科技有限公司

     该会员已使用本站12年以上
  • DAN222MT2L
  • 数量7055 
  • 厂家ROHM 
  • 封装原厂封装 
  • 批号22+ 
  • 原装正品★真实库存★价格优势★欢迎来电洽谈
  • QQ:1686616797QQ:1686616797 复制
    QQ:2440138151QQ:2440138151 复制
  • 0755-22655674 QQ:1686616797QQ:2440138151
  • DAN222图
  • 北京齐天芯科技有限公司

     该会员已使用本站15年以上
  • DAN222
  • 数量10000 
  • 厂家ROHM 
  • 封装原装正品 
  • 批号2024+ 
  • 原装正品,假一罚十
  • QQ:2880824479QQ:2880824479 复制
    QQ:1344056792QQ:1344056792 复制
  • 010-62104931 QQ:2880824479QQ:1344056792
  • DAN222N图
  • 北京首天国际有限公司

     该会员已使用本站16年以上
  • DAN222N
  • 数量26282 
  • 厂家长电 
  • 封装SOT-523 
  • 批号2024+ 
  • 百分百原装正品,现货库存
  • QQ:528164397QQ:528164397 复制
    QQ:1318502189QQ:1318502189 复制
  • 010-62565447 QQ:528164397QQ:1318502189
  • DAN222MFHT2L图
  • 深圳市欧瑞芯科技有限公司

     该会员已使用本站11年以上
  • DAN222MFHT2L
  • 数量10000 
  • 厂家ROHM/罗姆 
  • 封装SOT-723 
  • 批号24+ 
  • 绝对原装正品,可开专票,欢迎采购!!!
  • QQ:3354557638QQ:3354557638 复制
    QQ:3354557638QQ:3354557638 复制
  • 18565729389 QQ:3354557638QQ:3354557638
  • DAN222M 开关二极管图
  • 深圳市集创讯科技有限公司

     该会员已使用本站5年以上
  • DAN222M 开关二极管
  • 数量6500 
  • 厂家ROHM/罗姆 
  • 封装 
  • 批号24+ 
  • 原装进口正品现货,假一罚十价格优势
  • QQ:2885393494QQ:2885393494 复制
    QQ:2885393495QQ:2885393495 复制
  • 0755-83244680 QQ:2885393494QQ:2885393495
  • DAN222图
  • 深圳市华斯顿电子科技有限公司

     该会员已使用本站16年以上
  • DAN222
  • 数量12500 
  • 厂家ROHM 
  • 封装SOT423 
  • 批号2023+ 
  • 绝对原装全新正品现货/优势渠道商、原盘原包原盒
  • QQ:1002316308QQ:1002316308 复制
    QQ:515102657QQ:515102657 复制
  • 美驻深办0755-83777708“进口原装正品专供” QQ:1002316308QQ:515102657
  • DAN222 TL图
  • 深圳市华斯顿电子科技有限公司

     该会员已使用本站16年以上
  • DAN222 TL
  • 数量13050 
  • 厂家ROHM 
  • 封装SOT-523 
  • 批号2023+ 
  • 绝对原装正品现货/优势渠道商、原盘原包原盒
  • QQ:1002316308QQ:1002316308 复制
    QQ:515102657QQ:515102657 复制
  • 深圳分公司0755-83777708“进口原装正品专供” QQ:1002316308QQ:515102657
  • DAN222图
  • 深圳市富科达科技有限公司

     该会员已使用本站13年以上
  • DAN222
  • 数量24652 
  • 厂家ONSEMI 
  • 封装原封装 
  • 批号2020+ 
  • 全新原装现货热卖,价格绝对优势
  • QQ:1220223788QQ:1220223788 复制
    QQ:1327510916QQ:1327510916 复制
  • 86-0755-28767101 QQ:1220223788QQ:1327510916
  • DAN222TL图
  • 深圳市龙腾新业科技有限公司

     该会员已使用本站17年以上
  • DAN222TL
  • 数量13720 
  • 厂家ROHM/罗姆 
  • 封装SOD523 
  • 批号24+ 
  • 原装原厂 现货现卖
  • QQ:562765057QQ:562765057 复制
    QQ:370820820QQ:370820820 复制
  • 0755-84509636 QQ:562765057QQ:370820820
  • DAN222图
  • 深圳市晶美隆科技有限公司

     该会员已使用本站14年以上
  • DAN222
  • 数量11631 
  • 厂家ROHM/罗姆 
  • 封装Sot-423 
  • 批号23+ 
  • 全新原装正品现货热卖
  • QQ:2885348339QQ:2885348339 复制
    QQ:2885348317QQ:2885348317 复制
  • 0755-82519391 QQ:2885348339QQ:2885348317
  • DAN222-FH-TL图
  • 北京齐天芯科技有限公司

     该会员已使用本站15年以上
  • DAN222-FH-TL
  • 数量5000 
  • 厂家ROHM 
  • 封装原厂封装 
  • 批号2024+ 
  • 原装正品,假一罚十
  • QQ:2880824479QQ:2880824479 复制
    QQ:1344056792QQ:1344056792 复制
  • 010-62104931 QQ:2880824479QQ:1344056792
  • DAN222MFH图
  • 深圳市惊羽科技有限公司

     该会员已使用本站11年以上
  • DAN222MFH
  • 数量78800 
  • 厂家ROHM-罗姆 
  • 封装SOT-323 
  • 批号▉▉:2年内 
  • ▉▉¥10一一有问必回一一有长期订货一备货HK仓库
  • QQ:43871025QQ:43871025 复制
  • 131-4700-5145---Q-微-恭-候---有-问-秒-回 QQ:43871025

产品型号DAN222的概述

DAN222芯片概述 DAN222是一款广泛应用于消费电子产品和工业控制领域的集成电路芯片。其设计以高性能和高集成度见称,旨在满足现代电子设备对功耗管理、信号处理和实时控制的苛刻要求。作为一款集成度高、功能丰富的电子组件,DAN222在处理速度、功耗和多个外设接口的支持方面表现出色,在工程师和开发者中受到高度认可。 DAN222的详细参数 DAN222芯片主要具备以下技术参数: 1. 工作电压:DAN222支持的工作电压范围为2.7V至5.5V,这使其能够适应大多数电子电源系统。 2. 工作频率:其主频可达到100MHz,允许高频率的信号处理,适合复杂的应用场景。 3. 功耗:在静态模式下,功耗仅为10μA,而在动态工作状态下功耗也维持在较低水平,通常小于100mW。 4. I/O接口:该芯片支持多达32个通用输入输出(GPIO)端口,可以与多个外设进行通信。 5. 存储器:内置512...

产品型号DAN222的Datasheet PDF文件预览

This Common Cathode Silicon Epitaxial Planar Dual Diode is  
designed for use in ultra high speed switching applications. This  
device is housed in the SOT–416/SC–90 package which is designed  
for low power surface mount applications, where board space is at a  
premium.  
http://onsemi.com  
Fast t  
Low C  
Available in 8 mm Tape and Reel  
SOT–416/SC–90 PACKAGE  
COMMON CATHODE  
DUAL SWITCHING DIODE  
SURFACE MOUNT  
rr  
D
MAXIMUM RATINGS (TA = 25°C)  
CATHODE  
3
Rating  
Reverse Voltage  
Symbol  
Value  
80  
Unit  
Vdc  
V
R
Peak Reverse Voltage  
Forward Current  
V
80  
Vdc  
RM  
I
100  
300  
2.0  
mAdc  
mAdc  
Adc  
F
Peak Forward Current  
Peak Forward Surge Current  
I
FM  
I
(1)  
FSM  
1
2
ANODE  
THERMAL CHARACTERISTICS  
Rating  
Power Dissipation  
Symbol  
Max  
150  
Unit  
mW  
°C  
3
P
D
Junction Temperature  
Storage Temperature Range  
1. t = 1 µS  
T
J
150  
2
1
T
stg  
55 to +150  
°C  
SOT–416  
CASE 463  
STYLE 3  
DEVICE MARKING  
N9  
ORDERING INFORMATION  
Device  
DAN222  
Package  
Shipping  
3000/Tape & Reel  
SOT–416  
Semiconductor Components Industries, LLC, 2000  
1
Publication Order Number:  
March, 2000 – Rev. 2  
DAN222/D  
DAN222  
ELECTRICAL CHARACTERISTICS (T = 25°C)  
A
Characteristic  
Reverse Voltage Leakage Current  
Forward Voltage  
Symbol  
Condition  
= 70 V  
Min  
Max  
0.1  
1.2  
Unit  
µAdc  
Vdc  
Vdc  
pF  
I
R
V
R
V
I = 100 mA  
F
F
R
D
Reverse Breakdown Voltage  
Diode Capacitance  
V
C
I
R
= 100 µA  
80  
V
= 6.0 V, f = 1.0 MHz  
3.5  
4.0  
R
Reverse Recovery Time  
t (2)  
rr  
I = 5.0 mA, V = 6.0 V, R = 100 , I = 0.1 I  
R
ns  
F
R
L
rr  
2. t Test Circuit on following page.  
rr  
http://onsemi.com  
2
DAN222  
TYPICAL ELECTRICAL CHARACTERISTICS  
10  
100  
10  
T = 150°C  
A
T = 85°C  
A
T = 125°C  
A
1.0  
T = 40°C  
A
T = 85°C  
A
0.1  
0.01  
T = 55°C  
1.0  
0.1  
A
T = 25°C  
A
T = 25°C  
A
0.001  
50  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
0
10  
20  
30  
40  
V , FORWARD VOLTAGE (VOLTS)  
F
V , REVERSE VOLTAGE (VOLTS)  
R
Figure 1. Forward Voltage  
Figure 2. Reverse Current  
1.0  
0.9  
0.8  
0.7  
0.6  
0
2
4
6
8
V , REVERSE VOLTAGE (VOLTS)  
R
Figure 3. Diode Capacitance  
http://onsemi.com  
3
DAN222  
RECOVERY TIME EQUIVALENT TEST CIRCUIT  
R
L
A
INPUT PULSE  
OUTPUT PULSE  
t
r
t
p
t
rr  
I
F
t
t
10%  
I = 0.1 I  
rr  
R
90%  
I = 5.0 mA  
F
V
= 6 V  
R
V
R
R = 100 Ω  
L
t = 2 µs  
p
t = 0.35 ns  
r
http://onsemi.com  
4
DAN222  
INFORMATION FOR USING THE SOT-416 SURFACE MOUNT PACKAGE  
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS  
Surface mount board layout is a critical portion of the  
total design. The footprint for the semiconductor packages  
must be the correct size to insure proper solder connection  
interface between the board and the package. With the  
correct pad geometry, the packages will self align when  
subjected to a solder reflow process.  
0.5 min. (3x)  
TYPICAL  
SOLDERING PATTERN  
Unit: mm  
1.4  
SOT–416/SC–90 POWER DISSIPATION  
The power dissipation of the SOT–416/SC–90 is a  
function of the pad size. This can vary from the minimum  
pad size for soldering to the pad size given for maximum  
power dissipation. Power dissipation for a surface mount  
into the equation for an ambient temperature T of 25°C,  
one can calculate the power dissipation of the device which  
in this case is 125 milliwatts.  
A
150°C – 25°C  
833°C/W  
PD =  
= 150 milliwatts  
device is determined by T  
, the maximum rated  
J(max)  
junction temperature of the die, R , the thermal  
θJA  
resistance from the device junction to ambient; and the  
The 833°C/W assumes the use of the recommended  
footprint on a glass epoxy printed circuit board to achieve a  
power dissipation of 150 milliwatts. Another alternative  
would be to use a ceramic substrate or an aluminum core  
board such as Thermal Clad . Using a board material such  
as Thermal Clad, a higher power dissipation can be  
achieved using the same footprint.  
operating temperature, T . Using the values provided on  
A
the data sheet, P can be calculated as follows.  
D
T
J(max) – TA  
Rθ  
PD =  
JA  
The values for the equation are found in the maximum  
ratings table on the data sheet. Substituting these values  
SOLDERING PRECAUTIONS  
The melting temperature of solder is higher than the rated  
temperature of the device. When the entire device is heated  
to a high temperature, failure to complete soldering within  
a short time could result in device failure. Therefore, the  
following items should always be observed in order to  
minimize the thermal stress to which the devices are  
subjected.  
Always preheat the device.  
The delta temperature between the preheat and  
soldering should be 100°C or less.*  
When preheating and soldering, the temperature of the  
leads and the case must not exceed the maximum  
temperature ratings as shown on the data sheet. When  
using infrared heating with the reflow soldering  
method, the difference should be a maximum of 10°C.  
The soldering temperature and time should not exceed  
260°C for more than 10 seconds.  
When shifting from preheating to soldering, the  
maximum temperature gradient should be 5°C or less.  
After soldering has been completed, the device should  
be allowed to cool naturally for at least three minutes.  
Gradual cooling should be used as the use of forced  
cooling will increase the temperature gradient and  
result in latent failure due to mechanical stress.  
Mechanical stress or shock should not be applied  
during cooling  
* Soldering a device without preheating can cause  
excessive thermal shock and stress which can result in  
damage to the device.  
http://onsemi.com  
5
DAN222  
SOLDER STENCIL GUIDELINES  
Prior to placing surface mount components onto a printed  
The stencil opening size for the surface mounted package  
should be the same as the pad size on the printed circuit  
board, i.e., a 1:1 registration.  
circuit board, solder paste must be applied to the pads. A  
solder stencil is required to screen the optimum amount of  
solder paste onto the footprint. The stencil is made of brass  
or stainless steel with a typical thickness of 0.008 inches.  
TYPICAL SOLDER HEATING PROFILE  
For any given circuit board, there will be a group of  
control settings that will give the desired heat pattern. The  
operator must set temperatures for several heating zones,  
and a figure for belt speed. Taken together, these control  
settings make up a heating “profile” for that particular  
circuit board. On machines controlled by a computer, the  
computer remembers these profiles from one operating  
session to the next. Figure 4 shows a typical heating profile  
for use when soldering a surface mount device to a printed  
circuit board. This profile will vary among soldering  
systems but it is a good starting point. Factors that can  
affect the profile include the type of soldering system in  
use, density and types of components on the board, type of  
solder used, and the type of board or substrate material  
being used. This profile shows temperature versus time.  
The line on the graph shows the actual temperature that  
might be experienced on the surface of a test board at or  
near a central solder joint. The two profiles are based on a  
high density and a low density board. The Vitronics  
SMD310 convection/infrared reflow soldering system was  
used to generate this profile. The type of solder used was  
62/36/2 Tin Lead Silver with a melting point between  
177189°C. When this type of furnace is used for solder  
reflow work, the circuit boards and solder joints tend to  
heat first. The components on the board are then heated by  
conduction. The circuit board, because it has a large surface  
area, absorbs the thermal energy more efficiently, then  
distributes this energy to the components. Because of this  
effect, the main body of a component may be up to 30  
degrees cooler than the adjacent solder joints.  
STEP 5  
HEATING  
ZONES 4 & 7  
SPIKE”  
STEP 6 STEP 7  
VENT COOLING  
STEP 1  
PREHEAT  
ZONE 1  
STEP 2  
VENT  
SOAK” ZONES 2 & 5  
RAMP”  
STEP 3  
HEATING  
STEP 4  
HEATING  
ZONES 3 & 6  
SOAK”  
205° TO 219°C  
PEAK AT  
SOLDER JOINT  
RAMP”  
200°C  
150°C  
170°C  
DESIRED CURVE FOR HIGH  
MASS ASSEMBLIES  
160°C  
150°C  
SOLDER IS LIQUID FOR  
40 TO 80 SECONDS  
(DEPENDING ON  
140°C  
100°C  
MASS OF ASSEMBLY)  
100°C  
50°C  
DESIRED CURVE FOR LOW  
MASS ASSEMBLIES  
TIME (3 TO 7 MINUTES TOTAL)  
T
MAX  
Figure 4. Typical Solder Heating Profile  
http://onsemi.com  
6
DAN222  
PACKAGE DIMENSIONS  
SOT–416/SC–90  
CASE 463–01  
ISSUE B  
–A–  
S
NOTES:  
2
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3
G
–B–  
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
1
D 3 PL  
0.20 (0.008)  
A
B
C
D
G
H
J
K
L
S
0.70  
1.40  
0.60  
0.15  
0.80 0.028 0.031  
1.80 0.055 0.071  
0.90 0.024 0.035  
0.30 0.006 0.012  
M
B
0.20 (0.008) A  
K
1.00 BSC  
0.039 BSC  
–––  
0.10  
1.45  
0.10  
0.10  
––– 0.004  
0.25 0.004 0.010  
1.75 0.057 0.069  
0.20 0.004 0.008  
J
C
0.50 BSC  
0.020 BSC  
L
H
STYLE 1:  
PIN 1. BASE  
STYLE 2:  
PIN 1. ANODE  
STYLE 3:  
PIN 1. ANODE  
STYLE 4:  
PIN 1. CATHODE  
2. CATHODE  
3. ANODE  
2. EMITTER  
3. COLLECTOR  
2. N/C  
3. CATHODE  
2. ANODE  
3. CATHODE  
http://onsemi.com  
7
DAN222  
Thermal Clad is a trademark of the Bergquist Company.  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes  
withoutfurthernoticetoanyproductsherein. SCILLCmakesnowarranty,representationorguaranteeregardingthesuitabilityofitsproductsforanyparticular  
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,  
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be  
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.  
SCILLCproductsarenotdesigned, intended, orauthorizedforuseascomponentsinsystemsintendedforsurgicalimplantintothebody, orotherapplications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or  
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold  
SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable  
attorneyfees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim  
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.  
PUBLICATION ORDERING INFORMATION  
North America Literature Fulfillment:  
ASIA/PACIFIC: LDC for ON Semiconductor – Asia Support  
Phone: 303–675–2121 (Tue–Fri 9:00am to 1:00pm, Hong Kong Time)  
Toll Free from Hong Kong 800–4422–3781  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada  
Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada  
Email: ONlit@hibbertco.com  
Email: ONlit–asia@hibbertco.com  
JAPAN: ON Semiconductor, Japan Customer Focus Center  
4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–8549  
Phone: 81–3–5487–8345  
N. American Technical Support: 800–282–9855 Toll Free USA/Canada  
Email: r14153@onsemi.com  
EUROPE: LDC for ON Semiconductor – European Support  
German Phone: (+1) 303–308–7140 (M–F 2:30pm to 5:00pm Munich Time)  
Email: ONlit–german@hibbertco.com  
Fax Response Line: 303–675–2167  
800–344–3810 Toll Free USA/Canada  
French Phone: (+1) 303–308–7141 (M–F 2:30pm to 5:00pm Toulouse Time)  
Email: ONlit–french@hibbertco.com  
ON Semiconductor Website: http://onsemi.com  
English Phone: (+1) 303–308–7142 (M–F 1:30pm to 5:00pm UK Time)  
Email: ONlit@hibbertco.com  
For additional information, please contact your local  
Sales Representative.  
DAN222/D  
配单直通车
DAN222产品参数
型号:DAN222
生命周期:Active
IHS 制造商:CHANGZHOU GALAXY CENTURY MICROELECTRONICS CO LTD
零件包装代码:SOT-523
Reach Compliance Code:unknown
风险等级:5.63
Base Number Matches:1
配置:Dual,Common Cathode
VRRM (V) max:80
IF (A) max:0.1
VF (V) max:1.2
Condition1_IF (A):0.1
IFSM (A) max:2
IR (uA) max:0.1
Condition2_VR (V):70
trr (ns) max:4
AEC Qualified:No
最高工作温度:150
最低工作温度:-55
MSL等级:1
生命周期:Active
是否无铅:Yes
符合Reach:Yes
符合RoHS:Yes
ECCN代码:EAR99
Package Outlines:SOT-523
  •  
  • 供货商
  • 型号 *
  • 数量*
  • 厂商
  • 封装
  • 批号
  • 交易说明
  • 询价
批量询价选中的记录已选中0条,每次最多15条。
 复制成功!