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  • ESD5V3U2U-03F+H6327
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产品型号ESD5V3U2U-03F-E6433的Datasheet PDF文件预览

ESD5V3U2U...  
Ultra-Low Capacitance ESD Diode Array  
ESD / transient protection of high-speed  
data lines exceeding  
IEC61000-4-2 (ESD): 20 kV (air / contact)  
IEC61000-4-4 (EFT): 40 A (5/50 ns)  
IEC61000-4-5 (surge): 3 A (8/20 µs)  
Max. working voltage: 5.3 V  
Extremely low capacitance: down to 0.2 pF  
Very low clamping voltage: 12 V typ.  
Extremely low forward clamping voltage: 4 V typ.  
Very low reverse current: < 1 nA typ.  
Pb-free (RoHS compliant) package  
Applications  
USB 2.0, 10/100/1000 Ethernet, FireWire, DVI  
HDMI, S-ATA  
Mobile communication  
Consumer products (STB, MP3; DVD, DSC...)  
LCD displays, camera  
Notebooks and destop computers, peripherals  
ESD5V3U2U-03F  
ESD5V3U2U-03LRH  
1
2
3
Type  
ESD5V3U2U-03F  
Package  
TSFP-3  
Configuration  
2 lines, uni-directional*  
Marking  
Z1  
ESD5V3U2U-03LRH  
TSLP-3-7  
2 lines, uni-directional*  
Z1  
* or 1 line, bi-directional between pins 1 and 2, if pin 3 is not connected  
2011-06-17  
1
ESD5V3U2U...  
Maximum Ratings at T = 25°C, unless otherwise specified  
A
Parameter  
ESD contact/ air discharge  
Peak pulse current (t = 8 / 20 µs)  
Symbol  
V
ESD  
I
pp  
Value  
20  
Unit  
kV  
A
1)  
2)  
3
p
°C  
Operating temperature range  
Storage temperature  
T
-40...125  
-65...150  
op  
T
stg  
Electrical Characteristics at T = 25°C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
Unit  
min.  
typ. max.  
Characteristics -  
-
6
-
-
5.3  
-
V
Reverse working voltage  
Breakdown voltage  
V
V
RWM  
(BR)  
I
= 1 mA, from pin 1 to 3  
(BR)  
-
< 1  
50  
nA  
V
Reverse current  
I
R
V = 5.3 V, from pin 1 to 3  
R
Clamping voltage  
V
CL  
FC  
2)  
I
= 1 A, t = 8/20µs , from 1/2 to 3  
-
-
10  
12  
13  
15  
PP  
p
2)  
I
= 3 A, t = 8/20µs , from 1/2 to 3  
PP  
p
Forward clamping voltage  
V
2)  
I
= 1 A, t = 8/20µs , from 3 to 1/2  
-
-
2
4
4
6
PP  
p
2)  
I
= 3 A, t = 8/20µs , from 3 to 1/2  
PP  
p
pF  
Line capacitance, V = 0 V, f = 1 MHz  
from pin 1/2 to 3  
from pin 1 to 2, pin 3 not connected  
C
T
R
3)  
-
-
0.4  
0.2  
0.6  
0.4  
1
V
according to IEC61000-4-2  
according to IEC61000-4-5  
ESD  
2
3
I
pp  
Total capacitance line to ground  
2011-06-17  
2
ESD5V3U2U...  
Clamping voltage, V = ƒ(I )  
Forward clamping voltage V = ƒ(I )  
FC PP  
cl  
pp  
t = 8 / 20 µs, from pin 1/2 to 3  
t = 8 / 20 µs, from pin 3 to 1/2  
p
p
13  
V
6
V
11  
10  
9
4
3
2
1
0
8
7
6
A
A
0
1
2
4
0
1
2
3
5
I
I
pp  
pp  
Reverse current I = ƒ (T )  
Diode capacitance C = ƒ (V )  
R
A
T
R
V = Parameter, from pin 1/2 to 3  
f = 1MHz, from pin 1/2 to 3  
R
10 -6  
A
0.6  
pF  
10 -7  
10 -8  
0.4  
0.3  
0.2  
0.1  
0
10 -9  
10 -10  
10 -11  
25  
°C  
V
50  
75  
100  
150  
0
1
2
3
5
T
V
R
A
2011-06-17  
3
ESD5V3U2U...  
Line capacitance C = ƒ (f)  
Line capacitance C = ƒ(T )  
T A  
T
V = parameter, from pin 1/2 to 3  
V = 0 V, f = 1 MHz  
R
R
0.7  
pF  
0.6  
pF  
0.5  
VR=0V  
0.4  
5.3 V  
0.4  
0.3  
0.2  
0.1  
0
VR=5.3V  
0 V  
0.3  
0.2  
0.1  
0
MHz  
°C  
0
500  
1000  
1500  
2000  
3000  
-50  
-25  
0
25  
50  
100  
T
f
A
2011-06-17  
4
ESD5V3U2U...  
Application example ESD5V3U2U...  
2 lines, uni-directional  
2 protected high-speed I/O data lines  
I/O ESD sensitive  
I/O  
device  
2
1
The protection diode should be  
placed very close to the location  
where the ESD or other transients  
can occur to keep loops and  
inductances as small as possible.  
Pin 3 should be connected directly to  
a ground plane on the board.  
0.4 pF typ.  
3
Application example ESD5V3U2U...  
1 line, bi-directional  
1 protected high-speed I/O data lines  
I/O ESD sensitive  
I/O  
device  
2
1
The protection diode should be  
placed very close to the location  
where the ESD or other transients  
can occur to keep loops and  
inductances as small as possible.  
Pin 3 should not be connected on  
the board.  
0.2 pF typ.  
3
2011-06-17  
5
Package TSFP-3  
ESD5V3U2U...  
Package Outline  
0.0ꢀ  
1.2  
0.0ꢀ  
0.04  
0.2  
0.ꢀꢀ  
3
1
2
0.0ꢀ  
0.0ꢀ  
0.0ꢀ  
0.2  
0.1ꢀ  
0.4  
0.0ꢀ  
0.4  
Foot Print  
0.4  
0.4  
0.4  
Marking Layout (Example)  
Manufacturer  
BCR847BF  
Type code  
Pin 1  
Standard Packing  
Reel ø180 mm = 3.000 Pieces/Reel  
Reel ø330 mm = 10.000 Pieces/Reel  
4
0.2  
0.3  
0.7  
1.3ꢀ  
Pin 1  
2011-06-17  
6
Package TSLP-3-7  
ESD5V3U2U...  
Package Outline  
Top view  
Bottom view  
+0.01  
-0.03  
0.39  
0.0ꢀ  
0.6  
Cathode2)  
marking  
1)  
0.03ꢀ  
0.0ꢀ MAX.  
0.ꢀ  
3
2
3
1
1
2
0.0ꢀ  
1)  
0.3ꢀ  
Pin 1  
marking  
0.03ꢀ  
2x0.1ꢀ  
1) Dimension applies to plated terminal  
2) Only for diodes, cathode marking on pin 3  
Foot Print  
For board assembly information please refer to Infineon website "Packages"  
0.6  
0.4ꢀ  
R0.1  
0.2  
0.22ꢀ  
0.2  
0.17  
0.22ꢀ  
0.1ꢀ  
Copper  
Solder mask  
Stencil apertures  
Marking Layout  
Type code  
Type code  
Pin 1 marking  
Cathode marking  
Standard  
Only for diodes, cathode marking on pin 3  
Standard Packing  
Reel ø180 mm = 1ꢀ.000 Pieces/Reel  
Standard  
4
Only for diodes, cathode marking on pin 3  
0.ꢀ  
4
Pin 1  
marking  
Cathode  
marking  
0.76  
0.76  
2011-06-17  
7
ESD5V3U2U...  
Edition 2009-11-16  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
2009 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee  
of conditions or characteristics. With respect to any examples or hints given herein,  
any typical values stated herein and/or any information regarding the application of  
the device, Infineon Technologies hereby disclaims any and all warranties and  
liabilities of any kind, including without limitation, warranties of non-infringement of  
intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices,  
please contact the nearest Infineon Technologies Office (<www.infineon.com>).  
Warnings  
Due to technical requirements, components may contain dangerous substances.  
For information on the types in question, please contact the nearest Infineon  
Technologies Office.  
Infineon Technologies components may be used in life-support devices or systems  
only with the express written approval of Infineon Technologies, if a failure of such  
components can reasonably be expected to cause the failure of that life-support  
device or system or to affect the safety or effectiveness of that device or system.  
Life support devices or systems are intended to be implanted in the human body or  
to support and/or maintain and sustain and/or protect human life. If they fail, it is  
reasonable to assume that the health of the user or other persons may be  
endangered.  
2011-06-17  
8
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