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产品型号EV2300的概述

EV2300芯片概述 EV2300是德州仪器（Texas Instruments）推出的一款高性能电源监控和控制芯片，广泛应用于电池管理系统（BMS）、电动汽车（EV）以及其他相关应用中。其设计旨在实现精确的电池状态监测，提高电池的使用效率与寿命。EV2300能够与其他系统组件密切配合，以优化充电与放电管理，从而确保电池在最佳状态下运行。该芯片的优势在于其多功能的集成特性，集成了多种监测功能，包括电池电压、电流、温度等参数的实时监测。此外，EV2300还支持数字通信接口，便于与上位机或其他控制器进行数据交换。这一特性极大地推动了电池管理系统的智能化，使得用户可以通过可视化界面轻松跟踪和分析电池状态。 EV2300详细参数 EV2300芯片的详细参数包括： 1. 工作电压：3V至5.5V。 2. 电流监测范围：支持复杂的电流传感器，最大监测电流可达±5A。 3. 电池电压监测范围：0V...

产品型号EV2300的Datasheet PDF文件预览

User's Guide

SLUU159C–February 2005–Revised January 2012

EV2300 EVM Interface Board

This user's guide describes the function and operation of the EV2300 evaluation module. This guide

includes a complete description of the EV2300 EVM, as well as a bill of materials, and schematic.

Contents

Introduction .................................................................................................................. 2

Interfaces ..................................................................................................................... 2

EV2300 Bill of Materials, Component Placement, Schematic ........................................................ 6

List of Figures

Board Layer 1 ...............................................................................................................

Solder Mask 1 ...............................................................................................................

Solder Mask 2.............................................................................................................. 10

Board Layer 2.............................................................................................................. 11

Component Placement 1 ................................................................................................. 12

Component Placement 2 ................................................................................................. 13

Internal Board Layer 1 .................................................................................................... 14

Internal Board Layer 2 .................................................................................................... 15

List of Tables

Ordering Information........................................................................................................

SLUU159C–February 2005–Revised January 2012

EV2300 EVM Interface Board

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Introduction

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Introduction

This EVM interface board enables an IBM-compatible or other type (with required driver for the particular

platform) PC to communicate with Texas Instruments SMBus, HDQ, or DQ interface gas gauges via a

Universal Serial Bus (USB) port. In addition to this board, PC software is required to interpret the gas

gauge data to complete the evaluation system.

1.1 Features

•

Fully powered from the USB port

Capable of providing a 25-mA 3.3-V source

Complete interface between USB and SMBus, I²C, and HDQ (8/16) interfaces using a simple API

1.2 Kit Contents

•

EV2300 circuit module

Standard USB cable

1.3 Ordering Information

Table 1. Ordering Information

EVM Part Number

EV2300

Interfaces

The EV2300 interfaces are described in the following table. The reference designators on the circuit board

and the functions are also listed.

Reference

Designator

Function

HDQ and SMB

I²C

SMBus, HDQ, and DQ Interface ports

E²PROM I²C Interface

Terminal block for connecting to a target device

Terminal for connecting to a target E²PROM or I²C interface

battery monitor

USB

USB Interface

Interface to host computer

EV2300 EVM Interface Board

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Interfaces

2.1 Overview

The EV2300 is enclosed and is provided as shown.

2.2 EV2300 Controller

The EV2300 controller is a bq8012 running at 4 MHz. The controller firmware is stored in flash memory

and is executed by the core at power-up after the boot ROM code verifies the integrity words.

The controller communicates with target device(s) through either: a 2-wire SMBus communication port, a

1-wire HDQ port, or a 2-wire E²PROM I²C port. The 2-wire SMBus communication port supports both

SMBus and I²C protocols.

2.3 USB Interface (USB)

The interface board connects to a USB port (version 1.1) on a host computer and is powered from the

port. All communication over the USB is proprietary and does not fit any USB-defined device classes.

Therefore communication with the device requires a loader and driver from Texas Instruments.

The loader enumerates the device (determines it is present on the USB), then loads the EV2300 controller

firmware for the USB interface. Once the firmware load is complete, the loader sends a command to the

USB interface IC to execute the new program and the loader driver exits. A new driver takes control and

enumerates the EV2300 and makes the device present to programs running on the host.

The installer for the USB EVB installs:

1. A loader driver

2. A binary to load onto the USB interface IC

3. An EV2300 controller driver for direct access to the device

4. An EV2300 DLL for application access to the device

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Interfaces

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2.4 HDQ Interface (HDQ)

This interface allows a host computer to interact with a slave or target device through the two-wire SMBus

or the one-wire HDQ interfaces. The ports are labeled with the corresponding signal names above each

port connector. Connect the signal and a ground reference (GND), and optionally VOUT, to a target

device.

The two-wire interface supports SMBus version 1.1 byte, word, block transactions with and without PEC.

The SMBus limits the capacitance on each line (Data and Clock) to 100 pF. The EV2300 places 8 pF on

each line, so a device may place up to 92 pF total. If the capacitive load approaches or exceeds 100 pF,

SMBus communication may not be reliable.

Name

GND

VOUT

HDQ

VCC

Description

Ground return/reference for HDQ interface

Controlled EEPROM power. Supplies 5 VDC to a target EEPROM IC

HDQ one-wire interface. Pulled up to 3.3-V rail with a 10-kΩ resistor

Supplies 3.3 VDC to a target. Current load should be limited to 30 mA

2.5 I²C/EEPROM Interface (I²C)

This interface allows a host computer to interact with a target E²PROM or other I²C interface device such

as a battery monitor device through a two-wire I²C interface. The interface contains a controlled power pin,

the I²C clock and data lines, and a ground reference.

Name

GND

SCL

Description

Ground return. Connected to the SMD and HDQ GND

I²C clock. This line must be pulled up by the target.

I²C data. This line must be pulled up by the target.

SDA

VOUT

Controlled EEPROM power. Supplies 5 VDC to a target EEPROM IC

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Interfaces

2.6 SMBus Interface (SMBus)

Name

GND

Description

Ground reference

SMBC

SMB clock pin. This pin is pulled to 3.3 VDC through a 10-kΩ resistor. Do not exceed 5.6 VDC on

this pin.

SMBD

SMB data pin. This pin is pulled to 3.3 VDC through a 10-kΩ resistor. Do not exceed 5.6 VDC on

this pin.

Not connected on this board. This pin is floating.

SLUU159C–February 2005–Revised January 2012

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EV2300 Bill of Materials, Component Placement, Schematic

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EV2300 Bill of Materials, Component Placement, Schematic

This chapter includes the schematic, component placement on the circuit board, and a listing of the bill of

materials for the EV2300 EVM.

3.1 Bill of Materials (BOM)

(1)

(2) (3) (4)

Qty Ref Des

Description

Size

MFR

Part Number

10 C1-C7,

C10-C12,

Capacitor, ceramic, 0.1 µF, 25 V, X7R, 10%

603

TDK

C1608X7R1E104KT

C15, C20

C13

Open

C16, C21

C18

Capacitor, POSCAP 4.7 µF, 35 V, 20%

Capacitor, ceramic, 2200 pF, 50 V, C0G, 10%

Capacitor, ceramic, 150 pF, 50 V, C0G, 10%

Capacitor, ceramic, 22 pF, 50 V, C0G, 10%

6032 ©)

603

AVX

TDK

TAJC475K035R

C1608C0G1H222KT

C1608C0G1H151KT

C1608C0G1H220KT

C19

603

C8, C9

603

D1-D7, D9, Open

D13-D15,

0.068 × 0.049

D17

D12, D19

D20

Diode, LED, green, 20 mA, 0.9 mcd

0.068 × 0.049 Panasonic

LN1371G-(TR)

LN1271R-(TR)

Diode, LED, red, 20 mA, 0.9 mcd

Diode, dual, 250 mA, 70 V

D21-D23

SOT23

Vishay-Liteon BAW56GS08

General Semi GL05T

D8, D10,

D11, D16,

D18

Diode, low capacitance, TVS

Connector, USB upstream (Type B)

Header, friction lock assembly, 4-pin right angle

Header, 11 pin, 100 mil spacing, (36-pin strip)

Open

0.47" × 0.67" Molex

67068-1000

22-05-3041

PTC36SAAN

J13-J15

0.400 x 0.500 Molex

121100

Sullins

J3-J5,

0.038"

J8-J11

Header, 2 pin, 100 mil spacing, (36-pin strip)

Transistor, NPN, high-performance, 500 mA

MOSFET, P-ch, –12 V, 4 A, 51 mΩ

0.100 × 2"

SOT23

603

Sullins

Fairchild

Vishay

Std

PTC36SAAN

MMBT2222A

Si2335DS

Std

R1, R14,

R16, R19

Resistor, chip, 10 kΩ, 1/16 W, 5%

12 R13, R15,

R21–R24,

R26, R27,

R45, R46,

R49, R50

Resistor, chip, 100 Ω, 1/16 W, 5%

603

Std

R18, R42,

R43

Resistor, chip, 1 MΩ, 1/16 W, 1%

603

Std

Resistor, chip, 15 kΩ, 1/16 W, 5%

Resistor, chip, 100 kΩ, 1/16 W, 5%

603

Std

R3–R5,

R32–R34,

R39

R30, R51,

R52

Resistor, chip, 620 Ω, 1/16 W, 5%

603

Std

R31, R41

R35

Resistor, chip, 10 Ω, 1/16 W, 5%

Resistor, chip, 61.9 kΩ, 1/16 W, 1%

Resistor, chip, 0 Ω, 1/16 W, 5%

603

Std

R53

(1)

Reference designators marked with an asterisk (*) cannot be substituted. All other components can be substituted with

equivalent manufacturers components.

These assemblies are ESD sensitive, ESD precautions should be observed.

These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.

These assemblies must comply with workmanship standards IPC-A-610 Class 2.

(2)

(3)

(4)

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Qty Ref Des

EV2300 Bill of Materials, Component Placement, Schematic

(1)

(2) (3) (4)

Description

Size

MFR

Vishay

Part Number

R54

Resistor, chip, 113 kΩ, 1/16 W, 0.1%

603

TNPW06031133BT9R

Resistor, chip, 1.5 kΩ, 1/16 W, 5%

603

Std

R7,

Open

R10-R12,

R17, R20,

R25, R28,

R36-R38,

R40

R8, R9

SW1

Resistor, chip, 33 Ω, 1/16 W, 5%

603

Std

Open

5 mm × 5 mm

U1, U2

IC, Single bus buffer gate with 3-state output, with

negative enable

DCK

SN74LVC1G125DCK

SN74LVC1G126DCK

TUSB3210PM

IC, Single bus buffer gate with 3-state output, with

positive enable

DCK

IC, USB, general purpose, device controller

0.480 ×

0.480"

IC, ultra low-power LDO regulator, 3.3 V, 50 mA

IC, Advance gas gauge

SOT23-5

DBT38

TPS77033DBV

bq8015DBT

Y1 or Y4

Crystal, high performance, 12.00 MHz, SMT

0.126 × 0.126 Citizen or

CSA-309-12.000MABJ

or DSX630G-12.00

MHz

Daishinku

Y2 or Y3

N/A

Crystal, 32.768 MHz, 7-12 pF capacitance

1,9 mm × 5

Daishinku or

ECS

DST520G-32.768kHz

or ECS-0.327-8-14

Plastic enclosure, bone, Texas Instruments

silkscreen

PacTec

84107-501-039

Wire Cable Assembly⁽⁵⁾

Connector, female, 0.100 centers

Terminals, crimp, tin

Mate

N/A

22-01-30 47

08-50-011 4

Any

Molex

Any

N/A

Wire, insulated 22 Awg, red, 18 inches (±3 inches)

(VOUT)

N/A

Wire, insulated 22 Awg, white, 18 inches (±3 inches)

(SCL)

Any

Wire, insulated 22 Awg, black, 18 inches (±3 inches)

(GND)

Wire, insulated 22 Awg, brown, 18 inches (±3

inches) (SDA)

Heatshrink 1"

(5)

Make one EEPROM connector wire assembly for each assembly produced, from J15 mate, 4 - 22 AWG wires and crimp

terminals. Wire colors for pin numbers are listed below. Strip and tin flying leads 0.25 inches from end of wire.

Red - pin #4 (signal VOUT)

Brown - pin #3 (signal SDA)

White - pin #2 (signal SCL)

Black - pin #1 (GND)

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EV2300 Bill of Materials, Component Placement, Schematic

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3.2 EV2300 Component Placement

Figure 1. Board Layer 1

EV2300 EVM Interface Board

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EV2300 Bill of Materials, Component Placement, Schematic

Figure 2. Solder Mask 1

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EV2300 EVM Interface Board

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EV2300 Bill of Materials, Component Placement, Schematic

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Figure 3. Solder Mask 2

EV2300 EVM Interface Board

SLUU159C–February 2005–Revised January 2012

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EV2300 Bill of Materials, Component Placement, Schematic

Figure 4. Board Layer 2

SLUU159C–February 2005–Revised January 2012

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EV2300 Bill of Materials, Component Placement, Schematic

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Figure 5. Component Placement 1

EV2300 EVM Interface Board

SLUU159C–February 2005–Revised January 2012

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EV2300 Bill of Materials, Component Placement, Schematic

Figure 6. Component Placement 2

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EV2300 Bill of Materials, Component Placement, Schematic

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Figure 7. Internal Board Layer 1

EV2300 EVM Interface Board

SLUU159C–February 2005–Revised January 2012

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EV2300 Bill of Materials, Component Placement, Schematic

Figure 8. Internal Board Layer 2

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EV2300 EVM Interface Board

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EV2300 Bill of Materials, Component Placement, Schematic

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3.3 EV2300 Schematic

EV2300 EVM Interface Board

SLUU159C–February 2005–Revised January 2012

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Revision History

Changes from A Revision (February 2005) to B Revision ............................................................................................. Page

•

Changed label ............................................................................................................................ 3

Changed HDQ Interface pin names .................................................................................................... 4

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from B Revision (December 2011) to C Revision ........................................................................................... Page

•

Added Schematic ....................................................................................................................... 16

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

SLUU159C–February 2005–Revised January 2012

Revision History

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EV24-0.5-02-44M产品参数

型号:	EV24-0.5-02-44M
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Active
包装说明：	ROHS COMPLIANT PACKAGE
Reach Compliance Code：	compliant
风险等级：	2.23
其他特性：	INDUCTANCE 44 MILLI HENRY
认证：	UL
滤波器类型：	SINGLE PHASE EMI FILTER
高度：	29.1 mm
高电位：	2000 V
长度：	24.6 mm
安装类型：	THROUGH HOLE MOUNT
工作频率：	400Hz Hz
最高工作温度：	100 °C
最低工作温度：	-25 °C
物理尺寸：	L24.6XB17.4XH29.1 (mm)/L0.969XB0.685XH1.146 (inch)
额定电流：	0.5 A
额定电压：	250 V
宽度：	17.4 mm
Base Number Matches：	1

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产品型号EV2300的概述

产品型号EV2300的Datasheet PDF文件预览

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