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产品型号DSC1121CE1-T的Datasheet PDF文件预览

DSC1101/21  
Low-Jitter Precision CMOS Oscillator  
Features  
General Description  
• Low RMS Phase Jitter: <1 ps (typ.)  
The DSC1101 and DSC1121 series of high  
performance oscillators utilize a proven silicon MEMS  
technology to provide excellent jitter and stability over  
a wide range of supply voltages and temperatures. By  
eliminating the need for quartz or SAW technology,  
MEMS oscillators significantly enhance reliability and  
accelerate product development, while meeting  
stringent clock performance criteria for a variety of  
communications, storage, and networking applications.  
• High Stability: ±10 ppm, ±20 ppm, ±25 ppm,  
±50 ppm  
• Wide Temperature Range:  
- Automotive: –55°C to +125°C  
- Ext. Industrial: –40°C to +105°C  
- Industrial: –40°C to +85°C  
- Commercial: –20°C to +70°C  
• High Supply Noise Rejection: –50 dBc  
• Wide Freq. Range: 2.3 MHz to 170 MHz  
• Small Industry Standard Footprints  
DSC1101 has a standby feature that allows it to  
completely power-down when EN pin is pulled low;  
whereas for DSC1121, only the outputs are disabled  
when EN is low. Both oscillators are available in  
industry standard packages, including the small  
2.5 mm x 2.0 mm, and are “drop-in” replacements for  
standard 4-pin CMOS quartz crystal oscillators.  
- 2.5 mm x 2.0 mm, 3.2 mm x 2.5 mm, 5.0 mm  
x 3.2 mm, and 7.0 mm x 5.0 mm  
• Excellent Shock and Vibration Immunity  
- Qualified to MIL-STD-883  
• High Reliability  
- 20x Better MTF than Quartz Oscillators  
• Low Current Consumption  
Functional Block Diagram  
• Supply Range of 2.25 to 3.6V  
• Standby and Output Enable Function  
• Lead-Free and RoHS Compliant  
Applications  
• Storage Area Networks  
- SATA, SAS, Fibre Channel  
• Passive Optical Networks  
- EPON, 10G-EPON,V GPON, 10G-PON  
• Ethernet  
- 1G, 10GBASE-T/KR/LR/SR, and FCoE  
• HD/SD/SDI Video and Surveillance  
• PCI Express  
• Display Port  
2017 Microchip Technology Inc.  
DS20005613B-page 1  
DSC1101/21  
1.0  
ELECTRICAL CHARACTERISTICS  
Absolute Maximum Ratings †  
Input Voltage, VIN ..............................................................................................................................–0.3V to VDD + 0.3V  
Supply Voltage .......................................................................................................................................... –0.3V to +4.0V  
ESD Protection On All Pins...........................................................................................4000V HBM, 1500V CDM (max.)  
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.  
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated  
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended  
periods may affect device reliability.  
Note: 1000+ years of data retention on internal memory.  
TABLE 1-1:  
DC CHARACTERISTICS  
Electrical Characteristics  
Parameters  
Sym.  
Min.  
Typ.  
Max.  
Units  
Conditions  
Supply Voltage (Note 1)  
VDD  
2.25  
3.6  
V
DSC1101, EN pin low, output  
is disabled  
0.095  
22  
DSC1121, EN pin low, output  
is disabled  
Supply Current  
IDD  
20  
mA  
Output enabled, CL = 15 pF,  
F0 = 100 MHz  
31  
35  
±10  
±20  
±25  
±50  
±5  
Ext Comm. & Ind. only  
All temp ranges  
All temp ranges  
All temp ranges  
1 year @ 25°C  
T = 25°C  
Frequency Stability  
(Including frequency  
variations due to initial  
tolerance, temp. and  
power supply voltage.)  
f  
ppm  
Aging  
f  
tSU  
VIH  
ppm  
ms  
Startup Time (Note 2)  
5
Input Logic Levels  
Input Logic High  
Input Logic Low  
0.75VDD  
V
VIL  
tDS  
0.1VDD  
Output Disable Time  
(Note 3)  
5
ns  
5
ms  
ns  
DSC1101  
DSC1121  
Output Enable Time  
tEN  
20  
Enable Pull-up Resistor  
(Note 4)  
40  
k  
Pull-up Resistor Exist  
CMOS Output  
Output Logic Levels  
Output Logic High  
Output Logic Low  
VOH  
VOL  
0.9VDD  
V
I = ±6 mA  
0.1VDD  
Note 1: Pin 6 VDD should be filtered with 0.1 µF capacitor.  
2: tSU is time to 100 ppm of output frequency after VDD is applied and outputs are enabled.  
3: Output Waveform and Test Circuit figures define the parameters.  
4: Output is enabled if pad is floated or not connected.  
DS20005613B-page 2  
2017 Microchip Technology Inc.  
DSC1101/21  
TABLE 1-1:  
DC CHARACTERISTICS (CONTINUED)  
Electrical Characteristics  
Parameters  
Sym.  
tR  
Min.  
Typ.  
1.1  
Max.  
Units  
Conditions  
Output Transition Time  
Rise Time  
Fall Time  
2
2
20% to 80%  
CL = 15 pF  
ns  
tF  
1.3  
CL = 15 pF, 20°C to +70°C  
and –40°C to +85°C  
2.3  
3.3  
170  
170  
Frequency  
f0  
MHz  
%
CL = 15 pF, 40°C to +105°C  
and –55°C to +125°C  
Output Duty Cycle  
Period Jitter  
SYM  
JPER  
45  
3
55  
2
psRMS FOUT = 125 MHz  
200kHzto20MHz@125MHz  
0.3  
0.38  
1.7  
Integrated Phase Noise  
JPH  
psRMS 100kHzto20MHz@125MHz  
12 kHz to 20 MHz @ 125 MHz  
Note 1: Pin 6 VDD should be filtered with 0.1 µF capacitor.  
2: tSU is time to 100 ppm of output frequency after VDD is applied and outputs are enabled.  
3: Output Waveform and Test Circuit figures define the parameters.  
4: Output is enabled if pad is floated or not connected.  
2017 Microchip Technology Inc.  
DS20005613B-page 3  
DSC1101/21  
TEMPERATURE SPECIFICATIONS (Note 1)  
Parameters  
Temperature Ranges  
Sym.  
Min.  
Typ.  
Max.  
Units  
Conditions  
TA  
TA  
TA  
TA  
TJ  
–20  
–40  
–40  
–55  
+70  
+85  
°C  
°C  
°C  
°C  
°C  
°C  
°C  
Ordering Option E  
Ordering Option I  
Ordering Option L  
Ordering Option M  
Operating Temperature Range (T)  
+105  
+125  
+150  
+150  
+260  
Junction Operating Temperature  
Storage Temperature Range  
Soldering Temperature Range  
TA  
TS  
–40  
40 sec. max  
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable  
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the  
maximum allowable power dissipation will cause the device operating junction temperature to exceed the  
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.  
DS20005613B-page 4  
2017 Microchip Technology Inc.  
DSC1101/21  
2.0  
NOMINAL PERFORMANCE CURVES  
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of  
samples and are provided for informational purposes only. The performance characteristics listed herein  
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified  
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.  
FIGURE 2-1:  
Phase Jitter (Integrated  
Phase Noise).  
FIGURE 2-2:  
Power Supply Rejection  
Ratio.  
2017 Microchip Technology Inc.  
DS20005613B-page 5  
DSC1101/21  
3.0  
PIN DESCRIPTIONS  
The descriptions of the pins are listed in Table 3-1. Pin order and descriptions apply across all package types.  
TABLE 3-1: PIN FUNCTION TABLE  
Pin Number Pin Number Pin Number Pin Number Pin Number  
Pin Name  
Description  
7x5 w/ Pad  
7x5 w/o Pad  
5x3.2  
3.2x2.5  
2x2.5  
1
2
1
2
1
2
1
2
1
2
EN  
NC  
Enable.  
Do not connect.  
Ground.  
3
3
3
3
3
GND  
OUT  
NC  
4
4
4
4
4
Output.  
5
5
5
5
5
Do not connect.  
Supply voltage.  
Tie to ground.  
6
6
6
6
6
VDD  
PAD  
PAD  
TABLE 3-2:  
OUTPUT ENABLE MODES  
EN Pin  
DSC1101  
DSC1121  
High  
Output Active  
Output Active  
Standby  
Output Active  
Output Active  
NC  
Low  
Output Disabled  
DS20005613B-page 6  
2017 Microchip Technology Inc.  
DSC1101/21  
4.0  
OUTPUT WAVEFORM  
tR  
tF  
VOH  
OUTPUT  
VOL  
tEN  
1/fo  
tDA  
VIH  
ENABLE  
VIL  
FIGURE 4-1:  
DSC1101/21 Output Waveform.  
2017 Microchip Technology Inc.  
DS20005613B-page 7  
DSC1101/21  
5.0  
TYPICAL TERMINATION SCHEME  
FIGURE 5-1:  
Typical Termination Scheme for DSC1101/21.  
DS20005613B-page 8  
2017 Microchip Technology Inc.  
DSC1101/21  
6.0  
BOARD LAYOUT (RECOMMENDED)  
Via to GND layer  
1
2
6
5
4
Supply bypass  
capacitor  
3
Via to GND layer  
FIGURE 6-1:  
DSC1101/21 Recommended Board Layout.  
2017 Microchip Technology Inc.  
DS20005613B-page 9  
DSC1101/21  
7.0  
SOLDER REFLOW PROFILE  
MSL 1 @ 260°C refer to JSTD-020C  
Ramp-Up Rate (200°C to Peak Temp)  
Preheat Time 150°C to 200°C  
Time Maintained Above 217°C  
Peak Temperature  
3°C/Sec. Max.  
60-180 Sec.  
60-150 Sec.  
255-260°C  
20-40 Sec.  
Time within 5°C of Actual Peak  
Ramp-Down Rate  
6°C/Sec. Max.  
8 minute Max.  
Time 25°C to Peak Temperature  
DS20005613B-page 10  
2017 Microchip Technology Inc.  
DSC1101/21  
8.0  
8.1  
PACKAGING INFORMATION  
Package Marking Information  
Example  
6-Pin CDFN/VDFN*  
XXXXXXX  
DCPYYWW  
0SSS  
0750000  
DCP1723  
0421  
Legend: XX...X Product code, customer-specific information, or frequency in MHz  
without printed decimal point  
Y
Year code (last digit of calendar year)  
YY  
WW  
SSS  
Year code (last 2 digits of calendar year)  
Week code (week of January 1 is week ‘01’)  
Alphanumeric traceability code  
e
3
Pb-free JEDEC® designator for Matte Tin (Sn)  
This package is Pb-free. The Pb-free JEDEC designator (  
can be found on the outer packaging for this package.  
*
e
3
)
, , Pin one index is identified by a dot, delta up, or delta down (triangle  
Note: In the event the full Microchip part number cannot be marked on one line, it will  
be carried over to the next line, thus limiting the number of available  
characters for customer-specific information. Package may or may not include  
the corporate logo.  
Underbar (_) and/or Overbar () symbol may not be to scale.  
2017 Microchip Technology Inc.  
DS20005613B-page 11  
DSC1101/21  
6-Lead VDFN 2.5 mm x 2.0 mm Package Outline and Recommended Land Pattern  
6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
D
A
B
E
N
(DATUM A)  
(DATUM B)  
NOTE 1  
2X  
0.05 C  
1
TOP2VIEW  
2X  
0.05 C  
0.10 C  
A
C
A1  
SEATING  
PLANE  
6X  
0.08 C  
SIDE VIEW  
2X b2  
1
2
L2  
5X L1  
N
4X b1  
0.10  
0.05  
C A B  
C
e
BOTTOM VIEW  
Microchip Technology Drawing C04-1005A Sheet 1 of 2  
DS20005613B-page 12  
2017 Microchip Technology Inc.  
DSC1101/21  
6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
Units  
Dimension Limits  
MILLIMETERS  
NOM  
MIN  
MAX  
Number of Terminals  
Pitch  
Overall Height  
Standoff  
Overall Length  
Overall Width  
Terminal Width  
Terminal Width  
Terminal Length  
Terminal Length  
N
6
e
0.825 BSC  
0.85  
A
A1  
D
0.80  
0.00  
0.90  
0.05  
0.02  
2.50 BSC  
2.00 BSC  
0.65  
0.25  
0.70  
E
b1  
b2  
L1  
L2  
0.60  
0.20  
0.60  
0.70  
0.30  
0.80  
0.665  
0.765  
0.865  
Notes:  
1. Pin 1 visual index feature may vary, but must be located within the hatched area.  
2. Package is saw singulated  
3. Dimensioning and tolerancing per ASME Y14.5M  
BSC: Basic Dimension. Theoretically exact value shown without tolerances.  
REF: Reference Dimension, usually without tolerance, for information purposes only.  
Microchip Technology Drawing C04-1005A Sheet 2 of 2  
2017 Microchip Technology Inc.  
DS20005613B-page 13  
DSC1101/21  
6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
X1  
X2  
1
2
Y
G2 C  
6
G1  
SILK SCREEN  
E
RECOMMENDED LAND PATTERN  
Units  
MILLIMETERS  
Dimension Limits  
MIN  
NOM  
MAX  
Contact Pitch  
E
X1  
X2  
Y
0.825 BSC  
Contact Pad Width (X4)  
Contact Pad Width (X2)  
Contact Pad Length (X6)  
Contact Pad Spacing  
0.65  
0.25  
0.85  
C
1.45  
Space Between Contacts (X4)  
Space Between Contacts (X3)  
G1  
G2  
0.38  
0.60  
Notes:  
1. Dimensioning and tolerancing per ASME Y14.5M  
BSC: Basic Dimension. Theoretically exact value shown without tolerances.  
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during  
reflow process  
Microchip Technology Drawing C04-3005A  
DS20005613B-page 14  
2017 Microchip Technology Inc.  
DSC1101/21  
6-Lead VDFN 3.2 mm x 2.5 mm Package Outline and Recommended Land Pattern  
6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
D
A
B
E
N
(DATUM A)  
(DATUM B)  
NOTE 1  
2X  
0.05 C  
2X  
1
2
TOP VIEW  
0.05 C  
0.10 C  
0.08 C  
A1  
C
A
SEATING  
PLANE  
6X  
SIDE VIEW  
2X b2  
1
2
NOTE 1  
L
N
4X b1  
L1  
e
0.07  
0.05  
C A B  
C
BOTTOM VIEW  
Microchip Technology Drawing C04-1007A Sheet 1 of 2  
2017 Microchip Technology Inc.  
DS20005613B-page 15  
DSC1101/21  
6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
Units  
Dimension Limits  
MILLIMETERS  
NOM  
MIN  
MAX  
Number of Terminals  
Pitch  
Overall Height  
Standoff  
Overall Length  
Overall Width  
Terminal Width  
Terminal Width  
Terminal Length  
Terminal Pullback  
N
6
e
1.05 BSC  
0.85  
0.02  
3.20 BSC  
2.50 BSC  
0.90  
0.50  
0.70  
0.10 REF  
A
A1  
D
0.80  
0.00  
0.90  
0.05  
E
b1  
b2  
L
0.85  
0.45  
0.65  
0.95  
0.55  
0.75  
L1  
Notes:  
1. Pin 1 visual index feature may vary, but must be located within the hatched area.  
2. Package is saw singulated  
3. Dimensioning and tolerancing per ASME Y14.5M  
BSC: Basic Dimension. Theoretically exact value shown without tolerances.  
REF: Reference Dimension, usually without tolerance, for information purposes only.  
Microchip Technology Drawing C04-1007A Sheet 2 of 2  
DS20005613B-page 16  
2017 Microchip Technology Inc.  
DSC1101/21  
6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
X2  
G
6
C
Y
1
2
X1  
SILK SCREEN  
E
RECOMMENDED LAND PATTERN  
Units  
MILLIMETERS  
Dimension Limits  
MIN  
0.25  
NOM  
1.05 BSC  
1.60  
MAX  
Contact Pitch  
E
C
X1  
X2  
Y
Contact Pad Spacing  
Contact Pad Width (X4)  
Contact Pad Width (X2)  
Contact Pad Length (X6)  
1.00  
0.60  
0.85  
Space Between Contacts (X4)  
G1  
Notes:  
1. Dimensioning and tolerancing per ASME Y14.5M  
BSC: Basic Dimension. Theoretically exact value shown without tolerances.  
Microchip Technology Drawing C04-3007A  
2017 Microchip Technology Inc.  
DS20005613B-page 17  
DSC1101/21  
6-Lead CDFN 5.0 mm x 3.2 mm Package Outline and Recommended Land Pattern  
DS20005613B-page 18  
2017 Microchip Technology Inc.  
DSC1101/21  
6-Lead VDFN 7.0 mm x 5.0 mm Package Outline and Recommended Land Pattern  
6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN]  
With 2.8x1.8 mm Exposed Pad  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
X2  
EV  
6
ØV  
C
Y2  
EV  
G
Y1  
1
2
X1  
E
SILK SCREEN  
RECOMMENDED LAND PATTERN  
Units  
Dimension Limits  
E
MILLIMETERS  
NOM  
2.54 BSC  
MIN  
MAX  
Contact Pitch  
Optional Center Pad Width  
Optional Center Pad Length  
Contact Pad Spacing  
X2  
Y2  
C
2.90  
1.90  
3.70  
Contact Pad Width (X6)  
Contact Pad Length (X6)  
Contact Pad to Center Pad (X2)  
Thermal Via Diameter (X6)  
Thermal Via Pitch  
X1  
Y1  
G
V
EV  
1.50  
1.35  
0.20  
0.33  
1.20  
Notes:  
1. Dimensioning and tolerancing per ASME Y14.5M  
BSC: Basic Dimension. Theoretically exact value shown without tolerances.  
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during  
reflow process  
Microchip Technology Drawing C04-3010A  
2017 Microchip Technology Inc.  
DS20005613B-page 19  
DSC1101/21  
6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN]  
With 2.8x1.8 mm Exposed Pad  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
D
A
B
E
N
(DATUM A)  
(DATUM B)  
NOTE 1  
2X  
0.20 C  
2X  
1
2
0.20 C  
TOP VIEW  
A1  
0.10 C  
0.08 C  
C
A
SEATING  
PLANE  
6X  
SIDE VIEW  
0.10  
C A B  
D2  
2
1
0.10  
C A B  
NOTE 1  
E2  
6X L  
(K)  
6X b  
N
0.10  
0.05  
C A B  
C
e
BOTTOM VIEW  
Microchip Technology Drawing C04-1010A Sheet 1 of 2  
DS20005613B-page 20  
2017 Microchip Technology Inc.  
DSC1101/21  
6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN]  
With 2.8x1.8 mm Exposed Pad  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
Units  
Dimension Limits  
MILLIMETERS  
NOM  
MIN  
MAX  
Number of Terminals  
Pitch  
N
e
6
2.54  
Overall Height  
Standoff  
Overall Length  
Exposed Pad Length  
Overall Width  
Exposed Pad Width  
Terminal Width  
Terminal Length  
A
A1  
D
D2  
E
E2  
b
L
0.80  
0.00  
0.85  
0.02  
7.00 BSC  
2.80  
5.00 BSC  
1.80  
0.90  
0.05  
2.70  
2.90  
1.70  
1.35  
1.00  
1.90  
1.45  
1.20  
1.40  
1.10  
Terminal-to-Exposed-Pad  
K
0.20 REF  
Notes:  
1. Pin 1 visual index feature may vary, but must be located within the hatched area.  
2. Package is saw singulated  
3. Dimensioning and tolerancing per ASME Y14.5M  
BSC: Basic Dimension. Theoretically exact value shown without tolerances.  
REF: Reference Dimension, usually without tolerance, for information purposes only.  
Microchip Technology Drawing C04-1010A Sheet 2 of 2  
2017 Microchip Technology Inc.  
DS20005613B-page 21  
DSC1101/21  
6-Lead CDFN 7.0 mm x 5.0 mm Package Outline and Recommended Land Pattern  
DS20005613B-page 22  
2017 Microchip Technology Inc.  
DSC1101/21  
NOTES:  
2017 Microchip Technology Inc.  
DS20005613B-page 23  
DSC1101/21  
DS20005613B-page 24  
2017 Microchip Technology Inc.  
DSC1101/1121  
APPENDIX A: REVISION HISTORY  
Revision A (August 2017)  
• Initial creation of document DSC1101/21 to Micro-  
chip data sheet template DS20005613A.  
• Minor text changes throughout.  
Revision B (December 2017)  
• Military temperature range changed to Automotive  
in Features and Product Identification System.  
• Supply Current values updated in Table 1-1.  
Test Circuit section removed.  
• Updated Figure 6-1, Recommended Board Lay-  
out.  
2017 Microchip Technology Inc.  
DS20005613B-page 25  
DSC1101/21  
NOTES:  
DS20005613B-page 26  
2017 Microchip Technology Inc.  
DSC1101/21  
PRODUCT IDENTIFICATION SYSTEM  
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.  
Examples:  
X
PART NO.  
X
X
-XXX.XXXX  
X
a)  
DSC1101AM1-010.0000T:  
Low-Power  
CMOS Oscillator  
Device Package  
Precision  
with  
Temperature Stability  
Range  
Frequency  
Packaging  
Option  
Standby, 6-LD 7.0X5.0  
VDFN, Automotive Tem-  
perature Range, ±50 ppm,  
Device:  
DSC1101:  
DSC1121:  
Low-Power Precision CMOS Oscillator with  
Standby  
Low-Power Precision CMOS Oscillator  
10 MHz  
quency, 1,000/Reel  
b) DSC1101BL2-030.0000:  
Output  
Fre-  
Package:  
A
B
C
D
N
=
=
=
=
=
6-Lead 7.0 mm x 5.0 mm VDFN  
6-Lead 5.0 mm x 3.2 mm CDFN  
6-Lead 3.2 mm x 2.5 mm VDFN  
6-Lead 2.5 mm x 2.0 mm VDFN  
6-Lead 7.0 mm x 5.0 mm CDFN (no center pad)  
Low-Power  
Precision  
CMOS Oscillator with  
Standby, 6-LD 5.0X3.2  
CDFN, Extended Indus-  
trial Temperature Range,  
±25 ppm, 30 MHz Output  
Frequency, 110/Tube  
Temperature  
Range:  
E
I
L
M
=
=
=
=
–20C to +70C (Extended Commercial)  
–40C to +85C (Industrial)  
–40C to +105C (Extended Industrial)  
–55C to +125C (Automotive)  
c)  
DSC1101DE5-150.0000:  
Low-Power  
CMOS  
Precision  
with  
Oscillator  
Standby, 6-LD 2.5X2.0  
VDFN, Extended Commer-  
cial Temperature Range,  
±10 ppm, 150 MHz Output  
Frequency, 110/Tube  
Stability:  
1
2
3
5
=
=
=
=
±50 ppm  
±25 ppm  
±20 ppm  
±10 ppm  
d) DSC1101AI2-075.0000T:  
Frequency:  
xxx.xxxx =2.3 MHz to 170 MHz (user-defined)  
Low-Power  
Precision  
CMOS Oscillator with  
Standby, 6-LD 7.0X5.0  
VDFN, Industrial Tempera-  
ture Range, ±25 ppm,  
75 MHz Output Fre-  
quency, 1,000/Reel  
Packing Option:  
<blank>= 110/Tube  
T
=
1,000/Reel  
Note 1:  
Tape and Reel identifier only appears in the  
catalog part number description. This  
identifier is used for ordering purposes and  
is not printed on the device package. Check  
with your Microchip Sales Office for package  
availability with the Tape and Reel option.  
2017 Microchip Technology Inc.  
DS20005613B-page 27  
DSC1101/21  
NOTES:  
DS20005613B-page 28  
2017 Microchip Technology Inc.  
Note the following details of the code protection feature on Microchip devices:  
Microchip products meet the specification contained in their particular Microchip Data Sheet.  
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the  
intended manner and under normal conditions.  
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our  
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data  
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.  
Microchip is willing to work with the customer who is concerned about the integrity of their code.  
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not  
mean that we are guaranteeing the product as “unbreakable.”  
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our  
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts  
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.  
Information contained in this publication regarding device  
applications and the like is provided only for your convenience  
and may be superseded by updates. It is your responsibility to  
ensure that your application meets with your specifications.  
MICROCHIP MAKES NO REPRESENTATIONS OR  
WARRANTIES OF ANY KIND WHETHER EXPRESS OR  
IMPLIED, WRITTEN OR ORAL, STATUTORY OR  
OTHERWISE, RELATED TO THE INFORMATION,  
INCLUDING BUT NOT LIMITED TO ITS CONDITION,  
QUALITY, PERFORMANCE, MERCHANTABILITY OR  
FITNESS FOR PURPOSE. Microchip disclaims all liability  
arising from this information and its use. Use of Microchip  
devices in life support and/or safety applications is entirely at  
the buyer’s risk, and the buyer agrees to defend, indemnify and  
hold harmless Microchip from any and all damages, claims,  
suits, or expenses resulting from such use. No licenses are  
conveyed, implicitly or otherwise, under any Microchip  
intellectual property rights unless otherwise stated.  
Trademarks  
The Microchip name and logo, the Microchip logo, AnyRate, AVR,  
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,  
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,  
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,  
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,  
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip  
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST  
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered  
trademarks of Microchip Technology Incorporated in the U.S.A.  
and other countries.  
ClockWorks, The Embedded Control Solutions Company,  
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,  
mTouch, Precision Edge, and Quiet-Wire are registered  
trademarks of Microchip Technology Incorporated in the U.S.A.  
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any  
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,  
CodeGuard, CryptoAuthentication, CryptoCompanion,  
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average  
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial  
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,  
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,  
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,  
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,  
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple  
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,  
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,  
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and  
ZENAare trademarks of Microchip Technology Incorporated in the  
U.S.A. and other countries.  
SQTP is a service mark of Microchip Technology Incorporated in  
the U.S.A.  
Microchip received ISO/TS-16949:2009 certification for its worldwide  
headquarters, design and wafer fabrication facilities in Chandler and  
Tempe, Arizona; Gresham, Oregon and design centers in California  
and India. The Company’s quality system processes and procedures  
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping  
devices, Serial EEPROMs, microperipherals, nonvolatile memory and  
analog products. In addition, Microchip’s quality system for the design  
and manufacture of development systems is ISO 9001:2000 certified.  
Silicon Storage Technology is a registered trademark of Microchip  
Technology Inc. in other countries.  
GestIC is a registered trademark of Microchip Technology  
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology  
Inc., in other countries.  
All other trademarks mentioned herein are property of their  
respective companies.  
QUALITYMANAGEMENTꢀꢀSYSTEMꢀ  
CERTIFIEDBYDNVꢀ  
© 2017, Microchip Technology Incorporated, All Rights Reserved.  
ISBN: 978-1-5224-2480-2  
== ISO/TS16949==ꢀ  
2017 Microchip Technology Inc.  
DS20005613B-page 29  
Worldwide Sales and Service  
AMERICAS  
ASIA/PACIFIC  
ASIA/PACIFIC  
EUROPE  
Corporate Office  
2355 West Chandler Blvd.  
Chandler, AZ 85224-6199  
Tel: 480-792-7200  
Fax: 480-792-7277  
Technical Support:  
http://www.microchip.com/  
support  
Australia - Sydney  
Tel: 61-2-9868-6733  
India - Bangalore  
Tel: 91-80-3090-4444  
Austria - Wels  
Tel: 43-7242-2244-39  
Fax: 43-7242-2244-393  
China - Beijing  
Tel: 86-10-8569-7000  
India - New Delhi  
Tel: 91-11-4160-8631  
Denmark - Copenhagen  
Tel: 45-4450-2828  
Fax: 45-4485-2829  
China - Chengdu  
Tel: 86-28-8665-5511  
India - Pune  
Tel: 91-20-4121-0141  
Finland - Espoo  
Tel: 358-9-4520-820  
China - Chongqing  
Tel: 86-23-8980-9588  
Japan - Osaka  
Tel: 81-6-6152-7160  
Web Address:  
www.microchip.com  
France - Paris  
Tel: 33-1-69-53-63-20  
Fax: 33-1-69-30-90-79  
China - Dongguan  
Tel: 86-769-8702-9880  
Japan - Tokyo  
Tel: 81-3-6880- 3770  
Atlanta  
Duluth, GA  
Tel: 678-957-9614  
Fax: 678-957-1455  
China - Guangzhou  
Tel: 86-20-8755-8029  
Korea - Daegu  
Tel: 82-53-744-4301  
Germany - Garching  
Tel: 49-8931-9700  
China - Hangzhou  
Tel: 86-571-8792-8115  
Korea - Seoul  
Tel: 82-2-554-7200  
Germany - Haan  
Tel: 49-2129-3766400  
Austin, TX  
Tel: 512-257-3370  
China - Hong Kong SAR  
Tel: 852-2943-5100  
Malaysia - Kuala Lumpur  
Tel: 60-3-7651-7906  
Germany - Heilbronn  
Tel: 49-7131-67-3636  
Boston  
Westborough, MA  
Tel: 774-760-0087  
Fax: 774-760-0088  
China - Nanjing  
Tel: 86-25-8473-2460  
Malaysia - Penang  
Tel: 60-4-227-8870  
Germany - Karlsruhe  
Tel: 49-721-625370  
China - Qingdao  
Philippines - Manila  
Germany - Munich  
Tel: 49-89-627-144-0  
Fax: 49-89-627-144-44  
Tel: 86-532-8502-7355  
Tel: 63-2-634-9065  
Chicago  
Itasca, IL  
Tel: 630-285-0071  
Fax: 630-285-0075  
China - Shanghai  
Tel: 86-21-3326-8000  
Singapore  
Tel: 65-6334-8870  
Germany - Rosenheim  
Tel: 49-8031-354-560  
China - Shenyang  
Tel: 86-24-2334-2829  
Taiwan - Hsin Chu  
Tel: 886-3-577-8366  
Dallas  
Addison, TX  
Tel: 972-818-7423  
Fax: 972-818-2924  
Israel - Ra’anana  
Tel: 972-9-744-7705  
China - Shenzhen  
Tel: 86-755-8864-2200  
Taiwan - Kaohsiung  
Tel: 886-7-213-7830  
Italy - Milan  
Tel: 39-0331-742611  
Fax: 39-0331-466781  
China - Suzhou  
Tel: 86-186-6233-1526  
Taiwan - Taipei  
Tel: 886-2-2508-8600  
Detroit  
Novi, MI  
Tel: 248-848-4000  
China - Wuhan  
Tel: 86-27-5980-5300  
Thailand - Bangkok  
Tel: 66-2-694-1351  
Italy - Padova  
Tel: 39-049-7625286  
Houston, TX  
Tel: 281-894-5983  
China - Xian  
Tel: 86-29-8833-7252  
Vietnam - Ho Chi Minh  
Tel: 84-28-5448-2100  
Netherlands - Drunen  
Tel: 31-416-690399  
Fax: 31-416-690340  
Indianapolis  
Noblesville, IN  
Tel: 317-773-8323  
Fax: 317-773-5453  
Tel: 317-536-2380  
China - Xiamen  
Tel: 86-592-2388138  
Norway - Trondheim  
Tel: 47-7289-7561  
China - Zhuhai  
Tel: 86-756-3210040  
Poland - Warsaw  
Tel: 48-22-3325737  
Los Angeles  
Mission Viejo, CA  
Tel: 949-462-9523  
Fax: 949-462-9608  
Tel: 951-273-7800  
Romania - Bucharest  
Tel: 40-21-407-87-50  
Spain - Madrid  
Tel: 34-91-708-08-90  
Fax: 34-91-708-08-91  
Raleigh, NC  
Tel: 919-844-7510  
Sweden - Gothenberg  
Tel: 46-31-704-60-40  
New York, NY  
Tel: 631-435-6000  
Sweden - Stockholm  
Tel: 46-8-5090-4654  
San Jose, CA  
Tel: 408-735-9110  
Tel: 408-436-4270  
UK - Wokingham  
Tel: 44-118-921-5800  
Fax: 44-118-921-5820  
Canada - Toronto  
Tel: 905-695-1980  
Fax: 905-695-2078  
DS20005613B-page 30  
2017 Microchip Technology Inc.  
10/25/17  
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