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  • ERBSE4R00U图
  • 深圳市得捷芯城科技有限公司

     该会员已使用本站11年以上
  • ERBSE4R00U
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  • 深圳市三得电子有限公司

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  • 深圳市华斯顿电子科技有限公司

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  • ERBSE4R00U
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  • 深圳市亚泰盈科电子有限公司

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产品型号ERBSE4R00U的Datasheet PDF文件预览

Micro Chip Fuse  
Planed final production : Sep.2011  
Micro Chip Fuse  
Type:  
ERBSE  
ERBSD  
Features  
Small size  
Fast-acting and withstanding in-rush current characteristics  
Approved Safety Standards  
UL248-14 : File No.E194052  
c-UL(CSA)C22.2 No.248-14 : File No.E194052  
Explanation of Part Numbers  
1
2
3
4
5
6
7
8
9
10  
E
R
B
S
E
1
R
0
0
U
Product Code  
Fusing Characteristics  
Fast-acting and  
Product shape  
1608 size  
(1.6 mm҂0.8 mm)  
Packaging  
Punched carrier taping  
Rated Current (A)  
U
0R25 0.25 A 1R50 1.5 A  
0R31 0.315 A 2R00 2.0 A  
0R37 0.375 A 2R50 2.5 A  
E
Micro Chip Fuse  
withstanding in-rush  
current  
S
1005 size  
(1.0 mm҂0.5 mm)  
D
0R50 0.5 A  
3R00 3.0 A  
0R75 0.75 A 4R00 4.0 A  
1R00 1.0 A  
1R25 1.25 A  
5R00 5.0 A  
Dimensions in mm (not to scale)  
Construction  
Marking  
a
Fusing Element  
Ceramic Core  
Protective Coating  
t
Electrode  
(Outer)  
L
W
Trimming  
Dimensions (mm)  
Type  
(inches)  
L
W
a
t
ERBSE  
(0603)  
ERBSD  
(0402)  
0.15  
0.10  
0.15  
0.10  
0.20  
0.15  
0.10  
0.10  
1.60  
0.80  
0.50  
0.30  
0.70  
1.00  
0.20  
0.40  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Dec. 2007  
Micro Chip Fuse  
Ratings  
1608 Size  
ERBSE R  
U
२ २२  
Part No.  
0R50  
0.5  
F
0R75  
0.75  
G
1R00  
1.0  
H
1R25  
1.25  
J
1R50  
1.5  
K
2R00  
2R50  
2.5  
O
3R00  
3.0  
P
4R00  
4.0  
S
5R00  
5.0  
T
Rated Current (A)  
Marking Code  
2.0  
N
Internal R (m ) at 25 °C max.  
370  
245  
155  
120  
90  
60  
48  
36  
28  
20  
ȑ
Rated Current 100 %/4 hours min.  
҂
Fusing Current/Fusing Time  
(at 25 °C)  
Rated Current 200 %/5 seconds max.  
҂
Rated Current 300 %/0.2 seconds max.  
҂
Rated Voltage  
32 VDC  
50 A  
(Open Circuit Voltage)  
Interrupting Rating  
(at Rated Voltage)  
35 A  
Category Temp. Range  
(Operating Temp. Range)  
−40 °C to +100 °C  
1005 Size  
ERBSD R  
U
२ २२  
Part No.  
0R25 0R31 0R37 0R50 0R75 1R00 1R25 1R50 2R00 2R50 3R00  
Rated Current (A)  
Marking Code  
0.25  
V
0.315 0.375  
0.5  
F
0.75  
G
1.0  
H
1.25  
J
1.5  
K
2.0  
N
2.5  
O
3.0  
P
X
Y
Internal R (m ) at 25 °C max.  
700  
570  
460  
330  
200  
135  
100  
80  
53  
40  
33  
ȑ
Rated Current 100 %/4 hours min.  
҂
Fusing Current/Fusing Time  
(at 25 °C)  
Rated Current 200 %/5 seconds max.  
҂
Rated Current 300 %/0.2 seconds max.  
҂
Rated Voltage  
(Open Circuit Voltage)  
24 VDC  
35 A  
Interrupting Rating  
(at Rated Voltage)  
Category Temp. Range  
(Operating Temp. Range)  
−40 °C to +100 °C  
70 °C  
Power Derating Curve  
100  
80  
60  
40  
20  
0
For Circuit, current rating shall be derated in  
accordance with the figure on the right.  
This current derating curve is for fusing  
characteristics.  
100 °C  
–40 –20  
0
20 40 60 80 100 120 140  
Ambient Temperature (°C)  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Dec. 2007  
Micro Chip Fuse  
°
Fusing Characteristics (25 C typical)  
–t Characteristics  
Type ERBSE  
10  
I  
Type ERBSD  
10  
1
1
0.1  
0.1  
0.01  
0.01  
0.001  
0.001  
Reference Only  
Reference Only  
0.0001  
0.1  
0.0001  
0.1  
1
10  
100  
1
10  
100  
Fusing Current (A)  
Fusing Current (A)  
2t–t Characteristics  
I  
Type ERBSE  
Type ERBSD  
5.0 A  
100  
4.0 A  
3.0 A  
2.5 A  
2.0 A  
1.5 A  
1.25 A  
1.0 A  
0.75 A  
100  
3.0 A  
2.5 A  
2.0 A  
10  
1
1.5 A  
10  
1
1.25 A  
1.0 A  
0.75 A  
0.5 A  
0.5 A  
0.375 A  
0.315 A  
0.25 A  
0.1  
0.1  
0.01  
0.001  
0.01  
0.001  
Reference Only  
Reference Only  
0.0001  
0.0001  
0.0001  
0.0001  
0.001  
0.01  
t (s)  
0.1  
1
0.001  
0.01  
t (s)  
0.1  
1
Packaging Methods  
Standard Quantity  
Type  
ERBSE  
ERBSD  
Kind of Taping  
Pitch (P1)  
4 mm  
2 mm  
Quantity  
5000 pcs./ reel  
10000 pcs./ reel  
Punched Carrier Taping  
Punched Carrier Taping  
Taping Reel  
T
Sprocket hole  
Compartment  
φC  
φD0  
A
Taping running direction  
T
Chip component P1 P2 P0  
φA  
W
Type  
ERBSE 1.00  
ERBSD 0.65  
A
B
1.80  
1.15  
W
F
E
φA  
φB  
φC  
W
T
Dimen  
sions  
(mm)  
Dimensions  
0.10  
0.05  
0.20  
0.05  
0.20  
0.10  
0.05  
0.10  
+0  
1.0  
1.0  
1.0  
(mm)  
8.00  
3.50  
1.75  
180.0  
60 min. 13.0  
9.0  
11.4  
−3.0  
Type  
ERBSE 4.00  
ERBSD 2.00  
P1  
P2  
P0  
4.00  
D
T
0.85  
0.60  
φ
0
Dimen  
sions  
(mm)  
0.10  
0.10  
0.07  
0.07  
0.05  
+0.10  
–0  
2.00  
1.50  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Dec. 2007  
Micro Chip Fuse  
Recommended Land Pattern  
Dimensions (mm)  
Type  
C
A
B
C
ERBSE  
ERBSD  
0.9  
0.6  
2.1 to 2.3  
1.4 to 1.6  
0.8  
0.5  
A
B
Recommended Soldering Conditions  
Recommendations and precautions are described below.  
Recommended soldering conditions for reflow  
·Reflow soldering shall be performed a maximum of  
two times.  
·Please contact us for additional information when  
used in conditions other than those specified.  
·Please measure the temperature of the terminals and  
study every kind of solder and printed circuit board  
for solderability before actual use.  
For soldering (Example : Sn/Pb)  
Temperature  
Time  
Preheating  
Main heating  
Peak  
140 °C to 160 °C  
Above 200 °C  
235 5 °C  
60 s to 120 s  
30 s to 40 s  
max. 10 s  
Peak  
For lead-free soldering (Example : Sn/Ag/Cu)  
Preheating  
Temperature  
150 °C to 180 °C  
Above 230 °C  
max. 260 °C  
Time  
Preheating  
Main heating  
Peak  
60 s to 120 s  
30 s to 40 s  
max. 10 s  
Heating  
Time  
<Repair with hand soldering>  
Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder  
each electrode for 3 seconds or less.  
Never touch this product with the tip of a soldering iron.  
Safety Precautions  
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,  
Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog.  
1. Set the rated current so that the current passing through the Micro Chip Fuses (hereafter called the fuses)  
under normal conditions is within 70% of the rated current.  
2. Do not continuously pass a current exceeding the rated current through the fuses.  
3. If a pulse exceeding the rated current is applied, such as a rush current or surge current at power-on, take  
care not to cause unwanted fusing. Calculate the I2t value of the pulse and check the tolerance to the number  
of pulses according to the I2t-t characteristic curve before deciding to use the fuses. Before checking the  
tolerance, consult our sales staff in advance.  
4. The fuses are designed to be blown out by a current that is double or greater than the rated current. Ensure  
that the abnormal current generated when a circuit abnormality occurs in your product is at least double or  
greater than the rated current of the fuses. In addition, ensure that the abnormal current of your product does not  
exceed the maximum interrupting current of the fuses.  
5. The fuses are designed to be used on the secondary side of a power supply. Do not use them on the primary  
side.  
6. Ensure that the voltage applied to the fuses are within their rated voltage.  
7. The fusing characteristics of the fuses are affected by the ambient temperature. Before use, mount the fuses  
on your products and carefully check and evaluate their operating temperature range.  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Feb. 2006  
Safety Precautions (Common precautions for EMI Filters, Fuses, and Sensors[MR Elements])  
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written  
agreement on the specifications with us in advance. The design and specifications in this catalog are subject  
to change without prior notice.  
• Do not use the products beyond the specifications described in this catalog.  
• This catalog explains the quality and performance of the products as individual components. Before use, check  
and evaluate their operations when installed in your products.  
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment  
where a defect in these products may cause the loss of human life or other significant damage, such as damage to  
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating  
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.  
Systems equipped with a protection circuit and a protection device  
Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault  
(1) Precautions for use  
• These products are designed and manufactured for general and standard use in general electronic equipment  
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)  
• These products are not intended for use in the following special conditions. Before using the products,  
carefully check the effects on their quality and performance, and determine whether or not they can be used.  
1. In liquid, such as water, oil, chemicals, or organic solvent  
2. In direct sunlight, outdoors, or in dust  
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2  
4. Electric Static Discharge (ESD) Environment  
These components are sensitive to static electricity and can be damaged under static shock (ESD).  
Please take measures to avoid any of these environments.  
Smaller components are more sensitive to ESD environment.  
5. Electromagnetic Environment  
Avoid any environment where strong electromagnetic waves exist.  
6. In an environment where these products cause dew condensation  
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with  
resin or other materials  
• These products generate Joule heat when energized. Carefully position these products so that their heat will  
not affect the other components.  
• Carefully position these products so that their temperatures will not exceed the category temperature range due  
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components  
or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).  
• Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the  
performance or reliability of the products.  
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance  
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water  
residues. Otherwise, the insulation performance may be deteriorated.  
(2) Precautions for storage  
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival  
at your company, provided that they remain packed as they were when delivered and stored at a temperature  
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the  
date of arrival at your company)  
The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on  
the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 %  
to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a  
year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of  
-10 °C to +40 °C and a relative humidity of 30 % to 75 %.  
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,  
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping  
materials) may be deformed or deteriorated, resulting in mounting failures.  
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2  
2. In direct sunlight  
<Package markings>  
Package markings include the product number, quantity, and country of origin.  
In principle, the country of origin should be indicated in English.  
Feb. 2006  
– EX2 –  
配单直通车
ERBSE4R00U产品参数
型号:ERBSE4R00U
生命周期:Obsolete
IHS 制造商:PANASONIC CORP
包装说明:LEAD FREE
Reach Compliance Code:unknown
ECCN代码:EAR99
HTS代码:8536.10.00.40
风险等级:5.8
其他特性:RATED BREAKING CAPACITY AT 32 VDC: 50 A
熔断特性:FAST
主体宽度:0.8 mm
主体高度:0.7 mm
主体长度或直径:1.6 mm
电路保护类型:ELECTRIC FUSE
制造商序列号:ERBSE
安装特点:SURFACE MOUNT
最高工作温度:100 °C
最低工作温度:-40 °C
包装方法:TAPE AND REEL
物理尺寸:1.6mm x 0.8mm x 0.7mm
额定分断能力:35 A
额定电流:4 A
额定电压(直流):32 V
参考标准:CSA; UL
表面贴装:YES
端子形状:WRAPAROUND
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