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  • DSC6083JE2A-032K000T
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产品型号DSC6083JI1A-014K000的Datasheet PDF文件预览

DSC60XX  
Ultra-Small, Ultra-Low Power MEMS Oscillator  
Features  
General Description  
• Wide Frequency Range: 2 kHz to 80 MHz  
The DSC60xx family of MEMS oscillators combines  
industry-leading low-power consumption, ultra-small  
packages with exceptional frequency stability, and jitter  
performance over temperature. The single-output  
DSC60xx MEMS oscillators are excellent choices for  
use as clock references in small, battery-powered  
devices such as wearable and Internet of Things (IoT)  
devices in which small size, low power consumption,  
and long-term reliability are paramount. They also meet  
the stringent mechanical durability and reliability  
requirements within Automotive Electronics Council  
standard Q100 (AEC-Q100), so they are well suited for  
under-hood applications as well.  
• Ultra-Low Power Consumption: 1.3 mA/12 µA  
(Active/Standby)  
• Ultra-Small Footprints  
- 1.6 mm 1.2 mm  
- 2.0 mm 1.6 mm  
- 2.5 mm 2.0 mm  
- 3.2 mm 2.5 mm  
• Frequency Select Input Supports Two  
Pre-Defined Frequencies  
• High Stability: ±25 ppm, ±50 ppm  
• Wide Temperature Range  
The DSC60xx family is available in ultra-small  
1.6 mm x 1.2 mm and 2.0 mm x 1.6 mm packages.  
Other package sizes include: 2.5 mm x 2.0 mm and  
3.2 mm x 2.5 mm. These packages are “drop-in”  
replacements for standard 4-pin CMOS quartz crystal  
oscillators.  
- Industrial: –40°C to 85°C  
- Ext. Commercial: –20° to 70°C  
• Excellent Shock and Vibration Immunity  
- Qualified to MIL-STD-883  
• High Reliability  
- 20x Better MTF Than Quartz Oscillators  
• Supply Range of 1.71V to 3.63V  
• Short Sample Lead Time: <2 weeks  
• Lead Free & RoHS Compliant  
Package Types  
DSC60XX  
3.2 mm x 2.5 mm DFN  
2.5 mm x 2.0 mm LGA  
2.0 mm x 1.6 mm LGA  
1.6 mm x 1.2 mm LGA  
(Top View)  
Applications  
• Low Power/Portable Applications: IoT,  
Embedded/Smart Devices  
• Consumer: Home Healthcare, Fitness Devices,  
Home Automation  
• Automotive: Rear View/Surround View Cameras,  
Infotainment System  
1
OE/STBY/FS  
GND  
4
3
VDD  
OUT  
• Industrial: Building/Factory Automation,  
Surveillance Camera  
2
2017-2018 Microchip Technology Inc.  
DS20005625C-page 1  
DSC60XX  
Block Diagrams  
DSC6001/03/11/13/21/23/41/43/51/53/61/63  
DIGITAL  
CONTROL  
SUPPLY  
REGULATION  
OE/STBY/FS  
PIN 1  
VDD  
PIN 4  
MEMS  
RESONATOR  
PLL  
TEMP SENSOR  
CONTROL &  
COMPENSATION  
OUTPUT  
DIVIDER  
VCO  
DRIVER  
GND  
PIN 2  
OUTPUT  
PIN 3  
DSC6083 (kHz Output)  
SUPPLY  
REGULATION  
P4  
VDD  
DRIVER  
P1  
OUTPUT  
MEMS  
RESONATOR  
PLL  
OUTPUT  
DIVIDER  
TEMP SENSOR  
CONTROL&  
COMPENSATION  
VCO  
P2  
GND  
P3  
DNC  
DS20005625C-page 2  
2017-2018 Microchip Technology Inc.  
DSC60XX  
1.0  
ELECTRICAL CHARACTERISTICS  
Absolute Maximum Ratings  
Supply Voltage.......................................................................................................................................... –0.3V to +4.0V  
Input Voltage (VIN) ..............................................................................................................................–0.3V to VDD+0.3V  
ESD Protection ............................................................................................................ 4 kV HBM, 400V MM, 2 kV CDM  
ELECTRICAL CHARACTERISTICS  
Electrical Characteristics: Unless otherwise indicated, VDD = 1.8V –5% to 3.3V +10%, TA = –40°C to 85°C.  
Parameters  
Symbol  
Min.  
Typ.  
Max.  
Units Conditions  
Supply Voltage Note 1  
VDD  
1.71  
3.63  
V
FOUT = 24 MHz, VDD = 1.8V,  
No Load  
1.3  
Active Supply Current  
Power Supply Ramp  
IDD  
mA  
FOUT = 32.768 kHz  
(DSC6083), VDD = 1.8V, No  
Load  
1.19  
tPU  
0.1  
12  
80  
100  
ms  
µA  
Note 9  
VDD = 1.8/2.5V  
VDD = 3.3V  
Standby Supply Current  
Note 2  
ISTBY  
±25  
±50  
Frequency Stability Note 3  
Aging  
Δf  
Δf  
ppm All temp ranges  
±5  
±1  
1st year @25°C  
ppm  
Per year after first year  
From 90% VDD to valid clock  
output, T = 25°C  
Startup Time  
tSU  
1.3  
ms  
VIH  
VIL  
0.7 x VDD  
V
V
Input Logic High  
Input Logic Low  
Input Logic Levels Note 4  
0.3 x VDD  
Output Disable Time  
Note 5  
tDA  
tEN  
200+Period  
µs  
µs  
kΩ  
Output Enable Time  
Note 6  
1
Enable Pull-Up Resistor  
Note 7  
300  
If configured  
VOH  
VOL  
0.8 x VDD  
V
V
Output Logic High, I = 1 mA  
Output Logic Low, I = –1 mA  
Output Logic Levels,  
Low Drive  
0.2 x VDD  
Note 1: Pin 4 VDD should be filtered with 0.1 µF capacitor.  
2: Not including current through pull-up resistor on EN pin (if configured). Higher standby current seen at  
>3.3V VDD  
.
3: Includes frequency variations due to initial tolerance, temp. and power supply voltage.  
4: Input waveform must be monotonic with rise/fall time < 10 ms  
5: Output Disable time takes up to one period of the output waveform + 200 ns.  
6: For parts configured with OE, not Standby.  
7: Output is enabled if pad is floated or not connected.  
8: Output Duty Cycle will be 40% to 60% when output frequency is between 40 MHz to 60 MHz.  
9: Time to reach 90% of target VDD. Power ramp rise must be monotonic.  
2017-2018 Microchip Technology Inc.  
DS20005625C-page 3  
DSC60XX  
ELECTRICAL CHARACTERISTICS (CONTINUED)  
Electrical Characteristics: Unless otherwise indicated, VDD = 1.8V –5% to 3.3V +10%, TA = –40°C to 85°C.  
Parameters  
Symbol  
Min.  
Typ.  
Max.  
Units Conditions  
2.5  
3.5  
VDD = 1.8V  
DSC60x3  
Low Drive,  
20% to 80%  
tRX/tFX  
ns  
VDD  
2.5V/3.3V  
=
CL = 5 pF  
1.5  
1.2  
0.6  
2.2  
2.0  
1.2  
Output Transition Time  
Rise Time/Fall Time  
VDD = 1.8V  
DSC60x1  
Std. Drive,  
ns  
tRY/tFY  
20% to 80%  
VDD  
2.5V/3.3V  
=
CL = 10 pF  
Frequency  
f0  
0.002  
45  
80  
55  
MHz Output on Pin 1 for < 1 MHz  
Output Duty Cycle, Note 8  
SYM  
%
32  
25  
40  
32  
VDD = 1.8V  
DSC60x3  
Low Drive,  
FOUT  
=
VDD  
=
27 MHz  
2.5V/3.3V  
Period Jitter, RMS  
JPER  
psRMS  
23  
30  
VDD = 1.8V  
DSC60x1  
Std. Drive,  
FOUT  
=
VDD  
=
27 MHz  
20  
28  
2.5V/3.3V  
180  
120  
115  
90  
240  
170  
190  
150  
VDD = 1.8V  
DSC60x3  
Low Drive,  
FOUT  
=
VDD  
=
27 MHz  
2.5V/3.3V  
Cycle-to-Cycle Jitter  
(peak)  
JCy–Cy  
ps  
VDD = 1.8V  
DSC60x1,  
Std. Drive,  
FOUT  
=
VDD  
=
27 MHz  
2.5V/3.3V  
Note 1: Pin 4 VDD should be filtered with 0.1 µF capacitor.  
2: Not including current through pull-up resistor on EN pin (if configured). Higher standby current seen at  
>3.3V VDD  
.
3: Includes frequency variations due to initial tolerance, temp. and power supply voltage.  
4: Input waveform must be monotonic with rise/fall time < 10 ms  
5: Output Disable time takes up to one period of the output waveform + 200 ns.  
6: For parts configured with OE, not Standby.  
7: Output is enabled if pad is floated or not connected.  
8: Output Duty Cycle will be 40% to 60% when output frequency is between 40 MHz to 60 MHz.  
9: Time to reach 90% of target VDD. Power ramp rise must be monotonic.  
DS20005625C-page 4  
2017-2018 Microchip Technology Inc.  
DSC60XX  
TEMPERATURE SPECIFICATIONS (Note 1)  
Parameters  
Temperature Ranges  
Sym.  
Min.  
Typ.  
Max.  
Units  
Conditions  
Maximum Junction Temperature  
Ambient Operating Temperature  
Ambient Operating Temperature  
Storage Ambient Temperature Range  
Soldering Temperature  
TJ  
TA  
TA  
TA  
TS  
–40  
–20  
–55  
+150  
+85  
+70  
+150  
°C  
°C  
°C  
°C  
°C  
Industrial  
Extended Commercial  
+260  
40 sec. max.  
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable  
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the max-  
imum allowable power dissipation will cause the device operating junction temperature to exceed the max-  
imum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.  
2017-2018 Microchip Technology Inc.  
DS20005625C-page 5  
DSC60XX  
2.0  
PIN DESCRIPTIONS  
The descriptions of the pins are listed in Table 2-1 and Table 2-2.  
TABLE 2-1:  
Pin Number  
DSC6001/03/11/13/21/23/41/43/51/53/61/63 PIN FUNCTION TABLE (OUTPUT ≥1 MHZ)  
Pin Name  
Pin Type  
Description  
Output Enable: H = Specified Frequency Output, Note 1  
L = Output is high impedance  
OE  
Standby: H = Specified Frequency Output, Note 1  
L = Output is high impedance, Device is in low power  
mode, Supply current is at ISTBY  
1
STBY  
FS  
I
Frequency Select: H = Output Frequency 1, Note 2  
L = Output Frequency 2  
2
3
4
GND  
Output  
VDD  
Power  
O
Power supply ground  
Oscillator clock output  
Power supply, Note 3  
Power  
Note 1: DSC600x/1x/2x has 300 kΩ internal pull-up resistor on pin1. DSC604x/5x/6x has no internal pull-up resistor  
on pin1 and needs an external pull-up or to be driven by another chip.  
2: Two pre-programmed frequencies can be configured at http://clockworks.microchip.com/timing/.  
3: Bypass with 0.1 µF capacitor placed as close to the VDD pin as possible.  
TABLE 2-2:  
Pin Number  
DSC6083 PIN FUNCTION TABLE (OUTPUT FREQUENCY <1 MHZ)  
Pin Name  
Pin Type  
Description  
1
2
3
4
Output  
GND  
DNC  
VDD  
O
Oscillator clock output  
Power supply ground  
Do Not Connect  
Power  
DNC  
Power  
Power supply, Note 1  
Note 1: Bypass with 0.1 µF capacitor placed as close to VDD pin as possible.  
2.1  
Output Buffer Options  
The DSC60xx family is available in multiple output driver configurations.  
The low-drive DSC60x3 is configured with a low-power driver that minimizes current consumption and EMI while  
delivering greater than 1 mA output current at 20%/80% of the supply voltage. The standard-drive DSC60x1 delivers  
greater than 3 mA output current at 20%/80% of the supply voltage.  
DS20005625C-page 6  
2017-2018 Microchip Technology Inc.  
DSC60XX  
3.0  
DIAGRAMS  
tR  
tF  
VOH  
OUTPUT  
VOL  
tEN  
1/fo  
tDA  
VIH  
ENABLE  
VIL  
FIGURE 3-1:  
Output Waveform.  
IDD  
4
1
3
2
VDD  
0.1μF  
CL  
VDA  
FIGURE 3-2:  
Test Circuit.  
Via to GND Layer  
C1  
VDD  
Enable  
Output  
GND  
Via to GND Layer  
FIGURE 3-3:  
Recommended Board Layout.  
2017-2018 Microchip Technology Inc.  
DS20005625C-page 7  
DSC60XX  
4.0  
SOLDER REFLOW PROFILE  
20-40  
Seconds  
260°C  
60-150  
Seconds  
217°C  
200°C  
Reflow  
60-180  
150°C  
25°C  
Seconds  
Pre-Heat  
Cool  
Time  
8 minutes max.  
FIGURE 4-1:  
Solder Reflow Profile.  
MSL 1 @ 260°C refer to JSTD-020C  
Ramp-Up Rate (200°C to Peak Temp)  
Preheat Time 150°C to 200°C  
Time maintained above 217°C  
Peak Temperature  
3°C/sec. max.  
60 to 180 sec.  
60 to 150 sec.  
255°C to 260°C  
20 to 40 sec.  
Time within 5°C of actual Peak  
Ramp-Down Rate  
6°C/sec. max.  
8 minutes max.  
Time 25°C to Peak Temperature  
DS20005625C-page 8  
2017-2018 Microchip Technology Inc.  
DSC60XX  
5.0  
PACKAGING INFORMATION  
4-Lead VFLGA 1.6 mm x 1.2 mm Package Outline  
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
D
A
B
E
N
(DATUM A)  
(DATUM B)  
NOTE 1  
2X  
0.05 C  
2X  
1
2
TOP VIEW  
0.05 C  
0.10 C  
A1  
A
C
SEATING  
PLANE  
4X  
(A3)  
0.08 C  
SIDE VIEW  
b2  
1
3X b1  
0.07  
0.03  
C A B  
C
CH  
2
CH  
NOTE 1  
e1  
e1  
2
4X L  
N
e
BOTTOM VIEW  
Microchip Technology Drawing C04-1199A Sheet 1 of 2  
2017-2018 Microchip Technology Inc.  
DS20005625C-page 9  
DSC60XX  
4-Lead VFLGA 1.6 mm x 1.2 mm Package Outline  
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
Units  
Dimension Limits  
MILLIMETERS  
NOM  
MIN  
MAX  
Number of Terminals  
Terminal Pitch  
Terminal Pitch  
Overall Height  
Standoff  
N
4
e
1.20 BSC  
0.75 BSC  
0.84  
e1  
A
A1  
0.79  
0.00  
0.89  
0.05  
0.02  
Substrate Thickness (with Terminals) A3  
0.20 REF  
1.60 BSC  
1.20 BSC  
0.30  
0.375  
0.35  
Overall Length  
Overall Width  
D
E
Terminal Width  
Terminal Width  
Terminal Length  
Terminal 1 Index Chamfer  
b1  
b2  
L
0.25  
0.325  
0.30  
-
0.35  
0.425  
0.40  
-
CH  
0.125  
Notes:  
1. Pin 1 visual index feature may vary, but must be located within the hatched area.  
2. Package is saw singulated  
3. Dimensioning and tolerancing per ASME Y14.5M  
BSC: Basic Dimension. Theoretically exact value shown without tolerances.  
REF: Reference Dimension, usually without tolerance, for information purposes only.  
Microchip Technology Drawing C04-1199A Sheet 2 of 2  
DS20005625C-page 10  
2017-2018 Microchip Technology Inc.  
DSC60XX  
4-Lead VFLGA 1.6 mm x 1.2 mm Recommended Land Pattern  
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
E1  
X1  
G1  
4
Y
C
G2  
1
2
(CH)  
SILK SCREEN  
X2  
E2  
RECOMMENDED LAND PATTERN  
Units  
MILLIMETERS  
Dimension Limits  
MIN  
NOM  
1.20 BSC  
1.16 BSC  
0.75  
MAX  
Contact Pitch  
Contact Pitch  
E1  
E2  
C
Contact Spacing  
Contact Width (X3)  
Contact Width  
X1  
X2  
Y
0.35  
0.43  
0.50  
Contact Pad Length (X6)  
Space Between Contacts (X4)  
Space Between Contacts (X3)  
Contact 1 Index Chamfer  
G1  
G2  
CH  
0.85  
0.25  
0.13 X 45° REF  
Notes:  
1. Dimensioning and tolerancing per ASME Y14.5M  
BSC: Basic Dimension. Theoretically exact value shown without tolerances.  
Microchip Technology Drawing C04-3199A  
2017-2018 Microchip Technology Inc.  
DS20005625C-page 11  
DSC60XX  
4-Lead VFLGA 2.0 mm x 1.6 mm Package Outline  
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
D
A
B
E
N
(DATUM A)  
(DATUM B)  
NOTE 1  
2X  
0.05 C  
2X  
1
2
TOP VIEW  
0.05 C  
0.10 C  
A1  
A
C
SEATING  
PLANE  
4X  
(A3)  
0.08 C  
SIDE VIEW  
b2  
1
3X b1  
0.07  
0.03  
C A B  
C
CH  
2
CH  
NOTE 1  
e1  
e1  
2
4X L  
N
e
BOTTOM VIEW  
Microchip Technology Drawing C04-1200A Sheet 1 of 2  
DS20005625C-page 12  
2017-2018 Microchip Technology Inc.  
DSC60XX  
4-Lead VFLGA 2.0 mm x 1.6 mm Package Outline (Continued)  
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
Units  
Dimension Limits  
MILLIMETERS  
NOM  
MIN  
MAX  
Number of Terminals  
Terminal Pitch  
Terminal Pitch  
Overall Height  
Standoff  
N
6
e
1.55 BSC  
0.95 BSC  
0.84  
e1  
A
A1  
0.79  
0.00  
0.89  
0.05  
0.02  
Substrate Thickness (with Terminals) A3  
0.20 REF  
2.00 BSC  
1.60 BSC  
0.35  
0.45  
0.55  
Overall Length  
Overall Width  
D
E
Terminal Width  
Terminal Width  
Terminal Length  
Terminal 1 Index Chamfer  
b1  
b2  
L
0.30  
0.40  
0.50  
-
0.40  
0.50  
0.60  
-
CH  
0.15  
Notes:  
1. Pin 1 visual index feature may vary, but must be located within the hatched area.  
2. Package is saw singulated  
3. Dimensioning and tolerancing per ASME Y14.5M  
BSC: Basic Dimension. Theoretically exact value shown without tolerances.  
REF: Reference Dimension, usually without tolerance, for information purposes only.  
Microchip Technology Drawing C04-1200A Sheet 2 of 2  
2017-2018 Microchip Technology Inc.  
DS20005625C-page 13  
DSC60XX  
4-Lead VFLGA 2.0 mm x 1.6 mm Package Outline  
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
X1  
4
Y
G2  
C
1
2
(CH)  
G1  
E
SILK SCREEN  
RECOMMENDED LAND PATTERN  
Units  
MILLIMETERS  
Dimension Limits  
MIN  
NOM  
1.55 BSC  
0.95  
MAX  
Contact Pitch  
Contact Spacing  
E
C
Contact Width (X4)  
Contact Width (X2)  
Contact Pad Length (X6)  
X1  
X2  
Y
0.50  
0.40  
0.70  
Space Between Contacts (X4)  
Space Between Contacts (X3)  
Contact 1 Index Chamfer  
G1  
G2  
CH  
1.05  
0.25  
0.13 X 45° REF  
Notes:  
1. Dimensioning and tolerancing per ASME Y14.5M  
BSC: Basic Dimension. Theoretically exact value shown without tolerances.  
Microchip Technology Drawing C04-3200A  
DS20005625C-page 14  
2017-2018 Microchip Technology Inc.  
DSC60XX  
4-Lead VLGA 2.5 mm x 2.0 mm Package Outline  
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
D
A
B
E
N
(DATUM A)  
(DATUM B)  
NOTE 1  
2X  
0.05 C  
2X  
1
2
TOP VIEW  
0.05 C  
0.10 C  
A1  
C
A
SEATING  
PLANE  
4X  
(A3)  
0.08 C  
SIDE VIEW  
4X b1  
0.07  
0.03  
C A B  
C
CH  
1
2
CH  
NOTE 1  
e1  
e1  
2
4X L  
N
e
BOTTOM VIEW  
Microchip Technology Drawing C04-1202A Sheet 1 of 2  
2017-2018 Microchip Technology Inc.  
DS20005625C-page 15  
DSC60XX  
4-Lead VLGA 2.5 mm x 2.0 mm Package Outline (Continued)  
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
Units  
Dimension Limits  
MILLIMETERS  
NOM  
MIN  
MAX  
Number of Terminals  
Terminal Pitch  
Terminal Pitch  
Overall Height  
Standoff  
N
4
e
1.65 BSC  
1.25 BSC  
0.84  
e1  
A
A1  
0.79  
0.00  
0.89  
0.05  
0.02  
Substrate Thickness (with Terminals) A3  
0.20 REF  
2.50 BSC  
2.00 BSC  
0.65  
0.65  
0.225  
Overall Length  
Overall Width  
D
E
Terminal Width  
Terminal Length  
Terminal 1 Index Chamfer  
b1  
L
CH  
0.60  
0.60  
-
0.70  
0.70  
-
Notes:  
1. Pin 1 visual index feature may vary, but must be located within the hatched area.  
2. Package is saw singulated  
3. Dimensioning and tolerancing per ASME Y14.5M  
BSC: Basic Dimension. Theoretically exact value shown without tolerances.  
REF: Reference Dimension, usually without tolerance, for information purposes only.  
Microchip Technology Drawing C04-1202A Sheet 2 of 2  
DS20005625C-page 16  
2017-2018 Microchip Technology Inc.  
DSC60XX  
4-Lead VLGA 2.5 mm x 2.0 mm Recommended Land Pattern  
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
X
4
Y
C
G2  
1
2
(CH)  
G1  
E
SILK SCREEN  
RECOMMENDED LAND PATTERN  
Units  
MILLIMETERS  
Dimension Limits  
MIN  
NOM  
1.65 BSC  
1.25  
MAX  
Contact Pitch  
Contact Spacing  
Contact Width (X4)  
Contact Pad Length (X6)  
E
C
X
Y
0.70  
0.80  
Space Between Contacts (X4)  
Space Between Contacts (X3)  
Contact 1 Index Chamfer  
G1  
G2  
CH  
0.95  
0.45  
0.13 X 45° REF  
Notes:  
1. Dimensioning and tolerancing per ASME Y14.5M  
BSC: Basic Dimension. Theoretically exact value shown without tolerances.  
Microchip Technology Drawing C04-3202A  
2017-2018 Microchip Technology Inc.  
DS20005625C-page 17  
DSC60XX  
4-Lead CDFN 3.2 mm x 2.5 mm Package Outline and Recommended Land Pattern  
Note:  
For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
TITLE  
4 LEAD CDFN 3.2x2.5mm COL PACKAGE OUTLINE & RECOMMENDED LAND PATTERN  
DRAWING #  
UNIT  
MM  
CDFN3225-4LD-PL-1  
NOTE:  
1. Green shaded rectangles in Recommended Land Pattern are solder stencil opening.  
DS20005625C-page 18  
2017-2018 Microchip Technology Inc.  
DSC60XX  
APPENDIX A: REVISION HISTORY  
Revision A (September 2016)  
• Initial creation of DSC60xx Microchip data sheet  
DS20005625A.  
Revision B (September 2017)  
• Added Power Supply Ramp value in Electrical  
Characteristics table.  
• Redrew diagrams for clarity. No technical content  
affected.  
Revision C (November 2018)  
• Added a new condition to the Active Supply  
Current parameter with a new typical value in the  
Electrical Characteristics table.  
2017-2018 Microchip Technology Inc.  
DS20005625C-page 19  
DSC60XX  
NOTES:  
DS20005625C-page 20  
2017-2018 Microchip Technology Inc.  
DSC60XX  
PRODUCT IDENTIFICATION SYSTEM  
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.  
Examples:  
X
PART NO.  
X
X
X
X – XXX.XXXX  
X
X
a) DSC6013JI2A-100.0000:  
Device Pin 1  
Definition  
Output Package  
Drive  
Strength  
Temperature  
Range  
Revision Frequency  
Ultra–Low Power MEMS Oscillator, Pin1 = Standby  
with Internal Pull-Up, Low Drive Strength, 4-Lead  
2.5 mm x 2.0 mm VLGA, Industrial Temperature,  
±25 ppm Stability, Revision A, 100 MHz Frequency,  
100/Bag  
Tape  
and  
Reel  
Frequency  
Stability  
Device:  
DSC60xx:  
Ultra-Low Power MEMS Oscillator  
b) DSC6001HE1A-016.0000T:  
Pin Definition:  
Selection  
Pin 1  
Internal Pull-Up Register  
Ultra–Low Power MEMS Oscillator, Pin1 = OE with  
Internal Pull–Up, Standard Drive Strength, 4-Lead  
1.6 mm x 1.2 mm VFLGA, Extended Commercial  
Temp., ±50 ppm Stability, Revision A, 16 MHz  
Frequency, 1,000/Reel  
0
1
2
4
5
6
8
OE  
Pull-up  
Pull-up  
Pull-up  
None  
STDBY  
FS  
OE  
c) DSC6021MI2A-005Q:  
STDBY  
FS  
None  
Ultra–Low Power MEMS Oscillator, Pin1 = Freq. Select  
with Internal Pull-Up, Standard Drive Strength, 4-Lead  
2.0 mm x 1.6 mm VFLGA, Industrial Temperature,  
±25 ppm Stability, Revision A, Two Frequencies  
Configured through ClockWorks, 100/Bag  
None  
kHz  
Output  
None  
Note 1:  
Tape and Reel identifier only appears in the  
catalog part number description. This  
Output Drive  
Strength:  
1
3
Standard  
Low  
identifier is used for ordering purposes and  
is not printed on the device package. Check  
with your Microchip Sales Office for package  
availability with the Tape and Reel option.  
Packages:  
C
J
M
H
=
=
=
=
4-Lead 3.2 mm x 2.5 mm DFN  
4-Lead 2.5 mm x 2.0 mm VLGA  
4-Lead 2.0 mm x 1.6 mm VFLGA  
4-Lead 1.6 mm x 1.2 mm VFLGA  
Temperature  
Range:  
E
I
=
=
–20C to +70C (Extended Commercial)  
–40C to +85C (Industrial)  
Frequency  
Stability:  
1
2
=
=
± 50 ppm  
± 25 ppm  
Revision:  
A
=
Revision A  
Frequency:  
xxx.xxxx = User-Defined Frequency between  
001.0000 MHz and 80.0000 MHz  
xxxkxxx = User-Defined Frequency between 002.000 kHz  
and 999.999 kHz  
xxxx  
=
Frequency configuration code when pin 1 = FS.  
Configure the part online through ClockWorks  
configurator.  
Tape and Reel:  
<blank>= 100/Bag  
1,000/Reel  
T
=
Note 1: Please visit Microchip ClockWorks® Configurator Website to configure the part number for customized fre-  
quency. http://clockworks.microchip.com/timing/.  
2017-2018 Microchip Technology Inc.  
DS20005625C-page 21  
DSC60XX  
NOTES:  
DS20005625C-page 22  
2017-2018 Microchip Technology Inc.  
Note the following details of the code protection feature on Microchip devices:  
Microchip products meet the specification contained in their particular Microchip Data Sheet.  
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the  
intended manner and under normal conditions.  
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our  
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data  
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.  
Microchip is willing to work with the customer who is concerned about the integrity of their code.  
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not  
mean that we are guaranteeing the product as “unbreakable.”  
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our  
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts  
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.  
Information contained in this publication regarding device  
applications and the like is provided only for your convenience  
and may be superseded by updates. It is your responsibility to  
ensure that your application meets with your specifications.  
MICROCHIP MAKES NO REPRESENTATIONS OR  
WARRANTIES OF ANY KIND WHETHER EXPRESS OR  
IMPLIED, WRITTEN OR ORAL, STATUTORY OR  
OTHERWISE, RELATED TO THE INFORMATION,  
INCLUDING BUT NOT LIMITED TO ITS CONDITION,  
QUALITY, PERFORMANCE, MERCHANTABILITY OR  
FITNESS FOR PURPOSE. Microchip disclaims all liability  
arising from this information and its use. Use of Microchip  
devices in life support and/or safety applications is entirely at  
the buyer’s risk, and the buyer agrees to defend, indemnify and  
hold harmless Microchip from any and all damages, claims,  
suits, or expenses resulting from such use. No licenses are  
conveyed, implicitly or otherwise, under any Microchip  
intellectual property rights unless otherwise stated.  
Trademarks  
The Microchip name and logo, the Microchip logo, AnyRate, AVR,  
AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo,  
CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo,  
JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus,  
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,  
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip  
Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo,  
SuperFlash, tinyAVR, UNI/O, and XMEGA are registered  
trademarks of Microchip Technology Incorporated in the U.S.A.  
and other countries.  
ClockWorks, The Embedded Control Solutions Company,  
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,  
mTouch, Precision Edge, and Quiet-Wire are registered  
trademarks of Microchip Technology Incorporated in the U.S.A.  
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any  
Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard,  
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,  
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average  
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial  
Programming, ICSP, INICnet, Inter-Chip Connectivity,  
JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi,  
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,  
MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation,  
PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon,  
QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O,  
SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total  
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,  
WiperLock, Wireless DNA, and ZENA are trademarks of  
Microchip Technology Incorporated in the U.S.A. and other  
countries.  
SQTP is a service mark of Microchip Technology Incorporated in  
the U.S.A.  
Microchip received ISO/TS-16949:2009 certification for its worldwide  
headquarters, design and wafer fabrication facilities in Chandler and  
Tempe, Arizona; Gresham, Oregon and design centers in California  
and India. The Company’s quality system processes and procedures  
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping  
devices, Serial EEPROMs, microperipherals, nonvolatile memory and  
analog products. In addition, Microchip’s quality system for the design  
and manufacture of development systems is ISO 9001:2000 certified.  
Silicon Storage Technology is a registered trademark of Microchip  
Technology Inc. in other countries.  
GestIC is a registered trademark of Microchip Technology  
Germany II GmbH & Co. KG, a subsidiary of Microchip  
Technology Inc., in other countries.  
All other trademarks mentioned herein are property of their  
respective companies.  
QUALITYMANAGEMENTꢀꢀSYSTEMꢀ  
CERTIFIEDBYDNVꢀ  
© 2018, Microchip Technology Incorporated, All Rights Reserved.  
ISBN: 978-1-5224-3842-7  
== ISO/TS16949==ꢀ  
2017-2018 Microchip Technology Inc.  
DS20005625C-page 23  
Worldwide Sales and Service  
AMERICAS  
ASIA/PACIFIC  
ASIA/PACIFIC  
EUROPE  
Corporate Office  
2355 West Chandler Blvd.  
Chandler, AZ 85224-6199  
Tel: 480-792-7200  
Fax: 480-792-7277  
Technical Support:  
http://www.microchip.com/  
support  
Australia - Sydney  
Tel: 61-2-9868-6733  
India - Bangalore  
Tel: 91-80-3090-4444  
Austria - Wels  
Tel: 43-7242-2244-39  
Fax: 43-7242-2244-393  
China - Beijing  
Tel: 86-10-8569-7000  
India - New Delhi  
Tel: 91-11-4160-8631  
Denmark - Copenhagen  
Tel: 45-4450-2828  
Fax: 45-4485-2829  
China - Chengdu  
Tel: 86-28-8665-5511  
India - Pune  
Tel: 91-20-4121-0141  
Finland - Espoo  
Tel: 358-9-4520-820  
China - Chongqing  
Tel: 86-23-8980-9588  
Japan - Osaka  
Tel: 81-6-6152-7160  
Web Address:  
www.microchip.com  
France - Paris  
Tel: 33-1-69-53-63-20  
Fax: 33-1-69-30-90-79  
China - Dongguan  
Tel: 86-769-8702-9880  
Japan - Tokyo  
Tel: 81-3-6880- 3770  
Atlanta  
Duluth, GA  
Tel: 678-957-9614  
Fax: 678-957-1455  
China - Guangzhou  
Tel: 86-20-8755-8029  
Korea - Daegu  
Tel: 82-53-744-4301  
Germany - Garching  
Tel: 49-8931-9700  
China - Hangzhou  
Tel: 86-571-8792-8115  
Korea - Seoul  
Tel: 82-2-554-7200  
Germany - Haan  
Tel: 49-2129-3766400  
Austin, TX  
Tel: 512-257-3370  
China - Hong Kong SAR  
Tel: 852-2943-5100  
Malaysia - Kuala Lumpur  
Tel: 60-3-7651-7906  
Germany - Heilbronn  
Tel: 49-7131-67-3636  
Boston  
Westborough, MA  
Tel: 774-760-0087  
Fax: 774-760-0088  
China - Nanjing  
Tel: 86-25-8473-2460  
Malaysia - Penang  
Tel: 60-4-227-8870  
Germany - Karlsruhe  
Tel: 49-721-625370  
China - Qingdao  
Philippines - Manila  
Germany - Munich  
Tel: 49-89-627-144-0  
Fax: 49-89-627-144-44  
Tel: 86-532-8502-7355  
Tel: 63-2-634-9065  
Chicago  
Itasca, IL  
Tel: 630-285-0071  
Fax: 630-285-0075  
China - Shanghai  
Tel: 86-21-3326-8000  
Singapore  
Tel: 65-6334-8870  
Germany - Rosenheim  
Tel: 49-8031-354-560  
China - Shenyang  
Tel: 86-24-2334-2829  
Taiwan - Hsin Chu  
Tel: 886-3-577-8366  
Dallas  
Addison, TX  
Tel: 972-818-7423  
Fax: 972-818-2924  
Israel - Ra’anana  
Tel: 972-9-744-7705  
China - Shenzhen  
Tel: 86-755-8864-2200  
Taiwan - Kaohsiung  
Tel: 886-7-213-7830  
Italy - Milan  
Tel: 39-0331-742611  
Fax: 39-0331-466781  
China - Suzhou  
Tel: 86-186-6233-1526  
Taiwan - Taipei  
Tel: 886-2-2508-8600  
Detroit  
Novi, MI  
Tel: 248-848-4000  
China - Wuhan  
Tel: 86-27-5980-5300  
Thailand - Bangkok  
Tel: 66-2-694-1351  
Italy - Padova  
Tel: 39-049-7625286  
Houston, TX  
Tel: 281-894-5983  
China - Xian  
Tel: 86-29-8833-7252  
Vietnam - Ho Chi Minh  
Tel: 84-28-5448-2100  
Netherlands - Drunen  
Tel: 31-416-690399  
Fax: 31-416-690340  
Indianapolis  
Noblesville, IN  
Tel: 317-773-8323  
Fax: 317-773-5453  
Tel: 317-536-2380  
China - Xiamen  
Tel: 86-592-2388138  
Norway - Trondheim  
Tel: 47-7288-4388  
China - Zhuhai  
Tel: 86-756-3210040  
Poland - Warsaw  
Tel: 48-22-3325737  
Los Angeles  
Mission Viejo, CA  
Tel: 949-462-9523  
Fax: 949-462-9608  
Tel: 951-273-7800  
Romania - Bucharest  
Tel: 40-21-407-87-50  
Spain - Madrid  
Tel: 34-91-708-08-90  
Fax: 34-91-708-08-91  
Raleigh, NC  
Tel: 919-844-7510  
Sweden - Gothenberg  
Tel: 46-31-704-60-40  
New York, NY  
Tel: 631-435-6000  
Sweden - Stockholm  
Tel: 46-8-5090-4654  
San Jose, CA  
Tel: 408-735-9110  
Tel: 408-436-4270  
UK - Wokingham  
Tel: 44-118-921-5800  
Fax: 44-118-921-5820  
Canada - Toronto  
Tel: 905-695-1980  
Fax: 905-695-2078  
DS20005625C-page 24  
2017-2018 Microchip Technology Inc.  
08/15/18  
配单直通车
DSC610产品参数
型号:DSC610
生命周期:Contact Manufacturer
包装说明:,
Reach Compliance Code:unknown
风险等级:5.59
Base Number Matches:1
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