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产品型号ECLAMP8052P的Datasheet PDF文件预览

EClamp8052P

EMIClamp®

2-Line Common Mode Filter

and Low Capacitance ESD Protection

PROTECTION PRODUCTS

Description

Features

•

Transient Protection to

EClamp®8052P integrates common mode ﬁltering

with low capacitance ESD protection and is designed

speciﬁcally for MIPI, MHL, and USB interfaces. Each

device provides ﬁltering and ESD protection for one

high-speed diﬀerential pair.

IEC 61000-4-2 (ESD) 30kV (Air), 25kV (Contact)

IEC 61000-4-4 (EFT) 4kV (5/50ns)

IEC 61000-4-5 (Lightning) 6A (8/20µs)

•

Package design optimized for high speed lines

ESD protection and common mode ﬁltering for two

high-speed lines

•

High diﬀerential bandwidth cutoﬀ frequency

Low ESD Clamping Voltage

Dynamic Resistance: 0.50 Ohms (Typ)

Solid-State Silicon-Avalanche Technology

EClamp8052P is an easily implemented solution for

replacing discrete common mode chokes and ESD

protection devices in a single package. These devices

utilize silicon avalanche technology for superior ESD

and TLP clamping performance. They feature high

maximum ESD withstand voltage of +/- 25kV contact,

+/-30kV air discharge per IEC 61000-4-2. The integrated

common-mode choke has a typical diﬀerential mode

cutoﬀ frequency >3GHZ and typical common mode

suppression of 10dB at 500MHz and 15dB from 1GHz

to 2.8GHz. Each channel series resistance is 1.8 Ohms

maximum.

Mechanical Characteristics

•

SGP1917N5 package

Pb-Free, Halogen Free, RoHS/WEEE Compliant

Nominal Dimensions: 1.9 x 1.70 x 0.55 mm

Molding Compound Flammability Rating: UL 94V-0

Marking : Marking Code + Date Code

Packaging : Tape and Reel

Applications

•

Industrial Equipment

EClamp8052P is in a 7-pin SGP1917N5 package,

USB 2.0 / USB 3.0

measuring 1.9 x 1.7mm with a nominal height of

0.55mm. The leads have a nominal pin-to-pin pitch of

0.50mm. Flow- through package design simpliﬁes PCB

layout and maintains signal integrity on high-speed lines.

HDMI / MHL

MIPI Camera Serial Interface (CSI)

MIPI Display Serial Interface (DSI)

Circuit Diagram

Pin Conﬁguration

I/O+ In

I/O- In

I/O+ Out

I/O- Out

I/O+ In

I/O+ Out

I/O- In

I/O- Out

GND

EClamp8052P

Final Datasheet

Oct 4, 2016

Page 1

Semtech

www.semtech.com

Rev 4.1

Absolute Maximum Ratings

Rating

Symbol

Value

Units

Peak Pulse Current (tp = 8/20µs)

I_PP

ESD per IEC 61000-4-2 (Contact)⁽¹⁾

ESD per IEC 61000-4-2 (Air)⁽¹⁾

V_ESD

Operating Temperature

Storage Temperature

T_J

-40 to +125

-55 to +150

^OC

T_STG

Electrical Characteristics (T=25^OC unless otherwise speciﬁed)

Parameter

Symbol Conditions

Min. Typ.

Max. Units

-40^OC to 125^OC

Pin 1 or Pin 2 to Pin 3

Reverse Stand-Oﬀ Voltage

V_RWM

I_t= 1mA,

Pin 1 or 2 to Pin 3

Reverse Breakdown Voltage

Reverse Leakage Current

Clamping Voltage

V_BR

I_R

-40^OC to 125^OC

T = 25^OC

6.5

0.100

μA

V_RWM= 5V

0.005

I_PP= 1A, tp = 8/20µs,

Pin 1 or 2 to Pin 3

V_C

I_PP= 6A, tp = 8/20µs,

Pin 1 or 2 to Pin 3

Clamping Voltage

V_C

I_PP= 4A, tp = 0.2/100ns (TLP)

Pin 1 or 2 to Pin 3

ESD Clamping Voltage⁽²⁾

Dynamic Resistance^{(2), (3)}

Total Channel Capacitance

I_PP= 16A, tp = 0.2/100ns (TLP)

Pin 1 or 2 to Pin 3

V_C

tp = 0.2/100ns (TLP)

Pin 1 or 2 to Pin 3

R_DYN

C_IN

f_3dB

0.50

0.95

Ohms

V_R= 0V, f = 1MHz

Pin 1 or 2 to Pin 3

T = 25^OC

1.2

1.8

Diﬀerential (SDD21) Cut-Oﬀ

Frequency

50 Ohm Source and Load Termination

GHz

f = 75MHz

Common Mode (SCC21)

Attenuation

f_ATT

f = 500MHz

1.3

f = 1GHZ - 2.5GHz

Input to Output

Channel Resistance

R_CH

Ohms

Notes:

(1): ESD Gun return path to Ground Reference Plane (GRP)

(2): Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, I_TLPand V_TLPaveraging window: t₁= 70ns to t₂= 90ns.

(3): Dynamic resistance calculated from I_TLP= 4A to I_TLP= 16A

EClamp8052P

Final Datasheet

Oct 4, 2016

Page 2

Semtech

www.semtech.com

Rev 4.1

Typical Characteristics

Diﬀerential Mode Attenuation vs. Frequency

Common Mode Attenuation vs. Frequency

-5

-1

-10

-15

-20

-25

-30

-35

-40

-45

-50

-2

-3

-4

-5

-6

-7

-8

-9

-10

0.01

0.1

0.01

0.1

Frequency (GHz)

Junction Capacitance vs. Reverse Voltage

Junction Capacitance vs. Temperature

0.99

0.98

0.97

0.96

0.95

0.94

0.93

0.92

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

f = 1Mhz

Any Pin to GND

Normalized to 25^OC

VR = 0V

VR = 5V

f = 1Mhz

Any Pin to GND

_A= 25^OC

EC8052P_AR_CJvT

EC8052P_AR_CJvV

‐50

‐25

100

125

150

Reverse Voltage ‐ V_R(V)

Temperature (°C)

Channel DC Resistance vs. Temperature

Breakdown Voltage (V_BR) vs. Temperature

8.70

8.65

8.60

8.55

8.50

8.45

2.0

Any Pin to GND

Pin1 to 5 or 2 to 4

I_BR= 1mA

1.5

1.0

0.5

0.0

EC8052P_AR_VBR

EC8052P_AR_RCH

‐50

‐25

100

125

150

‐50

100

150

Temperature (^OC)

EClamp8052P

Final Datasheet

Oct 4, 2016

Page 3

Semtech

www.semtech.com

Rev 4.1

Typical Characteristics

ESD Clamping (+8kV Contact per IEC 61000-4-2)

ESD Clamping (-8kV Contact per IEC 61000-4-2)

150

130

110

Measured with 50 Ohm scope input

impedance, 2GHz bandwidth. Corrected

for 50 Ohm, 20dB attenuator. ESD gun

return path connected to ESD ground

‐20

plane. Pin1 or 2 to GND,T_A= 25^O

‐40

‐60

‐80

‐100

‐120

‐140

‐160

Measured with 50 Ohm scope input

impedance, 2GHz bandwidth. Corrected

for 50 Ohm, 20dB attenuator. ESD gun

return path connected to ESD ground

plane. Pin1 or 2 to GND,T_A= 25^O

EC8052P_AR_ESDN8

EC8052P_AR_ESDP8

‐10

Time (ns)

TLP Characteristic (Positive)

TLP Characteristic (Negative)

T_A= 25^OC

_P= 100ns

T_R= 0.2ns

T_P= 100ns

T_R= 0.2ns

0.7T_P< T_SAMPLE< 0.9T_P

‐5

0.7T_P< T_SAMPLE< 0.9T_P

‐10

‐15

‐20

‐25

‐30

EC8052P_AR_TLPN

EC8052P_AR_TLPP

‐25

‐20

‐15

‐10

‐5

V_DUT(V)

Clamping Voltage vs. Peak Pulse Current (tp=8/20us)

Reverse Leakage vs. Temperature

T_A= 25^OC

V_R= 5V

Any Pin to GND

tr = 8µs

td = 20µs

Surge applied and measured on same pin

I/O IN (Input Side)

EC8052P_AR_8_20

EC8052P_AR_IR

100

115

130

145

Peak Pulse Current ‐ I_PP(A)

Temperature (^OC)

EClamp8052P

Final Datasheet

Oct 4, 2016

Page 4

Semtech

www.semtech.com

Rev 4.1

Application Information

USB Interface Protection

width. Both ground pads should be connected for op-

timal performance. Ground connection is made using

ﬁlled via-in-pad. Additional information may be found on

the device data sheet.

EClamp8052P may be used to protect D+ and D- lines

against ESD and EMI in USB 2.0, USB 3.0, and USB 3.1

applications. USB D+ and D- lines enter at pins 1 and 2

(connector side) and exit at pins 4 and 5. The TVS diodes

are internally connected at pins 1 and 2 and therfore

Single line devices such as uClamp0571P are recom-

must be located towards the connector on the PCB. Pin 3 mended for surge and ESD protection of the VBus line.

is connected to the ground plane. Figures 1 is an exam-

ple of protecting a USB 3.0 Type-A interface (host side

shown).

This device features high surge and ESD capability and

may be used on 5V power rails.

Device Placement

Placement of the protection component is a critical ele-

ment for eﬀective ESD suppression. TVS diodes should

be placed as close to the connector as possible. This

helps reduce transient coupling to nearby traces.

Ground connections should be made directly to the

ground plane using micro-vias. This reduces parasitic

inductance in the ground path and minimizes the clamp-

ing voltage seen by the protected device.

For USB 3.0 applications, RClamp3324T is recommended

for protecting the 5Gb/s SuperSpeed line pairs. Lines

are routed through the device at pins 1-4. Traces should

be kept the same length to avoid impedance mismatch.

Ground is connected at pins 5 and 6. The diﬀerential

impedance of each pair can be controlled for USB 3.0 (85

Ohms +/-15%) while maintaining a minimum trace-to-

trace and trace-to-pad spacing. Individual PCB design

constraints may necessitate diﬀerent spacing or trace

EClamp8052P

GND

D+

SSRX-

SSRX+

GND

RClamp3324T

D-

SSTX-

SSTX+

VBus

uClamp0571P

USB 3.0 - Type A

Host Connector

Figure 1 - USB 3.0 Type-A Protection Example

EClamp8052P

Final Datasheet

Oct 4, 2016

Page 5

Semtech

www.semtech.com

Rev 4.1

Application Information

VBus

Vcc

D+

uClamp0571P

EClamp8052P

D-

MHL-

USB-

USB 2.0

MHL+

USB+

Applications

Processor

GND

MHL+

CBus/ID

uClamp0511P

MHL-

CBus

GND

Video

uUSB

GND

Connector

MHL

Applications

Processor

USB/MHL

Multiplexer

Figure 2 - USB2.0 / MHL Interface Protection

Applications Processor

EClamp8052P x 3

CLK+

CLK-

D0+

Camera

Module

D0-

D1+

D1-

Figure 3 - MIPI Camera Serial Interface Protection

EClamp8052P

Final Datasheet

Oct 4, 2016

Page 6

Semtech

www.semtech.com

Rev 4.1

Outline Drawing - SGP1917N5

DIMENSIONS

MILLIMETERS

DIM

MIN NOM MAX

0.50 0.55 0.60

See Note 2

0.15 0.20 0.25

1.85 1.90 1.95

1.65 1.70 1.75

0.50 BSC

0.35 0.40 0.45

PIN 1

INDICATOR

(LASER MARK)

aaa

0.08

0.10

bbb

SEATING

PLANE

aaa C

D/2

LxN

(0.025-0.075)

E/2

bxN

bbb

C A B

NOTES:

1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).

BOTTOM SOLDER MASK ( 0.020+/-0.007 )

SOLDER PAD ( 0.018+/-0.005)

Land Pattern - SGP1917N5

DIMENSIONS

DIM MILLIMETERS

(1.50)

0.75

0.50

0.25

0.75

2.25

(C)

NOTES:

CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).

THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.

CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR

COMPANY'S MANUFACTURING GUIDELINES ARE MET.

EClamp8052P

Final Datasheet

Oct 4, 2016

Page 7

Semtech

www.semtech.com

Rev 4.1

Marking Code

82P

PIN 1

INDICATOR

(LASER MARK)

YW = Alphanumeric character Date Code

Tape and Reel Speciﬁcation - Plastic Tape, 4mm Pitch

Pin1 Location

(towards sprocket holes )

Ordering Information

Part Number

EClamp8052P.TCT

Qty per Reel Reel Size

3000 7 Inch

Carrier Tape Pitch

Plastic

4mm

EMIClamp and EClamp are trademarks of Semtech Corporation.

EClamp8052P

Final Datasheet

Oct 4, 2016

Page 8

Semtech

www.semtech.com

Rev 4.1

IMPORTANT NOTICE

Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a

guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right

to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders

and should verify that such information is current and complete. Semtech warrants performance of its products to the speciﬁcations applicable at the time

of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale.

SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES

OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE

OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN

SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall

indemnify and hold Semtech and its oﬃcers, employees, subsidiaries, aﬃliates, and distributors harmless against all claims, costs damages and attorney

fees which could arise.

The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and

names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document

without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any

Contact Information

Semtech Corporation

200 Flynn Road, Camarillo, CA 93012

Phone: (805) 498-2111, Fax: (805) 498-3804

www.semtech.com

EClamp8052P

Final Datasheet

Oct 4, 2016

Page 9

Semtech

Rev 4.1

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