Absolute Maximum Ratings (Note 1)
ESD Ratings
(HBM 1.5 kΩ, 100 pF)
(EIAJ 0 Ω, 200 pF)
(CDM)
≥ 8kV
≥ 1000V
≥ 1000V
≥ 4kV
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (VCC
)
−0.3V to +4V
−0.3V to +3.6V
−0.3V to +3.9V
(IEC direct 330 Ω, 150 pF)
Input Voltage (DI)
Output Voltage (DO )
Recommended Operating
Conditions
@
Maximum Package Power Dissipation +25˚C
M Package
1190 mW
Min
Typ
3.3
25
Max
3.6
Units
V
Derate M Package
9.5 mW/˚C above +25˚C
−65˚C to +150˚C
Supply Voltage (VCC
)
3.0
Storage Temperature Range
Temperature (TA)
−40
+85
˚C
Lead Temperature Range Soldering
(4 sec.)
+260˚C
Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (Notes 2, 3, 7)
Symbol
Parameter
Conditions
Pin
Min
Typ
Max
450
Units
DIFFERENTIAL DRIVER CHARACTERISTICS
VOD
∆VOD
VOH
VOL
VOS
∆VOS
IOXD
IOSD
VIH
Output Differential Voltage
VOD Magnitude Change
Output High Voltage
Output Low Voltage
Offset Voltage
RL = 100Ω
(Figure 1)
DO+,
DO−
250
360
1
mV
mV
V
35
1.4
1.1
1.2
3
1.6
0.9
1.125
0
V
1.375
25
V
Offset Magnitude Change
Power-off Leakage
mV
µA
mA
V
VOUT = VCC or GND, VCC = 0V
1
10
Output Short Circuit Current
Input High Voltage
−5.7
−8
DI
2.0
VCC
0.8
10
VIL
Input Low Voltage
GND
V
IIH
Input High Current
VIN = 3.3V or 2.4V
VIN = GND or 0.5V
ICL = −18 mA
2
1
µA
µA
V
IIL
Input Low Current
10
VCL
ICC
Input Clamp Voltage
Power Supply Current
−1.5
−0.6
8
No Load
VIN = VCC or GND
VCC
14
20
mA
mA
RL = 100Ω
14
Switching Characteristics
Over Supply Voltage and Operating Temperature Ranges, unless otherwise specified. (Notes 3, 4, 5, 6)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
DIFFERENTIAL DRIVER CHARACTERISTICS
tPHLD
tPLHD
tSKD1
tSKD2
tSKD3
tSKD4
tTLH
Differential Propagation Delay High to Low
Differential Propagation Delay Low to High
Differential Pulse Skew |tPHLD − tPLHD| (Note 8)
Channel to Channel Skew (Note 9)
Differential Part to Part Skew (Note 10)
Differential Part to Part Skew (Note 11)
Transition Low to High Time
RL = 100Ω, CL = 15 pF
(Figure 2 and Figure 3)
0.3
0.3
0
0.8
1.1
0.3
0.4
1.5
1.5
0.7
0.8
1.0
1.2
1.0
1.0
ns
ns
ns
0
ns
0
ns
0
ns
0.2
0.2
0.5
0.5
350
ns
tTHL
Transition High to Low Time
ns
fMAX
Maximum Operating Frequency (Note 12)
MHz
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.
Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except V
.
OD
Note 3: All typicals are given for: V
= +3.3V and T = +25˚C.
A
CC
Note 4: These parameters are guaranteed by design. The limits are based on statistical analysis of the device over PVT (process, voltage, temperature) ranges.
Note 5: C includes probe and fixture capacitance.
L
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