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产品型号FAN2558SX的概述

芯片FAN2558SX的概述 FAN2558SX是一款综合性的功率管理芯片，主要应用于LED驱动、背光驱动和其他要求高精度电源管理的场景。这款芯片的设计旨在降低电源噪声，提高效率，并具备多种保护功能，能够满足复杂电源系统的需求。FAN2558SX的高性能和稳定性使其在消费电子、照明及工业设备等领域上得到了广泛的应用。 FAN2558SX采用了先进的集成电路技术，与传统的线性稳压器和开关电源相比，它具备了更高的转换效率和更小的物理占用空间。这一特性使得它非常适合于需要严格控制功率损耗的设备，特别是在空间有限且对热量管理要求较高的设计中。芯片FAN2558SX的详细参数从电气特性上来看，FAN2558SX具有以下主要参数： - 输出电压范围：FAN2558SX可以在可调的输出电压范围内工作，通常设定在1.2V至5.0V之间。 - 最大输出电流：该芯片的最大输出电流可以达到500mA，对...

产品型号FAN2558SX的Datasheet PDF文件预览

www.fairchildsemi.com

FAN2558/FAN2559

180mA Low Voltage CMOS LDO

Features

General Description

• Fixed 1.0V, 1.2V, 1.3V, 1.5V, 1.8V, 2.5V, 3.3V, 3.5V, 3.6V,

3.8V and Adjustable Output

• Power Good Indicator with Open Drain Output

• 180mA Output Current

The FAN2558/9 low voltage CMOS LDOs feature ﬁxed or

adjustable output voltage, 180mA load current, delayed

power good output (open drain) and 1% output accuracy

with excellent line and load regulation. An external bypass

capacitor provides ultra-low noise operation.

• 100µA Ground Current

• C_bypassfor Low Noise Operation

• Fast Enable for CDMA Applications

• High Ripple Rejection

• Current Limit

• Thermal Shutdown

• Excellent Line and Load Regulation

• Requires Only 1µF Output Capacitor

• Stable with 0 to 300mΩ ESR

• TTL-level Compatible Enable Input

• Active Output Discharge

The FAN2558/9 low voltage LDOs incorporate both thermal

shutdown and short circuit protection. Output is stable with a

1µF, low ESR capacitor. The FAN2558/9 family is available

in 5-Lead SOT-23, 6-Lead SOT-23 and 2x2mm MLP-6

packages.

FAN2558: Fixed Output LDO with Power Good output

FAN2558ADJ: Adjustable Output LDO with Power Good

output

Applications

• Processor Power-up sequencing

• PDAs, Cell Phones

FAN2559: Fixed Output LDO with Power Good output,

Low Noise

Available standard output voltages are 1.0, 1.2V, 1.3V, 1.5V,

1.8V, 2.5V, 3.3V, 3.5V, 3.6V, and 3.8V. Custom output volt-

age options are also available.

• Portable Electronic Equipment

• PCMCIA Vcc and Vpp regulation/switching

Typical Application

47KΩ

OUT

SHDN

GND

OUT

SHDN

GND

OUT

SHDN

GND

ADJ

BYP

CAP+

BYP

CAP-

FAN2558

FAN2558ADJ

FAN2559

REV. 1.0.4 3/15/04

FAN2558/FAN2559

PRODUCTSPECIFICATIONS

Pin Assignments

TOP-VIEW

OUT

GND

NC/ADJ/BYP

ADJ/BYP

GND

FAN2558

5-Lead SOT-23 PACKAGE

FAN2558ADJ/FAN2559

6-Lead SOT-23 PACKAGE

FAN2558/FAN2558ADJ/FAN2559

2x2mm MLP-6 PACKAGE

Pin Name

FAN2558ADJ

6SOT-23 2x2mm MLP-6

Pin no.

FAN2558

FAN2559

5SOT-23

V_IN

2x2mm MLP-6

6SOT-23

V_IN

2x2mm MLP-6

V_OUT

V_IN

GND.

V_OUT

ADJ

V_OUT

BYP

GND.

V_OUT

GND

V_IN

ADJ

V_OUT

GND

V_IN

BYP

V_OUT

GND

V_IN

Pin Descriptions

Symbol

Pin Function Description

V_IN

V_OUT

GND

Power Supply Input

Regulated Voltage Output

Ground Connection

Power Good Output, Open Drain

ADJ

BYP

Ratio of potential divider from V_outto ADJ determines output voltage

Reference Noise Bypass

Chip Enable Input. The regulator is fully enabled when TTL “H” is applied to this input. The regulator

enters into shutdown mode when TTL “L” is applied to this input.

REV. 1.0.4 3/15/04

PRODUCT SPECIFICATIONS

FAN2558/FAN2559

Absolute Maximum Ratings

Parameter

Min.

Max.

Units

V_INto GND

V_IN+ 0.3

150

Voltage on any other pin to GND

Junction Temperature (T_J)

Storage Temperature

-0.3

-55

-65

°C

150

Lead Soldering Temperature, 10 seconds

Power Dissipation (P_D)

300

Internally

Limited

Electrostatic Discharge (ESD) Protection (Note1)

HBM

CDM

Recommended Operating Conditions

Parameter

Min.

2.7

Typ.

Max.

5.5

Units

Supply Voltage Range, V_INfor V_OUT< 2.0V

Supply Voltage Range, V_INfor V_OUT≥ 2.0V

Load Current

V_OUT+ V_DROPOUT

5.5

180

V_IN

125

235

Enable Input Voltage V_EN

Power Good Output Voltage Range V_PG

Junction Temperature

-40

°C

Thermal Resistance-Junction to Ambient SOT-23 (Note 2)

°C/W

Thermal Resistance-Junction to Case, 2mm x 2mm

6-lead MLP

Notes:

1. Using Mil Std. 883E, method 3015.7 (Human Body Model) and EIA/JESD22C101-A (Charge Device Model)

2. Junction to ambient thermal resistance, Θ , is a strong function of PCB material, board thickness, thickness and number of

copper plains, number of via used, diameter of via used, available copper surface, and attached heat sink characteristics.

REV. 1.0.4 3/15/04

FAN2558/FAN2559

PRODUCTSPECIFICATIONS

Electrical Characteristics

V_IN= V_INmin (note 5) to 5.5V, V_EN= V_IN, I_LOAD= 100µA, T_A= -40°C to +85°C, unless otherwise noted.Typical values

are at 25°C.

Symbol

Parameter

Conditions

Min.

Typ.

Max.

Units

V_OUT

Output Voltage Accuracy

(Note 3)

I_LOAD= 100µA

-2

ꢀ

V_OUT(ADJ)Output Voltage Range

(Adjustable)

I_LOAD= 100µA

V_IN

∆V_{OUT_LNR}Line Regulation

∆V_{OUT_LDR}Load Regulation (Note 4)

V_INmin < V_IN< 5.5V

-0.3

0.3

ꢀ/V

ꢀ

I_LOAD= 0.1mA to 150mA

2.5

0.1

I_SD

Supply Current in Shutdown

Mode

V_EN< 0.4V

PG = No Connection

µA

I_GND

Ground Pin Current (Note 4)

I_LOAD= 0mA, V_IN= 5.5V

I_LOAD= 150mA, V_IN= 5.5V

V_OUT= 0V

150

500

µA

110

350

150

I_LIM

T_SD

Current Limit

260

°C

Thermal Shutdown

Temperature

Thermal Shutdown Hysteresis

Enable Input Low

°C

V_ENL

V_ENH

I_E

V_IN= 5.5V, Shutdown

V_IN= 5.5V, Enabled

V_ENL≤ 0.4V, V_IN= 5.5V

V_ENH≥ 1.6V, V_IN= 5.5V

ꢀ of V_OUTPG ON

0.4

Enable Input High

1.6

Enable Input Current

0.01

µA

V_PG

Low Threshold

ꢀ

High Threshold

ꢀ of V_OUTPG OFF

V_PGL

I_PG

PG Output Low Voltage

I_{PG_SINK}= 100µA,

Fault Condition

0.02

0.01

0.1

PG Leakage Current

Enable Response Time

Power "ON" Delay Time

PG off, V_PG=5.5V

µA

µS

T_EN

T_ON

C_OUT= 1µF

C_BYPASS= 10nF

300

500

C_OUT= 1µF

C_BYPASS= 10nF

V_ENL≥ 1.6V,

300

_IN= 0V to V_OUT+ 1V

D_PG

PG Delay time

V_DROP-OUTDropout Voltage

(For Adjustable Output

V_OUT> 2.7V and

I_LOAD= 180mA

400

Version)

V_{FB_ADJ}

Feedback Voltage

(For Adjustable Output

Version)

0.59

Note:

3. Guaranteed 1ꢀ output voltage accuracy parts are available on customer reꢁuest.

4. Measured at constant junction temperature using low duty cycle pulse testing.

5. V min = 2.7V or (V

+ 1V), whichever is greater.

OUT

REV. 1.0.4 3/15/04

PRODUCT SPECIFICATIONS

FAN2558/FAN2559

DC Electrical Characteristics (Continued)

V_IN= V_INmin (note 5) to 5.5V, V_EN= V_IN, I_LOAD= 100µA, T_A= -40°C to +85°C, unless otherwise noted. Typical

values are at 25°C.

Symbol

Parameter

Conditions

Min.

Typ.

Max.

Units

PSRR

Power Supply Rejection Ratio

DC to 100kHz

C_OUT=1µF

C_BYPASS= 10nF

I_LOAD= 0 to 150mA

V_OUT≤ 1.8V

e_N

Output Noise

BW: 300Hz to 50kHz

C_OUT=1µF

µV_RMS

C_BYPASS= 10nF

I_LOAD= 0 to 150mA

REV. 1.0.4 3/15/04

FAN2558/FAN2559

PRODUCTSPECIFICATIONS

capacitor quality still must be considered if the designer is to

achieve optimal circuit performance. In general, ceramic

capacitors offer superior ESR performance, and a smaller

case size than tantalum capacitors.

Functional Description

Utilizing BiCMOS technology, the FAN2525/FAN2559

product family is optimized for use in compact battery pow-

ered systems. These LDOs offer a unique combination of

high ripple rejection, low noise, low power consumption,

high tolerance for a variety of output capacitors, and less

than 1µA “OFF” current. In the circuit, a differential current

sense ampliﬁer controls a series-pass P-Channel MOSFET to

achieve high ripple rejection. A separate error ampliﬁer com-

pares the load voltage at the output with an onboard trimmed

low voltage bandgap reference for output regulation.

Input Capacitor

An input capacitor of 2.2µF (nominal value) or greater,

connected between the Input pin and Ground, placed in close

proximity to the device, will improve transient response and

ripple rejection. Higher values will further improve ripple

rejection and transient response. An input capacitor is rec-

ommended when the input source, either a battery or a regu-

lated AC voltage, is located far from the device. Any good

quality ceramic, tantalum, or metal ﬁlm capacitor will give

acceptable performance; however, in extreme cases capacitor

surge current ratings may have to be considered.

Thermal shutdown and current limit circuits protect the

device under extreme conditions. When the device tempera-

ture reaches 150°C, the output is disabled. When the device

cools down by 10°C, it is re-enabled. The user can shut down

the device using the Enable control pin at any time. The cur-

rent limit circuit is trimmed, which leads to consistent power

on /enable delays, and provides safe short circuit current

densities even in narrow traces of the PCB.

Output Capacitor

An output capacitor is required to maintain regulator loop

stability. Stable operation will be achieved with a wide vari-

ety of capacitors with ESR values ranging from 0mΩ up to

400mΩ. Multilayer ceramic, tantalum or aluminum electro-

lytic capacitors may be used. A nominal value of at least 1µF

is recommended. Note that the choice of output capacitor

affects load transient response, ripple rejection, and it has a

slight effect on noise performance as well.

A carefully optimized control loop accommodates a wide

range of ESR values in the output bypass capacitor, allowing

the user to optimize space, cost, and performance require-

ments.

An Enable pin shuts down the regulator output to conserve

power, reducing supply current to less than 1µA.

An internal resistor of approximately 100Ω is connected

between V_OUTand GND in shutdown mode, to discharge the

output capacitor at a faster rate.

The ﬁxed-voltage FAN2559 has a noise bypass pin. Power

Good is available as a diagnostic function to indicate that the

output voltage has reduced within 5% of the nominal value.

Bypass Capacitor (FAN2559 Only)

In the ﬁxed-voltage conﬁguration, connecting a capacitor

between the bypass pin and ground can signiﬁcantly reduce

output noise. Values ranging from 0pF to 47nF can be used,

depending on the sensitivity to output noise in the applica-

tion.

The six pin adjustable-voltage version utilizes pin 5 to con-

nect to an external voltage divider which feeds back to the

regulator error ampliﬁer, thus setting the output voltage to

the desired value.

At the high-impedance Bypass pin, care must be taken in the

PCB layout to minimize noise pickup, and capacitors must

be selected to minimize current loading (leakage). Noise

pickup from external sources can be considerable. Leakage

currents into the Bypass pin will directly affect regulator

accuracy and should be kept as low as possible; thus, high-

quality ceramic and ﬁlm types are recommended for their

low leakage characteristics. Cost-sensitive applications not

concerned with noise can omit this capacitor.

Applications Information

External Capacitors – Selection

The FAN2558/FAN2559 gives the user the ﬂexibility to uti-

lize a wide variety of capacitors compared to other LDOs.

An innovative design approach offers signiﬁcantly reduced

sensitivity to ESR, which degrades regulator loop stability in

older designs. While the improvements featured in the

FAN2558/FAN2559 family greatly simplify the design task,

REV. 1.0.4 3/15/04

PRODUCT SPECIFICATIONS

FAN2558/FAN2559

The ground pin current I_GNDcan be found in the charts

provided in the Electrical Characteristics section.

Control Functions

Enable Pin

The relationship describing the thermal behavior of the

package is:

Connecting 2V or greater to the Enable pin will enable the

output, while 0.4V or less will disable it while reducing the

quiescent current consumption to less than 1µA. If this shut-

down function is not needed, the pin can simply be con-

nected permanently to the V_INpin. Allowing this pin to ﬂoat

will cause erratic operation.

_J(max)– T







_A

-------------------------------

P_D(max)





θ_JA

where T_J(max)is the maximum allowable junction tempera-

ture of the die, which is 125°C, and T_Ais the ambient operat-

ing temperature. θ_JAis dependent on the surrounding PC

board layout and can be empirically obtained. While the θ_JC

(junction-to-case) of the SOT23-5 package is speciﬁed at

130°C /W, the θ_JAof the minimum PWB footprint will be at

least 235°C /W. This can be improved by providing a heat

sink of surrounding copper ground on the PWB. Depending

on the size of the copper area, the resulting θ_JAcan range

from approximately 180°C /W for one square inch to nearly

130°C /W for 4 square inches. The addition of backside cop-

per with through-holes, stiffeners, and other enhancements

can also aid in reducing thermal resistance. The heat contrib-

uted by the dissipation of other devices located nearby must

be included in the design considerations. Once the limiting

parameters in these two relationships have been determined,

the design can be modiﬁed to ensure that the device remains

within speciﬁed operating conditions. If overload conditions

are not considered, it is possible for the device to enter a

thermal cycling loop, in which the circuit enters a shutdown

condition, cools, re-enables, and then again overheats and

shuts down repeatedly due to an unmanaged fault condition.

Error Flag (Power Good)

Fault conditions such as input voltage dropout (low V_IN),

overheating, or overloading (excessive output current), will

set an error ﬂag. The PG pin which is an open-drain output,

will go LOW when V_OUTis less than 95% or the speciﬁed

output voltage. When the voltage at V_OUTis greater than

95% of the speciﬁed output voltage, the PG pin is HIGH. A

logic pull-up resistor of 47KΩ is recommended at this out-

put. The pin can be left disconnected if unused.

Thermal Protection

The FAN2558/FAN2559 is designed to supply high peak

output currents for brief periods, however sustained exces-

sive output load at high input - output voltage difference will

increase the device’s temperature and exceed maximum rat-

ings due to power dissipation. During output overload condi-

tions, when the die temperature exceeds the shutdown limit

temperature of 150°C, an onboard thermal protection will

disable the output until the temperature drops approximately

10°C below the limit, at which point the output is re-enabled.

During a thermal shutdown, the user may assert the power-

down function at the Enable pin, reducing power consump-

tion to a minimum.

Adjustable Version

The FAN2558ADJ includes an input pin ADJ which allows

the user to select an output voltage ranging from 1V to near

V_IN, using an external resistor divider. The voltage V_ADJpre-

sented to the ADJ pin is fed to the onboard error ampliﬁer

which adjusts the output voltage until V_ADJis equal to the

onboard bandgap reference voltage of 1.00V(typ). The equa-

Thermal Characteristics

The FAN2558/FAN2559 is designed to supply 180mA at the

speciﬁed output voltage with an operating die (junction)

temperature of up to 125°C. Once the power dissipation and

thermal resistance is known, the maximum junction tempera-

ture of the device can be calculated. While the power dissipa-

tion is calculated from known electrical parameters, the

actual thermal resistance depends on the thermal characteris-

tics of the SOT23-5 surface-mount package and the sur-

rounding PC board copper to which it is mounted.

tion is:

R₁

V_OUT= 0.59V × 1 + -----

R₂

Since the bandgap reference voltage is trimmed, 1% initial

accuracy can be achieved. The total value of the resistor

chain should not exceed 250KOhm total to keep the error

ampliﬁer biased during no-load conditions. Programming

output voltages very near V_INneed to allow for the magni-

tude and variation of the dropout voltage V_DOover load, sup-

ply, and temperature variations. Note that the low-leakage

FET input to the CMOS error ampliﬁer induces no bias

current error to the calculation.

The power dissipation is equal to the product of the input-to-

output voltage differential and the output current plus the

ground current multiplied by the input voltage,

or:

P_D= (V_IN– V_OUT) × I_OUT+ V_IN× I_GND

REV. 1.0.4 3/15/04

FAN2558/FAN2559

PRODUCTSPECIFICATIONS

load conditions. A large copper area in the local ground

serves as heat sink (as discussed above) when high power

dissipation signiﬁcantly increases device temperature. Com-

ponent-side copper provides signiﬁcantly better thermal per-

formance. Added feed through connecting the device side

ground plane to the back plane further reduces thermal resis-

tance.

General PCB Layout Considerations

For optimum device performance, careful circuit layout and

grounding techniques must be used. Establishing a small

local ground, to which the GND pin, and the output and

bypass capacitors are connected, is recommended. The input

capacitor should be grounded to the main ground plane. The

quiet local ground is then routed back to the main ground

plane using feed through via. In general, the high-frequency

compensation components (input, bypass, and output capaci-

tors) should be located as close to the device as possible.

Close proximity of the output capacitor is especially impor-

tant to achieve optimum performance, especially during high

REV. 1.0.4 3/15/04

PRODUCT SPECIFICATIONS

FAN2558/FAN2559

Block Diagram (Note 6)

Shutdown

Control

Bandgap

BYPASS

Precharge/Fast Enable

Error Amplifier

Shutdown

Load Current

Sense

Thermal

Shutdown

OUT

GND

Out of Regulation

Detection

Delay

Over-Current

Dropout

Detection

GND

Note:

6. Fixed output voltage version. BYPASS pin is available for FAN2559 only.

REV. 1.0.4 3/15/04

FAN2558/FAN2559

PRODUCTSPECIFICATIONS

Typical Performance Characteristics

Unless otherwise speciﬁed, C_IN= C_OUT= 1µF, R_PG= 47kΩ, T_A= 25°C, EN = V_IN

Output Voltage vs.Temperature

= 0mA

LOAD

= 180mA

LOAD

= 5.5V

Junction Temperature (°C)

Ground Current vs.Temperature

= 180mA

LOAD

= 0mA

= 5.5V

LOAD

= 5.5V

= 2.7V

Junction Temperature (°C)

Power On ResponseTime vs.Temperature

Enable ResponseTime vs.Temperature

Junction Temperature (°C)

Junction Temperature (°C))

REV. 1.0.4 3/15/04

PRODUCT SPECIFICATIONS

FAN2558/FAN2559

Typical Performance Characteristics (Continued)

Unless otherwise speciﬁed, C_IN= C_OUT= 1µF, R_PG= 47kΩ, T_A= 25°C, EN = V_IN

Power Good Delay vs. Input Voltage

Output Voltage vs. Input Voltage

= 100µA

LOAD

=100µA

LOAD

=180mA

LOAD

Input Voltage (V)

Output Voltage vs. Load Current

Output Voltage vs. Enable Voltage

=1µF

OUT

=1µF

OUT

=100µA

LOAD

=2.7V

Load Current (mA)

Enable Voltage (V)

Ripple Rejection vs. Frequency

≤ 1.8V

OUT

=0mA

=1µF

= 10nF

≤ 1.8V

LOAD

OUT

=180mA

=1µF

LOAD

OUT

BYP

= 10nF

BYP

REV. 1.0.4 3/15/04

FAN2558/FAN2559

PRODUCTSPECIFICATIONS

Typical Performance Characteristics (Continued)

Unless otherwise speciﬁed, C_IN= C_OUT= 1µF, R_PG= 47kΩ, T_A= 25°C, EN = V_IN

Output Spectral Noise Density

= 180mA

LOAD

=1µF

OUT

= 10nF

BYP

=1.2V

=2.7V

OUT

Enable Delay = 27.6µS

=0mA

=1µF

LOAD

OUT

BYP

=10nF

Time (20µS/div)

Load Transient Response

Power Good Delay

= 2.7V

=1.8V

= 4.7µF

=3V

Power Good Delay = 2mSec

=1V

=1µF

OUT

=100mA

LOAD

= 0mA

LOAD

Time (200µS/div)

Time (1mS/div)

Power Good in Fail Condition

= 4V

= 5V

= 3V

0.0

0.5

1.0

1.5

2.0

Power Good Voltage (V)

REV. 1.0.4 3/15/04

PRODUCT SPECIFICATIONS

FAN2558/FAN2559

Mechanical Dimensions

2x2mm 6-Lead MLP

REV. 1.0.4 3/15/04

FAN2558/FAN2559

PRODUCTSPECIFICATIONS

Mechanical Dimensions

6-Lead SOT-23 Package

5-Lead SOT-23 Package

Symbol

Inches

Millimeters

Notes

Min

.035

.000

.008

.003

.106

.059

Max

.057

.006

.020

.010

.122

.071

Min

.90

Max

1.45

.15

.00

.20

.50

.08

.25

2.70

1.50

3.10

1.80

.037 BSC

.075 BSC

.95 BSC

1.90 BSC

.087

.126

.024

10°

2.20

3.20

.60

.004

0°

.10

0°

10°

Notes:

7. Package outline exclusive of mold ﬂash & metal burr.

8. Packageoutline exclusive of solder plating.

9. EIAJ Ref Number SC_74A

REV. 1.0.4 3/15/04

PRODUCT SPECIFICATIONS

FAN2558/FAN2559

Ordering Information

T_A= -40°C to 85°C

Part Number Output Voltage

Package Marking

58T

Package

Order Code

FAN2558

1.0V

1.2V

5-Lead SOT-23

FAN2558S10X

FAN2558S12X

FAN2558S13X

FAN2558S15X

FAN2558S18X

FAN2558S25X

FAN2558S33X

FAN2558S35X

FAN2558S36X

FAN2558S38X

FAN2558MP10X

FAN2558MP12X

FAN2558MP13X

FAN2558MP15X

FAN2558MP18X

FAN2558SX

58U

58X

1.3V

1.5V

58V

1.8V

58O

58J

2.5V

3.3V

58K

3.5V

58P

3.6V

58Q

58I

3.8V

1.0V

58T

2mm x 2mm 6-Lead MLP

1.2V

58U

58X

1.3V

1.5V

58V

1.8V

58O

58R

59T

Adjustable

6-Lead SOT-23

2mm x 2mm 6-Lead MLP

6-Lead SOT-23

FAN2558MPX

FAN2559S10X

FAN2559S12X

FAN2559S13X

FAN2559S15X

FAN2559S18X

FAN2559MP10X

FAN2559MP12X

FAN2559MP13X

FAN2559MP15X

FAN2559MP18X

FAN2559

1.0V

1.2V

1.3V

1.5V

1.8V

1.0V

1.2V

1.3V

1.5V

1.8V

59U

59X

59V

59O

59T

2mm x 2mm 6-Lead MLP

59U

59X

59V

59O

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO

ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME

ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;

NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES

OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR

CORPORATION. As used herein:

1. Life support devices or systems are devices or systems

which, (a) are intended for surgical implant into the body,

or (b) support or sustain life, and (c) whose failure to

perform when properly used in accordance with

instructions for use provided in the labeling, can be

reasonably expected to result in a significant injury of the

user.

2. A critical component in any component of a life support

device or system whose failure to perform can be

reasonably expected to cause the failure of the life support

device or system, or to affect its safety or effectiveness.

www.fairchildsemi.com

REV. 1.0.4 3/15/04

 2004 Fairchild Semiconductor Corporation

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