DS90LV011ATMF/NOPB全新原装原理图各脚功能电路原理芯片引脚定义-中国IC网-芯三七

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产品型号DS90LV011ATMF/NOPB的概述

芯片DS90LV011ATMF/NOPB的概述 DS90LV011ATMF/NOPB是一款由德州仪器（Texas Instruments）公司生产的单通道LVDS（低压差分信号）发送器，它主要设计用于在高速数字信号的传输中实现高带宽、低功耗以及长距离的通信。这种芯片广泛应用于多个领域，包括图形界面、通信设备、餐饮设备和其他需要高速数据传输的应用场景。 DS90LV011ATMF/NOPB支持多种工作电压，具有宽广的工作温度范围，这使得它能够在多种严酷的环境下高效工作。该芯片的设计初衷是解决在高速信号传输过程中常见的信号失真和延迟问题。得益于LVDS技术，DS90LV011ATMF/NOPB实现了信号在长距离传输中的抗干扰能力。芯片DS90LV011ATMF/NOPB的详细参数 DS90LV011ATMF/NOPB的主要参数包括以下几个方面： - 输入电源电压（VCC）：一般范围在2....

产品型号DS90LV011ATMF/NOPB的Datasheet PDF文件预览

DS90LV011A

www.ti.com

SNLS140C –MAY 2002–REVISED APRIL 2013

DS90LV011A 3V LVDS Single High Speed Differential Driver

Check for Samples: DS90LV011A

FEATURES

DESCRIPTION

The DS90LV011A is a single LVDS driver device

optimized for high data rate and low power

applications. The DS90LV011A is a current mode

driver allowing power dissipation to remain low even

at high frequency. In addition, the short circuit fault

current is also minimized. The device is designed to

support data rates in excess of 400Mbps (200MHz)

utilizing Low Voltage Differential Signaling (LVDS)

technology.

•

Conforms to TIA/EIA-644-A Standard

>400Mbps (200MHz) Switching Rates

700 ps (100 ps Typical) Maximum Differential

Skew

•

1.5 ns Maximum Propagation Delay

Single 3.3V Power Supply

±350 mV Differential Signaling

Power Off Protection (Outputs in TRI-STATE)

Pinout Simplifies PCB Layout

The device is in a 5-lead SOT-23 package. The

LVDS outputs have been arranged for easy PCB

layout. The differential driver outputs provide low EMI

with its typical low output swing of 350 mV. The

DS90LV011A can be paired with its companion single

line receiver, the DS90LV012A, or with any of TI's

LVDS receivers, to provide a high-speed LVDS

interface.

Low Power Dissipation (23 mW @ 3.3V

Typical)

•

SOT-23 5-Lead Package

SOT-23 Version Pin Compatible with

SN65LVDS1

•

Fabricated with Advanced CMOS Process

Technology

Connection Diagram

Industrial Temperature Operating Range

–

(−40°C to +85°C)

Figure 1. Top View

See Package Number DBV (R-PDSO-G5)

Functional Diagram

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

DS90LV011A

SNLS140C –MAY 2002–REVISED APRIL 2013

www.ti.com

Absolute Maximum Ratings⁽¹⁾

Supply Voltage (V_DD

)

−0.3V to +4V

−0.3V to +3.6V

−0.3V to +3.9V

24mA

LVCMOS input voltage (TTL IN)

LVDS output voltage (OUT±)

LVDS output short circuit current

Maximum Package Power Dissipation @ +25°C

DBV Package

902 mW

7.22 mW/°C above +25°C

138.5°C/Watt

Derate DBV Package

Thermal Resistance (θ_JA

)

Storage Temperature

−65°C to +150°C

+260°C (4 sec.)

Lead Temperature – Soldering

Maximum Junction Temperature

ESD Ratings

+150°C

HBM (1.5 kΩ, 100 pF)

EIAJ (0 Ω, 200 pF)

≥ 9kV

≥ 900V

≥ 2000V

≥ 4kV

CDM (0 Ω, 0 pF)

IEC direct (330 Ω, 150 pF)

(1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be specified. They are not meant to imply

that the devices should be operated at these limits. Electrical Characteristics specifies conditions of device operation.

Recommended Operating Conditions

Min

3.0

-40

Typ

3.3

Max

3.6

Units

Supply Voltage (V_DD

)

Temperature (T_A)

+25

+85

°C

Submit Documentation Feedback

Product Folder Links: DS90LV011A

DS90LV011A

www.ti.com

SNLS140C –MAY 2002–REVISED APRIL 2013

Electrical Characteristics

Over Supply Voltage and Operating Temperature ranges, unless otherwise specified.^(1)(2)(3)

Symbol

Parameter

Output Differential Voltage

V_ODMagnitude Change

Offset Voltage

Conditions

Min

Typ

350

Max

450

Units

|V_OD

ΔV_OD

V_OS

R_L= 100Ω

OUT+,

OUT−

250

(Figure 2 and Figure 3)

R_L= 100Ω

(Figure 2)

1.125

1.22

1.375

ΔV_OS

I_OFF

Offset Magnitude Change

μA

Power-off Leakage

Output Short Circuit Current⁽⁴⁾

V_OUT= 3.6V or GND, V_DD= 0V

V_OUT+and V_OUT−= 0V

V_OD= 0V

±1

±10

−24

−12

I_OS

−6

−5

I_OSD

Differential Output Short Circuit

Current⁽⁴⁾

C_OUT

V_IH

V_IL

Output Capacitance

Input High Voltage

Input Low Voltage

Input High Current

Input Low Current

Input Clamp Voltage

Input Capacitance

Power Supply Current

TTL IN

2.0

V_DD

0.8

GND

I_IH

V_IN= 3.3V or 2.4V

V_IN= GND or 0.5V

I_CL= −18 mA

±2

±1

−0.6

±10

μA

I_IL

V_CL

C_IN

I_DD

−1.5

No Load

V_IN= V_DDor GND

V_DD

R_L= 100Ω

(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground

except V_OD

(2) All typicals are given for: V_DD= +3.3V and T_A= +25°C.

(3) The DS90LV011A is a current mode device and only function with datasheet specification when a resistive load is applied to the drivers

outputs.

(4) Output short circuit current (I_OS) is specified as magnitude only, minus sign indicates direction only.

Switching Characteristics

Over Supply Voltage and Operating Temperature Ranges, unless otherwise specified.^(1)(2)(3)(4)

Symbol

t_PHLD

Parameter

Conditions

R_L= 100Ω, C_L= 15 pF

(Figure 4 and Figure 5)

Min

0.3

Typ

1.0

1.1

0.1

0.2

0.4

0.5

250

Max

1.5

0.7

1.0

1.2

1.0

Units

Differential Propagation Delay High to Low

t_PLHD

t_SKD1

t_SKD3

t_SKD4

t_TLH

Differential Propagation Delay Low to High

(5)

Differential Pulse Skew |t_PHLD− t_PLHD

Differential Part to Part Skew⁽⁶⁾

Differential Part to Part Skew⁽⁷⁾

Transition Low to High Time

0.2

200

t_THL

Transition High to Low Time

Maximum Operating Frequency⁽⁸⁾

f_MAX

MHz

(1) All typicals are given for: V_DD= +3.3V and T_A= +25°C.

(2) These parameters are specified by design. The limits are based on statistical analysis of the device performance over PVT (process,

voltage, temperature) ranges.

(3) C_Lincludes probe and fixture capacitance.

(4) Generator waveform for all tests unless otherwise specified: f = 1 MHz, Z_O= 50Ω, t_r≤ 1 ns, t_f≤ 1 ns (10%-90%).

(5) t_SKD1, |t_PHLD− t_PLHD|, is the magnitude difference in differential propagation delay time between the positive going edge and the negative

going edge of the same channel.

(6) t_SKD3, Differential Part to Part Skew, is defined as the difference between the minimum and maximum specified differential propagation

delays. This specification applies to devices at the same V_DDand within 5°C of each other within the operating temperature range.

(7) t_SKD4, part to part skew, is the differential channel to channel skew of any event between devices. This specification applies to devices

over recommended operating temperature and voltage ranges, and across process distribution. t_SKD4is defined as |Max − Min|

differential propagation delay.

(8) f_MAXgenerator input conditions: t_r= t_f< 1 ns (0% to 100%), 50% duty cycle, 0V to 3V. Output criteria: duty cycle = 45%/55%, V_OD

250mV. The parameter is specified by design. The limit is based on the statistical analysis of the device over the PVT range by the

transitions times (t_TLHand t_THL).

Submit Documentation Feedback

Product Folder Links: DS90LV011A

DS90LV011A

SNLS140C –MAY 2002–REVISED APRIL 2013

www.ti.com

PARAMETER MEASUREMENT INFORMATION

Figure 2. Differential Driver DC Test Circuit

Figure 3. Differential Driver Full Load DC Test Circuit

Figure 4. Differential Driver Propagation Delay and Transition Time Test Circuit

Figure 5. Differential Driver Propagation Delay and Transition Time Waveforms

Submit Documentation Feedback

Product Folder Links: DS90LV011A

DS90LV011A

www.ti.com

SNLS140C –MAY 2002–REVISED APRIL 2013

APPLICATION INFORMATION

Table 1. Device Pin Descriptions

Pin Name

Package Pin Number

Description

SOT-23

TTL IN

OUT+

OUT−

GND

LVTTL/LVCMOS driver input pins

Non-inverting driver output pin

Inverting driver output pin

Ground pin

V_DD

Power supply pin, +3.3V ± 0.3V

Submit Documentation Feedback

Product Folder Links: DS90LV011A

DS90LV011A

SNLS140C –MAY 2002–REVISED APRIL 2013

www.ti.com

REVISION HISTORY

Changes from Revision B (April 2013) to Revision C

Page

•

Changed layout of National Data Sheet to TI format ............................................................................................................ 5

Submit Documentation Feedback

Product Folder Links: DS90LV011A

PACKAGE OPTION ADDENDUM

www.ti.com

1-Nov-2013

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

1000

(1)

(2)

(6)

(3)

(4/5)

DS90LV011ATMF

NRND

ACTIVE

SOT-23

DBV

TBD

Call TI

CU SN

Call TI

-40 to 85

N01

DS90LV011ATMF/NOPB

DBV

Green (RoHS

& no Sb/Br)

Level-1-260C-UNLIM

DS90LV011ATMFX/NOPB

ACTIVE

SOT-23

DBV

3000

Green (RoHS

& no Sb/Br)

CU SN

Level-1-260C-UNLIM

-40 to 85

N01

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

⁽⁶⁾Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

1-Nov-2013

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

11-Oct-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

DS90LV011ATMF

SOT-23

DBV

1000

3000

178.0

8.4

3.2

1.4

4.0

8.0

DS90LV011ATMF/NOPB SOT-23

DS90LV011ATMFX/NOPB SOT-23

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

11-Oct-2013

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

DS90LV011ATMF

SOT-23

DBV

1000

3000

210.0

185.0

35.0

DS90LV011ATMF/NOPB

DS90LV011ATMFX/NOPB

Pack Materials-Page 2

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

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DS90LV011ATMF/NOPB产品参数

型号:	DS90LV011ATMF/NOPB
是否Rohs认证：	符合
生命周期：	Transferred
IHS 制造商：	NATIONAL SEMICONDUCTOR CORP
包装说明：	LSSOP, TSOP5/6,.11,37
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
风险等级：	5.3
差分输出：	YES
驱动器位数：	1
高电平输入电流最大值：	0.00001 A
接口集成电路类型：	LINE DRIVER
接口标准：	EIA-644-A; TIA-644-A
JESD-30 代码：	R-PDSO-G5
JESD-609代码：	e3
长度：	2.92 mm
湿度敏感等级：	1
功能数量：	1
端子数量：	5
最高工作温度：	85 °C
最低工作温度：	-40 °C
最小输出摆幅：	0.25 V
输出特性：	3-STATE
封装主体材料：	PLASTIC/EPOXY
封装代码：	LSSOP
封装等效代码：	TSOP5/6,.11,37
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）：	260
电源：	3.3 V
认证状态：	Not Qualified
最大接收延迟：
座面最大高度：	1.22 mm
子类别：	Line Driver or Receivers
最大供电电压：	3.6 V
最小供电电压：	3 V
标称供电电压：	3.3 V
表面贴装：	YES
技术：	CMOS
温度等级：	INDUSTRIAL
端子面层：	Matte Tin (Sn)
端子形式：	GULL WING
端子节距：	0.95 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
最大传输延迟：	1.5 ns
宽度：	1.6 mm

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